Semiconductor package
Song , et al. October 17, 2
U.S. patent number D432,097 [Application Number D/117,450] was granted by the patent office on 2000-10-17 for semiconductor package. This patent grant is currently assigned to Samsung Electronics Co., Ltd.. Invention is credited to Jun-Young Jeon, Se-Yong Oh, Hai-Jeong Sohn, Young-Hee Song.
| United States Patent | D432,097 |
| Song , et al. | October 17, 2000 |
Semiconductor package
Claims
The ornamental design for a semiconductor package, as shown and described.
| Inventors: | Song; Young-Hee (Kyungki-Do, KR), Sohn; Hai-Jeong (Suwon, KR), Oh; Se-Yong (Seoul, KR), Jeon; Jun-Young (Seoul, KR) |
|---|---|
| Assignee: | Samsung Electronics Co., Ltd.
(Suwon, KR) |
| Appl. No.: | D/117,450 |
| Filed: | January 24, 2000 |
Foreign Application Priority Data
| Nov 20, 1999 [KR] | 99-27904 | |||
| Current U.S. Class: | D13/182 |
| Current International Class: | 1303 |
| Field of Search: | ;D13/182 ;174/524,525 ;257/690 ;361/752,798,820 |
References Cited [Referenced By]
U.S. Patent Documents
| D259783 | July 1981 | Mochizuki et al. |
| D359028 | June 1995 | Siegel et al. |
| D396847 | August 1998 | Nakayama et al. |
| D397092 | August 1998 | Sano et al. |
Attorney, Agent or Firm: Ladas & Parry
Description
FIG. 1 is a perspective view showing our design;
FIG. 2 is a left-hand side view thereof, the right-hand side view being a mirror image thereof;
FIG. 3 is a front view thereof, the rear view being identical thereto;
FIG. 4 is a sectional view thereof;
FIG. 5 is a top view thereof; and,
FIG. 6 is a bottom plan view thereof.
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