U.S. patent number D701,498 [Application Number D/414,723] was granted by the patent office on 2014-03-25 for arm for wafer transportation for manufacturing semiconductor.
This patent grant is currently assigned to Tokyo Electron Limited. The grantee listed for this patent is Naruaki Iida, Hideki Kajiwara. Invention is credited to Naruaki Iida, Hideki Kajiwara.
United States Patent |
D701,498 |
Iida , et al. |
March 25, 2014 |
Arm for wafer transportation for manufacturing semiconductor
Claims
CLAIM The ornamental design for arm for wafer transportation for
manufacturing semiconductor, as shown and described.
Inventors: |
Iida; Naruaki (Koshi,
JP), Kajiwara; Hideki (Koshi, JP) |
Applicant: |
Name |
City |
State |
Country |
Type |
Iida; Naruaki
Kajiwara; Hideki |
Koshi
Koshi |
N/A
N/A |
JP
JP |
|
|
Assignee: |
Tokyo Electron Limited
(Minato-Ku, JP)
|
Appl.
No.: |
D/414,723 |
Filed: |
March 2, 2012 |
Foreign Application Priority Data
|
|
|
|
|
Oct 20, 2011 [JP] |
|
|
2011-024076 |
|
Current U.S.
Class: |
D13/182 |
Current International
Class: |
1303 |
Field of
Search: |
;D13/182
;118/500,725,728,729 ;294/103.1 ;414/217,222.01,416.03,941 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Oswecki; Elizabeth J
Attorney, Agent or Firm: Burr & Brown, PLLC
Description
FIG. 1 is perspective view of an arm for wafer transportation for
manufacturing semiconductor showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a left side view thereof, the right side view being a
mirror image;
FIG. 7 is an enlarged sectional view taken along line 7-7 of FIG.
2; and,
FIG. 8 is an enlarged sectional view taken along line 8-8 of FIG.
2.
The broken lines shown in the drawings represent portions of the
arm for wafer transportation for manufacturing semiconductor that
form no part of the claimed design.
* * * * *