loadpatents
name:-0.0087389945983887
name:-0.063324213027954
name:-0.0014288425445557
Weibing; Chu Patent Filings

Weibing; Chu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Weibing; Chu.The latest application filed is for "space-efficient package for laterally conducting device".

Company Profile
0.26.6
  • Weibing; Chu - Shanghai CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Space-efficient package for laterally conducting device
Grant 7,667,309 - Harnden , et al. February 23, 2
2010-02-23
Space-efficient package for laterally conducting device
Grant 7,485,498 - Harnden , et al. February 3, 2
2009-02-03
Space-efficient package for laterally conducting device
App 20080217662 - Harnden; James ;   et al.
2008-09-11
Space-efficient package for laterally conducting device
App 20070134851 - Harnden; James ;   et al.
2007-06-14
Space-efficient package for laterally conducting device
Grant 7,215,012 - Harnden , et al. May 8, 2
2007-05-08
Surface mount package
App 20070007640 - Harnden; James ;   et al.
2007-01-11
Surface mount package
Grant 7,057,273 - Harnden , et al. June 6, 2
2006-06-06
Portion of a matrix for surface mount package leadframe
Grant D513,608 - Harnden , et al. January 17, 2
2006-01-17
Surface mount package
App 20050145998 - Harnden, James ;   et al.
2005-07-07
Portion of a matrix for surface mount package leadframe
Grant D505,121 - Harnden , et al. May 17, 2
2005-05-17
Portion of a matrix for surface mount package leadframe
Grant D505,122 - Harnden , et al. May 17, 2
2005-05-17
Space-efficient package for laterally conducting device
App 20040173881 - Harnden, James ;   et al.
2004-09-09
Portion of a matrix for surface mount package leadframe
Grant D494,939 - Harnden , et al. August 24, 2
2004-08-24
Portion of a matrix for surface mount package leadframe
Grant D492,266 - Harnden , et al. June 29, 2
2004-06-29
Portion of a matrix for surface mount package leadframe
Grant D491,900 - Harnden , et al. June 22, 2
2004-06-22
Portion of a matrix for surface mount package leadframe
Grant D488,136 - Harnden , et al. April 6, 2
2004-04-06
Portion of a matrix for surface mount package leadframe
Grant D487,432 - Harnden , et al. March 9, 2
2004-03-09
Portion of a matrix for surface mount package leadframe
Grant D487,431 - Harnden , et al. March 9, 2
2004-03-09
Portion of a matrix for surface mount package leadframe
Grant D486,802 - Harnden , et al. February 17, 2
2004-02-17
Portion of a matrix for surface mount package leadframe
Grant D485,808 - Harnden , et al. January 27, 2
2004-01-27
Portion of a matrix for surface mount package leadframe
Grant D485,244 - Harnden , et al. January 13, 2
2004-01-13
Portion of a matrix for surface mount package leadframe
Grant D485,243 - Harnden , et al. January 13, 2
2004-01-13
Portion of a matrix for surface mount package leadframe
Grant D484,858 - Harnden , et al. January 6, 2
2004-01-06
Portion of a matrix for surface mount package leadframe
Grant D484,859 - Harnden , et al. January 6, 2
2004-01-06
Portion of a matrix for surface mount package leadframe
Grant D484,103 - Harnden , et al. December 23, 2
2003-12-23
Portion of a matrix for surface mount package leadframe
Grant D484,104 - Harnden , et al. December 23, 2
2003-12-23
Portion of a matrix for surface mount package leadframe
Grant D483,336 - Harnden , et al. December 9, 2
2003-12-09
Portion of a matrix for surface mount package leadframe
Grant D483,337 - Harnden , et al. December 9, 2
2003-12-09
Surface mount package
App 20030062601 - Harnden, James ;   et al.
2003-04-03
Surface mount package
Grant D471,165 - Williams , et al. March 4, 2
2003-03-04
Leadframe matrix for a surface mount package
Grant D465,207 - Williams , et al. November 5, 2
2002-11-05
Surface mount package
Grant D462,062 - Williams , et al. August 27, 2
2002-08-27

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