Takiar; Hem

Patent Applications and Registrations

Patent applications and USPTO patent grants for Takiar; Hem.The latest application filed is for "semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch".

Company Profile

12.125.120

Takiar; Hem - Fremont CA
Takiar; Hem - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package and method of fabricating semiconductor package Grant 11,031,371 - Chiu , et al. June 8, 2	2021-06-08
Manufacturing process for separating logic and memory array Grant 10,930,607 - Takiar , et al. February 23, 2	2021-02-23
Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch Grant 10,854,573 - Ji , et al. December 1, 2	2020-12-01
Datacenter 3D solid state drives with matrix cooling Grant 10,818,575 - Chiu , et al. October 27, 2	2020-10-27
Semiconductor device Grant 10,811,386 - Chiu , et al. October 20, 2	2020-10-20
Semiconductor device including optically connected wafer stack Grant 10,734,354 - Chiu , et al.	2020-08-04
Semiconductor Die Singulation Using A Sacrificial Bonding Material Layer And An Anisotropic Channel Etch App 20200219842 - Ji; Zhongli ; et al.	2020-07-09
Manufacturing Process For Separating Logic And Memory Array App 20200126936 - Takiar; Hem ; et al.	2020-04-23
Heterogeneous fan-out structures for memory devices Grant 10,607,955 - Chiu , et al.	2020-03-31
Manufacturing Process For Separating Logic And Memory Array App 20200006268 - Takiar; Hem ; et al.	2020-01-02
Manufacturing process for separating logic and memory array Grant 10,522,489 - Takiar , et al. Dec	2019-12-31
Angled die semiconductor device Grant 10,490,529 - Chiu , et al. Nov	2019-11-26
Integrated USB connector and memory device Grant 10,485,125 - Takiar , et al. Nov	2019-11-19
Non-volatile memory system with wide I/O memory die Grant 10,381,327 - Ramachandra , et al. A	2019-08-13
Integrated Usb Connector And Memory Device App 20190200471 - Takiar; Hem ; et al.	2019-06-27
Semiconductor Device Including Optically Connected Wafer Stack App 20190198479 - Chiu; Chin-Tien ; et al.	2019-06-27
Datacenter 3d Solid State Drives With Matrix Cooling App 20190189536 - Chiu; Chin-Tien ; et al.	2019-06-20
Vertical semiconductor device having a stacked die block Grant 10,325,881 - Upadhyayula , et al.	2019-06-18
Wire bonded wide I/O semiconductor device Grant 10,249,592 - Mostovoy , et al.	2019-04-02
Semiconductor device including interconnected package on package Grant 10,242,965 - Chiu , et al.	2019-03-26
Heterogeneous Fan-out Structures For Memory Devices App 20180366429 - Chiu; Chin-Tien ; et al.	2018-12-20
Angled Die Semiconductor Device App 20180342483 - Chiu; Chin-Tien ; et al.	2018-11-29
Printed circuit board with coextensive electrical connectors and contact pad areas Grant 10,051,733 - Liao , et al. August 14, 2	2018-08-14
Wire Bonded Wide I/o Semiconductor Device App 20180174996 - Mostovoy; Michael ; et al.	2018-06-21
Semiconductor Device App 20180114777 - Chiu; Chin Tien ; et al.	2018-04-26
Semiconductor Package And Method Of Fabricating Semiconductor Package App 20180114773 - Chiu; Chin Tien ; et al.	2018-04-26
Non-volatile Memory System With Wide I/o Memory Die App 20180102344 - Ramachandra; Venkatesh P. ; et al.	2018-04-12
Wire bonded wide I/O semiconductor device Grant 9,899,347 - Mostovoy , et al. February 20, 2	2018-02-20
Vertical Semiconductor Device App 20180047706 - Upadhyayula; Suresh ; et al.	2018-02-15
Semiconductor Device Including Interconnected Package On Package App 20180005974 - Chiu; Chin-Tien ; et al.	2018-01-04
Wire tail connector for a semiconductor device Grant 9,362,244 - Chiu , et al. June 7, 2	2016-06-07
EMI shielding and thermal dissipation for semiconductor device Grant 9,337,153 - Fu , et al. May 10, 2	2016-05-10
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Grant 9,230,919 - Chiu , et al. January 5, 2	2016-01-05
Low profile wire bonded USB device Grant 9,218,953 - Upadhyayula , et al. December 22, 2	2015-12-22
Hidden plating traces Grant 9,209,159 - Takiar , et al. December 8, 2	2015-12-08
Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas App 20150223335 - Liao; Chih-Chin ; et al.	2015-08-06
Epoxy Coating On Substrate For Die Attach App 20150214184 - Gu; Wei ; et al.	2015-07-30
Low Profile Wire Bonded Usb Device App 20150155156 - Upadhyayula; Suresh ; et al.	2015-06-04
Printed circuit board with coextensive electrical connectors and contact pad areas Grant 9,006,912 - Liao , et al. April 14, 2	2015-04-14
Semiconductor package including flip chip controller at bottom of die stack Grant 8,987,053 - Upadhyayula , et al. March 24, 2	2015-03-24
Rigid Wave Pattern Design On Chip Carrier Substrate And Printed Circuit Board For Semiconductor And Electronic Sub-system Packaging App 20150054177 - Chiu; Chin-Tien ; et al.	2015-02-26
Low profile wire bonded USB device Grant 8,947,883 - Upadhyayula , et al. February 3, 2	2015-02-03
Wire Tail Connector For A Semiconductor Device App 20150001739 - Chiu; Chin Tien ; et al.	2015-01-01
Molded SiP package with reinforced solder columns Grant 8,878,346 - Chiu , et al. November 4, 2	2014-11-04
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Grant 8,878,368 - Chiu , et al. November 4, 2	2014-11-04
System-in-a-package based flash memory card Grant 8,852,999 - Takiar , et al. October 7, 2	2014-10-07
Method of fabricating a memory card using SIP/SMT hybrid technology Grant 8,728,864 - Ye , et al. May 20, 2	2014-05-20
Etched surface mount islands in a leadframe package Grant 8,659,133 - Upadhyayula , et al. February 25, 2	2014-02-25
High density three dimensional semiconductor die package Grant 8,653,653 - Yu , et al. February 18, 2	2014-02-18
Radiation-shielded semiconductor device Grant 8,637,963 - Upadhyayula , et al. January 28, 2	2014-01-28
Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel Grant 8,637,972 - Liao , et al. January 28, 2	2014-01-28
System-in-a-package based flash memory card Grant 8,637,978 - Takiar , et al. January 28, 2	2014-01-28
Emi Shielding And Thermal Dissipation For Semiconductor Device App 20140015116 - Fu; Peng ; et al.	2014-01-16
Rigid Wave Pattern Design On Chip Carrier Substrate And Printed Circuit Board For Semiconductor And Electronic Sub-system Packaging App 20130299959 - Chiu; Chin-Tien ; et al.	2013-11-14
Semiconductor device having under-filled die in a die stack Grant 8,575,724 - Bhagath , et al. November 5, 2	2013-11-05
Col-based semiconductor package including electrical connections through a single layer leadframe Grant 8,575,739 - Upadhyayula , et al. November 5, 2	2013-11-05
Two-sided Die In A Four-sided Leadframe Based Package App 20130200507 - Yu; Cheemen ; et al.	2013-08-08
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Grant 8,487,441 - Chiu , et al. July 16, 2	2013-07-16
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Grant 8,482,139 - Chang , et al. July 9, 2	2013-07-09
Method of fabricating stacked semiconductor package with localized cavities for wire bonding Grant 8,470,640 - Takiar , et al. June 25, 2	2013-06-25
Semiconductor Package Including Flip Chip Controller At Bottom Of Die Stack App 20130157413 - Upadhyayula; Suresh ; et al.	2013-06-20
Substrate panel with plating bar structured to allow minimum kerf width Grant 8,461,675 - Takiar , et al. June 11, 2	2013-06-11
Stacked wire bonded semiconductor package with low profile bond line Grant 8,432,043 - Takiar , et al. April 30, 2	2013-04-30
Radiation-shielded Semiconductor Device App 20130087895 - Upadhyayula; Suresh Kumar ; et al.	2013-04-11
Method Of Fabricating A Memory Card Using Sip/smt Hybrid Technology App 20130084677 - Ye; Ning ; et al.	2013-04-04
Two-sided die in a four-sided leadframe based package Grant 8,395,246 - Yu , et al. March 12, 2	2013-03-12
Semiconductor package including flip chip controller at bottom of die stack Grant 8,373,268 - Upadhyayula , et al. February 12, 2	2013-02-12
Method of fabricating a two-sided die in a four-sided leadframe based package Grant 8,349,655 - Yu , et al. January 8, 2	2013-01-08
Discrete Component Backward Traceability And Semiconductor Device Forward Traceability App 20130006564 - Chavet; Didier ; et al.	2013-01-03
Method of fabricating a memory card using SiP/SMT hybrid technology Grant 8,318,535 - Ye , et al. November 27, 2	2012-11-27
Epoxy Coating On Substrate For Die Attach App 20120279651 - Gu; Wei ; et al.	2012-11-08
Col-based Semiconductor Package Including Electrical Connections Through A Single Layer Leadframe App 20120280378 - Upadhyayula; Suresh ; et al.	2012-11-08
Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas App 20120273968 - Liao; Chih-Chin ; et al.	2012-11-01
Stacked semiconductor package with localized cavities for wire bonding Grant 8,294,251 - Takiar , et al. October 23, 2	2012-10-23
Method of fabricating stacked wire bonded semiconductor package with low profile bond line Grant 8,241,953 - Takiar , et al. August 14, 2	2012-08-14
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Grant 8,232,145 - Chang , et al. July 31, 2	2012-07-31
Printed circuit board with coextensive electrical connectors and contact pad areas Grant 8,217,522 - Liao , et al. July 10, 2	2012-07-10
Semiconductor die having a redistribution layer Grant 8,212,360 - Liao , et al. July 3, 2	2012-07-03
Hidden Plating Traces App 20120164828 - Takiar; Hem ; et al.	2012-06-28
Pre-treatment Of Memory Cards For Binding Glue And Other Curable Fluids App 20120146247 - Pomerantz; Itzhak ; et al.	2012-06-14
Pre-treatment Of Memory Cards For Ink Jet Printing App 20120081860 - Pomerantz; Itzhak ; et al.	2012-04-05
Hidden plating traces Grant 8,129,272 - Takiar , et al. March 6, 2	2012-03-06
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Grant 8,110,439 - Yu , et al. February 7, 2	2012-02-07
Die package with asymmetric leadframe connection Grant 8,097,495 - Lee , et al. January 17, 2	2012-01-17
System-in-a-package Based Flash Memory Card App 20120009732 - Takiar; Hem ; et al.	2012-01-12
System-in-a-package Based Flash Memory Card App 20120007226 - Takiar; Hem ; et al.	2012-01-12
Etched Surface Mount Islands In A Leadframe Package App 20110309485 - Upadhyayula; Suresh ; et al.	2011-12-22
Method of fabricating a two-sided die in a four-sided leadframe based package Grant 8,058,099 - Yu , et al. November 15, 2	2011-11-15
Stacked, interconnected semiconductor package Grant 8,053,880 - Yu , et al. November 8, 2	2011-11-08
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Grant 8,053,276 - Yu , et al. November 8, 2	2011-11-08
System-in-a-package based flash memory card Grant 8,022,519 - Takiar , et al. September 20, 2	2011-09-20
Method of assembling semiconductor devices with LEDS Grant 8,022,417 - Takiar , et al. September 20, 2	2011-09-20
Semiconductor Die Having A Redistribution Layer App 20110210446 - Liao; Chien-Ko ; et al.	2011-09-01
Etched surface mount islands in a leadframe package Grant 8,008,132 - Upadhyayula , et al. August 30, 2	2011-08-30
Method of reducing memory card edge roughness by edge coating Grant 7,994,647 - Hoo , et al. August 9, 2	2011-08-09
Padless substrate for surface mounted components Grant 7,967,184 - Liao , et al. June 28, 2	2011-06-28
Semiconductor package having through holes for molding back side of package Grant 7,952,179 - Chiu , et al. May 31, 2	2011-05-31
Method of fabricating a semiconductor package having through holes for molding back side of package Grant 7,939,382 - Chiu , et al. May 10, 2	2011-05-10
Semiconductor die having a redistribution layer Grant 7,939,944 - Liao , et al. May 10, 2	2011-05-10
Semiconductor Package Including Flip Chip Controller At Bottom Of Die Stack App 20110095440 - Upadhyayula; Suresh ; et al.	2011-04-28
Method Of Assembling Semiconductor Devices With Leds App 20110024897 - Takiar; Hem ; et al.	2011-02-03
Method Of Reducing Memory Card Edge Roughness By Edge Coating App 20110024891 - Hoo; Ong King ; et al.	2011-02-03
Semiconductor Device Having Under-filled Die In A Die Stack App 20110024881 - Bhagath; Shrikar ; et al.	2011-02-03
Semiconductor package including flip chip controller at bottom of die stack Grant 7,867,819 - Upadhyayula , et al. January 11, 2	2011-01-11
Peripheral card with sloped edges Grant 7,864,540 - Takiar January 4, 2	2011-01-04
Semiconductor Die Having A Redistribution Layer App 20100289147 - Liao; Chien-Ko ; et al.	2010-11-18
Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby Grant 7,816,181 - Bhagath , et al. October 19, 2	2010-10-19
Method of reducing memory card edge roughness by edge coating Grant 7,811,859 - Hoo , et al. October 12, 2	2010-10-12
Method of assembling semiconductor devices with LEDS Grant 7,812,356 - Takiar , et al. October 12, 2	2010-10-12
Method Of Fabricating A Two-sided Die In A Four-sided Leadframe Based Package App 20100255640 - Yu; Cheemen ; et al.	2010-10-07
Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas App 20100252315 - Liao; Chih-Chin ; et al.	2010-10-07
Rounded contact fingers on substrate/PCB for crack prevention Grant 7,806,731 - Takiar , et al. October 5, 2	2010-10-05
Leadframe based flash memory cards Grant 7,795,715 - Takiar , et al. September 14, 2	2010-09-14
Semiconductor device having multiple die redistribution layer Grant 7,791,191 - Takiar , et al. September 7, 2	2010-09-07
Memory card fabricated using SiP/SMT hybrid technology Grant 7,772,686 - Ye , et al. August 10, 2	2010-08-10
Methods of forming a single layer substrate for high capacity memory cards Grant 7,772,107 - Yu , et al. August 10, 2	2010-08-10
Method of fabricating a semiconductor die having a redistribution layer Grant 7,772,047 - Liao , et al. August 10, 2	2010-08-10
Semiconductor die having a distribution layer Grant 7,763,980 - Liao , et al. July 27, 2	2010-07-27
Method for reclaiming semiconductor package Grant 7,745,234 - Ong , et al. June 29, 2	2010-06-29
COL-TSOP with nonconductive material for reducing package capacitance Grant 7,728,411 - Lee , et al. June 1, 2	2010-06-01
High Density Three Dimensional Semiconductor Die Package App 20100102440 - Yu; Cheemen ; et al.	2010-04-29
Methods Of Promoting Adhesion Between Transfer Molded Ic Packages And Injection Molded Plastics For Creating Over-molded Memory Cards App 20100052155 - Chang; Che-Jung ; et al.	2010-03-04
Method Of Stacking And Interconnecting Semiconductor Packages Via Electrical Connectors Extending Between Adjoining Semiconductor Packages App 20100055836 - Yu; Cheeman ; et al.	2010-03-04
Methods Of Promoting Adhesion Between Transfer Molded Ic Packages And Injection Molded Plastics For Creating Over-molded Memory Cards App 20100055847 - Chang; Che-Jung ; et al.	2010-03-04
Method Of Stacking And Interconnecting Semiconductor Packages Via Electrical Connectors Extending Between Adjoining Semiconductor Packages App 20100055835 - Yu; Cheemen ; et al.	2010-03-04
Semiconductor Die Support In An Offset Die Stack App 20100044861 - Chiu; Chin-Tien ; et al.	2010-02-25
High density three dimensional semiconductor die package Grant 7,663,216 - Yu , et al. February 16, 2	2010-02-16
Stacked Wire Bonded Semiconductor Package With Low Profile Bond Line App 20090321951 - Takiar; Hem ; et al.	2009-12-31
Method Of Fabricating Stacked Wire Bonded Semiconductor Package With Low Profile Bond Line App 20090325344 - Takiar; Hem ; et al.	2009-12-31
Reclaiming Packages App 20090325321 - Ong; KH ; et al.	2009-12-31
Stacked Semiconductor Package With Localized Cavities For Wire Bonding App 20090321950 - Takiar; Hem ; et al.	2009-12-31
Method Of Fabricating Stacked Semiconductor Package With Localized Cavities For Wire Bonding App 20090325342 - Takiar; Hem ; et al.	2009-12-31
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards Grant 7,615,861 - Chang , et al. November 10, 2	2009-11-10
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages Grant 7,615,409 - Yu , et al. November 10, 2	2009-11-10
Method of minimizing kerf width on a semiconductor substrate panel Grant 7,611,927 - Liao , et al. November 3, 2	2009-11-03
Hidden Plating Traces App 20090263969 - Takiar; Hem ; et al.	2009-10-22
Stacked, Interconnected Semiconductor Package App 20090256249 - Yu; Cheemen ; et al.	2009-10-15
Hidden plating traces Grant 7,592,699 - Takiar , et al. September 22, 2	2009-09-22
Method of making a semiconductor device having multiple die redistribution layer Grant 7,560,304 - Takiar , et al. July 14, 2	2009-07-14
Tsop Leadframe Strip Of Multiply Encapsulated Packages App 20090166820 - Takiar; Hem ; et al.	2009-07-02
Etched Surface Mount Islands In A Leadframe Package App 20090166828 - Upadhyayula; Suresh ; et al.	2009-07-02
Semiconductor Package Including Flip Chip Controller At Bottom Of Die Stack App 20090166887 - Upadhyayula; Suresh ; et al.	2009-07-02
Low Profile Wire Bonded Usb Device App 20090165294 - Upadhyayula; Suresh ; et al.	2009-07-02
Stacked, interconnected semiconductor packages Grant 7,550,834 - Yu , et al. June 23, 2	2009-06-23
Leadframe Based Flash Memory Cards App 20090134502 - Takiar; Hem ; et al.	2009-05-28
Method Of Reducing Memory Card Edge Roughness By Particle Blasting App 20090085231 - Chiu; Chin-Tien ; et al.	2009-04-02
Method Of Reducing Memory Card Edge Roughness By Edge Coating App 20090085232 - Hoo; Ong King ; et al.	2009-04-02
Method Of Forming A Semiconductor Die Having A Sloped Edge For Receiving An Electrical Connector App 20090065902 - Yu; Cheemen ; et al.	2009-03-12
Test pads on flash memory cards Grant 7,495,255 - Takiar , et al. February 24, 2	2009-02-24
Method of fabricating leadframe based flash memory cards including singulation by straight line cuts Grant 7,488,620 - Takiar , et al. February 10, 2	2009-02-10
Method of manufacturing flash memory cards Grant 7,485,501 - Takiar , et al. February 3, 2	2009-02-03
Two-sided Die In A Four-sided Leadframe Based Package App 20090001534 - Yu; Cheemen ; et al.	2009-01-01
Semiconductor Package Having Through Holes For Molding Back Side Of Package App 20090001552 - Chiu; Chin-Tien ; et al.	2009-01-01
Method Of Fabricating A Semiconductor Package Having Through Holes For Molding Back Side Of Package App 20090004785 - Chiu; Chin-Tien ; et al.	2009-01-01
Semiconductor Die Having A Redistribution Layer App 20090001610 - Liao; Chien-Ko ; et al.	2009-01-01
Memory Card Fabricated Using Sip/smt Hybrid Technology App 20090001365 - Ye; Ning ; et al.	2009-01-01
Method Of Fabricating A Two-sided Die In A Four-sided Leadframe Based Package App 20090004782 - Yu; Cheemen ; et al.	2009-01-01
Method Of Fabricating A Semiconductor Die Having A Redistribution Layer App 20090004781 - Liao; Chien-Ko ; et al.	2009-01-01
Method Of Fabricating A Memory Card Using Sip/smt Hybrid Technology App 20090004776 - Ye; Ning ; et al.	2009-01-01
Semiconductor Molded Panel Having Reduced Warpage App 20080305306 - Yu; Cheemen ; et al.	2008-12-11
Method Of Minimizing Kerf Width On A Semiconductor Substrate Panel App 20080305577 - Liao; Chih-Chin ; et al.	2008-12-11
Two-sided Substrate Lead Connection For Minimizing Kerf Width On A Semiconductor Substrate Panel App 20080303166 - Liao; Chih-Chin ; et al.	2008-12-11
Method Of Reducing Warpage In Semiconductor Molded Panel App 20080305576 - Yu; Cheemen ; et al.	2008-12-11
Method of reducing mechanical stress on a semiconductor die during fabrication Grant 7,435,624 - Chiu , et al. October 14, 2	2008-10-14
Method Of Making Semiconductor Die Stack Having Heightened Contact For Wire Bond App 20080242076 - Takiar; Hem ; et al.	2008-10-02
Semiconductor Die Stack Having Heightened Contact For Wire Bond App 20080237887 - Takiar; Hem ; et al.	2008-10-02
Method Of Assembling Semiconductor Devices With Leds App 20080198031 - Takiar; Hem ; et al.	2008-08-21
Die Package With Asymmetric Leadframe Connection App 20080182365 - Lee; Ming Hsun ; et al.	2008-07-31
Semiconductor Device Having Multiple Die Redistribution Layer App 20080157355 - Takiar; Hem ; et al.	2008-07-03
Method Of Making A Semiconductor Device Having Multiple Die Redistribution Layer App 20080160674 - Takiar; Hem ; et al.	2008-07-03
Method of assembling semiconductor devices with LEDs Grant 7,384,817 - Takiar , et al. June 10, 2	2008-06-10
Method Of Die Stacking Using Insulated Wire Bonds App 20080131999 - Takiar; Hem ; et al.	2008-06-05
Method of fabricating a film-on-wire bond semiconductor device App 20080131998 - Takiar; Hem ; et al.	2008-06-05
Film-on-wire Bond Semiconductor Device App 20080128879 - Takiar; Hem ; et al.	2008-06-05
Die Stacking Using Insulated Wire Bonds App 20080128880 - Takiar; Hem ; et al.	2008-06-05
Die package with asymmetric leadframe connection Grant 7,375,415 - Lee , et al. May 20, 2	2008-05-20
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging Grant 7,355,283 - Chiu , et al. April 8, 2	2008-04-08
Methods Of Forming A Single Layer Substrate For High Capacity Memory Cards App 20080081455 - Yu; Cheemen ; et al.	2008-04-03
Rigid Wave Pattern Design On Chip Carrier Substrate And Printed Circuit Board For Semiconductor And Electronic Sub-system Packaging App 20080054445 - Chiu; Chin-Tien ; et al.	2008-03-06
Method Of Stacking And Interconnecting Semiconductor Packages App 20080001266 - Yu; Cheemen ; et al.	2008-01-03
Stacked, Interconnected Semiconductor Packages App 20080001303 - Yu; Cheemen ; et al.	2008-01-03
Printed circuit board with coextensive electrical connectors and contact pad areas App 20070284727 - Liao; Chih-Chin ; et al.	2007-12-13
Method of reducing stress on a semiconductor die with a distributed plating pattern App 20070269929 - Liao; Chih-Chin ; et al.	2007-11-22
Semiconductor device with a distributed plating pattern App 20070267759 - Liao; Chih-Chin ; et al.	2007-11-22
Interconnected Ic Packages With Vertical Smt Pads App 20070262434 - Chiu; Chin-Tien ; et al.	2007-11-15
Test Pads On Flash Memory Cards App 20070257352 - Takiar; Hem ; et al.	2007-11-08
Method of reducing mechanical stress on a semiconductor die during fabrication App 20070254407 - Chiu; Chin-Tien ; et al.	2007-11-01
Molded SiP package with reinforced solder columns App 20070252254 - Chiu; Chin-Tien ; et al.	2007-11-01
Substrate having conductive traces isolated by laser to allow electrical inspection App 20070235848 - Liao; Chih-Chin ; et al.	2007-10-11
Methods of promoting adhesion between transfer molded ic packages and injection molded plastics for creating over-molded memory cards App 20070210444 - Chang; Che-Jung ; et al.	2007-09-13
SiP module with a single sided lid App 20070207568 - Takiar; Hem ; et al.	2007-09-06
Test pads on flash memory cards Grant 7,259,028 - Takiar , et al. August 21, 2	2007-08-21
COL-TSOP with nonconductive material for reducing package capacitance App 20070187805 - Lee; Ming Hsun ; et al.	2007-08-16
SIP based flash memory card Grant D548,740 - Takiar , et al. August 14, 2	2007-08-14
Strip for integrated circuit packages having a maximized usable area App 20070163109 - Takiar; Hem ; et al.	2007-07-19
Interconnected IC packages with vertical SMT pads App 20070158799 - Chiu; Chin-Tien ; et al.	2007-07-12
Test Pads On Flash Memory Cards App 20070152215 - Takiar; Hem ; et al.	2007-07-05
Hidden plating traces App 20070152319 - Takiar; Hem ; et al.	2007-07-05
Leadframe based flash memory cards App 20070155046 - Takiar; Hem ; et al.	2007-07-05
Rounded contact fingers on substrate/PCB for crack prevention App 20070155247 - Takiar; Hem ; et al.	2007-07-05
Substrate having minimum kerf width App 20070132066 - Takiar; Hem ; et al.	2007-06-14
Padless substrate for surface mounted components App 20070108257 - Liao; Chih-Chin ; et al.	2007-05-17
Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die App 20070096285 - Chiu; Chin-Tien ; et al.	2007-05-03
Method of manufacturing flash memory cards App 20070099340 - Takiar; Hem ; et al.	2007-05-03
High density three dimensional semiconductor die package App 20070096266 - Yu; Cheemen ; et al.	2007-05-03
SiP module with a single sided lid Grant 7,193,161 - Takiar , et al. March 20, 2	2007-03-20
Method of reducing warpage in an over-molded IC package App 20070004094 - Takiar; Hem ; et al.	2007-01-04
Die package with asymmetric leadframe connection App 20070001272 - Lee; Ming Hsun ; et al.	2007-01-04
Apparatus having reduced warpage in an over-molded IC package App 20070001285 - Takiar; Hem ; et al.	2007-01-04
IC memory card Grant D533,556 - Yamada , et al. December 12, 2	2006-12-12
Method of assembling semiconductor devices with LEDs App 20060270105 - Takiar; Hem ; et al.	2006-11-30
System-in-a-package based flash memory card App 20060261454 - Takiar; Hem ; et al.	2006-11-23
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging App 20060231943 - Chiu; Chin-Tien ; et al.	2006-10-19
Liquid crystal display assembly for reducing optical defects Grant 7,102,703 - Mathew , et al. September 5, 2	2006-09-05
IC memory card Grant D517,072 - Yamada , et al. March 14, 2	2006-03-14
IC memory card Grant D510,935 - Yamada , et al. October 25, 2	2005-10-25
IC memory card Grant D510,579 - Yamada , et al. October 11, 2	2005-10-11
IC memory card Grant D507,795 - Yamada , et al. July 26, 2	2005-07-26
IC memory card Grant D505,959 - Yamada , et al. June 7, 2	2005-06-07
PTC fuse including external heat source Grant 6,489,879 - Singh , et al. December 3, 2	2002-12-03
Low cost die sized module for imaging application having a lens housing assembly Grant 6,384,397 - Takiar , et al. May 7, 2	2002-05-07
Multi-station rotary die handling device Grant 6,364,089 - Singh , et al. April 2, 2	2002-04-02
Integrated circuit packaged power supply Grant 5,621,635 - Takiar April 15, 1	1997-04-15