U.S. patent number 9,477,803 [Application Number 14/446,752] was granted by the patent office on 2016-10-25 for method of generating techfile having reduced corner variation value.
This patent grant is currently assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.. The grantee listed for this patent is TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.. Invention is credited to Wen-Hao Chen, Yen-Pin Chen, Chung-Kai Lin, King-Ho Tam, Chung-Hsing Wang, Chih-Hsiang Yao.
United States Patent |
9,477,803 |
Wang , et al. |
October 25, 2016 |
Method of generating techfile having reduced corner variation
value
Abstract
A method of generating a techfile corresponding to a
predetermined fabrication process is disclosed. The method includes
determining a typical value and a corner variation value usable to
model an electrical characteristic of a layer of back end of line
(BEOL) features to be fabricated by the predetermined fabrication
process, based on measurement of one or more sample integrated
circuit chips fabricated by the predetermined fabrication process.
A reduced variation value is calculated based on the corner
variation value and a scaling factor. The techfile is generated
based on the typical value and the reduced variation value.
Inventors: |
Wang; Chung-Hsing (Baoshan
Township, TW), Tam; King-Ho (Zhudong Township,
TW), Chen; Yen-Pin (Taipei, TW), Chen;
Wen-Hao (Hsinchu, TW), Lin; Chung-Kai (Taipei,
TW), Yao; Chih-Hsiang (Taipei, TW) |
Applicant: |
Name |
City |
State |
Country |
Type |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
Hsinchu |
N/A |
TW |
|
|
Assignee: |
TAIWAN SEMICONDUCTOR MANUFACTURING
COMPANY, LTD. (TW)
|
Family
ID: |
55180299 |
Appl.
No.: |
14/446,752 |
Filed: |
July 30, 2014 |
Prior Publication Data
|
|
|
|
Document
Identifier |
Publication Date |
|
US 20160034631 A1 |
Feb 4, 2016 |
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
G06F
30/20 (20200101); G06F 30/367 (20200101); G06F
30/398 (20200101) |
Current International
Class: |
G06F
17/50 (20060101) |
Field of
Search: |
;716/51,54-55,100,106,119,136 |
References Cited
[Referenced By]
U.S. Patent Documents
Primary Examiner: Dinh; Paul
Attorney, Agent or Firm: Hauptman Ham, LLP
Claims
What is claimed is:
1. A method of generating a techfile corresponding to a
predetermined fabrication process, the method comprising:
determining a typical value and a corner variation value usable to
model an electrical characteristic of a layer of back end of line
(BEOL) features to be fabricated by the predetermined fabrication
process, based on measurement of the electrical characteristic from
one or more sample integrated circuit chips fabricated by the
predetermined fabrication process; calculating a reduced variation
value by applying a scaling factor to the corner variation value;
and generating, using a processor, the techfile based on the
typical value and the reduced variation value, wherein the techfile
is provided for generating a layout design for fabricating
additional integrated circuit chips by the predetermined
fabrication process.
2. The method of claim 1, wherein the layer of BEOL features to be
fabricated by the predetermined fabrication process corresponds to
an i-th layer of via plugs from a bottom of the BEOL features, an
order index i being a positive integer; and the scaling factor is
set as ##EQU00005##
3. The method of claim 1, wherein the layer of BEOL features to be
fabricated by the predetermined fabrication process corresponds to
a layer of conductive lines; and the scaling factor is set as a
predetermined value ranging from 0.2 to 1.0.
4. The method of claim 3, wherein the predetermined value ranges
from 0.3 to 0.5.
5. The method of claim 1, further comprising: determining another
typical value and another corner variation value usable to model
the electrical characteristic of another layer of BEOL features to
be fabricated by the predetermined fabrication process, based on
the measurement of the electrical characteristic from the one or
more sample integrated circuit chips fabricated by the
predetermined fabrication process; and calculating another reduced
variation value based on the another corner variation value and
another scaling factor; wherein the generating the techfile is
performed based on the typical value, the reduced variation value,
the another typical value, and the another reduced variation value;
the layer of BEOL features to be fabricated by the predetermined
fabrication process corresponds to a layer of via plugs; and the
another layer of BEOL features to be fabricated by the
predetermined fabrication process corresponds to a layer of
conductive lines.
6. The method of claim 1, further comprising: determining another
typical value and another corner variation value usable to model
the electrical characteristic of another layer of BEOL features to
be fabricated by the predetermined fabrication process, based on
the measurement of the electrical characteristic from the one or
more sample integrated circuit chips fabricated by the
predetermined fabrication process; and calculating another reduced
variation value based on the another corner variation value and
another scaling factor; wherein the generating the techfile is
performed based on the typical value, the reduced variation value,
the another typical value, and the another reduced variation value;
the layer of BEOL features to be fabricated by the predetermined
fabrication process corresponds to a first layer of via plugs; the
another layer of BEOL features to be fabricated by the
predetermined fabrication process corresponds to a second layer of
via plugs over the first layer of via plugs; and the another
scaling factor is greater than the scaling factor.
7. The method of claim 1, wherein the electrical characteristic is
resistance of the layer of the BEOL features, and the typical value
is a unit resistance value.
8. The method of claim 1, wherein the electrical characteristic is
capacitance of the layer of the BEOL features, and the typical
value is a unit capacitance value.
9. A method of generating a techfile corresponding to a
predetermined fabrication process, the method comprising:
determining a first set of typical values and a first set of corner
variation values usable to model an electrical characteristic of a
plurality of via plug layers of back end of line (BEOL) features to
be fabricated by the predetermined fabrication process, based on
measurement of the electrical characteristic from one or more
sample integrated circuit chips fabricated by the predetermined
fabrication process; calculating a first set of reduced variation
values based on multiplying the first set of corner variation
values by a corresponding one of a first set of scaling factors, a
first scaling factor of the first set of scaling factors of an
upper layer of the plurality of via plug layers being less than a
second scaling factor of the first set of scaling factors of a
lower layer of the plurality of via plug layers; and generating,
using a processor, the techfile based on the typical values and the
reduced variation values, wherein the techfile is provided for
generating a layout design for fabricating additional integrated
circuit chips by the predetermined fabrication process.
10. The method of claim 9, wherein a scaling factor of the scaling
factors corresponding to an i-th layer of via plugs from a bottom
of all BEOL features is ##EQU00006##
11. The method of claim 9, further comprising: determining a second
set of typical values and a second set of corner variation values
usable to model the electrical characteristic of a plurality of
conductive line layers of the BEOL features to be fabricated by the
predetermined fabrication process, based on the measurement of the
electrical characteristic from the one or more sample integrated
circuit chips fabricated by the predetermined fabrication process;
and calculating a second set of reduced variation values based on
multiplying the second set of corner variation values by another
scaling factor; wherein the generating the techfile is performed
based on the first set of typical values, the first set of reduced
variation values, the second set of typical values, and the second
set of reduced variation values.
12. The method of claim 11, wherein the predetermined scaling
factor is set as a predetermined value ranging from 0.2 to 1.0.
13. The method of claim 12, wherein the predetermined value ranges
from 0.3 to 0.5.
14. The method of claim 11, further comprising: generating another
techfile based on the first set of typical values, the second set
of typical values, the first set of corner variation values, and
the second set of corner variation values.
15. The method of claim 9, wherein the electrical characteristic is
resistance of the layer of the BEOL features, and the first set of
typical values is a set of unit resistance values.
16. The method of claim 9, wherein the electrical characteristic is
capacitance of the layer of the BEOL features, and the first set of
typical values is a set of unit capacitance values.
17. A system for generating a techfile corresponding to a
predetermined fabrication process, the system comprising: a
processor; a non-transitory, computer readable storage medium
configured to store executable instructions, the executable
instructions configured to cause the processor to: determine a
typical value and a corner variation value usable to model an
electrical characteristic of a layer of back end of line (BEOL)
features to be fabricated by the predetermined fabrication process,
based on measurement of the electrical characteristic from one or
more sample integrated circuit chips fabricated by the
predetermined fabrication process; calculate a reduced variation
value by applying a scaling factor to the corner variation value;
and generate the techfile based on the typical value and the
reduced variation value, wherein the techfile is provided for
generating a layout design for fabricating additional integrated
circuit chips by the predetermined fabrication process.
18. The system of claim 17, wherein the layer of BEOL features to
be fabricated by the predetermined fabrication process corresponds
to an i-th layer of via plugs from a bottom of the BEOL features,
an order index i being a positive integer; and the scaling factor
is set as ##EQU00007##
19. The system of claim 17, wherein the layer of BEOL features to
be fabricated by the predetermined fabrication process corresponds
to a layer of conductive lines; and the scaling factor is set as a
predetermined value ranging from 0.2 to 1.0.
20. The system of claim 17, wherein either: the electrical
characteristic is resistance of the layer of the BEOL features, and
the typical value is a unit resistance value, or the electrical
characteristic is capacitance of the layer of the BEOL features,
and the typical value is a unit capacitance value.
Description
BACKGROUND
During manufacturing of integrated circuits, process variations
result in formation of actual devices and features which have some
differences from designed devices and features. Circuit designers
will verify a circuit design in order to account for these
differences between designed devices and features and the actual
devices and features.
In some approaches, circuit designers design each device and
feature to account for a worst case process corner. A process
corner is a characterization of performance of an actual device or
feature relative to other devices or features. In some instances,
the worst case process corner is the slow process corner where a
produced device operates slower than the designed device or the
produced feature transfers a signal slower than the designed
feature.
BRIEF DESCRIPTION OF THE DRAWINGS
Aspects of the present disclosure are best understood from the
following detailed description when read with the accompanying
figures. It is noted that, in accordance with the standard practice
in the industry, various features are not drawn to scale. In fact,
the dimensions of the various features may be arbitrarily increased
or reduced for clarity of discussion.
FIG. 1 is a flowchart of a method of generating one or more
techfiles and/or simulation model files usable in a subsequent
resistance-capacitance extraction process in accordance with some
embodiments.
FIG. 2 is a flowchart of a method of designing a circuit in
accordance with some embodiments.
FIG. 3 is a schematic diagram of an interconnect structure in
accordance with some embodiments.
FIG. 4 is a schematic view of a system for generating the one or
more techfiles or for designing a circuit in accordance with some
embodiments.
DETAILED DESCRIPTION
The following disclosure provides many different embodiments, or
examples, for implementing different features of the provided
subject matter. Specific examples of components and arrangements
are described below to simplify the present disclosure. These are,
of course, merely examples and are not intended to be limiting. For
example, the formation of a first feature over or on a second
feature in the description that follows may include embodiments in
which the first and second features are formed in direct contact,
and may also include embodiments in which additional features may
be formed between the first and second features, such that the
first and second features may not be in direct contact. In
addition, the present disclosure may repeat reference numerals
and/or letters in the various examples. This repetition is for the
purpose of simplicity and clarity and does not in itself dictate a
relationship between the various embodiments and/or configurations
discussed.
FIG. 1 is a flowchart of a method 100 of generating one or more
techfiles and/or simulation model files usable in a subsequent
resistance-capacitance extraction process in accordance with some
embodiments. It is understood that additional operations may be
performed before, during, and/or after the method 100 depicted in
FIG. 1, and that some other processes may only be briefly described
herein.
A circuit includes front end of line (FEOL) devices as well as back
end of line (BEOL) features configured to be electrically connected
separate FEOL devices together. In some embodiments, FEOL devices
include transistors, resistors, switching devices or other suitable
devices. In some embodiments, BEOL features include conductive
lines, conductive vias, capacitors, fuses, or other suitable
devices.
Method 100 begins with operation 102 in which FEOL measurements of
one or more electrical characteristics of FEOL devices
corresponding to a predetermined fabrication process are performed.
In some embodiments, operation 102 is performed based on one or
more sample integrated circuit chips fabricated by the
predetermined fabrication process. In some embodiments, the one or
more sample integrated circuit chips are test-key chips. In some
embodiments, the one or more sample integrated circuit chips are
sampled commercial products. In some embodiments, the one or more
electrical characteristics include switching speed, signal delay,
resistance, capacitance, or other suitable information. In some
embodiments, the one or more electrical characteristics include
ranges for switching speed, signal delay, resistance, capacitance,
or the other suitable information. In some embodiments, the one or
more electrical characteristics are obtained using a simulation
program executed by a processor. In some embodiments, the one or
more electrical characteristics are obtained based on empirical
results from prior manufacturing results.
Method 100 continues with operation 104 in which FEOL corner
conditions are collected. The FEOL corner conditions include the
one or more electrical characteristics for FEOL devices in the fast
process corner, the typical condition, as well as in the slow
process corner. The typical condition refers to an ideal condition
without any process variations. In some embodiments, the typical
condition includes a typical value of a unit resistance value. In
some embodiments, the typical condition includes a typical value of
a unit capacitance value. The fast process corner describes
produced FEOL devices which operate at a faster speed than the
typical condition. The slow process corner describes produced FEOL
devices which operate at a slower speed than the typical
condition.
Method 100 continues with operation 106 in which a simulation model
compilation is performed. As a result, a simulation model file 108
usable in a subsequent resistance-capacitance extraction or timing
analysis is generated. In some embodiments, the simulation model
includes a simulation program with integrated circuit emphasis
(SPICE) model.
In operation 110, BEOL measurements are performed for each layer of
interconnect structures, such as via plugs and conductive lines. In
some embodiments, operation 110 is performed based on one or more
sample integrated circuit chips fabricated by the predetermined
fabrication process. In some embodiments, the one or more sample
integrated circuit chips are test-key chips. In some embodiments,
the one or more sample integrated circuit chips are sampled
commercial products. In some embodiments, the BEOL measurements are
performed sequentially for each layer of the interconnect
structures. In some embodiments, the BEOL measurements are
performed simultaneously for at least two layers of the
interconnect structure. In some embodiments, the electrical
characteristics to be determined during operation 110 include
resistance, capacitance, signal delay, or other suitable
information. In some embodiments, the electrical characteristics
include ranges for resistance, signal delay or other suitable
information. In some embodiments, the electrical characteristics
are obtained using a simulation program executed by a processor. In
some embodiments, the performance data is obtained based on
empirical results from prior manufacturing results. In some
embodiments, the BEOL measurements are obtained sequentially with
the FEOL measurements. In some embodiments, the BEOL measurements
are obtained simultaneously with the FEOL measurements.
Method 100 continues with operation 112 in which BEOL corner
conditions are collected. The BEOL corner conditions include
electrical characteristics for BEOL devices in the fast process
corner, the typical condition, as well as in the slow process
corner. In some embodiments, the BEOL corner conditions are
recorded in a form of values of various technology parameters. In
some embodiments, the technology parameters include dielectric
permittivity, resistance, capacitance, and other suitable
technology parameters. In some embodiments, the typical condition
includes a typical value of a unit resistance value. In some
embodiments, the typical condition includes a typical value of a
unit capacitance value. In order to more accurately determine an
electrical characteristic of BEOL features while still accounting
for production variations, method 100 includes operation 114 and
operation 116 which help to reduce pessimism in the variation
values of the technology parameters usable in the subsequent
resistance-capacitance extraction and/or timing analysis of a
circuit design while the circuit still satisfies the desired
performance characteristics.
Method 100 continues with operation 122, where a techfile 132 is
generated based on typical values and corner variation values from
operation 112.
In operation 114, a via variation reduction process is performed
based on the measurement from operations 110 and 112. The via
variation reduction process utilizes an assumption that variations
among different via plugs within an interconnect structure will be
independent variables and have a Gaussian distribution, and thus
effectively act to cancel each other. In other words, it is highly
unlikely to have all via plugs manufactured by the predetermined
fabrication process to be all at the slowest corner condition or
all at the fastest corner condition. The via variation reduction
process is applicable to all circuit designs which include an
interconnect structure between separate FEOL devices.
In some embodiments, the via variation reduction process takes into
account the relative size of via plugs in different levels of the
interconnect structure. In some instances, via plugs located
farther from a substrate have larger dimensions in order to
effectively transfer higher currents and voltages. The larger
dimensions result in a lower variation of the via plugs in levels
of the interconnect structure remote from the substrate. The lower
amount of variation in the larger via plugs results in the lower
level via plugs dominating delay variation introduced by the BEOL
features. For example, if a lower via plug contributes 100
picoseconds (ps) to the delay variation while an upper via plug
contributes 1 ps, the resulting overall delay variation would
become {square root over (100.sup.2+1.sup.2)}.apprxeq.100. The
larger dimensions of the upper vias also cause a lower average
resistance in comparison with vias located closer to the
substrate.
In some embodiments, the via variation reduction process takes into
account the relative position of via plugs. In some embodiments, a
signal path is defined as traversing from a driving electrical
component through various via plugs and conductive lines and then
reaching a receiving electrical component. In some embodiments, an
up-stream via plug along the signal path dominates the overall
delay variation of the signal path than a down-stream via plug.
However, at the stage of preparing techfiles, it is unknown how a
circuit designer will place various via plugs. Nevertheless, it is
reasonable to assume that a lower level via plug has a 50-50 chance
to be either the most variation-dominant via plug or the least
variation-dominant via plug of a signal path, while a higher level
via plug tends to be in the middle of affecting the overall delay
variation of the signal path. As a result, lower level via plugs
tends to statistically dominate the delay variation.
In some embodiments, the via variation reduction process reduces a
variation value from a corresponding original corner variation
value of a technology parameter of the BEOL features in
interconnect levels above a threshold level. In some embodiments,
the variation of the technology parameter is reduced to zero,
meaning that the BEOL feature is formed as set forth in the initial
design without accounting for manufacturing variation. In some
embodiments, the via variation reduction process using a weighting
factor to reduce an amount of variation of the technology
parameters of BEOL features in interconnect levels above the
threshold level. In some embodiments, the threshold level is set to
a predetermined percentage of a number of interconnect levels. In
some embodiments, the predetermined percentage ranges from about
33% to about 67%.
In some embodiments, the via variation reduction process takes
Elmore delay into account. Elmore delay describes a propagation of
a signal through a resistance-capacitance (RC) network, such as an
interconnect structure. Elmore delay indicates that a delay
associated with a particular element of the RC network is a
summation of the RC delay of the particular element and each
downstream element. As a result, a delay associated with elements
closer to an output of the RC network is less than a delay
associated with elements closer to an input of the RC network. In
circuits where the variation of via resistance has a Gaussian
distribution, a variation of Elmore delay is given by:
.DELTA..sub.elmore=sqrt(.SIGMA..sub.i=1.about.N(.delta..sub.i*C.sub.i).su-
p.2+.SIGMA..sub.i=2.about.N(.delta..sub.i*C.sub.i).sup.2+ . . .
.SIGMA..sub.i=N(.delta..sub.i*C.sub.i).sup.2) Eq. (1) where
.DELTA..sub.elmore is the variation of Elmore delay, .delta..sub.i
is the variation of the via resistance of the i.sup.th via, and
C.sub.i is the capacitance of the i.sup.th via.
As indicated by Equation 1, the variation in Elmore delay is
impacted by elements closer to the input of the RC network. In some
embodiments, the via variation reduction process reduces variation
added to BEOL features beyond a threshold element in the RC
network. In some embodiments, the threshold element is set to a
predetermined percentage of a number of elements in the RC network.
In some embodiments, the predetermined percentage ranges from about
33% to about 67%.
In some embodiments, the via variation reduction process using a
scaling factor to reduce variation of technology parameters for
BEOL features. In some embodiments, for an i-th layer of via plugs
from a bottom of the BEOL features, an order index i being a
positive integer, the scaling factor is set as
##EQU00001## An order of the layer of via plugs is determined
according to a distance of a particular layer of features from a
substrate. In some embodiments which include the scaling factor,
the determined corner variation values, e.g., from operation 112,
is multiplied by the scaling factor in order to scale down the
variation values of the technology parameters of BEOL features. In
some embodiments, the scaling factor is implemented within an
automated circuit design tool. In some embodiments where the
scaling factor is implemented within the automated circuit design
tool, the fabrication process engineer is permitted to alter the
scaling factor.
The via variation reduction process is further described in a
non-limiting example with respect to FIG. 3. FIG. 3 is a schematic
diagram of an interconnect structure 300 in accordance with some
embodiments. A first FEOL device D1 is electrically connected to a
second FEOL device D2 by interconnect structure 300. Interconnect
structure 300 includes a first via plug 302 directly connected to
first FEOL device D1. First via plug 302 is located in a first
level of interconnect structure 300. A second via plug 304 is
connected in series with first via plug 302. Second via plug 304 is
located in a second level of interconnect structure 300. A third
via plug 306 is connected in series with second via plug 304. Third
via plug 306 is located in a third level of interconnect structure
300. A fourth via plug 308 is connected in series with third via
plug 306. Fourth via plug 308 is located in the third level of
interconnect structure 300. A fifth via plug 310 is connected in
series with fourth via plug 308. Fifth via plug 310 is located in
the second level of interconnect structure 300. A sixth via plug
312 is connected in series with fifth via plug 310 and is connected
to second FEOL device D2. Sixth via plug 312 is located in the
first level of interconnect structure 300.
First via plug 302 includes a first typical resistance .mu..sub.1
and a first resistance variation .delta..sub.1. In some
embodiments, first typical resistance .mu..sub.1 and first
resistance variation .delta..sub.1 are determined in operations 110
and 112 (FIG. 1). Similarly, second via plug 304 includes a second
typical resistance .mu..sub.2 and a second resistance variation
.mu..sub.2. Third via plug 306, fourth via plug 308, fifth via plug
310 and sixth via plug 312 each have a respective typical
resistance and resistance variation.
In a via variation reduction process, e.g., via variation reduction
process of operation 114 (FIG. 1), the variation values in
resistance in third via plug 306 and fourth via plug 308 are scaled
down, in some embodiments. The variation values in resistance in
third via plug 306 and fourth via plug 308 are scaled down due to
the increased size of via plugs located in levels of interconnect
structure 300 farthest from a substrate where first FEOL device D1
and second FEOL device D2 are located. In some embodiments,
variation values of technology parameters of third via plug 306 and
fourth via plug 308 are scaled down by a scaling factor, e.g.,
as
##EQU00002## where i metal level of the via plug, when the
resistance variation of the respective via plugs has a Gaussian
distribution.
In a via variation reduction process, e.g., via variation reduction
process of operation 114 (FIG. 1), the variation values in
resistance in fifth via plug 310 and sixth via plug 312 are scaled
down, in some embodiments. The variation values in resistance in
fifth via plug 310 and sixth via plug 312 are scaled down due to
the reduced amount of delay introduced by the fifth via plug and
the sixth via plug relative to first via plug 302 or second via
plug 304. In some embodiments, variation values of technology
parameters of fifth via plug 310 and sixth via plug 312 are scaled
down by a scaling factor, e.g.,
##EQU00003## where i is a metal level of the via plug, when the
resistance variation of the respective via plugs has a Gaussian
distribution.
In some embodiments, variation values of technology parameters of
each via of first via plug 302 through sixth via plug 312 are
scaled down by a scaling factor, e.g.,
##EQU00004## where i is a metal level of the via, when the
resistance variation of the respective via has a Gaussian
distribution. This scaling factor scheme places an increased
emphasis on an impact of technology parameters for via plugs which
are closer to the substrate and closer to an input portion of a
signal propagation path. Via plugs which are farther from the
substrate or closer to an output portion of the signal propagation
path have less impact on delay variation due to manufacturing
variation. Adjustments to technology parameters result in a
produced circuit having a smaller area in comparison with a circuit
which maintains technology parameters for all BEOL features.
Adjustments to technology parameters also help to reduce power
consumption in the produced circuit in comparison with circuits
which maintains technology parameters for all BEOL features.
Returning to FIG. 1, method 100 continues with operation 124, where
a techfile 134 with reduced via variation values is generated based
on typical values and reduced variation values from operation 114.
In some embodiments, operation 124 is omitted, and techfile 134 is
not generated.
Method 100 continues with operation 116 in which a BEOL variation
reduction process is performed. The BEOL variation reduction
process scales down variation values for technology parameters for
BEOL features by using a scaling factor, which is also referred to
as a discounting factor .alpha.. In some circuits, delay variation
introduced by FEOL devices dominants delay variation. In some
circuits, FEOL devices account for 70% to 80% of all delay
variation within a circuit. Due to the large amount of delay
variation introduced by FEOL devices, scaling down of the variation
values of technology parameters for all BEOL features by
discounting factor .alpha. is usable without significantly
impacting the accuracy of a subsequent resistance-capacitance
extraction process or timing analysis process. In some embodiments,
the discounting factor ranges from about 0.2 to about 1.0. In some
embodiments, the discounting factor ranges from about 0.3 to about
0.5. In some embodiments, if the discounting factor is less than
about 0.3, then scaling down of variation values of technology
parameters of the BEOL features is not sufficient to satisfy the
desired accuracy in the subsequent resistance-capacitance
extraction process or timing analysis process. In some embodiments,
if the discounting factor is greater than about 0.5, then the
scaled down delay variation introduced by the BEOL features is not
sufficient to help to design a circuit in a more realistic and/or
aggressive manner, and thus the area of driving capability saved by
the reduced variation values is insignificant compared with a
counterpart design based on corner variation values.
Method 100 continues with operation 126, where a techfile 136 with
reduced via variation values and reduced BEOL variation values is
generated based on typical values, reduced via variation values
from operation 114, and reduced BEOL variation values from
operation 116.
FIG. 2 is a flowchart of a method 200 of designing a circuit in
accordance with some embodiments. It is understood that additional
operations may be performed before, during, and/or after the method
200 depicted in FIG. 2, and that some other processes may only be
briefly described herein.
Method 200 begins with operation 210, where a circuit designer
receives a plurality of techfiles and one or more model files, such
as techfiles 132, 134, and 136 and simulation model file 108. The
circuit designer selects one of the techfiles 132, 134, and 136 to
begin with. In some embodiments, the circuit designer selects the
most aggressive techfile, e.g., techfile 136, that has the greatest
reduction in its variation estimation.
Method 200 continues with operation 220, where a circuit schematic
and/or circuit layout is designed based on the selected techfile.
Method 200 continues with operation 230 in which
resistance-capacitance extraction and timing analysis of the layout
of the circuit design is performed. The resistance-capacitance
extraction and timing analysis is performed to determine the
electrical performance of the circuit. In some embodiments, the
resistance-capacitance extraction and timing analysis of the
circuit design is performed by executing a computer software
program. In some embodiments, the computer software program for
performing operation 230 is also referred to as a post-layout
simulation tool.
Method 200 continues with operation 240, where a determination is
made whether the timing analysis matches the assumptions of the
selected techfile 136. In operation 240, in order to determine
whether reduced BEOL variation values in the techfile 136 are
applicable, an amount of delay variation contributed by BEOL
features is compared with an amount of variation delay contributed
by FEOL devices. This comparison is performed by analyzing three
different factors. A first factor is an amount of delay in a
circuit where the BEOL features are in a corner condition and the
FEOL devices are in a typical condition. A second factor is an
amount of delay in a circuit where the BEOL features are in a
typical condition and the FEOL devices are in the typical
condition. A third factor is an amount of delay in a circuit where
the BEOL features are in the typical condition and the FEOL devices
are in a corner condition.
In some embodiments, an amount of delay for FEOL devices in the
typical condition is obtained during operation 230. In some
embodiments, an amount of delay for FEOL devices in the corner
condition is obtained during operation 230. In some embodiments, an
amount of delay for BEOL features in the typical condition is
obtained in operation 230.
An amount of delay variation attributable to BEOL features is
determined based on a difference between the first factor and the
second factor. An amount of delay variation attributable to FEOL
devices is determined based a difference between the third factor
and the second factor. If the amount of delay variation
attributable to FEOL devices is equal to or greater than the amount
of delay attributable to BEOL features, then the reduced BEOL
processes are applicable. In such scenario, method 200 proceeds to
operation 250. Otherwise, method 200 goes back to operation 210,
where the circuit designer selects a less aggressive techfile and
start the circuit or layout designing process all over again based
on the newly-selected, less aggressive techfile.
In operation 250, the timing analysis results from operation 230 of
the circuit design is compared with the desired circuit performance
characteristics. In some embodiments, the desired circuit
performance characteristics are provided by a customer. In some
embodiments, the desired circuit performance characteristics are
provided by the circuit designer.
Method 200 continues with operation 260 if the timing analysis
results from operation 230 of the circuit design satisfy the
desired circuit performance characteristics. In operation 260, the
circuit design and/or the corresponding layout design is finalized
and preparation of masks for implementing the circuit layout for
manufacturing begins.
Method 200 continues with operation 270 if the timing analysis
results from operation 230 of the circuit design do not satisfy the
desired circuit performance characteristics. In operation 270, the
fail result is reported the circuit designer, and the circuit
designer will take further actions to resolve this issue, such as
having the circuit schematic of layout redesigned. In some
embodiments, the circuit is redesigned by adjusting the at least
one of an FEOL device or a BEOL feature. In some embodiments, the
circuit is redesigned by adjusting a power supplied to the circuit.
In some embodiments, the circuit is redesigned by including at
least one additional FEOL device or BEOL feature; by removing at
least one FEOL device or BEOL feature; or by another suitable
redesign operation.
FIG. 4 is a schematic view of a system 400 for generating tech
files and/or for designing a circuit in accordance with some
embodiments. System 400 includes a hardware processor 402 and a
non-transitory, computer readable storage medium 404 encoded with,
i.e., storing, the computer program code 406, i.e., a set of
executable instructions. Computer readable storage medium 404 is
also encoded with instructions 407 for interfacing with
manufacturing machines for producing the memory array. The
processor 402 is electrically coupled to the computer readable
storage medium 404 via a bus 408. The processor 402 is also
electrically coupled to an I/O interface 410 by bus 408. A network
interface 412 is also electrically connected to the processor 402
via bus 408. Network interface 412 is connected to a network 414,
so that processor 402 and computer readable storage medium 404 are
capable of connecting to external elements via network 414. The
processor 402 is configured to execute the computer program code
406 encoded in the computer readable storage medium 404 in order to
cause system 400 to be usable for performing a portion or all of
the operations as described in method 100 and/or method 200.
In some embodiments, the processor 402 is a central processing unit
(CPU), a multi-processor, a distributed processing system, an
application specific integrated circuit (ASIC), and/or a suitable
processing unit.
In some embodiments, the computer readable storage medium 404 is an
electronic, magnetic, optical, electromagnetic, infrared, and/or a
semiconductor system (or apparatus or device). For example, the
computer readable storage medium 404 includes a semiconductor or
solid-state memory, a magnetic tape, a removable computer diskette,
a random access memory (RAM), a read-only memory (ROM), a rigid
magnetic disk, and/or an optical disk. In some embodiments using
optical disks, the computer readable storage medium 304 includes a
compact disk-read only memory (CD-ROM), a compact disk-read/write
(CD-R/W), and/or a digital video disc (DVD).
In some embodiments, the storage medium 404 stores the computer
program code 406 configured to cause system 400 to perform method
100 and/or method 200. In some embodiments, the storage medium 404
also stores information needed for performing method 100 and/or
method 200 as well as information generated during performing the
method 100 and/or method 200, such as a BEOL typical condition
parameter 416, a BEOL corner condition parameter 418, a FEOL
typical condition parameter 420, a FEOL corner condition parameter
422, a via resistance variation(s) parameter 424, a scaling factor
parameter 426, a discounting factor parameter 428 and/or a set of
executable instructions to perform the operation of method 100
and/or method 200. In some embodiments, some or all of the
information 416-428 are recorded in the form of simulation model
file 108 and techfiles 132, 134, and 136 (FIG. 1).
In some embodiments, the storage medium 404 stores instructions 407
for interfacing with manufacturing machines. The instructions 407
enable processor 402 to generate manufacturing instructions
readable by the manufacturing machines to effectively implement
method 100 and/or method 200 during a circuit design process.
System 400 includes I/O interface 410. I/O interface 410 is coupled
to external circuitry. In some embodiments, I/O interface 410
includes a keyboard, keypad, mouse, trackball, trackpad, and/or
cursor direction keys for communicating information and commands to
processor 402.
System 400 also includes network interface 412 coupled to the
processor 402. Network interface 412 allows system 400 to
communicate with network 414, to which one or more other computer
systems are connected. Network interface 412 includes wireless
network interfaces such as BLUETOOTH, WIFI, WIMAX, GPRS, or WCDMA;
or wired network interface such as ETHERNET, USB, or IEEE-1394. In
some embodiments, method 100 and/or method 200 is implemented in
two or more systems 400, and information such as memory type,
memory array layout, I/O voltage, I/O pin location and charge pump
are exchanged between different systems 400 via network 414.
System 400 is configured to receive information related to BEOL
typical conditions. The information is transferred to processor 402
via bus 408 and is then stored in computer readable medium 404 as
BEOL typical condition parameter 416. In some embodiments, the BEOL
typical conditions are obtained in operation 110 (FIG. 1). System
400 is configured to receive information related to BEOL corner
conditions which is stored in computer readable medium 404 as BEOL
corner condition parameter 418. In some embodiments, the BEOL
corner conditions are obtained in operation 112. System 400 is
configured to receive information related to FEOL typical
conditions which is stored in computer readable medium 404 as FEOL
typical condition parameter 420. In some embodiments, the FEOL
typical conditions are obtained in operation 102. System 400 is
configured to receive information related to FEOL corner conditions
which is stored in computer readable medium 404 as FEOL corner
condition parameter 422. In some embodiments, the FEOL corner
conditions are obtained in operation 104. System 400 is configured
to receive information related to via resistance variation(s) which
is stored in computer readable medium 404 as via resistance
variation(s) parameter 424. In some embodiments, the via resistance
variations(s) are obtained in operation 424. System 400 is
configured to receive information related to the scaling factor
which is stored in computer readable medium 404 as scaling factor
parameter 426. In some embodiments, the scaling factor is obtained
in operation 114. System 400 is configured to receive information
related to the discounting factor which is stored in computer
readable medium 404 as discounting factor parameter 428. In some
embodiments, the discounting parameter is obtained in operation
116.
In accordance with one embodiment, a method of generating a
techfile corresponding to a predetermined fabrication process is
disclosed. The method includes determining a typical value and a
corner variation value usable to model an electrical characteristic
of a layer of back end of line (BEOL) features to be fabricated by
the predetermined fabrication process, based on measurement of one
or more sample integrated circuit chips fabricated by the
predetermined fabrication process. A reduced variation value is
calculated based on the corner variation value and a scaling
factor. The techfile is generated based on the typical value and
the reduced variation value.
In accordance with another embodiment, a method of generating a
techfile corresponding to a predetermined fabrication process is
disclosed. The method includes determining a first set of typical
values and a first set of corner variation values usable to model
an electrical characteristic of a plurality of via plug layers of
back end of line (BEOL) features to be fabricated by the
predetermined fabrication process, based on measurement of one or
more sample integrated circuit chips fabricated by the
predetermined fabrication process. A first set of reduced variation
values is calculated based on multiplying the first set of corner
variation values by corresponding one of a first set of scaling
factors, a first scaling factor of the first set of scaling factors
of an upper layer of the plurality of via plug layers is less than
a second scaling factor of the first set of scaling factors of a
lower layer of the plurality of via plug layers. The techfile is
generated based on the typical values and the reduced variation
values.
In accordance with another embodiment, a method of designing a
circuit to be fabricated by a predetermined fabrication process is
disclosed. The method includes designing a layout of the circuit
based on a first techfile, the first techfile being generated based
on one or more typical values and one or more reduced corner
variation values usable to model an electrical characteristic of a
plurality of back end of line (BEOL) features to be fabricated by a
predetermined fabrication process. A timing analysis is performed
based on the layout and the first techfile, and the timing analysis
includes obtaining a first delay attributable to the plurality of
BEOL features of the circuit; and obtaining a second delay
attributable to a plurality of front end of line (FEOL) devices of
the circuit. A result of the timing analysis is compared with a
predetermined timing specification if the first delay is less than
the second delay. Another timing analysis is performed based on the
layout and a second techfile if the first delay is greater than the
second delay, the second techfile being generated based on the one
or more typical values and one or more original corner variation
values usable to model the electrical characteristic of the
plurality of BEOL features to be fabricated by the predetermined
fabrication process. A reduced corner variation value of the one or
more reduced corner variation values equals a corresponding one of
the one or more original corner variation values multiplied by a
corresponding scaling factor.
The foregoing outlines features of several embodiments so that
those skilled in the art may better understand the aspects of the
present disclosure. Those skilled in the art should appreciate that
they may readily use the present disclosure as a basis for
designing or modifying other processes and structures for carrying
out the same purposes and/or achieving the same advantages of the
embodiments introduced herein. Those skilled in the art should also
realize that such equivalent constructions do not depart from the
spirit and scope of the present disclosure, and that they may make
various changes, substitutions, and alterations herein without
departing from the spirit and scope of the present disclosure.
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