Telephone interconnect module face plate

Description

FIG. 1 is a front, top, and right side perspective view showing our new design for a telephone interconnect module face plate;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a left elevational view thereof.

Claims

The ornamental design for a telephone interconnect module face plate, as shown and described.

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Inventors:	Weber; Janice M. (Elgin, IL), Peterson; Gary E. (Schaumburg, IL), Ng; Richard (Palatine, IL)
Assignee:	Motorola, Inc. (Schaumburg, IL)
Appl. No.:	D/025,960
Filed:	July 18, 1994

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Current U.S. Class:	D14/240; D13/177; D14/257
Field of Search:	;D14/140,142,240,257 ;D13/110,162,164,177,184 ;361/627,622,636,693,801,727,600,736,6,683 ;379/441,442,440

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References Cited [Referenced By]

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U.S. Patent Documents

D274615	July 1984	Bean et al.
D333655	March 1993	Weber
D334561	April 1993	Crater et al.
D337304	July 1993	Lubbe et al.
D337754	July 1993	Peterson et al.
D353810	December 1994	Pullman et al.
4454596	June 1984	Wunsch et al.
4702535	October 1987	Beun
4758928	July 1988	Wierce et al.
4862320	August 1989	Schmidt et al.
5323454	June 1994	Shay et al.

Primary Examiner: Asch; Jeffrey
Attorney, Agent or Firm: Moreno; Christopher P. Egan; Wayne J. Parmelee; Steven G.