Lam; Allen K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lam; Allen K..The latest application filed is for "space-efficient package for laterally conducting device".

Company Profile

0.12.5

Lam; Allen K. - Fremont CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Space-efficient package for laterally conducting device Grant 7,667,309 - Harnden , et al. February 23, 2	2010-02-23
Space-efficient package for laterally conducting device Grant 7,485,498 - Harnden , et al. February 3, 2	2009-02-03
Space-efficient package for laterally conducting device App 20080217662 - Harnden; James ; et al.	2008-09-11
Space-efficient package for laterally conducting device App 20070134851 - Harnden; James ; et al.	2007-06-14
Space-efficient package for laterally conducting device Grant 7,215,012 - Harnden , et al. May 8, 2	2007-05-08
Portion of a matrix for surface mount package leadframe Grant D513,608 - Harnden , et al. January 17, 2	2006-01-17
Portion of a matrix for surface mount package leadframe Grant D505,122 - Harnden , et al. May 17, 2	2005-05-17
Portion of a matrix for surface mount package leadframe Grant D505,121 - Harnden , et al. May 17, 2	2005-05-17
Package for semiconductor die containing symmetrical lead and heat sink Grant 6,800,932 - Lam , et al. October 5, 2	2004-10-05
Space-efficient package for laterally conducting device App 20040173881 - Harnden, James ; et al.	2004-09-09
Portion of a matrix for surface mount package leadframe Grant D488,136 - Harnden , et al. April 6, 2	2004-04-06
Portion of a matrix for surface mount package leadframe Grant D487,431 - Harnden , et al. March 9, 2	2004-03-09
Portion of a matrix for surface mount package leadframe Grant D485,808 - Harnden , et al. January 27, 2	2004-01-27
Symmetrical package for semiconductor die App 20020071253 - Lam, Allen K. ; et al.	2002-06-13
Symmetrical package for semiconductor die App 20010040277 - Lam, Allen K. ; et al.	2001-11-15
Surface mount semiconductor package, die-leadframe combination and leadframe therefor and method of mounting leadframes to surfaces of semiconductor die Grant 6,307,755 - Williams , et al. October 23, 2	2001-10-23
Symmetrical package for semiconductor die Grant 6,256,200 - Lam , et al. July 3, 2	2001-07-03

Company Registrations

SEC

0001329738

LAM ALLEN K

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.