Chemical vapor deposition wafer carrier with thermal cover
Krishnan , et al. Oc
Patent Grant D863239
U.S. patent number D863,239 [Application Number D/641,931] was granted by the patent office on 2019-10-15 for chemical vapor deposition wafer carrier with thermal cover. This patent grant is currently assigned to Veeco Instruments Inc.. The grantee listed for this patent is Veeco Instruments Inc.. Invention is credited to Leo Chin, Mandar Deshpande, Alexander Gurary, Sandeep Krishnan, Yuliy Rashkovsky.
| United States Patent | D863,239 |
| Krishnan , et al. | October 15, 2019 |
Chemical vapor deposition wafer carrier with thermal cover
Claims
CLAIM The ornamental design for a chemical vapor deposition wafer carrier with thermal cover, as shown and described.
| Inventors: | Krishnan; Sandeep (Jersey City, NJ), Rashkovsky; Yuliy (Millburn, NJ), Gurary; Alexander (Bridgewater, NJ), Chin; Leo (Poughquag, NY), Deshpande; Mandar (Bridgewater, NJ) | ||||||||||
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| Applicant: |
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| Assignee: | Veeco Instruments Inc.
(Plainview, NY) |
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| Appl. No.: | D/641,931 | ||||||||||
| Filed: | March 26, 2018 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;D15/144,144.1,144.2 ;D23/323,328,335,336,337,341,352,357,385,386,397,399,400,406,411,413,499 |
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Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Patterson Thuente Pedersen, P.A.
Description
FIG. 1 is a perspective view of a first embodiment of a chemical vapor deposition wafer carrier with thermal cover showing our new design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a right side view thereof, with the left side view, front view, and rear view being identical.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a perspective view of a second embodiment of a chemical vapor deposition wafer carrier with thermal cover, showing our new design, which differs from the embodiment shown in FIG. 1 in that it includes staples extending through the thickness of the chemical vapor deposition wafer carrier with thermal cover; and,
FIG. 6 is a perspective view of the thermal cover of the chemical vapor deposition wafer carrier with thermal cover, shown separately from the base without staples for ease of illustration.
In each of the figures, portions or features shown in broken lines form no part of the claimed design.
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Patent Diagrams and Documents
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