U.S. patent application number 16/378844 was filed with the patent office on 2020-10-15 for ion-sensitive field-effect transistor with micro-pillar well to enhance sensitivity.
The applicant listed for this patent is International Business Machines Corporation. Invention is credited to Kangguo Cheng, Juntao Li, Chanro Park, Ruilong Xie.
Application Number | 20200328088 16/378844 |
Document ID | / |
Family ID | 1000005117873 |
Filed Date | 2020-10-15 |
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United States Patent
Application |
20200328088 |
Kind Code |
A1 |
Li; Juntao ; et al. |
October 15, 2020 |
ION-SENSITIVE FIELD-EFFECT TRANSISTOR WITH MICRO-PILLAR WELL TO
ENHANCE SENSITIVITY
Abstract
A semiconductor device includes a first passivation layer
disposed on a semiconductor base. The semiconductor device further
includes a dielectric layer disposed on the first passivation
layer. The semiconductor device further includes a plurality of
pillars disposed in an opening in the dielectric layer and the
first passivation layer and from a top surface of the semiconductor
base. The semiconductor device further includes a metal layer
disposed on the exterior surfaces of the plurality of pillars and
sidewalls of the dielectric layer and the first passivation layer
and on the exposed top surface of the semiconductor base. The
semiconductor device further includes a second passivation layer
disposed on the metal layer and a top surface of the semiconductor
device; wherein the second passivation layer has an electrical
charge.
Inventors: |
Li; Juntao; (Cohoes, NY)
; Cheng; Kangguo; (Schenectady, NY) ; Xie;
Ruilong; (Niskayuna, NY) ; Park; Chanro;
(Clifton Park, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
International Business Machines Corporation |
Armonk |
NY |
US |
|
|
Family ID: |
1000005117873 |
Appl. No.: |
16/378844 |
Filed: |
April 9, 2019 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/31116 20130101;
H01L 27/092 20130101; H01L 21/31144 20130101; G01N 27/414 20130101;
H01L 21/32051 20130101; H01L 29/423 20130101; H01L 21/0337
20130101 |
International
Class: |
H01L 21/311 20060101
H01L021/311; H01L 29/423 20060101 H01L029/423; H01L 27/092 20060101
H01L027/092; H01L 21/033 20060101 H01L021/033; H01L 21/3205
20060101 H01L021/3205; G01N 27/414 20060101 G01N027/414 |
Claims
1. A method for fabricating a semiconductor device comprising:
depositing a first passivation layer on a semiconductor base;
depositing a dielectric layer on the first passivation layer;
depositing a hardmask on the dielectric layer; patterning and
etching an opening into the hardmask, the dielectric layer, and the
first passivation layer which exposes a top surface of the
semiconductor base and forms a plurality of pillars in the opening,
wherein a top surface of the plurality of pillars is below a top
surface of the hardmask on the dielectric layer defining a width of
the opening; depositing a metal layer on the exterior surfaces of
the dielectric layer, the plurality of pillars and the exposed top
surface of the semiconductor base in the opening and over the top
surface of the hardmask on the dielectric layer defining the width
of the opening; depositing a sacrificial layer in the opening;
removing the metal layer disposed on the top surface of the
hardmask on the dielectric layer; depositing a second passivation
layer on the metal layer and the top surface of the hardmask on the
dielectric layer; and forming an electrical charge in the second
passivation layer.
2. The method of claim 1, wherein the semiconductor base comprises
a complementary metal oxide semiconductor integrated circuit.
3. The method of claim 1, wherein the step of patterning and
etching the opening into the hardmask, the dielectric layer and the
first passivation layer comprises: etching the hardmask, the
dielectric layer and the first passivation layer to form the
opening and the plurality of pillars therein which exposes a top
surface of the first passivation layer; and etching the exposed
first passivation layer to expose the top surface of the
semiconductor base.
4. The method of claim 1, wherein the first passivation layer
comprises silicon nitride (SiN).
5. The method of claim 1, wherein the metal layer comprises a metal
selected from the group consisting of tungsten, titanium, tantalum,
ruthenium, zirconium, cobalt, copper, aluminum, lead, platinum,
tin, silver, and gold.
6. The method of claim 5, wherein the sacrificial layer comprises
one of an amorphous silicon and an amorphous silicon germanium
alloy (aSiGe).
7. The method of claim 6, wherein the second passivation layer
comprises one of SiN, Al.sub.2O.sub.3, and Ta.sub.2O.sub.5.
8. The method of claim 1, wherein the step of forming the
electrical charge in the second passivation layer comprises
contacting the second passivation layer with a solution comprising
an anion or a cation.
9. A method for fabricating a semiconductor device comprising:
depositing a first passivation layer on a semiconductor base;
depositing a first dielectric layer on the first passivation layer;
etching an opening into the dielectric layer and the first
passivation layer which exposes a top surface of the semiconductor
base; forming a second dielectric layer on each sidewall of the
first dielectric layer and the first passivation layer in the
opening; forming a third dielectric layer on each sidewall of the
second dielectric layer defining an opening therebetween;
depositing a fourth dielectric layer in the opening between the
third dielectric layer on each sidewall of the second dielectric
layer; recessing a top surface of the second dielectric layer, the
third dielectric layer and the fourth dielectric layer to below a
top surface of the first dielectric layer; removing the second
dielectric layer and the fourth dielectric layer which exposes a
top surface of the semiconductor base and forms an opening;
depositing a metal layer on the exterior surfaces of the first
dielectric layer, the third dielectric layer and the exposed top
surface of the semiconductor base in the opening and over the top
surface of the first dielectric layer defining the width of the
opening; depositing a sacrificial layer in the opening; removing
the metal layer disposed on the top surface of the first dielectric
layer; depositing a second passivation layer on the metal layer and
the top surface of the first dielectric layer; and forming an
electrical charge in the second passivation layer.
10. The method of claim 9, wherein the semiconductor base comprises
a complementary metal oxide semiconductor integrated circuit.
11. The method of claim 9, wherein the step of forming the second
dielectric layer on each sidewall of the first dielectric layer and
the first passivation layer in the opening comprises: depositing
the second dielectric in the opening; and etching a central portion
of the second dielectric layer to form the second dielectric layer
on each sidewall of the first dielectric layer and the first
passivation layer defining an opening therebetween which exposes
the top surface of the semiconductor base.
12. The method of claim 11, wherein the step of forming the third
dielectric layer on each sidewall of the second dielectric layer
comprises: depositing the third dielectric layer in the opening
between the second dielectric layers; and etching a central portion
of the third dielectric layer to form the third dielectric layer on
each sidewall of the second dielectric layer and defining the
opening therebetween which exposes the top surface of the
semiconductor base.
13. The method of claim 9, wherein the second dielectric layer
comprises amorphous silicon and the third dielectric layer
comprises SiN.
14. The method of claim 9, wherein the metal layer comprises a
metal selected from the group consisting of tungsten, titanium,
tantalum, ruthenium, zirconium, cobalt, copper, aluminum, lead,
platinum, tin, silver, and gold.
15. The method of claim 14, wherein the sacrificial layer comprises
one of an amorphous silicon and aSiGe.
16. The method of claim 15, wherein the second passivation layer
comprises one of SiN, Al.sub.2O.sub.3, and Ta.sub.2O.sub.5.
17. The method of claim 9, wherein the step of forming the
electrical charge in the second passivation layer comprises
contacting the second passivation layer with an analyte-containing
solution.
18. A semiconductor device comprising: a semiconductor base; a
first passivation layer disposed on the semiconductor base; a
dielectric layer disposed on the first passivation layer; a
plurality of pillars disposed in an opening in the dielectric layer
and the first passivation layer and from a top surface of the
semiconductor base; a metal layer disposed on the exterior surfaces
of the plurality of pillars and sidewalls of the dielectric layer
and the first passivation layer and on the exposed top surface of
the semiconductor base; and a second passivation layer disposed on
the metal layer and a top surface of the semiconductor device;
wherein the second passivation layer has an electrical charge.
19. The semiconductor device of claim 18, further comprising a
hardmask disposed on the dielectric layer.
20. The semiconductor device of claim 18, wherein the semiconductor
base comprises a CMOS integrated circuit.
Description
BACKGROUND
[0001] Biological and chemical sensors based on ion-sensitive field
effect transistors (ISFET) can be integrated with modern
microelectronic devices and used to detect and measure various
aspects of chemical reactions and substance properties. For
example, an ISFET may be used to measure ion concentrations, such
as hydrogen ion concentration, in a sample of an analyte. An ISFET
is similar to a metal oxide semiconductor field effect transistor
(MOSFET), but lacks a gate electrode. Instead, an ion-sensitive
membrane is placed over the channel region of the ISFET and is
exposed to the analyte sample. A reference electrode of the ISFET
is separated from the ion-sensitive membrane by the solution. The
potential difference between the channel and the reference
electrode is a function of the ion concentration in the analyte
sample. An operating characteristic of the ISFET may be measured
and used to calculate ion concentration.
SUMMARY
[0002] Embodiments described herein provide methods of forming
semiconductor devices. For example, one exemplary embodiment
includes a method for fabricating a semiconductor device comprising
depositing a first passivation layer on a semiconductor base. The
method further comprises depositing a dielectric layer on the first
passivation layer. The method further comprises depositing a
hardmask on the dielectric layer. The method further comprises
patterning and etching an opening into the hardmask, the dielectric
layer and the first passivation layer which exposes a top surface
of the semiconductor base and forms a plurality of pillars in the
opening, wherein a top surface of the plurality of pillars is below
a top surface of the hardmask on the dielectric layer defining a
width of the opening. The method further comprises depositing a
metal layer on the exterior surfaces of the dielectric layer, the
plurality of pillars and the exposed top surface of the
semiconductor base in the opening and over the top surface of the
hardmask on the dielectric layer defining the width of the opening.
The method further comprises depositing a sacrificial layer in the
opening. The method further comprises removing the exposed metal
layer disposed on the top surface of the hardmask on the dielectric
layer. The method further comprises depositing a second passivation
layer on the metal layer and the top surface of the hardmask on the
dielectric layer. The method further comprises forming an
electrical charge in the second passivation layer.
[0003] Another exemplary embodiment includes a method for
fabricating a semiconductor device comprising depositing a first
passivation layer on a semiconductor base. The method further
comprises depositing a first dielectric layer on the first
passivation layer. The method further comprises etching an opening
into the first dielectric layer and the first passivation layer
which exposes a top surface of the semiconductor base. The method
further comprises forming a second dielectric layer on each
sidewall of the first dielectric layer and the first passivation
layer in the opening. The method further comprises forming a third
dielectric layer on each sidewall of the second dielectric layer
defining an opening therebetween. The method further comprises
depositing a fourth dielectric layer in the opening between the
third dielectric layer on each sidewall of the second dielectric
layer. The method further comprises recessing a top surface of the
second dielectric layer, the third dielectric layer and the fourth
dielectric layer to below a top surface of the first dielectric
layer. The method further comprises removing the second dielectric
layer and the fourth dielectric layer which exposes a top surface
of the semiconductor base and forms an opening. The method further
comprises depositing a metal layer on the exterior surfaces of the
first dielectric layer, the third dielectric layer and the exposed
top surface of the semiconductor base in the opening and over the
top surface of the first dielectric layer defining the width of the
opening. The method further comprises depositing a sacrificial
layer in the opening. The method further comprises removing the
metal layer disposed on the top surface of the first dielectric
layer. The method further comprises depositing a second passivation
layer on the metal layer and the top surface of the first
dielectric layer. The method further comprises forming an
electrical charge in the second passivation layer.
[0004] Another exemplary embodiment includes a semiconductor device
comprising a first passivation layer disposed on a semiconductor
base. The semiconductor device further comprises a dielectric layer
disposed on the first passivation layer. The semiconductor device
further comprises a plurality of pillars disposed in an opening in
the dielectric layer and the first passivation layer and from a top
surface of the semiconductor base. The semiconductor device further
comprises a metal layer disposed on the exterior surfaces of the
plurality of pillars and sidewalls of the dielectric layer and the
first passivation layer and on the exposed top surface of the
semiconductor base. The semiconductor device further comprises a
second passivation layer disposed on the metal layer and a top
surface of the semiconductor structure; wherein the second
passivation layer has an electrical charge.
[0005] These and other features, objects and advantages of the
present invention will become apparent from the following detailed
description of illustrative embodiments thereof, which is to be
read in connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0006] FIG. 1 is a schematic cross-sectional view of a
semiconductor structure at a first-intermediate fabrication stage,
in accordance with an illustrative embodiment.
[0007] FIG. 2 is a schematic cross-sectional view of a
semiconductor structure at a second-intermediate fabrication stage,
in accordance with an illustrative embodiment.
[0008] FIG. 3 is a schematic cross-sectional view of a
semiconductor structure at a third-intermediate fabrication stage,
according to an illustrative embodiment.
[0009] FIG. 4 is a schematic cross-sectional view of a
semiconductor structure at a fourth-intermediate fabrication stage,
according to an illustrative embodiment.
[0010] FIG. 5 is a schematic cross-sectional view of a
semiconductor structure at a fifth-intermediate fabrication stage,
according to an illustrative embodiment.
[0011] FIG. 6 is a schematic cross-sectional view of a
semiconductor structure at a sixth-intermediate fabrication stage,
according to an illustrative embodiment.
[0012] FIG. 7 is a schematic cross-sectional view of a
semiconductor structure at a seventh-intermediate fabrication
stage, according to an illustrative embodiment.
[0013] FIG. 8 is a top down view of the micro-well of the
semiconductor structure of FIG. 7, in accordance with an
illustrative embodiment.
[0014] FIG. 9 is a schematic cross-sectional view of a
semiconductor structure at a first-intermediate fabrication stage,
according to another illustrative embodiment.
[0015] FIG. 10 is a schematic cross-sectional view of a
semiconductor structure at a second-intermediate fabrication stage,
according to another illustrative embodiment.
[0016] FIG. 11 is a schematic cross-sectional view of a
semiconductor structure at a third-intermediate fabrication stage,
according to another illustrative embodiment.
[0017] FIG. 12 is a schematic cross-sectional view of a
semiconductor structure at a fourth-intermediate fabrication stage,
according to another illustrative embodiment.
[0018] FIG. 13 is a schematic cross-sectional view of a
semiconductor structure at a fifth-intermediate fabrication stage,
according to another illustrative embodiment.
[0019] FIG. 14 is a schematic cross-sectional view of a
semiconductor structure at a sixth-intermediate fabrication stage,
according to another illustrative embodiment.
[0020] FIG. 15 is a top down view of the semiconductor structure of
FIG. 14, in accordance with another illustrative embodiment.
[0021] FIG. 16 is a schematic cross-sectional view of a
semiconductor structure at a first-intermediate fabrication stage,
according to an alternative illustrative embodiment.
[0022] FIG. 17 is a schematic cross-sectional view of a
semiconductor structure at a second-intermediate fabrication stage,
according to an alternative illustrative embodiment.
[0023] FIG. 18 is a schematic cross-sectional view of a
semiconductor structure at a third-intermediate fabrication stage,
according to an alternative illustrative embodiment.
[0024] FIG. 19 is a schematic cross-sectional view of a
semiconductor structure at a fourth-intermediate fabrication stage,
according to an alternative illustrative embodiment.
[0025] FIG. 20 is a top down view of the semiconductor structure of
FIG. 19, in accordance with an alternative illustrative
embodiment.
DETAILED DESCRIPTION
[0026] The present invention generally relates to semiconductor
manufacturing and, more particularly, to device structures,
fabrication methods, and design structures for a biological or
chemical sensor.
[0027] As stated above, biological and chemical sensors can be
based on an ISFET (i.e., transistor). In general, an ISFET can be
fabricated along with standard MOSFET to make a "lab-on-chip" in
which ISFETs are used as sensors and MOSFETs are used for signal
processing. A passivation layer (e.g., silicon nitride) is
typically used on top of the last metal layer of the MOSFET. The
passivation layer serves two purposes: (1) it prevents ions such as
sodium or potassium from getting into the underlying transistor,
and (2) it serves as a sensing layer to absorb electric charges
from an analyte solution into the surface of the passivation layer.
The amount of electrical charges is measured by the threshold
voltage change of the underlying transistor, thus analyte
(biological or chemical) in a micro-well is sensed.
[0028] However, a passivation layer reduces the sensitivity of the
underlying ISFET because it creates a capacitance (C.sub.p) in
series with the FET capacitance (C.sub.FET). Compared with the case
without a passivation layer (analyte directly contacting the gate),
the sensitivity of the ISFET is reduced to a factor of A, where A
can be expressed as:
A=C.sub.p/(C.sub.p+C.sub.FET).
The passivation layer is typically much thicker than the gate
dielectric layer. Therefore, C.sub.p is much less than C.sub.FET.
As a result, A is much less than 1. Therefore, there is a need to
improve the sensitivity of ISFET.
[0029] Accordingly, enhanced sensitivity of an ISFET according to
the present invention can increase the passivation capacitance due
to an increase of surface area by forming vertical standing
micro-pillars inside a micro well.
[0030] It is to be understood that the various layers, structures,
and regions shown in the accompanying drawings are schematic
illustrations that are not drawn to scale. In addition, for ease of
explanation, one or more layers, structures, and regions of a type
commonly used to form semiconductor devices or structures may not
be explicitly shown in a given drawing. This does not imply that
any layers, structures, and regions not explicitly shown are
omitted from the actual semiconductor structures.
[0031] Furthermore, it is to be understood that the embodiments
discussed herein are not limited to the particular materials,
features, and processing steps shown and described herein. In
particular, with respect to semiconductor processing steps, it is
to be emphasized that the descriptions provided herein are not
intended to encompass all of the processing steps that may be
required to form a functional semiconductor integrated circuit
device. Rather, certain processing steps that are commonly used in
forming semiconductor devices, such as, for example, wet cleaning
and annealing steps, are purposefully not described herein for
economy of description.
[0032] Moreover, the same or similar reference numbers are used
throughout the drawings to denote the same or similar features,
elements, or structures, and thus, a detailed explanation of the
same or similar features, elements, or structures will not be
repeated for each of the drawings. It is to be understood that the
terms "about" or "substantially" as used herein with regard to
thicknesses, widths, percentages, ranges, etc., are meant to denote
being close or approximate to, but not exactly. For example, the
term "about" or "substantially" as used herein implies that a small
margin of error may be present, such as 1% or less than the stated
amount.
[0033] Reference in the specification to "one embodiment" or "an
embodiment" of the present principles, as well as other variations
thereof, means that a particular feature, structure,
characteristic, and so forth described in connection with the
embodiment is included in at least one embodiment of the present
principles. Thus, the appearances of the phrase "in one embodiment"
or "in an embodiment", as well any other variations, appearing in
various places throughout the specification are not necessarily all
referring to the same embodiment. For purposes of the description
hereinafter, the terms "upper", "over", "overlying", "lower",
"under", "underlying", "right", "left", "vertical", "horizontal",
"top", "bottom", and derivatives thereof shall relate to the
embodiments of the disclosure, as it is oriented in the drawing
figures. The term "positioned on" means that a first element, such
as a first structure, is present on a second element, such as a
second structure, wherein intervening elements, such as an
interface structure, e.g. interface layer, may be present between
the first element and the second element. The term "direct contact"
means that a first element, such as a first structure, and a second
element, such as a second structure, are connected without any
intermediary conducting, insulating or semiconductor layers at the
interface of the two elements.
[0034] It will be understood that, although the terms first,
second, etc. may be used herein to describe various elements, these
elements should not be limited by these terms. These terms are only
used to distinguish one element from another element. Thus, a first
element discussed below could be termed a second element without
departing from the scope of the present concept.
[0035] As used herein, "height" refers to a vertical size of an
element (e.g., a layer, trench, hole, opening, etc.) in the
cross-sectional views measured from a bottom surface to a top
surface of the element, and/or measured with respect to a surface
on which the element is located. Conversely, a "depth" refers to a
vertical size of an element (e.g., a layer, trench, hole, opening,
etc.) in the cross-sectional views measured from a top surface to a
bottom surface of the element. Terms such as "thick", "thickness",
"thin" or derivatives thereof may be used in place of "height"
where indicated.
[0036] As used herein, "width" or "length" refers to a size of an
element (e.g., a layer, trench, hole, opening, etc.) in the
drawings measured from a side surface to an opposite surface of the
element. Terms such as "thick", "thickness", "thin" or derivatives
thereof may be used in place of "width" or "length" where
indicated.
[0037] As used herein, terms such as "upper", "lower", "right",
"left", "vertical", "horizontal", "top", "bottom", and derivatives
thereof shall relate to the disclosed structures and methods, as
oriented in the drawing figures. For example, as used herein,
"vertical" refers to a direction perpendicular to the top surface
of the substrate in the cross-sectional views, and "horizontal"
refers to a direction parallel to the top surface of the substrate
in the cross-sectional views.
[0038] As used herein, unless otherwise specified, terms such as
"on", "overlying", "atop", "on top", "positioned on" or "positioned
atop" mean that a first element is present on a second element,
wherein intervening elements may be present between the first
element and the second element. As used herein, unless otherwise
specified, the term "directly" used in connection with the terms
"on", "overlying", "atop", "on top", "positioned on" or "positioned
atop" or the term "direct contact" mean that a first element and a
second element are connected without any intervening elements, such
as, for example, intermediary conducting, insulating or
semiconductor layers, present between the first element and the
second element.
[0039] One illustrative embodiment for forming an ISFET will be
described below with reference to FIGS. 1-8. Note that the same
reference numeral (100) is used to denote the semiconductor
structure through the various intermediate fabrication stages
illustrated in FIGS. 1 through 8. Note also that the ISFET
described herein can also be considered to be a semiconductor
device and/or an integrated circuit, or some part thereof. FIG. 1
illustrates a cross sectional view of an ISFET at a
first-intermediate fabrication stage. For the purpose of clarity,
several fabrication steps leading up to the production of the ISFET
as illustrated in FIG. 1 are omitted. In other words, the ISFET
does not necessarily start out in the form illustrated in FIG. 1,
but may develop into the illustrated structure over one or more
well-known processing steps which are not illustrated but are
well-known to those of ordinary skill in the art.
[0040] Referring to FIG. 1, a semiconductor structure 100 comprises
a semiconductor base 102. In general, semiconductor base 102 can
have semiconductor components (e.g., transistor, etc.) formed
therein such as, by way of example, a complementary metal oxide
semiconductor (CMOS) integrated circuit (IC) logic device which
contains both n-type field effect transistors (NFETs) and p-type
field effect transistors (PFETs). For example, semiconductor base
102 can be formed by standard CMOS flow including implementing a
gate over the semiconductor fins. In addition, semiconductor base
102 can include a substrate 102a, source 102b and a drain 102c, a
gate oxide 102d and metal gate 102e contacted to a BEOL metal 102g,
together with metal contacts 102h in a dielectric layer 102f. For
clarity, the semiconductor structure discussed herein will
reference the semiconductor base as semiconductor base 102 or
semiconductor base 202 or semiconductor base 302.
[0041] Semiconductor structure 100 further includes a passivation
layer 104 disposed on a top surface of semiconductor base 102.
Passivation layer 104 includes, for example, silicon nitride and
may be formed by any conventional deposition process such as
chemical vapor deposition (CVD), physical vapor deposition (PVD),
plasma enhanced chemical vapor deposition (PECVD), atomic layer
deposition (ALD), chemical solution deposition or other like
processes. The thickness of passivation layer 104 can be relatively
thin, e.g., a thickness ranging from about 3 nanometers (nm) to
about 6 nm. More specifically, the passivation layer 104 can have a
thickness of, e.g., about 5 nm
[0042] Semiconductor structure 100 further includes a dielectric
layer 106 disposed on a top surface of passivation layer 104.
Suitable dielectric material for dielectric layer 106 includes, for
example, silicon nitride, silicon oxide, silicon dioxide, silicon
oxynitride, a dielectric metal oxide, a dielectric metal nitride,
or a combination thereof. The dielectric layer 106 may be formed by
suitable deposition processes, for example, CVD, PVD, PECVD, ALD,
chemical solution deposition or other like processes. The thickness
of the dielectric material may vary depending on the deposition
process as well as the composition and dielectric material
used.
[0043] Semiconductor structure 100 further includes a hardmask 108
disposed over dielectric layer 106. For illustrative purposes of
the present invention, hardmask 108 may be silicon dioxide
(SiO.sub.2) or silicon nitride (Si.sub.3N.sub.4), depending on the
material for dielectric layer 106. In addition, a photoresist layer
(not shown) may be provided above hardmask 108. In at least one
embodiment of the present invention, hardmask 108 can be patterned
or etched by any technique known in the art to form a pillar mask
108a in micro well region defined by D.sub.1. For example, etching
may be accomplished by etching into the substrate utilizing a
conventional dry etching process such as reactive-ion etching (RIE)
or plasma etching. RIE is a form of plasma etching in which during
etching the surface to be etched is placed on a radio-frequency
powered electrode. Moreover, during RIE the surface to be etched
takes on a potential that accelerates the etching species extracted
from plasma toward the surface, in which the chemical etching
reaction is taking place in the direction normal to the surface.
Other examples of anisotropic etching that can be used at this
point of the present invention include ion beam etching, plasma
etching or laser ablation.
[0044] FIG. 2 illustrates a view of a semiconductor structure 100
at a second-intermediate fabrication stage. First, a directional
etch technique such as, for example, RIE, is carried out through
dielectric layer 106 that exposes the top surface of passivation
layer 104 to form pillars 110. When carrying out this directional
etch, a portion of hardmask 108 is removed from the top of pillars
110.
[0045] Next, the exposed passivation layer 104 is removed utilizing
an isotropic etching process that selectivity removes the
passivation layer 104 and exposes the top surface of semiconductor
base 102. The isotropic etch may be a wet or dry etch that is
selective to the material in passivation layer 104. If desired, an
additional isotropic etch of hardmask 108 can be carried out to
completely remove the hardmask 108 on top of pillars 110 while
removing a portion of the top surface of hardmask 108 on dielectric
layer 106, e.g., about 0.3 .mu.m or less, and portion of sidewalls
of hardmask 108 on dielectric layer 106 defined by D.sub.1. See
FIG. 3. The geometry of the pillars in the micro-well resulting
from the selective etching of dielectric material can increase
total capacitor surface area as compared to other designs. In
addition, this can enhance the sensitivity of the underlying ISFET
by increasing capacitor surface area as compared to other
designs
[0046] FIG. 4 illustrates a view of semiconductor structure 100 at
a fourth-intermediate fabrication stage. During this stage metal
layer 112 is deposited on the exposed surfaces of semiconductor
base 102, passivation layer 104, dielectric layer 106, hardmask 108
and pillars 110. Suitable metallic material for metal layer 112
includes, for example, tungsten, titanium, tantalum, ruthenium,
zirconium, cobalt, copper, aluminum, lead, platinum, tin, silver,
and gold. Metal layer 112 can be formed by a suitable deposition
process, for example, ALD.
[0047] FIG. 5 illustrates a cross-sectional view of semiconductor
structure 100 at a fifth-intermediate fabrication stage. During
this stage, a sacrificial material 114 is deposited in the
micro-well defined by D.sub.1 and over the top surface of
semiconductor structure 100 including metal layer 112 on the top
surface of hardmask 108 (not shown). Suitable sacrificial material
includes, for example, amorphous materials such as amorphous
silicon, an amorphous silicon germanium alloy (aSiGe) and the like.
Sacrificial material 114 can be deposited by any conventional
deposition process such as CVD, PVD, PECVD, ALD, chemical solution
deposition or other like processes. Sacrificial material 114 is
then planarized by, for example, a planarization process such as a
chemical mechanical planarization (CMP). Optionally, sacrificial
material 114 can be recessed in the micro-well to remove the
residual of sacrificial material 114 (if there is any) on top of
the top surface of the metal 112 to expose the top surface of metal
layer 112 on the top surface of hardmask 108. The exposed metal
layer 112 on the top surface of hardmask 108 is removed utilizing
an isotropic etching process that selectivity removes the metal
layer 112 and exposes the top surface of hardmask 108. The
isotropic etch may be a wet or dry etch that is selective to the
metal layer 112.
[0048] FIG. 6 illustrates a view of semiconductor structure 100 at
a sixth-intermediate fabrication stage. During this stage,
sacrificial material 114 is removed by conventional techniques,
e.g., by a gas phase HCL etch, and passivation layer 116 is
deposited on the exposed surfaces of hardmask 108 and metal layer
112. The passivation layer 116 can be used to, e.g., (1) prevent
ions (e.g., sodium (Na) and/or potassium (K) ions) from getting
into the underlying transistor, and (2) serve as a sensing layer to
absorb electric charges in the analyte solution applied to the
surface of the passivation layer 116. The passivation layer 116 can
include any suitable material in accordance with the embodiments
described herein. Suitable material for passivation layer 116
includes, for example, SiN, Al.sub.2O.sub.3, Ta.sub.2O.sub.5, and
the like. Passivation layer 116 can be deposited by any
conventional deposition process such as CVD, PVD, PECVD, ALD,
chemical solution deposition or other like processes.
[0049] FIG. 7 illustrates a view of semiconductor structure 100 at
a seventh-intermediate fabrication stage. FIG. 7 illustrates the
exemplary structure of FIG. 6 after providing (i.e., introducing)
an analyte-containing solution (not shown) to the micro-well. The
term "analyte" is used throughout the present application to denote
a substance (either chemical or biological), or a chemical or
biological constituent that can be subject to analyses and
detection by ISFET sensing. That is, the analyte is composed of a
chemical or biological material that has, or can generate an
electric charge 118, in a solution (aqueous or non-aqueous (polar
or non-polar)) such that the amount of electrical charge 118 in the
analyte-containing solution (not shown) can be measured by the
threshold voltage change of the underlying FET. The resulting ISFET
will have enhanced sensitivity by increasing the passivation
capacitance due to increase of surface area by forming the vertical
standing micro-pillars inside the micro well defined by D.sub.1.
For example, FIG. 8 illustrates a top down view of the micro-well
of semiconductor structure 100 of FIG. 7 in accordance with the
illustrative embodiment containing pillars 110 and the passivation
layer with electrical charge 118.
[0050] Multiple vertical pillars are formed inside the micro-well
and the geometry resulting from the selective etch process (e.g.,
vertical pillar-shaped geometry) can allow for an increased
capacitor surface area as compared to other geometries (e.g.,
rectangular shaped geometries). As will be described in further
detail below, sensitivity can be enhanced due to the increased
capacitor surface area achieved by this geometry.
[0051] Although the passivation layer 116 can prevent ions from
getting into the underlying transistor and can serve as a sensing
layer to absorb electric charges in the analyte solution to the
surface of the passivation layer 116, the passivation layer 116 can
reduce the sensitivity of the underlying transistor. For example,
the passivation layer 116 can create a passivation capacitance
(C.sub.p) in series with a FET capacitance (C.sub.FET). More
specifically, as compared with the case without a passivation layer
(e.g., analyte directly contacting gate), the sensitivity of the
underlying ISFET can be reduced by a factor of A, where A can be
expressed as A=C.sub.p/(C.sub.p+C.sub.FET). In the embodiment in
which the passivation layer 116 has a thickness greater than that
of the gate dielectric 102d in base 102, C.sub.p can be less than
C.sub.FET, thereby resulting in sensitivity value of A of less than
1. Based on this, the sensitivity of the underlying transistor can
be increased by increasing the value of C.sub.p. There is a direct
relationship between total capacitor surface area and C.sub.p, such
that the greater the total capacitor surface area, the larger the
capacitance value of C.sub.p. Accordingly, increasing the total
capacitor surface area can result in enhanced sensitivity of the
underlying transistor.
[0052] For yet another example, vertical pillars with a smaller
diameter "d" and pitch "P" as shown in FIG. 8 can be formed to
achieve larger surface area and thus a higher passivation
capacitance (C.sub.p), which will result in further enhanced
sensitivity of the underlying transistor.
[0053] Another illustrative embodiment for forming an ISFET will be
described below with reference to FIGS. 9-15. Note that the same
reference numeral (200) is used to denote the semiconductor
structure through the various intermediate fabrication stages
illustrated in FIGS. 9 through 15. Note also that the ISFET
described herein can also be considered to be a semiconductor
device and/or an integrated circuit, or some part thereof. FIG. 9
illustrates a cross sectional view of an ISFET at a
first-intermediate fabrication stage. For the purpose of clarity,
several fabrication steps leading up to the production of the ISFET
as illustrated in FIG. 9 are omitted. In other words, the ISFET
does not necessarily start out in the form illustrated in FIG. 9,
but may develop into the illustrated structure over one or more
well-known processing steps which are not illustrated but are
well-known to those of ordinary skill in the art.
[0054] Referring to FIG. 9, a semiconductor structure 200 comprises
a semiconductor base 202. In general, semiconductor base 202 can be
the same as described above for semiconductor base 102.
Semiconductor structure 200 further includes a passivation layer
204 disposed on a top surface of semiconductor base 202 and a
dielectric layer 206 disposed on a top surface of passivation layer
204. Passivation layer 204 and dielectric layer 206 can be the same
as those described above for passivation layer 104 and dielectric
layer 106. Micro-well defined as D.sub.1 is formed by first
depositing a hardmask (not shown) over the dielectric layer 206 as
a mask to etch through the dielectric layer and exposing the top
surface of passivation layer 204 layer, and then the hardmask is
removed by conventional means. A first dielectric layer 208 (e.g.,
amorphous Si) is deposited on the top surface and sidewall of the
dielectric layer 206 as well as the top surface of the passivation
layer 204. A directional reactive ion etch is performed to remove
the first dielectric layer 208 on the horizontal surfaces and form
the first dielectric layer 208 as a first sidewall spacer. Then a
second dielectric layer 210 (e.g., silicon nitride) is deposited. A
directional reactive ion etch is then performed to remove the
second dielectric layer 210 on the horizontal surfaces and form the
second dielectric layer 210 as a second sidewall spacer. Next, the
first dielectric layer 208 (such as a-Si) is deposited for the
second time followed by a RIE etch process. The second dielectric
layer 210 (such as SiN) is then deposited for the second time
followed by the RIE process. This deposition/etch process can be
repeated until the final gap is pinched off. As one skilled in the
art will readily appreciate, depending on the thickness of the
alternative layers and the dimension of the pre-defined micro well,
multiple layer deposition and spacer RIE can be done before the
final layer deposition pinches off.
[0055] FIG. 10 illustrates a view of semiconductor structure 200 at
a second-intermediate fabrication stage. During this stage, the top
surface of the first dielectric layers 208, and second dielectric
layers 210 is recessed to below a top surface of dielectric layer
206. The top surface of the first dielectric layers 208, and second
dielectric layers 210 can be recessed using a selective directional
removal technique that is selective to the first dielectric layers
208, and second dielectric layers 210, for example, a wet or dry
isotropic etch.
[0056] FIG. 11 illustrates a view of semiconductor structure 200 at
a third-intermediate fabrication stage. During this stage, the
first dielectric layers 208 are selectively removed utilizing an
isotropic etching process that exposes the top surface of
semiconductor base 202. The isotropic etch may be a wet or dry etch
that is selective to the first dielectric layers 208. Next, metal
layer 214 is deposited on the exposed surfaces of semiconductor
base 202, dielectric layer 206, and second dielectric layers 210.
Suitable metallic material and deposition techniques for metal
layer 214 can be the same as those described above for metal layer
112.
[0057] FIG. 12 illustrates a cross-sectional view of semiconductor
structure 200 at a fourth-intermediate fabrication stage. During
this stage, a sacrificial material 216 is deposited in the
micro-well defined by D.sub.1 and over the top surface of
semiconductor structure 200 including metal layer 214 on the top
surface of dielectric layer 206 (not shown). Suitable sacrificial
material can be any of those described above for sacrificial
material 114. Sacrificial material 216 can be deposited by any
conventional deposition process such as CVD, PVD, PECVD, ALD,
chemical solution deposition or other like processes. Sacrificial
material 216 is then planarized by, for example, a planarization
process such as CMP. Optionally, sacrificial material 216 can be
recessed in the micro-well to remove the residual of sacrificial
material 216 (if there is any) on top of the top surface of the
metal 214 to expose the top surface of metal layer 214 on the top
surface of dielectric layer 206 (not shown). The exposed metal
layer 214 on the top surface of dielectric layer 206 is removed
utilizing an isotropic etching process that selectivity removes the
metal layer 214 and exposes the top surface of dielectric layer
206. The isotropic etch may be a wet or dry etch that is selective
to the metal layer 214.
[0058] FIG. 13 illustrates a view of semiconductor structure 200 at
a fifth-intermediate fabrication stage. During this stage,
sacrificial material 216 is removed by conventional techniques,
e.g., a gas phase HCL etch, and passivation layer 218 is deposited
on the exposed surfaces of dielectric layer 208 and metal layer
214. Suitable material and deposition techniques for passivation
layer 218 can be the same as those described above for passivation
layer 116.
[0059] FIG. 14 illustrates a view of semiconductor structure 200 at
a sixth-intermediate fabrication stage. During this stage, an
electrical charge 220 is introduced into passivation layer 218 by
methods described above. The resulting ISFET will have enhanced
sensitivity by increasing the passivation capacitance due to
increase of surface area by forming multiple vertical rings inside
the micro cell defined by D.sub.1 using no hardmask. For example,
FIG. 15 illustrates a top down view of the micro-well of
semiconductor structure 200 of FIG. 13 after sacrificial layer 216
has been removed, such that semiconductor structure 200 has
vertical rings for dielectric layer 206, and dielectric layers 210.
In this example, sacrificial layer 216 is deposited for three times
and the dielectric layer 210 is deposited twice to completely fill
the micro-well before the sacrificial layer 216 is removed. The
geometry of the vertical rings in the micro-well resulting from the
selective etching of dielectric material can increase the total
capacitor surface area as compared to other designs. In addition,
this can enhance the sensitivity of the underlying ISFET by
increasing capacitor surface area as compared to other designs.
[0060] Another illustrative embodiment for forming an ISFET will be
described below with reference to FIGS. 16-20. Note that the same
reference numeral (300) is used to denote the semiconductor
structure through the various intermediate fabrication stages
illustrated in FIGS. 16 through 20. Note also that the ISFET
described herein can also be considered to be a semiconductor
device and/or an integrated circuit, or some part thereof. FIG. 16
illustrates a cross sectional view of an ISFET at a
first-intermediate fabrication stage. For the purpose of clarity,
several fabrication steps leading up to the production of the ISFET
as illustrated in FIG. 16 are omitted. In other words, the ISFET
does not necessarily start out in the form illustrated in FIG. 16,
but may develop into the illustrated structure over one or more
well-known processing steps which are not illustrated but are
well-known to those of ordinary skill in the art.
[0061] Referring to FIG. 16, a semiconductor structure 300
comprises a semiconductor base 302. In general, semiconductor base
302 can be the same as described above for semiconductor base 102.
Semiconductor structure 300 further includes a passivation layer
304 disposed on a top surface of semiconductor base 302 and a
dielectric layer 306 disposed on a top surface of passivation layer
304. Passivation layer 304 and dielectric layer 306 can be the same
as those described above for passivation layer 104 and dielectric
layer 106. A micro-well defined as D.sub.1 is formed as described
above.
[0062] Semiconductor structure 300 further includes metal layer 308
deposited on the exterior surface of the micro-well defined by
D.sub.1. Metal layer 308 can be the same material as those
described above for metal layer 112. A conformal sacrificial layer
310 is then deposited. Sacrificial layer 310 can be the same
material as those described above for sacrificial layer 208. Next,
a conformal dielectric material 312 is deposited. Dielectric layer
312 can be the same material as those described above for
passivation layer 210. Another sacrificial layer 310 is then
deposited in and fills the opening in dielectric layer 312. In this
embodiment, two sacrificial layer depositions and one dielectric
layer deposition are used. However, other arrangements are
contemplated herein. Next, a CMP process is performed to remove the
multilayers on top of the metal layer 308 on top of the dielectric
layer 306. The CMP process can also remove the horizontal portion
of the metal layer 308 on top of dielectric layer 306.
Alternatively, the CMP process can stop on top of the horizontal
surface of the metal layer 308 on dielectric layer 306. The exposed
metal layer 308 can be selectively removed by suitable methods
known in art. Next, the top surface of the dielectric layer 310 and
sacrificial layer 312 is recessed to below a top surface of
dielectric layer 306. The top surface can be recessed using a
selective directional removal technique that is selective to the
dielectric layer 310 and sacrificial layer 312, for example, a wet
or dry isotropic etch.
[0063] FIG. 17 illustrates a view of semiconductor structure 300 at
a second-intermediate fabrication stage. During this stage, a
selective etch, e.g., isotropic etch, of the sacrificial layer 310
is carried out to leave a portion of the sacrificial layer 310
under dielectric layer 312 to support the dielectric layer 312
structure. In general, the remaining sacrificial layer 310 should
have a thickness ranging from about 500 nm to about 1000 nm.
[0064] FIG. 18 illustrates a cross-sectional view of semiconductor
structure 300 at a third-intermediate fabrication stage. During
this stage, metal layer 314 is deposited on the exposed surfaces of
semiconductor structure 300. Suitable metallic material for metal
layer 314 can be the same as those described above for metal layer
112. Metal layer 314 can be formed by a suitable deposition
process, for example, ALD. Next, sacrificial material 316 is
deposited in the micro-well defined by D.sub.1 and over the top
surface of semiconductor structure 300 including metal layer 314
(not shown). Suitable sacrificial material can be any of those
described above for sacrificial material 114. Sacrificial material
316 can be deposited by any conventional deposition process such as
CVD, PVD, PECVD, ALD, chemical solution deposition or other like
processes. Sacrificial material 316 is then planarized by, for
example, a planarization process such as a chemical mechanical
planarization (CMP). Next, sacrificial material 316 is then
recessed in the micro-well and exposes the top surface of metal
layer 314 on the top surface of dielectric layer 306 (not shown).
The exposed metal layer 314 on the top surface of dielectric layer
306 is then removed utilizing an isotropic etching process that
selectivity removes the metal layer 314 and exposes the top surface
of dielectric layer 306. The isotropic etch may be a wet or dry
etch that is selective to the metal layer 314.
[0065] FIG. 19 illustrates a view of semiconductor structure 300 at
a fourth-intermediate fabrication stage. During this stage,
sacrificial material 316 is removed by conventional techniques as
described above and passivation layer 318 is deposited on the
exposed surfaces of dielectric layer 306 and metal layer 314.
Suitable material and deposition techniques for passivation layer
318 can be the same as those described above for passivation layer
116. Next, an electrical charge 320 is introduced into passivation
layer 318 by methods described above. The resulting ISFET will have
enhanced sensitivity by increasing the passivation capacitance due
to increase of surface area by forming multiple vertical rings with
different heights inside the micro cell defined by D.sub.1 using no
hardmask. For example, FIG. 20 illustrates a cross-sectional view
of the micro-well of semiconductor structure 300 of FIG. 17 after a
portion of sacrificial layer 312 has been removed. The geometry of
the vertical rings in the micro-well resulting from the selective
etching of dielectric material can increase total capacitor surface
area as compared to other designs. In addition, this can enhance
the sensitivity of the underlying ISFET by increasing capacitor
surface area as compared to other designs
[0066] It is to be understood that the methods discussed herein for
fabricating semiconductor structures can be incorporated within
semiconductor processing flows for fabricating other types of
semiconductor devices and integrated circuits with various analog
and digital circuitry or mixed-signal circuitry. In particular,
integrated circuit dies can be fabricated with various devices such
as transistors, diodes, capacitors, inductors, etc. An integrated
circuit in accordance with embodiments can be employed in
applications, hardware, and/or electronic systems. Suitable
hardware and systems for implementing embodiments of the invention
may include, but are not limited to, personal computers,
communication networks, electronic commerce systems, portable
communications devices (e.g., cell phones), solid-state media
storage devices, functional circuitry, etc. Systems and hardware
incorporating such integrated circuits are considered part of the
embodiments described herein.
[0067] Furthermore, various layers, regions, and/or structures
described above may be implemented in integrated circuits (chips).
The resulting integrated circuit chips can be distributed by the
fabricator in raw wafer form (that is, as a single wafer that has
multiple unpackaged chips), as a bare die, or in a packaged form.
In the latter case, the chip is mounted in a single chip package
(such as a plastic carrier, with leads that are affixed to a
motherboard or other higher level carrier) or in a multichip
package (such as a ceramic carrier that has either or both surface
interconnections or buried interconnections). In any case, the chip
is then integrated with other chips, discrete circuit elements,
and/or other signal processing devices as part of either (a) an
intermediate product, such as a motherboard, or (b) an end product.
The end product can be any product that includes integrated circuit
chips, ranging from toys and other low-end applications to advanced
computer products having a display, a keyboard or other input
device, and a central processor.
[0068] Although illustrative embodiments have been described herein
with reference to the accompanying drawings, it is to be understood
that the invention is not limited to those precise embodiments, and
that various other changes and modifications may be made by one
skilled in art without departing from the scope or spirit of the
invention.
* * * * *