U.S. patent application number 16/033384 was filed with the patent office on 2020-01-16 for disposable laser/flash anneal absorber for embedded neuromorphic memory device fabrication.
The applicant listed for this patent is International Business Machines Corporation. Invention is credited to Martin M. Frank, Kam-Leung Lee, Vijay Narayanan, Deborah A. Neumayer, Son Nguyen.
Application Number | 20200020542 16/033384 |
Document ID | / |
Family ID | 69139608 |
Filed Date | 2020-01-16 |
United States Patent
Application |
20200020542 |
Kind Code |
A1 |
Lee; Kam-Leung ; et
al. |
January 16, 2020 |
DISPOSABLE LASER/FLASH ANNEAL ABSORBER FOR EMBEDDED NEUROMORPHIC
MEMORY DEVICE FABRICATION
Abstract
A conformal disposable absorber is disclosed which is capable of
providing efficient heat transfer to an embedded memory device
during a localized absorber anneal, without adversary impacting the
back-end-of-the-line (BEOL) structure. The disposable absorber is
composed of an amorphous carbonitride material that can be designed
to have a low reflection coefficient for laser/flash illumination,
and a high extinction coefficient for efficient laser/flash
illumination absorption. The disposable absorber is formed at a
temperature of 400.degree. C. or less.
Inventors: |
Lee; Kam-Leung; (Putnam
Valley, NY) ; Neumayer; Deborah A.; (Danbury, CT)
; Nguyen; Son; (Schenectady, NY) ; Frank; Martin
M.; (Dobbs Ferry, NY) ; Narayanan; Vijay; (New
York, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
International Business Machines Corporation |
Armonk |
NY |
US |
|
|
Family ID: |
69139608 |
Appl. No.: |
16/033384 |
Filed: |
July 12, 2018 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/324 20130101;
H01L 27/11509 20130101; H01L 23/5222 20130101; H01L 21/76895
20130101; H01L 27/11502 20130101; H01L 21/02118 20130101; H01L
21/76849 20130101; H01L 21/02115 20130101; H01L 27/222 20130101;
H01L 28/60 20130101; H01L 43/02 20130101; G06N 3/0635 20130101;
H01L 45/00 20130101; H01L 45/08 20130101; H01L 28/40 20130101; H01L
21/02274 20130101; H01L 45/06 20130101; H01L 27/24 20130101 |
International
Class: |
H01L 21/324 20060101
H01L021/324; H01L 21/768 20060101 H01L021/768; H01L 21/02 20060101
H01L021/02; H01L 49/02 20060101 H01L049/02; H01L 23/522 20060101
H01L023/522 |
Claims
1. A method of forming a structure, the method comprising:
providing a lower interconnect level including at least one first
electrically conductive structure embedded in a memory device area
of a first interconnect dielectric material layer; forming a memory
device above the at least one first electrically conductive
structure; forming a conformal disposable absorber composed of an
amorphous carbonitride material surrounding at least an upper
portion of the memory device; performing an anneal to predominately
heat the disposable absorber locally and to activate the memory
device; removing the disposable absorber; and forming an upper
interconnect level above the lower interconnect level and the
memory device.
2. The method of claim 1, wherein the amorphous carbonitride
material has a reflection coefficient of 0.15 or less, and an
extinction coefficient of 0.2 or greater.
3. The method of claim 2, wherein the amorphous carbonitride
material has a minimum of hydrocarbon content as observed by
FTIR.
4. The method of claim 1, further comprising forming, prior to the
forming of the memory device, a landing pad above the at least one
first electrically conductive structure.
5. The method of claim 4, wherein the at least one first
electrically conductive structure has a recessed surface.
6. The method of claim 5, wherein a metal capping layer is present
on the recessed surface of the at least one first electrically
conductive structure.
7. The method of claim 1, wherein the memory device comprises a
ferroelectric (FE) memory device, a resistive random access memory
(ReRAM) device, a magnetoresistive random access memory (MRAM), or
a phase change random access memory (PRAM).
8. The method of claim 1, further comprising forming, prior to the
forming of the disposable absorber, a dielectric capping layer
surrounding at least a lower portion of the memory device.
9. The method of claim 1, wherein the upper interconnect level
includes at least one second electrically conductive structure
embedded in a second interconnect dielectric material layer, and
contacting the memory device.
10. The method of claim 1, wherein the anneal is performed at a
temperature of 400.degree. C. to 1000.degree. C. or greater.
11. The method of claim 10, wherein the anneal is a nanosecond to
millisecond flash anneal, a laser anneal, or a microwave
anneal.
12. A method of forming a structure, the method comprising:
providing a lower interconnect level including at least one first
electrically conductive structure embedded in a first interconnect
dielectric material layer; forming a metal-insulator-metal
capacitor above the at least one first electrically conductive
structure; forming a conformal disposable absorber composed of an
amorphous carbonitride material surrounding at least an upper
portion of the metal-insulator-metal capacitor; performing an
anneal to predominately heat the disposable absorber locally and to
activate the memory device; removing the disposable absorber; and
forming an upper interconnect level above the lower interconnect
level and the metal-insulator-metal capacitor.
13. The method of claim 12, wherein the amorphous carbonitride
material has a reflection coefficient of 0.15 or less, and an
extinction coefficient of 0.2 or greater.
14.-20. (canceled)
21. The method of claim 12, wherein the amorphous carbonitride
material has a minimum of hydrocarbon content as observed by
FTIR.
22. The method of claim 12, wherein the anneal is performed at a
temperature of 400.degree. C. to 1000.degree. C. or greater.
23. The method of claim 22, wherein the anneal is a nanosecond to
millisecond flash anneal, a laser anneal, or a microwave anneal.
Description
BACKGROUND
[0001] The present application relates to a method of fabricating a
memory device embedded in a back-end-of-the-line (BEOL) structure
for use in a neuromorphic computing system. More particularly, a
conformal disposable absorber is disclosed which is capable of
providing efficient heat transfer to an embedded memory device
during a localized absorber anneal, without adversary impacting the
BEOL structure.
[0002] Neuromorphic computing systems, also referred to as
artificial neural networks, are computational systems that permit
electronic systems to essentially function in a manner analogous to
that of biological brains. Neuromorphic computing systems do not
generally utilize a traditional digital model of manipulating Os
and 1s. Instead, neuromorphic computing systems create connections
between processing elements that are roughly functionally
equivalent to neurons of a biological brain.
[0003] Neuromorphic computing systems may include memory devices
that are embedded in a back-end-of-the-line (BEOL) structure.
Examples of memory devices that can be employed in neuromorphic
computing systems and embedded in a BEOL structure may include
ferroelectric (FE) memory, resistive random access memory (ReRAM),
magnetoresistive random access memory (MRAM), and/or phase change
random access memory (PRAM).
[0004] In the fabrication of memory devices that are embedded in a
back-end-of-the-line (BEOL) structure, a high temperature thermal
anneal such as, a flash anneal or rapid thermal anneal, may be
useful in order to optimize one or more elements of the embedded
memory device. For example, FE memory devices including a stack of
TiN/HfO.sub.2/TiN require a high temperature rapid thermal anneal
budget (greater than 600.degree. C./1 second) to enable HfO.sub.2
to recrystallize to exhibit a ferroelectric capacitance behavior.
The high thermal anneal budget requirement is incompatible with the
elements of the BEOL structure.
[0005] In addition to using thermal anneals, a high temperature
(about 1000.degree. C.) nanosecond laser anneal, which has a much
less thermal budget than rapid thermal annealing, has been used to
provide HfO.sub.2 with ferroelectric capacitance behavior. However,
and given that the BEOL dielectric material is optically
transparent to laser illumination, the direct illumination of the
laser to the BEOL structure will create undesirable heating effects
of the electrically conductive metal or metal alloy structure
embedded in the interconnect dielectric material of the BEOL
structure.
[0006] There is thus a need for providing a method which can be
used to fabricate an embedded memory device in a BEOL structure
that substantially, or even entirely, eliminates the aforementioned
problems associated with annealing of such memory devices.
SUMMARY
[0007] A conformal disposable absorber is disclosed which is
capable of providing efficient heat transfer to an embedded memory
device during a localized absorber anneal, without adversary
impacting the back-end-of-the-line (BEOL) structure. The disposable
absorber is composed of an amorphous carbonitride material that can
be designed to have a low reflection coefficient for laser/flash
illumination, and a high extinction coefficient for efficient
laser/flash illumination absorption. The disposable absorber is
formed at a temperature of 400.degree. C. or less.
[0008] In one aspect of the present application, a method of
forming a structure including a memory device embedded in a
back-end-of-the-line (BEOL) structure is provided. In one
embodiment, the method includes providing a lower interconnect
level including at least one first electrically conductive
structure embedded in a memory device area of a first interconnect
dielectric material layer. A memory device is then formed above the
at least one first electrically conductive structure, and
thereafter a conformal disposable absorber composed of an amorphous
carbonitride material is formed surrounding at least an upper
portion of the memory device. An anneal is then performed to
predominately heat the disposable absorber locally and to activate
the memory device. After the anneal, the disposable absorber is
removed. Next, an upper interconnect level is formed above the
lower interconnect level and the memory device.
[0009] In another aspect of the present application, a method of
forming a structure including a metal-insulator-metal capacitor
embedded in back-end-of-the-line (BEOL) structure is provided. In
one embodiment, the method includes providing a lower interconnect
level including at least one first electrically conductive
structure embedded in a first interconnect dielectric material
layer. A metal-insulator-metal capacitor (MIM cap) is then formed
above the at least one first electrically conductive structure, and
thereafter a conformal disposable absorber composed of an amorphous
carbonitride material is formed surrounding at least an upper
portion of the metal-insulator-metal capacitor. An anneal is then
performed to predominately heat the disposable absorber locally and
to activate the memory device. After the anneal, the disposable
absorber is removed. Next, an upper interconnect level is formed
above the lower interconnect level and the MIM cap.
[0010] In yet another aspect of the present application, a
structure is provided. In one embodiment, the structure includes a
lower interconnect level including at least one first electrically
conductive structure embedded in a memory device area of a first
interconnect dielectric material layer. A memory device is located
above the at least one first electrically conductive structure, and
a conformal disposable absorber composed of an amorphous
carbonitride material surrounds at least an upper portion of the
memory device.
BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS
[0011] FIG. 1 is a cross sectional view of an exemplary structure
of the present application during an early stage of fabrication,
and including a lower interconnect level containing a plurality of
first electrically conductive structures embedded in a first
interconnect dielectric material layer.
[0012] FIG. 2 is a cross sectional view of the exemplary structure
of FIG. 1 after forming a metal capping layer on a physically
exposed surface of each first electrically conductive
structure.
[0013] FIG. 3 is a cross sectional view of the exemplary structure
of FIG. 2 after forming a landing pad above each first electrically
conductive structure present in a memory device area of the
structure.
[0014] FIG. 4 is a cross sectional view of the exemplary structure
of FIG. 3 after forming a memory device on the landing pad.
[0015] FIG. 5 is a cross sectional view of the exemplary structure
of FIG. 4 after forming a dielectric capping layer.
[0016] FIG. 6 is a cross sectional view of the exemplary structure
of FIG. 5 after forming a conformal disposable absorber on the
dielectric capping layer.
[0017] FIG. 7 is a cross sectional view of the exemplary structure
of FIG. 6 after performing an anneal to predominately heat the
disposable absorber locally and to activate the memory device, and
thereafter removing the disposable absorber.
[0018] FIG. 8 is a cross sectional view of the exemplary structure
of FIG. 7 after forming an upper interconnect level containing a
plurality of second electrically conductive structures embedded in
a second interconnect dielectric material layer.
DETAILED DESCRIPTION
[0019] The present application will now be described in greater
detail by referring to the following discussion and drawings that
accompany the present application. It is noted that the drawings of
the present application are provided for illustrative purposes only
and, as such, the drawings are not drawn to scale. It is also noted
that like and corresponding elements are referred to by like
reference numerals.
[0020] In the following description, numerous specific details are
set forth, such as particular structures, components, materials,
dimensions, processing steps and techniques, in order to provide an
understanding of the various embodiments of the present
application. However, it will be appreciated by one of ordinary
skill in the art that the various embodiments of the present
application may be practiced without these specific details. In
other instances, well-known structures or processing steps have not
been described in detail in order to avoid obscuring the present
application.
[0021] It will be understood that when an element as a layer,
region or substrate is referred to as being "on" or "over" another
element, it can be directly on the other element or intervening
elements may also be present. In contrast, when an element is
referred to as being "directly on" or "directly over" another
element, there are no intervening elements present. It will also be
understood that when an element is referred to as being "beneath"
or "under" another element, it can be directly beneath or under the
other element, or intervening elements may be present. In contrast,
when an element is referred to as being "directly beneath" or
"directly under" another element, there are no intervening elements
present.
[0022] Referring first to FIG. 1, there is illustrated an exemplary
structure of the present application during an early stage of
fabrication, and including a lower interconnect level containing a
plurality of first electrically conductive structures 16 embedded
in a first interconnect dielectric material layer 12. As is shown,
the exemplary structure includes a first device area in which
non-memory devices (i.e., non-memory device area 100) such as, for
example, logic devices, are present, and a second device area in
which an embedded memory device will be subsequently formed (i.e.,
memory device area 102). When logic devices are present in the
non-memory device area 100, the logic devices would be located in a
front-end-of-the-line (FEOL) level 10 that would be located beneath
the interconnect dielectric material layer 12. A diffusion barrier
liner 14 is typically present between each electrically conductive
structure 16 and the first interconnect dielectric material layer
12.
[0023] The first interconnect dielectric material layer 12 may
include an inorganic dielectric material or an organic dielectric
material. In one embodiment, the first interconnect dielectric
material layer 12 may be non-porous. In another embodiment, the
first interconnect dielectric material layer 12 may be porous. Some
examples of suitable dielectric materials that may be used as the
first interconnect dielectric material layer 12 include, but are
not limited to, silicon dioxide, silsesquioxanes, C doped oxides
(i.e., organosilicates) that includes atoms of Si, C, O and H,
thermosetting polyarylene ethers, or multilayers thereof. The term
"polyarylene" is used in this application to denote aryl moieties
or inertly substituted aryl moieties which are linked together by
bonds, fused rings, or inert linking groups such as, for example,
oxygen, sulfur, sulfone, sulfoxide, carbonyl and the like.
[0024] The first interconnect dielectric material layer 12
typically has a dielectric constant that is about 4.0 or less, with
a dielectric constant of about 2.8 or less being more typical. All
dielectric constants mentioned herein are relative to a vacuum,
unless otherwise noted. These dielectrics generally have a lower
parasitic cross talk as compared with dielectric materials that
have a higher dielectric constant than 4.0. The thickness of the
first interconnect dielectric material layer 12 may vary depending
upon the type of dielectric material(s) used. In one example, the
first interconnect dielectric material layer 12 may have a
thickness from 50 nm to 1000 nm. Other thicknesses that are lesser
than, or greater than, the aforementioned thickness range may also
be employed in the present application for the thickness of the
first interconnect dielectric material layer 12. The first
interconnect dielectric material layer 12 may be formed utilizing
any deposition process including, but not limited to, chemical
vapor deposition (CVD), plasma enhanced chemical vapor deposition
(PECVD) or spin-on coating.
[0025] The first interconnect dielectric material layer 12 is then
processed to include a plurality of openings (not shown). A single
opening and/or a plurality of openings can be formed into each of
the non-memory device area 100 and the memory device area 102. In
the illustrated embodiment of FIG. 1, a single opening is formed
into the memory device area 102 of the first interconnect
dielectric material layer 12, while two openings are formed into
the non-memory device area 100 of the first interconnect dielectric
material layer 12. The openings, which are used to house the first
electrically conductive structures 16, may extend partially through
the first interconnect dielectric material layer 12 (illustrated
embodiment of FIG. 1) or entirely through the first interconnect
dielectric material layer 12 (not shown in the drawings of the
present application). The openings may be via openings, line
openings or a combined via and line opening. The openings may be
formed by lithography and etching.
[0026] In some embodiments, and prior to forming the openings, a
hard mask material layer (not shown) is formed on the first
interconnect dielectric material layer 12. The hard mask material
may be composed of a dielectric oxide, a dielectric nitride and/or
a dielectric oxynitride. In one example, the hard mask material may
be composed of silicon dioxide and/or silicon nitride. The hard
mask material layer may be formed utilizing a deposition process
such as, for example, chemical vapor deposition (CVD) or plasma
enhanced chemical vapor deposition (PECVD). Openings (as defined
above) can then be formed through the hard mask material layer and
into the first interconnect dielectric material layer 12 by
lithography and etching. The thus patterned hard mask material
layer may be removed after forming the openings utilizing any well
known material removal process.
[0027] A diffusion barrier material layer is then formed into each
opening and on the topmost surface of the first interconnect
dielectric material layer 12. The diffusion barrier material layer
includes a diffusion barrier material (i.e., a material that serves
as a barrier to prevent a conductive material such as copper from
diffusing there through) such as, for example, Ta, TaN, Ti, TiN,
Ru, RuN, RuTa, RuTaN, W, or WN. In some embodiments, the diffusion
barrier material layer may include a material stack of diffusion
barrier materials. In one example, the diffusion barrier material
layer may be composed of a stack of Ta/TaN. The thickness of the
diffusion barrier material layer may vary depending on the
deposition process used as well as the material employed. In some
embodiments, the diffusion barrier material layer may have a
thickness from 2 nm to 50 nm; although other thicknesses for the
diffusion barrier material layer are contemplated and can be
employed in the present application. The diffusion barrier material
layer can be formed by a deposition process including, for example,
chemical vapor deposition (CVD), plasma enhanced chemical vapor
deposition (PECVD), atomic layer deposition (ALD), physical vapor
deposition (PVD), sputtering, chemical solution deposition or
plating.
[0028] An electrically conductive metal or metal alloy is formed
into each opening and, is present, on the diffusion barrier
material layer. Examples of electrically conductive metals that may
be used in the present application include copper (Cu), aluminum
(Al), or tungsten (W), while an example of an electrically
conductive metal alloy is a Cu--Al alloy. Typically, copper or a
copper alloy is used in providing each first electrically
conductive structure 16. The electrically conductive metal or metal
alloy can be formed utilizing a deposition process such as, for
example, CVD, PECVD, sputtering, chemical solution deposition or
plating. In one embodiment, a bottom-up plating process is employed
in forming the electrically conductive metal or metal alloy.
[0029] Following the deposition of the electrically conductive
metal or metal alloy, a planarization process such as, for example,
chemical mechanical polishing (CMP) and/or grinding, can be used to
remove the electrically conductive metal or metal alloy (i.e.,
overburden material) and the diffusion barrier material layer that
is present outside each of the openings and from the topmost
surface of the first interconnect dielectric material layer 12. The
electrically conductive metal or metal alloy remaining in each
opening is referred to herein as a first electrically conductive
structure 16, while the diffusion barrier material layer that
remains in each opening is referred to herein as diffusion barrier
liner 14. The planarization stops on a topmost surface of the first
interconnect dielectric material layer 12. At this point of the
present application, and as shown in FIG. 1, each first
electrically conductive structure 16 has a topmost surface that is
coplanar with a topmost surface of the first interconnect
dielectric material layer 12, as well as, the topmost surfaces of
the diffusion barrier liner 14. As is shown, a diffusion barrier
liner 14 is located between each first electrically conductive
structure 16 and the first interconnect dielectric material layer
12. In some embodiments (not specifically shown), the diffusion
barrier liner 14 may be omitted from the exemplary structure.
Collectively, the first interconnect dielectric material layer 12,
the diffusion barrier liners 14 (if present), and the first
electrically conductive structures 16 form a lower interconnect
level of the structure of the present application.
[0030] Referring now to FIG. 2, there is illustrated the exemplary
structure of FIG. 1 after forming a metal capping layer 18 on a
physically exposed surface of each first electrically conductive
structure 16. In some embodiments, this step of the present
application may be omitted. When present, and as is illustrated in
FIG. 2, the metal capping layer 18 may be formed on a recessed
surface of the first electrically conductive structures 16. In
other embodiments (not specifically shown) the metal capping layer
18 may be formed on a non-recessed surface of each of the first
electrically conductive structures 16. Recessing of the first
electrically conductive structures 16 may be performed utilizing an
etching process that is selective in removing the electrically
conductive metal or metal alloy that provides the first
electrically conductive structures 16.
[0031] When present, the metal capping layer 18 may include cobalt
(Co), iridium (Ir), ruthenium (Ru), or manganese (Mn) alone, or
their alloys with at least one of W, B, P, Mo and Re. In one
embodiment, the metal capping layer 18 may be composed of Co or a
CoWP alloy. The metal capping layer 18 may have a thickness from 2
nm to 25 nm; other thicknesses are possible and can be used in the
present application as the thickness of the metal capping layer
18.
[0032] The metal capping layer 18 is typically, but not necessary
always, formed utilizing a selective deposition process including
for example, a catalytic plating process or an electroless plating
process. When a selective deposition process is used, the metal
capping layer 18 is formed on the first electrically conductive
structures 16; the metal capping layer 18 may also extend onto the
diffusion barrier liner 14. In some embodiments, a non-selective
deposition process such as sputtering, ALD, CVD or PVD can be used
in forming the metal capping layer. In such an embodiment, the
metal capping layer is formed on all physically exposed surfaces of
the lower interconnect level (12/14/16). An etch back process, a
planarization process (such as, for example, chemical mechanical
polishing), or patterning process (such as, for example,
lithography and etching) may follow the deposition of the metal
capping layer 18.
[0033] Referring now to FIG. 3, there is illustrated the exemplary
structure of FIG. 2 after forming a landing pad 20 above each first
electrically conductive structure 16 present in the memory device
area 102 of the structure. The landing pad 20 typically includes at
least one metal nitride such as, for example, TaN and/or TiN. The
landing pad 20 may be formed utilizing a deposition such as, for
example, sputtering, CVD, PECVD, or ALD. A patterning process may
follow the deposition of the landing pad 20. The landing pad 20 may
have a thickness from 5 nm to 50 nm, other thicknesses are possible
and can be used in the present application as the thickness of the
landing pad 20.
[0034] Referring now to FIG. 4, there is illustrated the exemplary
structure of FIG. 3 after forming a memory device 22 on the landing
pad 20. The memory device 22 that can be used in the present
application is a non-volatile memory such as, for example, a
ferroelectric memory (FE) device, a resistive random access memory
(ReRAM) device, a magnetoresistive random access memory (MRAM)
device, or a phase change random access memory (PRAM) device. When
more than one first electrically conductive structure 16 is present
in the memory device area 102 of the structure, the memory device
formed atop the first electrically conductive structure 16 in the
memory device area 102, may be of a same, or a different type.
[0035] The FE memory device, which can be used as memory device 22,
is a random access memory similar in construction to a DRAM by
using a ferroelectric layer instead of a dielectric layer to
achieved non-volatility. FE memory devices typically include a
material stack of, from bottom to top, a bottom electrode, a
ferroelectric layer, and a top electrode. The bottom and top
electrodes may be composed of a metal or metal nitride. For
example, TiN may be used as the material for both the bottom and
top electrodes. The ferroelectric layer is composed of one or more
ferroelectric materials exhibiting ferroelectricity (i.e., a
material that has a spontaneous electric polarization that can be
reversed by the application of an external electric field).
Examples of ferroelectric materials that can be used as the
ferroelectric layer include, but at not limited to, mixed metal
oxides such as, BaTiO.sub.3, Pb(Zr.sub.xT.sub.1-x]O.sub.3
(0.1.ltoreq.x.ltoreq.1), or crystalline HfO.sub.2 with, or without,
a doping element selected from Zr, Al, Ca, Ce, Dy, Er, Gd, Ge, La,
Sc, Si, Sr, Sn, C, N, and Y. The FE material stack can be formed by
deposition of the various material layers, and then patterning the
material layers by lithography and etching.
[0036] The ReRAM device, which can be used as memory device 22, is
a random access memory that typically includes a material stack of,
from bottom to top, a bottom electrode, a metal oxide that can
exhibit a change in electron localization, and a top electrode. The
bottom and top electrodes may be composed of a metal or metal
nitride. For example, TiN may be used as the material for both the
bottom and top electrodes. The metal oxide may include oxides of
nickel, zirconium, hafnium, iron, or copper. The ReRAM material
stack can be formed by deposition of the various material layers,
and then patterning the material layers by lithography and
etching.
[0037] The MRAM device, which can be used as memory device 22, is a
random access memory, that includes a magnetic tunnel junction
(MTJ) structure The magnetic tunnel junction (MTJ) structure may
include a reference layer, a tunnel barrier, and a free layer. The
reference layer has a fixed magnetization. The reference layer may
be composed of a metal or metal alloy that includes one or more
metals exhibiting high spin polarization. In alternative
embodiments, exemplary metals for the formation of the reference
layer include iron, nickel, cobalt, chromium, boron, and manganese.
Exemplary metal alloys may include the metals exemplified by the
above. In another embodiment, the reference layer may be a
multilayer arrangement having (1) a high spin polarization region
formed from of a metal and/or metal alloy using the metals
mentioned above, and (2) a region constructed of a material or
materials that exhibit strong perpendicular magnetic anisotropy
(strong PMA). Exemplary materials with strong PMA that may be used
include a metal such as cobalt, nickel, platinum, palladium,
iridium, or ruthenium, and may be arranged as alternating layers.
The strong PMA region may also include alloys that exhibit strong
PMA, with exemplary alloys including cobalt-iron-terbium,
cobalt-iron-gadolinium, cobalt-chromium-platinum, cobalt-platinum,
cobalt-palladium, iron-platinum, and/or iron-palladium. The alloys
may be arranged as alternating layers. In one embodiment,
combinations of these materials and regions may also be
employed.
[0038] The tunnel barrier of the MTJ structure is composed of an
insulator material and is formed at such a thickness as to provide
an appropriate tunneling resistance. Exemplary materials for the
tunnel barrier include magnesium oxide, aluminum oxide, and
titanium oxide, or materials of higher electrical tunnel
conductance, such as semiconductors or low-bandgap insulators.
[0039] The free layer of the MTJ structure is composed of a
magnetic material with a magnetization that can be changed in
orientation relative to the magnetization orientation of the
reference layer. Exemplary materials for the free layer of the MTJ
structure include alloys and/or multilayers of cobalt, iron, alloys
of cobalt-iron, nickel, alloys of nickel-iron, and alloys of
cobalt-iron-boron.
[0040] The MTJ structure of the MRAM device can be formed by
deposition of the various material layers, and then patterning the
material layers by lithography and etching.
[0041] The PRAM device, which can be used as memory device 22, is a
random access memory that typically includes a material stack of,
from bottom to top, a bottom electrode, a phase change memory
material that exhibits a change in atomic order (from crystalline
to amorphous or vice versa), and a top electrode. The bottom and
top electrodes may be composed of a metal or metal nitride. For
example, TiN may be used as the material for both the bottom and
top electrodes. The phase change memory material may include a
chalcogenide glass such as, for example, Ge.sub.2Sb.sub.2Te.sub.5
or Ge.sub.2Bi.sub.2Te.sub.6. The PRAM stack can be formed by
deposition of the various material layers, and then patterning the
material layers by lithography and etching.
[0042] Referring now to FIG. 5, there is illustrated the exemplary
structure of FIG. 4 after forming a dielectric capping layer 24. In
some embodiments, dielectric capping layer 24 can be omitted.
Dielectric capping layer 24 is formed on physically exposed
surfaces of the lower interconnect level (12/14/16). In some
embodiments, the dielectric capping layer 24 is a barrier layer
that may serve as a thermal break between the annealing process and
the first electrically conductive structures 16. The dielectric
capping layer may or may not cover the entirety of the memory
device 22. FIG. 5 illustrates an embodiment in which the dielectric
capping layer 24 laterally surrounds a lower portion of the memory
device 22, and has a height that is less than the height of the
memory device. In other embodiments, the dielectric capping layer
24 may have a height that is equal to, or even greater than, the
height of the memory device 22.
[0043] The dielectric capping layer 24 may include any dielectric
material such as, for example, silicon carbide (SiC), silicon
nitride (Si.sub.3N.sub.4), silicon dioxide (SiO.sub.2), a carbon
doped oxide, a nitrogen and hydrogen doped silicon carbide
(SiC(N,H)) or a multilayered stack of at least one of the
aforementioned dielectric capping materials. The capping material
that provides the dielectric capping layer 24 may be formed
utilizing a deposition process such as, for example, CVD, PECVD,
ALD, PVD, chemical solution deposition or evaporation. A recessing
process may or may not follow the deposition of the dielectric
capping layer 24. The dielectric capping layer 24 may have a
thickness from 10 nm to 100 nm; other thicknesses are possible and
can be used in the present application as the thickness of the
dielectric capping layer 24.
[0044] In some embodiments of the present application, the
dielectric capping layer 24 can be formed prior to forming the
memory device 22. In such an embodiment, a patterning process is
used to provide an opening within a blanket layer of dielectric
capping material that physically exposes a surface of the landing
pad 20. The memory device 22 is then formed into the opening.
[0045] Referring now to FIG. 6, there is illustrated the exemplary
structure of FIG. 5 after forming a disposable absorber 26 on the
dielectric capping layer 24. In some embodiments and as shown in
FIG. 6, the disposable absorber 26 surrounds an upper portion of
the memory stack 22. The presence of the disposable absorber 26
allows sufficient heating of the elements within the BEOL structure
without causing any deleterious effects on the first electrically
conductive structures 16.
[0046] The disposable absorber 26 is composed of an amorphous
carbonitride material that generally has a low reflection
coefficient for laser/flash illumination, and a high extinction
coefficient for efficient laser/flash illumination absorption. The
term "amorphous" when used in conjunction with the carbonitride
material denotes that the carbonitride material lacks a well
defined crystal structure. Moreover, while there may be local
ordering of the atoms or molecules in the amorphous carbonitride
material, no long-term ordering is present. Typically, the
disposable absorber 26 is composed of an amorphous carbonitride
material having a reflection coefficient of 0.15 or less, and an
extinction coefficient of 0.2 or greater.
[0047] The amorphous carbonitride material that can be used as the
disposable absorber 26 also has a minimum of hydrocarbon content as
observed by FTIR. By "minimum of hydrocarbon content as observed by
FTIR" it is meant a normalized hydrocarbon content less than 3 as
defined by integrating under the C--H stretching peak in the FTIR
spectra from 3170-2750 cm.sup.-1 and dividing the integrated peak
area by the film thickness in microns.
[0048] The high extinction coefficient and low reflection
coefficient are indicative of greater absorptivity of the amorphous
carbonitride material, and less transparency which minimizes
reflectance variations from the BEOL structure. Additionally, the
amorphous carbonitride material can be optimized to possess minimal
stress in order to avoid delamination during deposition, and
anneals. The amorphous carbonitride material can also be designed
to be an efficient microwave absorber thus it can be used during a
microwave anneal.
[0049] The disposable absorber 26 having the aforementioned
properties can be deposited at a temperature of 450.degree. C. or
less. In one embodiment, disposable absorber 26 having the
aforementioned properties can be deposited at temperature from
250.degree. C. to 400.degree. C.
[0050] The disposable absorber 26 having the above properties can
be produced using a combination of at least a carbon precursor
source, and a nitrogen source. An oxidant is also typically, but
not necessarily always, employed to facilitate decomposition,
fragmentation and hydrogen removal. Such a combination of gases can
be referred to herein as a reactant gas mixture. The reactant gas
mixture may further include an inert gas such as helium or argon.
The inert gas may be introduced as a separate component of the
reactant gas mixture or it can be present within at least one of
the carbon precursor source, the nitrogen source and the oxidant.
In some embodiments, the disposable absorber 26 having the above
properties can be produced using a single carbonitride precursor
that includes both carbon and nitrogen in the molecule. An oxidant
is also typically, but not necessarily always, employed in this
embodiment of the invention as well.
[0051] The carbon precursor source that can be employed in the
invention is selected from alkanes, alkenes, alkynes and mixtures
thereof. The carbon precursor sources may be linear, branched,
and/or cyclic. In one embodiment, the carbon precursor sources have
a minimal C/H ratio. By "minimal C/H ratio" it is meant less than 3
hydrogens for every carbon atom in the precursor.
[0052] The term "alkane" denotes a chemical compound that consists
only of the elements carbon and hydrogen (i.e., hydrocarbons),
wherein these atoms are linked together exclusively by single bonds
(i.e., they are saturated compounds). In one embodiment of the
invention, the alkane includes from 1 to 22, typically from 1 to
16, more typically, from 1 to 12 carbon atoms. The term "alkene"
denotes an unsaturated chemical compound containing at least one
carbon-to-carbon double bond. In one embodiment, the alkene is an
acyclic alkene, with only one double bond and no other functional
groups. In such an embodiment, the acylic alkene forms a homologous
series of hydrocarbons with the general formula C.sub.nH.sub.2n,
wherein n is an integer from 2 to 22, typically 2 to 16, more
typically 2 to 12 carbon atoms. The term "alkyne" denotes a
hydrocarbon that has a triple bond between two carbon atoms, with
the formula C.sub.nH.sub.2n-2, wherein n is an integer from 2 to
22, typically 2 to 16, more typically 2 to 12 carbon atoms. Alkynes
are traditionally known as acetylenes.
[0053] Some examples of typical carbon precursor sources that can
be employed in forming the disposable absorber 26 include, but are
not limited to ethylene, propylene, butene, acetylene, and/or
methyl acetylene. In one embodiment, propylene is employed as the
carbon precursor source.
[0054] The nitrogen source that can be employed in forming the
disposable absorber 26 can be selected from nitriding sources
including, but not limited to nitrogen, ammonia, amines, azides,
and/or hydrazines. In one embodiment, nitrogen (N.sub.2) and/or
ammonium (NH.sub.3) is employed as the nitrogen source. The oxidant
that can be employed in forming the disposable absorber 26 can be
selected from oxidizing sources including oxygen, nitrous oxide,
carbon dioxide, carbon monoxide, water, and/or ozone. In one
embodiment of the invention, oxygen is employed as the oxidant.
[0055] Although any combination of carbon precursor source,
nitrogen source and oxidant can be employed in forming the
disposable absorber 26, one embodiment of the present application
employs propylene as the carbon precursor source, nitrogen
(N.sub.2) or ammonium (NH.sub.3) as the nitrogen source, and oxygen
(O.sub.2) as the oxidant. Such a reactant gas mixture can be used
as is or diluted with an inert gas such as helium or argon.
[0056] In one embodiment, as mentioned above, a single carbonitride
precursor that includes both carbon and nitrogen in the molecule
can be used to form the disposable absorber 26. One example of such
a single carbonitride precursor that can be employed in the present
application invention is acetonitrile. Other single carbonitride
precursors beside acetonitrile can be used as long as the precursor
includes carbon and nitrogen atoms therein. When a single
carbonitride precursor is employed, an oxidant, as described above
can also be used. The single carbonitride precursor can be used as
is or diluted with an inert gas such as helium or argon. Other
potential single carbonitride precursors include heterocyclic
compounds such as pyrrole, imidazole, pyrazole, pyridine, pyrazine,
pyrimidine, pyridazine, pyrazinyl, imidazolyl, pyrimidinyl,
piperazine, triazine, amines such as methylamine, diamine ethane,
diamine methane, aminoethane, aminopropane, azo, hydrzo,
dimethylhydrazine, alkylazo compounds such as diethyldiazene, and
amidines including acetamidine.
[0057] The gases may be introduced separately into a reactor
chamber of a deposition tool, or some, or all of the gases may be
admixed prior to being introduced into a reactor chamber of a
deposition tool. Typically, the various gases are admixed in a
mixing system prior to being introduced into the reactor chamber of
a deposition tool. The reactor chamber of the deposition tool
typically includes a substrate holder.
[0058] The gases may be introduced in a deposition tool in
different stochiometries. In some embodiments, the carbon source
may be introduced at a flow rate between 50 sccm and 2000 sccm, the
nitrogen source may be introduced at a flow rate between 10 sccm
and 50000 sccm, and the oxidant may be introduced at a flow rate
between 10 sccm and 500 sccm. The inert gas may be introduced at a
flow rate from 50 sccm to 50000 sccm.
[0059] In some further embodiments, the process pressure used in
forming the disposable absorber 26 can be varied from 1 torr to 8
torr. In yet another embodiment of the invention, the substrate
temperature during the deposition process can be fixed at
400.degree. C. or 350.degree. C. In an even further embodiment of
the invention, the plasma can be generated using either a low
frequency radio frequency (LFRF) plasma source at 100 MHz or a high
frequency radio frequency HFRF plasma source at 13.56 GHz. The
process pressure, substrate temperature and power used in
generating the plasma are exemplary and other conditions are
possible provided the selected conditions are capable of forming a
disposable absorber 26 having the properties mentioned above.
[0060] The disposable absorber 26 is a conformal film or coating
that follows the topography of the underlying material layers of
the memory device 22 and has a vertical thickness that is nearly
the same as the lateral thickness. The conformality of the
disposable absorber 26 provides better transfer of heat to the
memory device 22 without adversely impacting the first electrically
conductive structures 16 embedded in the first interconnect
dielectric material layer 12 during a subsequently performed
localized heating of the disposable absorber 26.
[0061] Referring now to FIG. 7, there is illustrated the exemplary
structure of FIG. 6 after performing an anneal to predominately
heat the disposable absorber 26 locally and to activate the memory
device 22, and removing the disposable absorber 26 after
transferring of the heat from the locally heated disposable
absorber 26 to the memory device 22. The term "to predominately
heat the disposable absorber 26 locally" denotes that the anneal
mainly (90% or greater) heats the disposable absorber 26, while
minimizing the heating of other portions of the structure. Examples
of anneals that may be employed include a nanosecond to millisecond
flash anneal, a laser anneal, or a microwave anneal. The anneal,
which is used to active elements (such as, the element(s) of the
memory device 22) of the exemplary structure through transfer of
heat from the locally heated disposable absorber 26, may be
performed at a temperature of 400.degree. C.-1000.degree. C. or
greater. The conditions for each anneal are well known to those
skilled in the art and due to the disposable absorber 26 are not
limited in the present application. In one example, and when a
flash anneal is employed, the flash anneal quickly heats the
disposable absorber 26 locally to a temperature of 400.degree.
C.-1000.degree. C. or greater. In another example, and when a laser
anneal is employed, the laser anneal includes any laser that can
heat the disposable absorber 26 locally to a temperature of
400.degree. C.-1000.degree. C. or greater. In a further example,
and when a microwave anneal is employed, the microwave anneal
includes any microwave emitter source that can heat the disposable
absorber 26 locally to a temperature of 400.degree. C.-1000.degree.
C. or greater.
[0062] The disposable absorber 26 is removed after heating of the
disposable absorber 26 locally and activation of the memory device
22 through heat transfer have performed. The disposable absorber 26
may be removed utilizing a stripping process such as, for example,
plasma oxygen ashing and/or N.sub.2/H.sub.2 stripping and NH.sub.3
etching.
[0063] Referring now to FIG. 8, there is illustrated the exemplary
structure of FIG. 7 after forming an upper interconnect level
containing a plurality of second electrically conductive structures
30A, 30B embedded in a second interconnect dielectric material
layer 28.
[0064] The second interconnect dielectric material layer 28 may
include one of the dielectric materials mentioned above for the
first interconnect dielectric material layer 12. In one embodiment,
second interconnect dielectric material layer 28 is composed of a
same dielectric material as the first interconnect dielectric
material layer 12. In another embodiment, the second interconnect
dielectric material layer 28 is composed of a different dielectric
material than the first interconnect dielectric material layer 12.
The second interconnect dielectric material layer 28 may be formed
by utilizing one of the deposition processes mentioned above in
forming the first interconnect dielectric material layer 12. The
second interconnect dielectric material layer 28 may have a
thickness within the thickness range mentioned above for the first
dielectric material layer 12.
[0065] Openings are then formed into the second dielectric material
layer 44 and the dielectric capping layer 24. The openings can be
formed by lithography and etching. At least one of the openings
physically exposes a topmost surface of the memory device 22 in the
memory device area 102, while another of the openings contacts the
metal capping layer 18 in the non-memory device area 100. A
diffusion barrier material (not shown) and/or an electrically
conductive metal or metal alloy layer (not shown) is then formed on
the physically exposed topmost surface of the second interconnect
dielectric material layer 28 and within the openings. By way of one
example and in the illustrated embodiment, only the electrically
conductive metal or metal alloy layer is formed into the
openings.
[0066] The diffusion barrier material layer may include one of the
diffusion barrier materials mentioned above for diffusion barrier
liner 14. In one embodiment, diffusion barrier material layer is
composed of a same diffusion barrier material as diffusion barrier
liner 14. In another embodiment, diffusion barrier material layer
is composed of a different diffusion barrier material than
diffusion barrier liner 14. The diffusion barrier material layer
may be deposited utilizing one of the deposition processes
mentioned above in forming diffusion barrier liner 14. The
diffusion barrier material layer may have a thickness within the
thickness range mentioned above for diffusion barrier liner 14.
[0067] The electrically conductive metal or metal alloy layer may
include one of the electrically conductive metals or metal alloys
mentioned above for the first electrically conductive structures
16. In one embodiment, the electrically conductive metal or metal
alloy layer is composed of a same electrically conductive metal or
metal alloy as the first electrically conductive structures 16. In
another embodiment, the electrically conductive metal or metal
alloy layer is composed of a different electrically conductive
metal or metal alloy than the first electrically conductive
structures 16. The electrically conductive metal or metal alloy
layer may be deposited utilizing one of the deposition processes
mentioned above in forming the first electrically conductive
structures 16.
[0068] Following the deposition of the diffusion barrier material
layer and/or the electrically conductive metal or metal alloy, a
planarization process such as, for example, chemical mechanical
polishing, can be employed to form the structure shown in FIG. 8.
In FIG. 8, the electrically conductive metal or metal alloy that
remains in each of the openings in the second interconnect
dielectric material layer 28 after planarization is referred to as
a second electrically conductive structure 30A, 30B. The second
electrically conductive structure 30A is present in the non-memory
device area 100 of the structure, while the second electrically
conductive structure 30B is present in the memory device area 102
of the structure. If present, the diffusion barrier material layer
that remains in the openings in the second interconnect dielectric
material layer 28 may be referred to as a second diffusion barrier
liner; in FIG. 8 the second diffusion barrier liner has been
omitted.
[0069] Although the disposable absorber 26 is described and
illustrated for use with embedded BEOL memory devices, the
disposable absorber 26 may be used when other non-memory devices
such, as for example, metal-insulator-metal (MIM) capacitors that
are buried within one of the interconnect levels of an interconnect
structure.
[0070] While the present application has been particularly shown
and described with respect to preferred embodiments thereof, it
will be understood by those skilled in the art that the foregoing
and other changes in forms and details may be made without
departing from the spirit and scope of the present application. It
is therefore intended that the present application not be limited
to the exact forms and details described and illustrated, but fall
within the scope of the appended claims.
* * * * *