U.S. patent number D510,850 [Application Number D/172,952] was granted by the patent office on 2005-10-25 for polishing pad. This patent grant is currently assigned to Production Chemical Mfg. Inc.. Invention is credited to Lewyn B. Boler, Jr..
United States Patent | D510,850 |
Boler, Jr. | October 25, 2005 |
Inventors: | Boler, Jr.; Lewyn B. (Stockton, CA) |
---|---|
Assignee: | Production Chemical Mfg. Inc.
(Stockton, CA) |
Appl. No.: | D/172,952 |
Filed: | December 20, 2002 |
Current U.S. Class: | D8/70 |
Current International Class: | 0805 |
Field of Search: | ;D8/70,20,61,62,63,90 ;D4/137 ;D15/124,126,138,139 ;D32/35,40,42 ;15/229.11,229.14,230,230.14,230.11,244.1,234.11,209.1,166 ;30/307,347,355,388,389,390 ;51/276 ;83/663,676,835 ;125/15,18 ;451/259,359,420,490,510,540,541,542,548,550 |
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