U.S. patent number D576,855 [Application Number D/295,220] was granted by the patent office on 2008-09-16 for polishing pad. This patent grant is currently assigned to JSR Corporation. Invention is credited to Takahiro Okamoto, Hiroshi Shiho.
United States Patent | D576,855 |
Okamoto , et al. | September 16, 2008 |
Inventors: | Okamoto; Takahiro (Tokyo, JP), Shiho; Hiroshi (Tokyo, JP) |
---|---|
Assignee: | JSR Corporation (Tokyo,
JP) |
Appl. No.: | D/295,220 |
Filed: | September 24, 2007 |
Application Number | Filing Date | Patent Number | Issue Date | ||
---|---|---|---|---|---|
29213407 | Sep 17, 2004 | D559064 | |||
Mar 17, 2004 [JP] | 2004-8161 | |||
Mar 17, 2004 [JP] | 2004-8162 | |||
Current U.S. Class: | D8/70 |
Current International Class: | 0805 |
Field of Search: | ;D8/61,62,63,70 ;D15/124,126,138,139,140 ;15/230 ;83/835 ;451/6,60,287,288,359,446,526,527,533,541,548,550 |
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US. Appl. No. 29/213,405, filed Sep. 17, 2004, Okamoto, et al. cited by other . U.S. Appl. No. 29/296,712, filed Oct. 26, 2007, Okamoto, et al. cited by other. |
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