Leadframe matrix for a surface mount package
Williams , et al. November 5, 2
U.S. patent number D465,207 [Application Number D/143,226] was granted by the patent office on 2002-11-05 for leadframe matrix for a surface mount package. This patent grant is currently assigned to GEM Services, Inc.. Invention is credited to Anthony Chia, James Harnden, Chu Weibing, Richard K. Williams.
| United States Patent | D465,207 |
| Williams , et al. | November 5, 2002 |
Leadframe matrix for a surface mount package
Claims
The ornamental design for leadframe matrix for a surface mount package, as shown and described.
| Inventors: | Williams; Richard K. (Cupertino, CA), Harnden; James (Hollister, CA), Chia; Anthony (Singapore, SG), Weibing; Chu (Shanghai, CN) |
|---|---|
| Assignee: | GEM Services, Inc. (Santa
Clara, CA) |
| Appl. No.: | D/143,226 |
| Filed: | June 8, 2001 |
| Current U.S. Class: | D13/182; D13/184 |
| Current International Class: | 1303 |
| Field of Search: | ;D9/345 ;D13/182,184 ;174/52.4 ;206/714,715,716,713,727,728 |
References Cited [Referenced By]
U.S. Patent Documents
| 4118859 | October 1978 | Busler |
| 4234666 | November 1980 | Gursky |
| 4633582 | January 1987 | Ching et al. |
| 4809054 | February 1989 | Waldner |
| 4818960 | April 1989 | Satoh et al. |
| 4852250 | August 1989 | Andrews |
| 4865193 | September 1989 | Shimamoto et al. |
| 5115299 | May 1992 | Wright |
| 5900582 | May 1999 | Tomita et al. |
| 6016918 | January 2000 | Ziberna |
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Townsend and Townsend and Crew LLP
Description
FIG. 1 is a top plan view of a portion of a leadframe matrix for a surface mount package showing my new design;
FIG. 2 is a top plan view of a single surface mount package shown at a lager scale for clarity of illustration; and,
FIG. 3 is a perspective view of FIG. 1.
The leadframe matrix for a surface mount package is shown broken away in FIGS. 1 and 3 of the drawing to indicate indeterminant length, it being understood that it has a uniform shape and appearance throughout its length.
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