Shiho; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Shiho; Hiroshi.The latest application filed is for "method of manufacturing chemical mechanical polishing pad".

Company Profile

0.27.22

Shiho; Hiroshi - Chuo-ku JP
Shiho; Hiroshi - Tokyo JP
Shiho, Hiroshi - Mie JP
Shiho; Hiroshi - Mie-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing pad Grant D600,989 - Tano , et al. September 29, 2	2009-09-29
Polishing pad Grant D592,030 - Tano , et al. May 12, 2	2009-05-12
Polishing pad Grant D592,029 - Tano , et al. May 12, 2	2009-05-12
Polishing pad Grant D584,591 - Tano , et al. January 13, 2	2009-01-13
Polishing pad Grant D581,237 - Okamoto , et al. November 25, 2	2008-11-25
Chemical mechanical polishing pad Grant 7,442,116 - Miyauchi , et al. October 28, 2	2008-10-28
Polishing pad Grant D576,855 - Okamoto , et al. September 16, 2	2008-09-16
Chemical mechanical polishing pad and chemical mechanical polishing process Grant 7,354,527 - Tano , et al. April 8, 2	2008-04-08
Method of manufacturing chemical mechanical polishing pad Grant 7,329,174 - Hosaka , et al. February 12, 2	2008-02-12
Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer Grant 7,323,415 - Shiho , et al. January 29, 2	2008-01-29
Polishing pad Grant D560,457 - Miyauchi , et al. January 29, 2	2008-01-29
Polishing pad Grant D559,648 - Miyauchi , et al. January 15, 2	2008-01-15
Polishing pad Grant D559,064 - Okamoto , et al. January 8, 2	2008-01-08
Polishing pad Grant D559,065 - Miyauchi , et al. January 8, 2	2008-01-08
Polishing pad Grant D559,063 - Okamoto , et al. January 8, 2	2008-01-08
Polishing pad Grant D559,066 - Tano , et al. January 8, 2	2008-01-08
Method of manufacturing chemical mechanical polishing pad App 20070082587 - Hosaka; Yukio ; et al.	2007-04-12
Chemical mechanical polishing pad and chemical mechanical polishing method Grant 7,183,213 - Shiho , et al. February 27, 2	2007-02-27
Silane composition, silicon film forming method and solar cell production method Grant 7,173,180 - Shiho , et al. February 6, 2	2007-02-06
Silane composition, silicon film forming method and solar cell production method App 20060185712 - Shiho; Hiroshi ; et al.	2006-08-24
Silane composition, silicon film forming method and solar cell production method Grant 7,067,069 - Shiho , et al. June 27, 2	2006-06-27
Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer App 20060128271 - Shiho; Hiroshi ; et al.	2006-06-15
Chemical mechanical polishing pad and chemical mechanical polishing process App 20060060569 - Tano; Hiroyuki ; et al.	2006-03-23
Polishing pad Grant 6,992,123 - Shiho , et al. January 31, 2	2006-01-31
Polishing pad Grant 6,976,910 - Hosaka , et al. December 20, 2	2005-12-20
Chemical mechanical polishing pad and chemical mechanical polishing method App 20050260929 - Shiho, Hiroshi ; et al.	2005-11-24
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers App 20050245171 - Hosaka, Yukio ; et al.	2005-11-03
Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method App 20050239380 - Hosaka, Yukio ; et al.	2005-10-27
Aqueous dispersion, process for production thereof and coated substances Grant 6,953,821 - Tamori , et al. October 11, 2	2005-10-11
Chemical mechanical polishing pad, production method thereof, and chemical mechanical polishing process App 20050222336 - Okamoto, Takahiro ; et al.	2005-10-06
Chemical mechanical polishing pad App 20050113011 - Miyauchi, Hiroyuki ; et al.	2005-05-26
Ruthenium film, ruthenium oxide film and process for forming the same Grant 6,875,518 - Shiho , et al. April 5, 2	2005-04-05
Chemical mechanical polishing pad and chemical mechanical polishing method App 20050014376 - Shiho, Hiroshi ; et al.	2005-01-20
Polishing pad App 20050003749 - Hosaka, Yukio ; et al.	2005-01-06
Method of machining semiconductor wafer-use polishing pad and semiconductor wafer-use polishing pad App 20040266326 - Shiho, Hiroshi ; et al.	2004-12-30
Polishing pad and method of polishing a semiconductor wafer App 20040224611 - Aoi, Hiromi ; et al.	2004-11-11
Polishing pad and chemical mechanical polishing method App 20040224616 - Shiho, Hiroshi ; et al.	2004-11-11
Tantalum oxide film, use thereof, process for forming the same and composition Grant 6,806,210 - Shiho , et al. October 19, 2	2004-10-19
Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method App 20040203320 - Hosaka, Yukio ; et al.	2004-10-14
Polishing pad App 20040118051 - Shiho, Hiroshi ; et al.	2004-06-24
Polishing pad and multi-layer polishing pad App 20040014413 - Kawahashi, Nobuo ; et al.	2004-01-22
Coating composition and hardened film obtained therefrom Grant 6,660,394 - Ishizuki , et al. December 9, 2	2003-12-09
Gas barrier coating composition, process for producing the same, and gas barrier coating film Grant 6,656,602 - Ishikawa , et al. December 2, 2	2003-12-02
Gas barrier coating composition and method for manufacturing same App 20030187113 - Shiho, Hiroshi ; et al.	2003-10-02
Aqueous dispersion, process for production thereof and coated substances App 20030045626 - Tamori, Kouji ; et al.	2003-03-06
Silane composition, silicon film forming method and solar cell production method App 20030045632 - Shiho, Hiroshi ; et al.	2003-03-06
Rutenium film rutenium oxide film, and method for formation thereof App 20030008157 - Shiho, Hiroshi ; et al.	2003-01-09
Tantalum oxide film, use thereof, and method and composition for forming the same App 20030003235 - Shiho, Hiroshi ; et al.	2003-01-02
Coating composition, and a coated film and glass each having a coating layer comprised thereof Grant 6,485,838 - Shimada , et al. November 26, 2	2002-11-26