U.S. patent number D826,185 [Application Number D/596,974] was granted by the patent office on 2018-08-21 for ceiling heater for substrate processing apparatus.
This patent grant is currently assigned to HITACHI KOKUSAI ELECTRIC INC.. The grantee listed for this patent is Hitachi Kokusai Electric Inc.. Invention is credited to Tetsuya Kosugi, Shuhei Saido, Takatomo Yamaguchi.
United States Patent |
D826,185 |
Kosugi , et al. |
August 21, 2018 |
Ceiling heater for substrate processing apparatus
Claims
CLAIM We claim the ornamental design for a ceiling heater for
substrate processing apparatus, as shown and described.
Inventors: |
Kosugi; Tetsuya (Toyama,
JP), Yamaguchi; Takatomo (Toyama, JP),
Saido; Shuhei (Toyama, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Hitachi Kokusai Electric Inc. |
Tokyo |
N/A |
JP |
|
|
Assignee: |
HITACHI KOKUSAI ELECTRIC INC.
(Tokyo, JP)
|
Appl.
No.: |
D/596,974 |
Filed: |
March 13, 2017 |
Foreign Application Priority Data
|
|
|
|
|
Oct 14, 2016 [JP] |
|
|
022413/2016 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/123-132,154,184,199
;D15/138,140,144.1 |
References Cited
[Referenced By]
U.S. Patent Documents
Foreign Patent Documents
Other References
EC21 Inc. <URL:
https://diamondhrichard.en.ec21.com/Duplex_Winding_Infrared_Coil_Ceramic--
-5521314_8834245.html.> Visited Feb. 28, 2018. Duplex Winding
Infrared Coil/ Ceramic Cooker/ Heating Plate/Radiant Element/Hob.
cited by examiner .
Modello designs. <URL:
https://www.modellocustomstencils.com/collections/medallion-stencils.>
Visited Feb. 28, 2018. Medallion Stencils. cited by
examiner.
|
Primary Examiner: Johannes; Thomas
Assistant Examiner: McVey; Lauren
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery,
LLP
Description
FIG. 1 is a front, bottom and right side perspective view of a
ceiling heater for substrate processing apparartus showing our new
design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a rear elevational view thereof.
* * * * *
References