Panel board for integrated circuit packages
Murphy February 17, 1
U.S. patent number D258,281 [Application Number 05/836,246] was granted by the patent office on 1981-02-17 for panel board for integrated circuit packages. This patent grant is currently assigned to Electronic Molding Corporation. Invention is credited to James V. Murphy.
| United States Patent | D258,281 |
| Murphy | February 17, 1981 |
Panel board for integrated circuit packages
Claims
The ornamental design for a panel board for integrated circuit packages, substantially as shown and described.
| Inventors: | Murphy; James V. (Warwick, RI) |
|---|---|
| Assignee: | Electronic Molding Corporation
(Woonsocket, RI) |
| Appl. No.: | 05/836,246 |
| Filed: | September 23, 1977 |
| Current U.S. Class: | D13/182 |
| Current International Class: | D1303 |
| Field of Search: | ;D13/12,13,24 ;174/68.5 |
References Cited [Referenced By]
U.S. Patent Documents
| D235264 | June 1975 | Murphy |
Other References
|
Api/Amp Terminal & Connector Handbook, 1972, p. 551, Standard Series Panels. . Electronic Molding Corp. Product Bulletin, FS-18, High Density Nurl-Loc, i.c. Panel.. |
Primary Examiner: Lucas; Susan J.
Attorney, Agent or Firm: Salter; Elliot A.
Description
FIG. 1 is a top plan view of one side of a panel board for integrated circuit packages showing my new design, the other side being substantially identical thereto;
FIG. 2 is a side elevational view thereof;
FIG. 3 is a fragmentary, front elevational view thereof, the board being broken away for convenience of illustration;
FIG. 4 is a fragmentary, rear elevational view thereof, the board being broken away for convenience of illustration.
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