Surface mount package

Description

FIG. 1 is a perspective view of a surface mount package showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof:

FIG. 4 is a front elevational view thereof:

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a left side elevational view thereof; and,

FIG. 7 the right side elevational view thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a surface mount package, as shown and described.

---

Inventors:	Williams; Richard K. (Cupertino, CA), Harnden; James (Hollister, CA), Chia; Anthony (Singapore, SG), Weibing; Chu (Shanghai, CN)
Assignee:	GEM Services, Inc. (Santa Clara, CA)
Appl. No.:	D/142,096
Filed:	May 18, 2001

---

Current U.S. Class:	D13/182
Current International Class:	1303
Field of Search:	;D13/182,114 ;257/621,666,669,672,673,674,676,684,690,692,696,710,711,730,731 ;361/718,742,760,774,820

---

References Cited [Referenced By]

---

U.S. Patent Documents

5224021	June 1993	Takada et al.
5446623	August 1995	Kanetake
5521429	May 1996	Aono et al.
5689135	November 1997	Ball

Other References

JEDEC Solid State Product Outlines, "Small Outline J-Lead" (SOJ) .300 Body Family (MS-013 Body), Issue A, Jun., 1988, MO-088, AA-AF. . JEDEC Solid State Product Outline, Low Profile Small Outline J-Lead Package (LSOJ), PRSO-J/LSOJ, Issue B, Jun., 1999, MO-199, pp. 1-5. . JEDEC Solid State Product Outlines, "Plastic Small Outline (SOJ) Package Family with .330 Inch Body Width", Issue B, May, 1992, MO-121, pp. 1-2..

Primary Examiner: Gandy; James
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Townsend & Townsend & Crew LLP