Portion of a matrix for surface mount package leadframe
Harnden , et al. January 6, 2
U.S. patent number D484,858 [Application Number D/171,102] was granted by the patent office on 2004-01-06 for portion of a matrix for surface mount package leadframe. This patent grant is currently assigned to GEM Services, Inc.. Invention is credited to Anthony Chia, James Harnden, Chu Weibing, Richard K. Williams.
| United States Patent | D484,858 |
| Harnden , et al. | January 6, 2004 |
Portion of a matrix for surface mount package leadframe
Claims
The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
| Inventors: | Harnden; James (Hollister, CA), Williams; Richard K. (Cupertino, CA), Chia; Anthony (Singapore, SG), Weibing; Chu (Shanghai, CN) |
|---|---|
| Assignee: | GEM Services, Inc. (San Jose,
CA) |
| Appl. No.: | D/171,102 |
| Filed: | November 15, 2002 |
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;29/622,827 ;174/52.2,52.4 ;206/713,714,715,716,727,728 ;257/667,668 ;333/185 ;428/573 |
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Townsend and Townsend and Crew LLP
Description
FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;
FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,
FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.
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