Portion of a matrix for surface mount package leadframe

Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Claims

CLAIM The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.

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Inventors:	Harnden; James (Hollister, CA), Williams; Richard K. (Cupertino, CA), Chia; Anthony (Singapore, SG), Weibing; Chu (Shanghai, CN), Lam; Allen K. (Fremont, CA)
Assignee:	GEM Services, Inc. (San Jose, CA)
Appl. No.:	D/173,644
Filed:	January 3, 2003

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Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182 ;29/622,740,827 ;74/56.2,52.4 ;206/713,714,715,716,727,728 ;257/667,668 ;333/185 ;428/573

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References Cited [Referenced By]

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U.S. Patent Documents

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Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Townsend and Townsend and Crew LLP