U.S. patent number D648,328 [Application Number D/371,311] was granted by the patent office on 2011-11-08 for earphone.
This patent grant is currently assigned to Sony Corporation. Invention is credited to So Morimoto.
United States Patent |
D648,328 |
Morimoto |
November 8, 2011 |
Earphone
Claims
CLAIM The ornamental design for an earphone, as shown and
described.
Inventors: |
Morimoto; So (Tokyo,
JP) |
Assignee: |
Sony Corporation (Tokyo,
JP)
|
Appl.
No.: |
D/371,311 |
Filed: |
December 28, 2010 |
Foreign Application Priority Data
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|
|
|
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Aug 4, 2010 [CN] |
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2010 3 0262795 |
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Current U.S.
Class: |
D14/223 |
Current International
Class: |
1401 |
Field of
Search: |
;D14/205,206,223,188,192
;181/129,130,135 ;381/380,381 ;379/430,431,433.01,433.02
;455/90.3,575.2 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Greene; Paula
Attorney, Agent or Firm: Rader, Fishman & Grauer
PLLC
Description
FIG. 1 is a front, top, right perspective view of a first
embodiment of an earphone showing my new design;
FIG. 2 is a front, top, left perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
FIG. 9 is a front, top, right perspective view of a second
embodiment of an earphone showing my new design;
FIG. 10 is a front, top, left perspective view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a rear elevational view thereof;
FIG. 13 is a left side elevational view thereof;
FIG. 14 is a right side elevational view thereof;
FIG. 15 is a top plan view thereof; and,
FIG. 16 is a bottom plan view thereof.
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