Wafer transfer apparatus

Hiroki , et al. February 19, 2

Patent Grant D562524

U.S. patent number D562,524 [Application Number D/220,627] was granted by the patent office on 2008-02-19 for wafer transfer apparatus. This patent grant is currently assigned to Tokyo Electron Limited. Invention is credited to Tsutomu Hiroki, Wataru Machiyama, Takehiro Shindo.


United States Patent D562,524
Hiroki ,   et al. February 19, 2008

Wafer transfer apparatus

Claims

CLAIM We claim the ornamental design for a wafer transfer apparatus, as shown and described.
Inventors: Hiroki; Tsutomu (Yamanashi, JP), Machiyama; Wataru (Yamanashi, JP), Shindo; Takehiro (Yamanashi, JP)
Assignee: Tokyo Electron Limited (Tokyo, JP)
Appl. No.: D/220,627
Filed: January 5, 2005

Foreign Application Priority Data

Jul 20, 2004 [JP] 2004-21726
Current U.S. Class: D34/28; D34/35
Current International Class: 1205
Field of Search: ;D34/29,35 ;198/771,866,890,367,890.1,370.1,370.04,782,722 ;193/35A,35C ;438/220,232,5,689

References Cited [Referenced By]

U.S. Patent Documents
4810019 March 1989 Brucher
6279730 August 2001 Schreger et al.
6927181 August 2005 Wakizako et al.
6949466 September 2005 Jeong
D525408 July 2006 Nitadori
7104867 September 2006 Jeong
2002/0162742 November 2002 Bae et al.
2003/0064902 April 2003 Ng et al.
2004/0048474 March 2004 Asano
2004/0092069 May 2004 Ishii et al.
2005/0145584 July 2005 Buckley et al.
2005/0255609 November 2005 Kumagai et al.
2006/0046376 March 2006 Hofer et al.
2006/0105580 May 2006 Wirth et al.
2006/0166503 July 2006 Sasaki et al.
2006/0169674 August 2006 Mao et al.
2006/0194445 August 2006 Hayashi et al.
Primary Examiner: Ramirez; Cynthia E.
Attorney, Agent or Firm: Smith, Gambrell & Russell, LLP

Description



FIG. 1 is a top view of the wafer transfer apparatus of the present design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a back elevational view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus;

FIG. 8 is a reference figure showing a top view seen from a back-left hand side of the apparatus;

FIG. 9 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;

FIG. 10 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus;

FIG. 11 is a reference figure showing a right side view seen from a back side of the apparatus;

FIG. 12 is a reference figure showing a perspective view seen from the back-left hand side of the apparatus;

FIG. 13 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;

FIG. 14 is a reference figure showing a perspective view seen from the front-left hand side of the apparatus;

FIG. 15 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus; and,

FIG. 16 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus.

The broken line showing of wafers in some of the figures is included for the purpose of illustrating environment and forms no part of the claimed design.

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