Circuit package lid

Description

FIG. 1 is a front perspective view of a circuit package lid;

FIG. 2 is a front view of the circuit package lid;

FIG. 3 is a top view of the circuit package lid;

FIG. 4 is a bottom view of the circuit package lid;

FIG. 5 is a left side view of the circuit package lid;

FIG. 6 is a right side view of the circuit package lid; and,

FIG. 7 is a rear view of the circuit package lid.

Claims

CLAIM The ornamental design for a circuit package lid, as shown and described.

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Inventors:	Heng; Stephen (Las Gatos, CA), Dandia; Sanjay (San Jose, CA), Banouvong; Nikon (San Jose, CA), Leong; Chia-Ken (Fremont, CA)
Assignee:	Advanced Micro Devices, Inc. (Sunnyvale, CA)
Appl. No.:	D/358,472
Filed:	March 26, 2010

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;439/70,71,72,73,74,330,331,620.2

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References Cited [Referenced By]

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U.S. Patent Documents

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Other References

L1 Package; 2008; pp. 1-3. cited by other . Picture of Socket F design; from www.commons.wikimedia.org; Mar. 25, 2010. cited by other . Advanced Micro Devices; AMD Socket F (1207) Design Specification; Publication No. 31700; Revision 1.03; Mar. 2006. cited by other . U.S. Appl. No. 29/358,467, filed Mar. 26, 2010. cited by other . U.S. Appl. No. 29/358,436, filed Mar. 26, 2010. cited by other . U.S. Appl. No. 29/358,473, filed Mar. 26, 2010. cited by other . U.S. Appl. No. 29/358,468, filed Mar. 26, 2010. cited by other . U.S. Appl. No. 29/358,435, filed Mar. 26, 2010. cited by other.

Primary Examiner: Sikder; Selina
Attorney, Agent or Firm: Vedder Price P.C.