Lee; Kam-Leung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Kam-Leung.The latest application filed is for "low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type iv semiconductor elements".

Company Profile

9.34.33

Lee; Kam-Leung - New York NY
Lee; Kam-Leung - Putnam Valley NY
Lee; Kam-Leung - Yorktown Heights NY US
Lee; Kam-Leung - Putnum Valley NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low Resistance Contacts Including Intermetallic Alloy Of Nickel, Platinum, Titanium, Aluminum And Type Iv Semiconductor Elements App 20210343647 - Bruley; John ; et al.	2021-11-04
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements Grant 11,101,219 - Bruley , et al. August 24, 2	2021-08-24
Low Resistance Contacts Including Intermetallic Alloy Of Nickel, Platinum, Titanium, Aluminum And Type Iv Semiconductor Elements App 20210193576 - Bruley; John ; et al.	2021-06-24
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements Grant 10,985,105 - Bruley , et al. April 20, 2	2021-04-20
Fast recrystallization of hafnium or zirconium based oxides in insulator-metal structures Grant 10,833,150 - Frank , et al. November 10, 2	2020-11-10
Disposable laser/flash anneal absorber for embedded neuromorphic memory device fabrication Grant 10,541,151 - Lee , et al. Ja	2020-01-21
Disposable Laser/flash Anneal Absorber For Embedded Neuromorphic Memory Device Fabrication App 20200020542 - Lee; Kam-Leung ; et al.	2020-01-16
Fast Recrystallization Of Hafnium Or Zirconium Based Oxides In Insulator-metal Structures App 20200020762 - Frank; Martin M. ; et al.	2020-01-16
Shallow, abrupt and highly activated tin extension implant junction Grant 10,529,832 - Bruley , et al. J	2020-01-07
Low Resistance Contacts Including Intermetallic Alloy Of Nickel, Platinum, Titanium, Aluminum And Type Iv Semiconductor Elements App 20190157203 - Bruley; John ; et al.	2019-05-23
Low resistance contacts including intermetallic alloy of nickel, platinum, titanium, aluminum and type IV semiconductor elements Grant 10,269,714 - Bruley , et al.	2019-04-23
Low Resistance Contacts Including Intermetallic Alloy Of Nickel, Platinum, Titanium, Aluminum And Type Iv Semiconductor Elements App 20190067198 - Bruley; John ; et al.	2019-02-28
Method of junction control for lateral bipolar junction transistor Grant 10,134,882 - Hashemi , et al. November 20, 2	2018-11-20
Shallow, Abrupt And Highly Activated Tin Extension Implant Junction App 20180175174 - Bruley; John ; et al.	2018-06-21
Method of junction control for lateral bipolar junction transistor Grant 9,929,258 - Hashemi , et al. March 27, 2	2018-03-27
Method Of Junction Control For Lateral Bipolar Junction Transistor App 20180083126 - Hashemi; Pouya ; et al.	2018-03-22
Method Of Junction Control For Lateral Bipolar Junction Transistor App 20180083125 - HASHEMI; Pouya ; et al.	2018-03-22
Silicon-germanium FinFET device with controlled junction Grant 9,922,886 - Cheng , et al. March 20, 2	2018-03-20
Low Resistance Contacts Including Intermetallic Alloy Of Nickel, Platinum, Titanium, Aluminum And Type Iv Semiconductor Elements App 20180068950 - Bruley; John ; et al.	2018-03-08
Silicon-germanium Finfet Device With Controlled Junction App 20170018466 - Cheng; Kangguo ; et al.	2017-01-19
Silicon-germanium FinFET device with controlled junction Grant 9,514,997 - Cheng , et al. December 6, 2	2016-12-06
Silicon-germanium Finfet Device With Controlled Junction App 20160284606 - Cheng; Kangguo ; et al.	2016-09-29
Semiconductor device having diffusion barrier to reduce back channel leakage Grant 9,406,569 - Freeman , et al. August 2, 2	2016-08-02
Semiconductor device having diffusion barrier to reduce back channel leakage Grant 9,240,354 - Freeman , et al. January 19, 2	2016-01-19
FinFET extension regions Grant 9,196,712 - Hasanuzzaman , et al. November 24, 2	2015-11-24
Conformal doping for FinFET devices Grant 9,105,559 - Basker , et al. August 11, 2	2015-08-11
Conformal Doping For Finfet Devices App 20150079773 - Basker; Veeraraghavan S. ; et al.	2015-03-19
Semiconductor Device Having Diffusion Barrier To Reduce Back Channel Leakage App 20150056760 - Freeman; Gregory G. ; et al.	2015-02-26
Raised silicide contact Grant 8,927,422 - Alptekin , et al. January 6, 2	2015-01-06
Semiconductor Device Having Diffusion Barrier To Reduce Back Channel Leakage App 20140131782 - Freeman; Gregory G. ; et al.	2014-05-15
Raised Silicide Contact App 20130334693 - Alptekin; Emre ; et al.	2013-12-19
Annealing Techniques For High Performance Complementary Metal Oxide Semiconductor (cmos) Device Fabrication App 20120190216 - Chan; Kevin K. ; et al.	2012-07-26
Shallow extension regions having abrupt extension junctions Grant 8,114,748 - Lee , et al. February 14, 2	2012-02-14
Low-temperature Absorber Film And Method Of Fabrication App 20110254138 - Babich; Katherina E. ; et al.	2011-10-20
Shallow Extension Regions Having Abrupt Extension Junctions App 20100327375 - Lee; Kam-Leung ; et al.	2010-12-30
High performance strained silicon FinFETs device and method for forming same Grant 7,705,345 - Bedell , et al. April 27, 2	2010-04-27
Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics Grant 7,691,733 - Fogel , et al. April 6, 2	2010-04-06
Anneal Sequence Integration For Cmos Devices App 20090186457 - Lee; Kam-Leung ; et al.	2009-07-23
Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics Grant 7,547,616 - Fogel , et al. June 16, 2	2009-06-16
Laser Processing Method For Trench-edge-defect-free Solid Phase Epitaxy In Confined Geometrics App 20080286917 - Fogel; Keith E. ; et al.	2008-11-20
Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom Grant 7,163,867 - Lee , et al. January 16, 2	2007-01-16
Laser processing method for trench-edge-defect-free solid phase epitaxy in confined geometrics App 20060275971 - Fogel; Keith E. ; et al.	2006-12-07
Semiconductor Device Forming Method And Structure For Retarding Dopant-enhanced Diffusion App 20060220112 - Zhu; Huilong ; et al.	2006-10-05
Elevated source drain disposable spacer CMOS Grant 7,074,684 - Roy , et al. July 11, 2	2006-07-11
High performance strained silicon FinFETs device and method for forming same App 20050145941 - Bedell, Stephen W. ; et al.	2005-07-07
Method for slowing down dopant-enhanced diffusion in substrates and devices fabricated therefrom App 20050026403 - Lee, Kam-Leung ; et al.	2005-02-03
Elevated source drain disposable spacer CMOS App 20040266124 - Roy, Ronnen A. ; et al.	2004-12-30
Elevated source drain disposable spacer CMOS Grant 6,777,298 - Roy , et al. August 17, 2	2004-08-17
Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication Grant 6,743,686 - Lee , et al. June 1, 2	2004-06-01
All-in-one disposable/permanent spacer elevated source/drain, self-aligned silicide CMOS Grant 6,727,135 - Lee , et al. April 27, 2	2004-04-27
Elevated source drain disposable spacer CMOS App 20030232464 - Roy, Ronnen A. ; et al.	2003-12-18
All-in-one disposable/permanent spacer elevated source/drain, self-aligned silicide CMOS App 20030209765 - Lee, Kam Leung ; et al.	2003-11-13
All-in-one disposable/permanent spacer elevated source/drain, self-aligned silicide CMOS Grant 6,614,079 - Lee , et al. September 2, 2	2003-09-02
Ultra-shallow semiconductor junction formation Grant 6,537,886 - Lee March 25, 2	2003-03-25
Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication Grant 6,518,136 - Lee , et al. February 11, 2	2003-02-11
All-in-one disposable/permanent spacer elevated source/drain, self-aligned silicide CMOS App 20030015762 - Lee, Kam Leung ; et al.	2003-01-23
Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication App 20020151145 - Lee, Kam Leung ; et al.	2002-10-17
Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabrication App 20020076889 - Lee, Kam Leung ; et al.	2002-06-20
Ultra-shallow semiconductor junction formation App 20010041432 - Lee, Kam Leung	2001-11-15
Application of excimer laser anneal to DRAM processing Grant 6,297,086 - Hegde , et al. October 2, 2	2001-10-02
Continual flow rapid thermal processing apparatus and method Grant 6,291,801 - Guidotti , et al. September 18, 2	2001-09-18
Formation of ultra-shallow semiconductor junction using microwave annealing Grant 6,051,483 - Lee , et al. April 18, 2	2000-04-18
Microwave annealing Grant 6,051,283 - Lee , et al. April 18, 2	2000-04-18
Ultra-shallow semiconductor junction formation Grant 6,037,640 - Lee March 14, 2	2000-03-14
Inspection system utilizing retarding field back scattered electron collection Grant 4,933,552 - Lee June 12, 1	1990-06-12

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