Portion of a matrix for surface mount package leadframe

Harnden , et al. December 23, 2

Patent Grant D484103

U.S. patent number D484,103 [Application Number D/171,103] was granted by the patent office on 2003-12-23 for portion of a matrix for surface mount package leadframe. This patent grant is currently assigned to GEM Services, Inc.. Invention is credited to Anthony Chia, James Harnden, Chu Weibing, Richard K. Williams.


United States Patent D484,103
Harnden ,   et al. December 23, 2003

Portion of a matrix for surface mount package leadframe

Claims

The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.
Inventors: Harnden; James (Hollister, CA), Williams; Richard K. (Cupertino, CA), Chia; Anthony (Singapore, SG), Weibing; Chu (Shanghai, CN)
Assignee: GEM Services, Inc. (San Jose, CA)
Appl. No.: D/171,103
Filed: November 15, 2002

Current U.S. Class: D13/182
Current International Class: 1303
Field of Search: ;D13/182 ;29/622,827 ;174/52.2,52.4 ;206/713,714,715,716,727,728 ;257/667,668 ;333/185 ;428/573

References Cited [Referenced By]

U.S. Patent Documents
4118859 October 1978 Busler
4234666 November 1980 Gursky
4298883 November 1981 Komatsu et al.
4633582 January 1987 Ching et al.
4809054 February 1989 Waldner
4818960 April 1989 Satoh et al.
4852250 August 1989 Andrews
4865193 September 1989 Shimamoto et al.
5115299 May 1992 Wright
5554886 September 1996 Song
5900582 May 1999 Tomita et al.
6016918 January 2000 Ziberna
D465207 November 2002 Williams et al.
Primary Examiner: Hyder; Philip S.
Assistant Examiner: Sikder; Selina
Attorney, Agent or Firm: Townsend and Townsend and Crew LLP

Description



FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a matrix for surface mount package leadframes showing my new design.

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