Circuit board material

Description

The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

FIG. 1 is a front view of a circuit board material showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is an enlarged front view of the enclosed portion in FIG. 1;

FIG. 8 is an enlarged right side view of the enclosed portion in FIG. 5; and,

FIG. 9 is an enlarged cross sectional view taken along line 9-9 in FIG. 7.

The upper layer of the circuit board material is a flat, transparent surface in which an underlying second layer showing a woven structure is visible through the first upper layer.

Dashed-dot-dashed broken lines define the boundary lines of the enlarged portions of the design in FIGS. 1, 5, and 7-9.

Claims

CLAIM The ornamental design for a circuit board material, as shown and described.

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Inventors:	Nakabayashi; Makoto (Osaka, JP), Kouchi; Masahiko (Koka, JP)
Applicant:	Name City State Country Type SUMITOMO ELECTRIC FINE POLYMER, INC. SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. Sennan-gun, Osaka Koka-shi, Shiga N/A N/A JP JP
Assignee:	SUMITOMO ELECTRIC FINE POLYMER, INC. (Osaka, JP) SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (Shiga, JP)
Appl. No.:	D/478,679
Filed:	January 7, 2014

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Foreign Application Priority Data

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Jul 10, 2013 [JP]			2013-015840

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;D5/55,58,59 ;D25/103 ;336/199,200,205,206 ;439/55,64,68,77,78 ;174/250,251,255,256,257,258,259 ;361/720,748,749,750,751,760,761,762

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References Cited [Referenced By]

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U.S. Patent Documents

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Other References

Products News 173, "Black colored flexible printed circuit stiffener," http://www.risho.co.jp/rishonews/pn173/productnews.html, Risho Kogyo Co., Ltd., Jul. 10, 2010, 4 pgs., with English abstract. cited by applicant . Chukoh Flo, "Copper-Clad Laminates," Chukoh Chemical Industries, Ltd., Nov. 1, 2007, 5 pgs., with English abstract. cited by applicant . Pillar PC-Clad, "Microwave Copper-Clad Laminates," Release date Unknown but publicly known at least as early as 2008, Nippon Pillar Packing Co., Ltd., 5 pgs., with English abstract. cited by applicant.

Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: McDermott Will & Emery LLP