U.S. patent number D487,432 [Application Number D/175,588] was granted by the patent office on 2004-03-09 for portion of a matrix for surface mount package leadframe. This patent grant is currently assigned to GEM Services, Inc.. Invention is credited to Anthony Chia, James Harnden, Chu Weibing, Richard K. Williams.
United States Patent | D487,432 |
Harnden , et al. | March 9, 2004 |
Inventors: | Harnden; James (Hollister, CA), Williams; Richard K. (Cupertino, CA), Chia; Anthony (Singapore, SG), Weibing; Chu (Shanghai, CN) |
---|---|
Assignee: | GEM Services, Inc. (San Jose,
CA) |
Appl. No.: | D/175,588 |
Filed: | February 7, 2003 |
Current U.S. Class: | D13/182 |
Current International Class: | 1303 |
Field of Search: | ;D13/182 ;29/622,827 ;174/52.2,52.4 ;206/713,714,715,716,727,728 ;257/667,668 ;333/185 ;428/573 |
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