Cover of seal cap for reaction chamber of semiconductor

Description

FIG. 1 is a front, top and right side perspective view of a cover of seal cap for reaction chamber of semiconductor showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a left side elevational view; and,

FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 4.

Claims

CLAIM The ornamental design for a cover of seal cap for reaction chamber of semiconductor, as shown and described.

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Inventors:	Okajima; Yusaku (Toyama, JP), Saido; Shuhei (Toyama, JP), Urushihara; Mika (Toyama, JP)
Applicant:	Name City State Country Type Hitachi Kokusai Electric Inc. Tokyo N/A JP
Assignee:	HITACHI KOKUSAI ELECTRIC INC. (Tokyo, JP)
Appl. No.:	D/591,907
Filed:	January 25, 2017

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Foreign Application Priority Data

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Jul 26, 2016 [JP]			015868/2016

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,184,162 ;D10/49,50

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References Cited [Referenced By]

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U.S. Patent Documents

5789810	August 1998	Gross
6251189	June 2001	Odake
D602886	October 2009	Dao
D642547	August 2011	Untersee
D720309	December 2014	Kaneko
D742339	November 2015	Takagi
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D796458	September 2017	Jang
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2017/0221790	August 2017	Tomie
2017/0229360	August 2017	Kothandapani

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, LLP