U.S. patent application number 16/243469 was filed with the patent office on 2019-07-18 for three-dimensional memory device having support-die-assisted source power distribution and method of making thereof.
The applicant listed for this patent is SANDISK TECHNOLOGIES LLC. Invention is credited to Masaaki HIGASHITANI, Kwang-Ho KIM, Akio NISHIDA, Fumiaki TOYAMA.
Application Number | 20190221557 16/243469 |
Document ID | / |
Family ID | 67213039 |
Filed Date | 2019-07-18 |
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United States Patent
Application |
20190221557 |
Kind Code |
A1 |
KIM; Kwang-Ho ; et
al. |
July 18, 2019 |
THREE-DIMENSIONAL MEMORY DEVICE HAVING SUPPORT-DIE-ASSISTED SOURCE
POWER DISTRIBUTION AND METHOD OF MAKING THEREOF
Abstract
A memory-containing die includes a three-dimensional memory
array, a memory dielectric material layer located on a first side
of the three-dimensional memory array, and memory-side bonding
pads. A logic die includes a peripheral circuitry configured to
control operation of the three-dimensional memory array, logic
dielectric material layers located on a first side of the
peripheral circuitry, and logic-side bonding pads included in the
logic dielectric material layers. The logic-side bonding pads
includes a pad-level mesh structure electrically connected to a
source power supply circuit within the peripheral circuitry and
containing an array of discrete openings therethrough, and discrete
logic-side bonding pads. The logic-side bonding pads are bonded to
a respective one, or a respective subset, of the memory-side
bonding pads. The pad-level mesh structure can be used as a
component of a source power distribution network.
Inventors: |
KIM; Kwang-Ho; (Pleasanton,
CA) ; HIGASHITANI; Masaaki; (Cupertino, CA) ;
TOYAMA; Fumiaki; (Cupertino, CA) ; NISHIDA; Akio;
(Yokkaichi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SANDISK TECHNOLOGIES LLC |
Addison |
TX |
US |
|
|
Family ID: |
67213039 |
Appl. No.: |
16/243469 |
Filed: |
January 9, 2019 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15873101 |
Jan 17, 2018 |
10283493 |
|
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16243469 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 2224/80895
20130101; H01L 2924/1431 20130101; H01L 2224/05647 20130101; H01L
25/50 20130101; H01L 25/18 20130101; H01L 2224/80896 20130101; H01L
23/5226 20130101; H01L 23/481 20130101; H01L 2224/08145 20130101;
H01L 27/11582 20130101; H01L 2224/8083 20130101; H01L 27/11573
20130101; H01L 24/80 20130101; H01L 27/11575 20130101; H01L 27/1157
20130101; H01L 27/11519 20130101; H01L 27/11565 20130101; H01L
24/08 20130101; H01L 2924/14511 20130101; H01L 24/05 20130101; H01L
27/11529 20130101; H01L 27/11556 20130101; H01L 2224/05647
20130101; H01L 2924/00014 20130101 |
International
Class: |
H01L 25/18 20060101
H01L025/18; H01L 25/00 20060101 H01L025/00; H01L 23/00 20060101
H01L023/00 |
Claims
1. A three-dimensional memory device, comprising: a
memory-containing die comprising a three-dimensional memory array,
a memory dielectric material layer located on a first side of the
three-dimensional memory array, and memory-side bonding pads
included in the memory dielectric material layer and electrically
connected to a respective node within the three-dimensional memory
array; and a logic die comprising a peripheral circuitry configured
to control operation of the three-dimensional memory array, logic
dielectric material layers located on a first side of the
peripheral circuitry, and logic-side bonding pads included in the
logic dielectric material layers and electrically connected to a
respective node of the peripheral circuitry and bonded to a
respective one, or a respective subset, of the memory-side bonding
pads, wherein the logic-side bonding pads comprise: a pad-level
mesh structure electrically connected to a source power supply
circuit within the peripheral circuitry and including an array of
discrete openings therethrough; and discrete logic-side bonding
pads electrically isolated one from another and from the pad-level
mesh structure.
2. The three-dimensional memory device of claim 1, wherein the
discrete logic-side bonding pads are electrically connected to a
sense circuit within the peripheral circuitry through a subset of
metal interconnect structures included within the logic dielectric
material layers.
3. The three-dimensional memory device of claim 2, wherein: the
sense circuit comprises multiple groups of sense amplifiers that
are laterally spaced apart one from another; each group among the
multiple group of sense amplifiers includes plural sense
amplifiers; discrete logic-side bonding pads are arranged as groups
of logic-side bonding pads that overlie a respective group of sense
amplifiers; and each group of logic-side bonding pads includes
plural logic-side bonding pads that are connected to an input node
of a respective one of the sense amplifiers.
4. The three-dimensional memory device of claim 2, wherein the
subset of metal interconnect structures comprises:
pad-connection-level via structures contacting a respective one of
the discrete logic-side bonding pads; interconnect metal line
structures contacting a respective one of the pad-connection-level
via structures; and interconnect metal via structures contacting a
respective one of the interconnect metal line structures.
5. The three-dimensional memory device of claim 1, wherein the
logic die comprises: line-level mesh structures included within the
logic dielectric material layers and including a plurality of
openings therethrough; and pad-connection-level via structures
contacting the pad-level mesh structure and a respective one of the
line-level mesh structures.
6. The three-dimensional memory device of claim 5, wherein the
logic die comprises additional pad-connection-level via structures
contacting a respective one of the discrete logic-side bonding pads
and located at a same level as the pad-connection-level via
structures.
7. The three-dimensional memory device of claim 6, wherein a
plurality of the additional pad-connection-level via structures is
located between a neighboring pair of line-level mesh structures
among the line-level mesh structures.
8. The three-dimensional memory device of claim 5, wherein: the
logic die further comprises additional pad-level mesh structures
contacting a respective subset of the pad-connection-level via
structures; and each of additional pad-level mesh structures is
electrically connected to the line-level mesh structures.
9. The three-dimensional memory device of claim 1, wherein each of
the discrete logic-side bonding pads is located within a respective
opening through the pad-level mesh structure.
10. The three-dimensional memory device of claim 9, wherein the
memory-side bonding pads comprise: a plurality of memory-side
source connection bonding pads electrically connected to source
regions within the memory-containing die and bonded to the
pad-level mesh structure; and a plurality of memory-side bit line
connection bonding pads electrically connected to bit lines within
the memory-containing die and bonded to a respective one of the
discrete logic-side bonding pads.
11. The three-dimensional memory device of claim 9, wherein the
logic die comprises: a pad-connection-level via structure
contacting one of the discrete logic-side bonding pads; an
interconnect metal line structure contacting a bottom surface of
the pad-connection-level via structure and laterally extending to a
region underneath a portion of the pad-level mesh structure; and an
interconnect metal via structure contacting a bottom surface of the
interconnect metal line structure and electrically connected to a
sense amplifier within the peripheral circuitry, wherein the
interconnect metal line structure, the pad-level mesh structure,
and the interconnect metal via structure overlap one another in a
plan view along a direction perpendicular to an interface between
the memory-containing die and the logic die; and wherein the
pad-level mesh structure is electrically isolated from the
interconnect metal via structure and the interconnect metal line
structure.
12. The three-dimensional memory device of claim 1, wherein the
memory-containing die comprises: a two-dimensional array of memory
stack structures including a respective vertical semiconductor
channel and a respective vertical stack of memory elements; source
regions electrically connected to a first end of the vertical
semiconductor channels; and a first subset of memory-side metal
interconnect structures electrically connecting the source regions
to a first subset of the memory-side bonding pads that is bonded to
the pad-level mesh structure.
13. The three-dimensional memory device of claim 12, wherein the
memory-containing die comprises: bit lines electrically connected
to a second end of a respective subset of the vertical
semiconductor channels; and a second subset of memory-side metal
interconnect structures connecting the bit lines to a second subset
of the memory-side bonding pads that is bonded to the discrete
logic-side bonding pads.
14. The three-dimensional memory device of claim 1, wherein: the
three-dimensional memory array comprises a two-dimensional array of
vertical NAND strings located in the memory die; each vertical NAND
string in the array of vertical NAND strings comprises charge
storage elements controlled by word lines and a vertical
semiconductor channel; a first end portion of each vertical
semiconductor channel is connected to a respective source region; a
second end portion of each vertical semiconductor channel is
connected to a respective bit line; the pad-level mesh structure is
electrically connected to each of the source regions; and the
discrete logic-side bonding pads is electrically connected to a
respective one of the bit lines.
15. A method of forming a three-dimensional memory device,
comprising: providing a memory-containing die comprising a
three-dimensional memory array, a memory dielectric material layer
located on a first side of the three-dimensional memory array, and
memory-side bonding pads included in the memory dielectric material
layer and electrically connected to a respective node within the
three-dimensional memory array; providing a logic die comprising a
peripheral circuitry configured to control operation of the
three-dimensional memory array, logic dielectric material layers
located on a first side of the peripheral circuitry, and logic-side
bonding pads included in the logic dielectric material layers and
electrically connected to a respective node of the peripheral
circuitry, wherein the logic-side bonding pads comprise a pad-level
mesh structure electrically connected to a source power supply
circuit within the peripheral circuitry and including an array of
discrete openings therethrough, and discrete logic-side bonding
pads electrically isolated one from another and from the pad-level
mesh structure; and bonding the logic-side bonding pads to a
respective one, or a respective subset, of the memory-side bonding
pads.
16. The method of claim 15, wherein the logic die comprises:
line-level mesh structures included within the logic dielectric
material layers and including a plurality of openings therethrough;
and pad-connection-level via structures contacting the pad-level
mesh structure and a respective one of the line-level mesh
structures.
17. The method of claim 16, wherein: the logic die comprises
additional pad-connection-level via structures contacting a
respective one of the discrete logic-side bonding pads and located
at a same level as the pad-connection-level via structures; and a
plurality of the additional pad-connection-level via structures is
located between a neighboring pair of line-level mesh structures
among the line-level mesh structures.
18. The method of claim 16, wherein: the logic die further
comprises additional pad-level mesh structures contacting a
respective subset of the pad-connection-level via structures; and
each of additional pad-level mesh structures is electrically
connected to the line-level mesh structures.
19. The method of claim 15, wherein: each of the discrete
logic-side bonding pads is formed within a respective opening
through the pad-level mesh structure by patterning a conductive
bonding material; and the memory-side bonding pads comprise a
plurality of memory-side source connection bonding pads
electrically connected to source regions within the
memory-containing die and bonded to the pad-level mesh structure,
and a plurality of memory-side bit line connection bonding pads
electrically connected to bit lines within the memory-containing
die and bonded to a respective one of the discrete logic-side
bonding pads.
20. The method of claim 19, wherein the logic die comprises: a
pad-connection-level via structure contacting one of the discrete
logic-side bonding pads; an interconnect metal line structure
contacting a bottom surface of the pad-connection-level via
structure and laterally extending to a region underneath a portion
of the pad-level mesh structure; and an interconnect metal via
structure contacting a bottom surface of the interconnect metal
line structure and electrically connected to a sense amplifier
within the peripheral circuitry, wherein the interconnect metal
line structure, the pad-level mesh structure, and the interconnect
metal via structure overlap one another in a plan view along a
direction perpendicular to an interface between the
memory-containing die and the logic die; and wherein the pad-level
mesh structure is electrically isolated from the interconnect metal
via structure and the interconnect metal line structure.
Description
RELATED APPLICATIONS
[0001] The present application is a continuation-in-part
application of U.S. application Ser. No. 15/873,101 filed on Jan.
17, 2018, the entire contents of which are incorporated herein by
reference.
FIELD
[0002] The present disclosure relates generally to the field of
semiconductor devices and specifically to a three-dimensional
memory device having support-die-assisted source power distribution
and methods of making the same.
BACKGROUND
[0003] Recently, ultra-high density storage devices using
three-dimensional (3D) memory stack structures have been proposed.
For example, a 3D NAND stacked memory device can be formed from an
array of an alternating stack of insulating materials and spacer
material layers that are formed as electrically conductive layers
or replaced with electrically conductive layers over a substrate
containing peripheral devices (e.g., driver/logic circuits). Memory
openings are formed through the alternating stack, and are filled
with memory stack structures, each of which includes a vertical
stack of memory elements and a vertical semiconductor channel.
SUMMARY
[0004] According to an aspect of the present disclosure, a
three-dimensional memory device is provided, which comprises: a
memory-containing die comprising a three-dimensional memory array,
a memory dielectric material layer located on a first side of the
three-dimensional memory array, and memory-side bonding pads
included in the memory dielectric material layer and electrically
connected to a respective node within the three-dimensional memory
array; and a logic die comprising a peripheral circuitry configured
to control operation of the three-dimensional memory array, logic
dielectric material layers located on a first side of the
peripheral circuitry, and logic-side bonding pads included in the
logic dielectric material layers and electrically connected to a
respective node of the peripheral circuitry and bonded to a
respective one, or a respective subset, of the memory-side bonding
pads, wherein the logic-side bonding pads comprise: a pad-level
mesh structure electrically connected to a source power supply
circuit within the peripheral circuitry and including an array of
discrete openings therethrough; and discrete logic-side bonding
pads electrically isolated one from another and from the pad-level
mesh structure.
[0005] According to another aspect of the present disclosure, a
method of forming a three-dimensional memory device is provided,
which comprises: providing a memory-containing die comprising a
three-dimensional memory array, a memory dielectric material layer
located on a first side of the three-dimensional memory array, and
memory-side bonding pads included in the memory dielectric material
layer and electrically connected to a respective node within the
three-dimensional memory array; and providing a logic die
comprising a peripheral circuitry configured to control operation
of the three-dimensional memory array, logic dielectric material
layers located on a first side of the peripheral circuitry, and
logic-side bonding pads included in the logic dielectric material
layers and electrically connected to a respective node of the
peripheral circuitry, wherein the logic-side bonding pads comprise
a pad-level mesh structure electrically connected to a source power
supply circuit within the peripheral circuitry and including an
array of discrete openings therethrough, and discrete logic-side
bonding pads electrically isolated one from another and from the
pad-level mesh structure; and bonding the logic-side bonding pads
to a respective one, or a respective subset, of the memory-side
bonding pads.
[0006] According to an aspect of the present disclosure, a
semiconductor structure is provided, which comprises: a first die
comprising a three-dimensional memory device including a
three-dimensional array of memory elements, a first dielectric
material layer overlying, or underlying, the three-dimensional
array of memory elements, and first bonding pads included in the
first dielectric material layer and electrically connected to a
respective node within the three-dimensional memory device; and a
second die comprising a semiconductor substrate, a peripheral logic
circuitry that includes complementary metal oxide semiconductor
(CMOS) devices located on the semiconductor substrate, a second
dielectric material layer overlying, or underlying, the CMOS
devices, and second bonding pads included in the second dielectric
material layer and electrically connected to a respective node
within the CMOS devices, wherein the first bonding pads are bonded
with the second bonding pads through copper interdiffusion to
provide multiple bonded pairs of a respective first bonding pad and
a respective second bonding pad at an interface between the first
die and the second die.
[0007] According to another aspect of the present disclosure, a
semiconductor structure comprises a first die comprising a
three-dimensional memory device including a three-dimensional array
of NAND memory elements, and a second die comprising a
semiconductor substrate, a peripheral logic circuitry that includes
complementary metal oxide semiconductor (CMOS) devices located on
the semiconductor substrate. The first die is bonded to the second
die. Gate structures of the CMOS devices of the second die are
located between the three-dimensional array of NAND memory elements
of the first die and the semiconductor substrate of the second die
containing active regions separated by a channel of the CMOS
devices.
[0008] According to another aspect of the present disclosure, a
method of forming a semiconductor structure includes providing a
first die comprising a three-dimensional memory device including a
three-dimensional array of NAND memory elements, providing a second
die comprising a semiconductor substrate and peripheral logic
circuitry that includes complementary metal oxide semiconductor
(CMOS) devices located on the semiconductor substrate, and forming
a bonded assembly by bonding the first die to the second die.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 is a vertical cross-sectional view of a first
exemplary structure after formation of semiconductor devices, lower
level dielectric layers including a silicon nitride layer, lower
metal interconnect structures, and a planar semiconductor material
layer on a semiconductor substrate according to a first embodiment
of the present disclosure.
[0010] FIG. 2 is a vertical cross-sectional view of the first
exemplary structure after formation of a first-tier alternating
stack of first insulating layers and first spacer material layers
according to an embodiment of the present disclosure.
[0011] FIG. 3 is a vertical cross-sectional view of the first
exemplary structure after patterning first-tier staircase regions
on the first-tier alternating stack and forming a first-tier
retro-stepped dielectric material portion according to an
embodiment of the present disclosure.
[0012] FIG. 4A is a vertical cross-sectional view of the first
exemplary structure after formation of first-tier memory openings
and first tier support openings according to an embodiment of the
present disclosure.
[0013] FIG. 4B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 4A. The
zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 4A.
[0014] FIG. 5 is a vertical cross-sectional view of the first
exemplary structure after formation of sacrificial memory opening
fill portions and sacrificial support opening fill portions
according to an embodiment of the present disclosure.
[0015] FIG. 6 is a vertical cross-sectional view of the first
exemplary structure after formation of a second-tier alternating
stack of second insulating layers and second spacer material
layers, a second-tier retro-stepped dielectric material portion,
and a second insulating cap layer according to an embodiment of the
present disclosure.
[0016] FIG. 7A is a vertical cross-sectional view of the first
exemplary structure after formation of inter-tier memory openings
and inter-tier support openings according to an embodiment of the
present disclosure.
[0017] FIG. 7B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 7A. The
zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 7A.
[0018] FIG. 8 is a vertical cross-sectional view of the first
exemplary structure after formation of memory stack structures
according to an embodiment of the present disclosure.
[0019] FIGS. 9A-9H are sequential vertical cross-sectional views of
an inter-tier memory opening during formation of a pillar channel
portion, a memory stack structure, a dielectric core, and a drain
region according to an embodiment of the present disclosure.
[0020] FIG. 10A is a vertical cross-sectional view of the first
exemplary structure after formation of first through-stack via
cavities according to an embodiment of the present disclosure.
[0021] FIG. 10B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 10A.
The zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 10A.
[0022] FIG. 11 is a vertical cross-sectional view of the first
exemplary structure after formation of through-stack insulating
material portion according to an embodiment of the present
disclosure.
[0023] FIG. 12A is a vertical cross-sectional view of the first
exemplary structure after formation of backside contact trenches
according to an embodiment of the present disclosure.
[0024] FIG. 12B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 12A.
The zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 12A.
[0025] FIG. 13A is a vertical cross-sectional view of the first
exemplary structure after replacement of sacrificial material
layers with electrically conductive layers and formation of
insulating spacers and backside contact via structures according to
an embodiment of the present disclosure.
[0026] FIG. 13B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 13A.
The zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 13A.
[0027] FIG. 14A is a vertical cross-sectional view of the first
exemplary structure after formation of drain contact via structures
and word line contact via structures according to an embodiment of
the present disclosure.
[0028] FIG. 14B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 14A.
The zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 14A.
[0029] FIG. 15 is a vertical cross-sectional view of the first
exemplary structure after formation of second through-track via
cavities and through-dielectric via cavities according to an
embodiment of the present disclosure.
[0030] FIG. 16A is a vertical cross-sectional view of the first
exemplary structure after formation of through-stack contact via
structures and through-dielectric contact via structures according
to an embodiment of the present disclosure.
[0031] FIG. 16B is a horizontal cross-sectional view of the first
exemplary structure along the horizontal plane B-B' in FIG. 16A.
The zig-zag vertical plane A-A' corresponds to the plane of the
vertical cross-sectional view of FIG. 16A.
[0032] FIG. 17 is a vertical cross-sectional view of the first
exemplary structure after formation of upper metal line structures
during manufacture of a first die according to an embodiment of the
present disclosure.
[0033] FIG. 18 is a vertical cross-sectional view of an alternative
embodiment of the first exemplary structure during manufacture of a
first die according to an embodiment of the present disclosure.
[0034] FIG. 19 is a vertical cross-sectional view of a second
exemplary structure that can be used to provide a second die
according to an embodiment of the present disclosure.
[0035] FIG. 20 is a vertical cross-sectional view of the second
exemplary structure after thinning the backside of a semiconductor
substrate according to an embodiment of the present disclosure.
[0036] FIG. 21 is a vertical cross-section view of the alternate
embodiment of the first exemplary structure after formation of
first bonding pads according to an embodiment of the present
disclosure.
[0037] FIG. 22 is a vertical cross-sectional view of a first
exemplary bonded assembly formed by bonding the alternative
embodiment of the first exemplary structure of FIG. 21 and the
second exemplary structure of FIG. 20 according to an embodiment of
the present disclosure.
[0038] FIG. 23 is a vertical cross-sectional view of the first
exemplary bonded assembly after formation of a through-substrate
via structure and a bonding pad according to an embodiment of the
present disclosure.
[0039] FIG. 24 is a vertical cross-sectional view of an alternative
embodiment of the first exemplary bonded assembly formed by bonding
the first exemplary structure of FIG. 17 as modified by formation
of first bonding pads and the second exemplary structure of FIG. 20
according to an embodiment of the present disclosure.
[0040] FIG. 25 is a vertical cross-sectional view of the
alternative embodiment of the first exemplary bonded assembly after
formation of a through-substrate via structure and a bonding pad
according to an embodiment of the present disclosure.
[0041] FIG. 26 is a vertical cross-sectional view of a first die
and a second die prior to bonding according to an embodiment of the
present disclosure.
[0042] FIG. 27 is a vertical cross-sectional view of a second
exemplary bonded assembly according to an embodiment of the present
disclosure.
[0043] FIG. 28 is a vertical cross-sectional view of an alternative
embodiment of the second exemplary bonded assembly according to an
embodiment of the present disclosure.
[0044] FIG. 29 is a vertical cross-sectional view of a third
exemplary bonded assembly of a first die, a second die, and a third
die according to an embodiment of the present disclosure.
[0045] FIGS. 30A-30F are sequential vertical cross-sectional views
of an exemplary structure during bonding of two dies according to
an embodiment of the present disclosure.
[0046] FIGS. 31A-31D illustrate various configurations of areal
overlap in a bonded assembly of a first die and a second die
according to various embodiments of the present disclosure.
[0047] FIG. 32 is a layout of a logic die that can be used as one
of bonded dies in a bonded assembly according to an embodiment of
the present disclosure.
[0048] FIG. 33 is a layout of a first magnified region M1 within
the logic die of FIG. 32.
[0049] FIG. 34 is a first exemplary layout of a second magnified
region M2 within the first magnified region M1 of FIG. 33 at a
first metal line level and a first metal via level according to an
embodiment of the present disclosure.
[0050] FIG. 35 is the first exemplary layout of the second
magnified region M2 at the first metal via level and at a second
metal line level according to an embodiment of the present
disclosure.
[0051] FIG. 36 is the first exemplary layout of the second
magnified region M2 at the second metal line level and at a pad
connection level according to an embodiment of the present
disclosure.
[0052] FIG. 37 is the first exemplary layout of the second
magnified region M2 at the pad connection level and at a metal pad
level according to an embodiment of the present disclosure.
[0053] FIG. 38 is a vertical cross-sectional view along the
vertical cross-sectional plane X-X' of FIGS. 34, 35, 36, and 37 of
the second magnified region M2 according to an embodiment of the
present disclosure.
[0054] FIG. 39 is a plan view of components of a source power
distribution network at the levels of the second metal line level,
the pad connection level, and the metal pad level within the second
magnified region M2 according to an embodiment of the present
disclosure.
[0055] FIG. 40 is a second exemplary layout of the second magnified
region M2 within the first magnified region M1 of FIG. 33 at a
first metal line level and a first metal via level according to an
embodiment of the present disclosure.
[0056] FIG. 41 is the second exemplary layout of the second
magnified region M2 at the first metal via level and at a second
metal line level according to an embodiment of the present
disclosure.
[0057] FIG. 42 is the second exemplary layout of the second
magnified region M2 at the second metal line level and at a pad
connection level according to an embodiment of the present
disclosure.
[0058] FIG. 43 is the second exemplary layout of the second
magnified region M2 at the pad connection level and at a metal pad
level according to an embodiment of the present disclosure.
[0059] FIG. 44 is a vertical cross-sectional view along the
vertical cross-sectional plane X-X' of FIGS. 40, 41, 42, and 43 of
the second magnified region M2 according to an embodiment of the
present disclosure.
[0060] FIG. 45 is a vertical cross-sectional view along the
vertical cross-sectional plane Y-Y' of FIGS. 40, 41, 42, and 43 of
the second magnified region M2 according to an embodiment of the
present disclosure.
DETAILED DESCRIPTION
[0061] As three-dimensional memory devices scale to smaller device
dimensions, the device area for peripheral devices (which can be
referred to interchangeably as driver devices, driver circuits,
logic circuitry, logic devices, peripheral circuits, etc.) can take
up a significant portion of the total chip area. The peripheral
logic circuitry provides control of the various nodes of the memory
devices. Typically, complementary metal oxide semiconductor (CMOS)
devices are formed on a same substrate as the three-dimensional
memory device. Manufacture of a three-dimensional memory array
typically involves many high temperature processing steps, such as
activation anneals and high temperature layer deposition steps.
Such high temperature processing steps have an adverse impact on
logic devices formed on a same substrate as the three-dimensional
memory array. However, degradation of CMOS devices due to
collateral thermal cycling and hydrogen diffusion during
manufacture of the three-dimensional memory device places a severe
constraint on performance of the support circuitry including the
CMOS devices. However, high performance peripheral devices are
necessary to provide high performance for a three-dimensional
memory device. Further, performance of the three-dimensional memory
device can be significantly degraded due to voltage drops in a
power distribution network such as a source voltage distribution
network. The embodiments of the present disclosure provide a
peripheral circuit die containing logic devices, such as CMOS
devices, which is bonded to the memory-containing die containing a
three-dimensional memory device. This configuration avoids or
reduces the negative effect of the high temperature processing
steps on the logic devices.
[0062] The embodiments of the present disclosure can be used to
form various semiconductor devices such as three-dimensional
monolithic memory array devices comprising a plurality of NAND
memory strings. The drawings are not drawn to scale. Multiple
instances of an element may be duplicated where a single instance
of the element is illustrated, unless absence of duplication of
elements is expressly described or clearly indicated otherwise.
[0063] Ordinals such as "first," "second," and "third" are used
merely to identify similar elements, and different ordinals may be
used across the specification and the claims of the instant
disclosure. As used herein, a first element located "on" a second
element can be located on the exterior side of a surface of the
second element or on the interior side of the second element. As
used herein, a first element is located "directly on" a second
element if there exist a physical contact between a surface of the
first element and a surface of the second element. As used herein,
an "in-process" structure or a "transient" structure refers to a
structure that is subsequently modified.
[0064] As used herein, a "layer" refers to a material portion
including a region having a thickness. A layer may extend over the
entirety of an underlying or overlying structure, or may have an
extent less than the extent of an underlying or overlying
structure. Further, a layer may be a region of a homogeneous or
inhomogeneous continuous structure that has a thickness less than
the thickness of the continuous structure. For example, a layer may
be located between any pair of horizontal planes between or at a
top surface and a bottom surface of the continuous structure. A
layer may extend horizontally, vertically, and/or along a tapered
surface. A substrate may be a layer, may include one or more layers
therein, and/or may have one or more layer thereupon, thereabove,
and/or therebelow.
[0065] As used herein, a "memory level" or a "memory array level"
refers to the level corresponding to a general region between a
first horizontal plane (i.e., a plane parallel to the top surface
of the substrate) including topmost surfaces of an array of memory
elements and a second horizontal plane including bottommost
surfaces of the array of memory elements. As used herein, a
"through-stack" element refers to an element that vertically
extends through a memory level.
[0066] As used herein, a "semiconducting material" refers to a
material having electrical conductivity in the range from
1.0.times.10.sup.-6 S/cm to 1.0.times.10.sup.5 S/cm. As used
herein, a "semiconductor material" refers to a material having
electrical conductivity in the range from 1.0.times.10.sup.-6 S/cm
to 1.0.times.10.sup.5 S/cm in the absence of electrical dopants
therein, and is capable of producing a doped material having
electrical conductivity in a range from 1.0 S/cm to
1.0.times.10.sup.5 S/cm upon suitable doping with an electrical
dopant. As used herein, an "electrical dopant" refers to a p-type
dopant that adds a hole to a valence band within a band structure,
or an n-type dopant that adds an electron to a conduction band
within a band structure. As used herein, a "conductive material"
refers to a material having electrical conductivity greater than
1.0.times.10.sup.5 S/cm. As used herein, an "insulating material"
or a "dielectric material" refers to a material having electrical
conductivity less than 1.0.times.10.sup.-6 S/cm. As used herein, a
"heavily doped semiconductor material" refers to a semiconductor
material that is doped with electrical dopant at a sufficiently
high atomic concentration to become a conductive material, i.e., to
have electrical conductivity greater than 1.0.times.10.sup.5 S/cm.
A "doped semiconductor material" may be a heavily doped
semiconductor material, or may be a semiconductor material that
includes electrical dopants (i.e., p-type dopants and/or n-type
dopants) at a concentration that provides electrical conductivity
in the range from 1.0.times.10.sup.-6 S/cm to 1.0.times.10.sup.5
S/cm. An "intrinsic semiconductor material" refers to a
semiconductor material that is not doped with electrical dopants.
Thus, a semiconductor material may be semiconducting or conductive,
and may be an intrinsic semiconductor material or a doped
semiconductor material. A doped semiconductor material can be
semiconducting or conductive depending on the atomic concentration
of electrical dopants therein. As used herein, a "metallic
material" refers to a conductive material including at least one
metallic element therein. All measurements for electrical
conductivities are made at the standard condition.
[0067] A monolithic three-dimensional memory array is one in which
multiple memory levels are formed above a single substrate, such as
a semiconductor wafer, with no intervening substrates. The term
"monolithic" means that layers of each level of the array are
directly deposited on the layers of each underlying level of the
array. In contrast, two dimensional arrays may be formed separately
and then packaged together to form a non-monolithic memory device.
For example, non-monolithic stacked memories have been constructed
by forming memory levels on separate substrates and vertically
stacking the memory levels, as described in U.S. Pat. No. 5,915,167
titled "Three-dimensional Structure Memory." The substrates may be
thinned or removed from the memory levels before bonding, but as
the memory levels are initially formed over separate substrates,
such memories are not true monolithic three-dimensional memory
arrays. The substrate may include integrated circuits fabricated
thereon, such as driver circuits for a memory device
[0068] Three-dimensional memory devices of various embodiments of
the present disclosure include a monolithic three-dimensional NAND
string memory device, and can be fabricated using the various
embodiments described herein. The monolithic three-dimensional NAND
string is located in a monolithic, three-dimensional array of NAND
strings located over the substrate. At least one memory cell in the
first device level of the three-dimensional array of NAND strings
is located over another memory cell in the second device level of
the three-dimensional array of NAND strings.
[0069] Referring to FIG. 1, a first exemplary structure according
to an embodiment of the present disclosure is illustrated. The
first exemplary structure includes a semiconductor substrate 8, and
semiconductor devices 710 formed thereupon. The semiconductor
substrate 8 includes a substrate semiconductor layer 9 at least at
an upper portion thereof. Shallow trench isolation structures 720
can be formed in an upper portion of the substrate semiconductor
layer 9 to provide electrical isolation among the semiconductor
devices. The semiconductor devices 710 can include, for example,
field effect transistors including respective transistor active
regions 742 (i.e., source regions and drain regions), channel
regions 746 and gate structures 750. The field effect transistors
may be arranged in a CMOS configuration. Each gate structure 750
can include, for example, a gate dielectric 752, a gate electrode
754, a dielectric gate spacer 756 and a gate cap dielectric 758.
The semiconductor devices can include any semiconductor circuitry
to support operation of a memory structure to be subsequently
formed, which is typically referred to as a driver circuitry, which
is also known as peripheral circuitry. As used herein, a peripheral
circuitry refers to any, each, or all, of word line decoder
circuitry, word line switching circuitry, bit line decoder
circuitry, bit line sensing and/or switching circuitry, power
supply/distribution circuitry, data buffer and/or latch, or any
other semiconductor circuitry that can be implemented outside a
memory array structure for a memory device. For example, the
semiconductor devices can include word line switching devices for
electrically biasing word lines of three-dimensional memory
structures to be subsequently formed.
[0070] Dielectric material layers are formed over the semiconductor
devices, which is herein referred to as lower level dielectric
layers 760. The lower level dielectric layers 760 constitute a
dielectric layer stack in which each lower level dielectric layer
760 overlies or underlies other lower level dielectric layers 760.
The lower level dielectric layers 760 can include, for example, a
dielectric liner 762 such as a silicon nitride liner that blocks
diffusion of mobile ions and/or apply appropriate stress to
underlying structures, at least one first dielectric material layer
764 that overlies the dielectric liner 762, a silicon nitride layer
(e.g., hydrogen diffusion barrier) 766 that overlies the dielectric
material layer 764, and at least one second dielectric layer
768.
[0071] The dielectric layer stack including the lower level
dielectric layers 760 functions as a matrix for lower metal
interconnect structures 780 that provide electrical wiring between
the various nodes of the semiconductor devices and landing pads for
through-stack contact via structures to be subsequently formed. The
lower metal interconnect structures 780 are included within the
dielectric layer stack of the lower level dielectric layers 760,
and comprise a lower metal line structure located under and
optionally contacting a bottom surface of the silicon nitride layer
766.
[0072] For example, the lower metal interconnect structures 780 can
be included within the at least one first dielectric material layer
764. The at least one first dielectric material layer 764 may be a
plurality of dielectric material layers in which various elements
of the lower metal interconnect structures 780 are sequentially
included. Each dielectric material layer of the at least one first
dielectric material layer 764 may include any of doped silicate
glass, undoped silicate glass, organosilicate glass, silicon
nitride, silicon oxynitride, and dielectric metal oxides (such as
aluminum oxide). In one embodiment, the at least one first
dielectric material layer 764 can comprise, or consist essentially
of, dielectric material layers having dielectric constants that do
not exceed the dielectric constant of undoped silicate glass
(silicon oxide) of 3.9.
[0073] The lower metal interconnect structures 780 can include
various device contact via structures 782 (e.g., source and drain
electrodes which contact the respective source and drain nodes of
the device or gate electrode contacts), intermediate lower metal
line structures 784, lower metal via structures 786, and topmost
lower metal line structures 788 that are configured to function as
landing pads for through-stack contact via structures to be
subsequently formed. In this case, the at least one first
dielectric material layer 764 may be a plurality of dielectric
material layers that are formed level by level while incorporating
components of the lower metal interconnect structures 780 within
each respective level. For example, single damascene processes may
be used to form the lower metal interconnect structures 780, and
each level of the lower metal via structures 786 may be included
within a respective via level dielectric material layer and each
level of the lower level metal line structures (784, 788) may be
included within a respective line level dielectric material layer.
Alternatively, a dual damascene process may be used to form
integrated line and via structures, each of which includes a lower
metal line structure and at least one lower metal via
structure.
[0074] The topmost lower metal line structures 788 can be formed
within a topmost dielectric material layer of the at least one
first dielectric material layer 764 (which can be a plurality of
dielectric material layers). Each of the lower metal interconnect
structures 780 can include a metallic nitride liner 78A and a metal
fill portion 78B. Each metallic nitride liner 78A can include a
conductive metallic nitride material such as TiN, TaN, and/or WN.
Each metal fill portion 78B can include an elemental metal (such as
Cu, W, Al, Co, Ru) or an intermetallic alloy of at least two
metals. Top surfaces of the topmost lower metal line structures 788
and the topmost surface of the at least one first dielectric
material layer 764 may be planarized by a planarization process,
such as chemical mechanical planarization. In this case, the top
surfaces of the topmost lower metal line structures 788 and the
topmost surface of the at least one first dielectric material layer
764 may be within a horizontal plane that is parallel to the top
surface of the substrate 8.
[0075] The silicon nitride layer 766 can be formed directly on the
top surfaces of the topmost lower metal line structures 788 and the
topmost surface of the at least one first dielectric material layer
764. Alternatively, a portion of the first dielectric material
layer 764 can be located on the top surfaces of the topmost lower
metal line structures 788 below the silicon nitride layer 766. In
one embodiment, the silicon nitride layer 766 is a substantially
stoichiometric silicon nitride layer which has a composition of
Si.sub.3N.sub.4. A silicon nitride material formed by thermal
decomposition of a silicon nitride precursor is preferred for the
purpose of blocking hydrogen diffusion. In one embodiment, the
silicon nitride layer 766 can be deposited by a low pressure
chemical vapor deposition (LPCVD) using dichlorosilane
(SiH.sub.2Cl.sub.2) and ammonia (NH.sub.3) as precursor gases. The
temperature of the LPCVD process may be in a range from 750 degrees
Celsius to 825 degrees Celsius, although lesser and greater
deposition temperatures can also be used. The sum of the partial
pressures of dichlorosilane and ammonia may be in a range from 50
mTorr to 500 mTorr, although lesser and greater pressures can also
be used. The thickness of the silicon nitride layer 766 is selected
such that the silicon nitride layer 766 functions as a sufficiently
robust hydrogen diffusion barrier for subsequent thermal processes.
For example, the thickness of the silicon nitride layer 766 can be
in a range from 6 nm to 100 nm, although lesser and greater
thicknesses may also be used.
[0076] The at least one second dielectric material layer 768 may
include a single dielectric material layer or a plurality of
dielectric material layers. Each dielectric material layer of the
at least one second dielectric material layer 768 may include any
of doped silicate glass, undoped silicate glass, and organosilicate
glass. In one embodiment, the at least one first second material
layer 768 can comprise, or consist essentially of, dielectric
material layers having dielectric constants that do not exceed the
dielectric constant of undoped silicate glass (silicon oxide) of
3.9.
[0077] An optional layer of a metallic material and a layer of a
semiconductor material can be deposited over, or within patterned
recesses of, the at least one second dielectric material layer 768,
and is lithographically patterned to provide an optional planar
conductive material layer 6 and a planar semiconductor material
layer 10. The optional planar conductive material layer 6, if
present, provides a high conductivity conduction path for
electrical current that flows into, or out of, the planar
semiconductor material layer 10. The optional planar conductive
material layer 6 includes a conductive material such as a metal or
a heavily doped semiconductor material. The optional planar
conductive material layer 6, for example, may include a tungsten
layer having a thickness in a range from 3 nm to 100 nm, although
lesser and greater thicknesses can also be used. A metal nitride
layer (not shown) may be provided as a diffusion barrier layer on
top of the planar conductive material layer 6. Layer 6 may function
as a special source line in the completed device. Alternatively,
layer 6 may comprise an etch stop layer and may comprise any
suitable conductive, semiconductor or insulating layer.
[0078] The planar semiconductor material layer 10 can include
horizontal semiconductor channels and/or source regions for a
three-dimensional array of memory devices to be subsequently
formed. The optional planar conductive material layer 6 can include
a metallic compound material such as a conductive metallic nitride
(e.g., TiN) and/or a metal (e.g., W). The thickness of the optional
planar conductive material layer 6 may be in a range from 5 nm to
100 nm, although lesser and greater thicknesses can also be used.
The planar semiconductor material layer 10 includes a
polycrystalline semiconductor material such as polysilicon or a
polycrystalline silicon-germanium alloy. The thickness of the
planar semiconductor material layer 10 may be in a range from 30 nm
to 300 nm, although lesser and greater thicknesses can also be
used.
[0079] The planar semiconductor material layer 10 includes a
semiconductor material, which can include at least one elemental
semiconductor material, at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, and/or other
semiconductor materials known in the art. In one embodiment, the
planar semiconductor material layer 10 can include a
polycrystalline semiconductor material (such as polysilicon), or an
amorphous semiconductor material (such as amorphous silicon) that
is converted into a polycrystalline semiconductor material in a
subsequent processing step (such as an anneal step). The planar
semiconductor material layer 10 can be formed directly above a
subset of the semiconductor devices on the semiconductor substrate
8 (e.g., silicon wafer). As used herein, a first element is located
"directly above" a second element if the first element is located
above a horizontal plane including a topmost surface of the second
element and an area of the first element and an area of the second
element has an areal overlap in a plan view (i.e., along a vertical
plane or direction perpendicular to the top surface of the
substrate 8). In one embodiment, the planar semiconductor material
layer 10 or portions thereof can be doped with electrical dopants,
which may be p-type dopants or n-type dopants. The conductivity
type of the dopants in the planar semiconductor material layer 10
is herein referred to as a first conductivity type.
[0080] The optional planar conductive material layer 6 and the
planar semiconductor material layer 10 may be patterned to provide
openings in areas in which through-stack contact via structures and
through-dielectric contact via structures are to be subsequently
formed. In one embodiment, the openings in the optional planar
conductive material layer 6 and the planar semiconductor material
layer 10 can be formed within the area of a memory array region
100, in which a three-dimensional memory array including memory
stack structures is to be subsequently formed. Further, additional
openings in the optional planar conductive material layer 6 and the
planar semiconductor material layer 10 can be formed within the
area of a contact region 200 in which contact via structures
contacting word line electrically conductive layers are to be
subsequently formed.
[0081] The region of the semiconductor devices 710 and the
combination of the lower level dielectric layers 760 and the lower
metal interconnect structures 780 is herein referred to an
underlying peripheral device region 700, which is located
underneath a memory-level assembly to be subsequently formed and
includes peripheral devices for the memory-level assembly. The
lower metal interconnect structures 780 are included in the lower
level dielectric layers 760.
[0082] The lower metal interconnect structures 780 can be
electrically connected to active nodes (e.g., transistor active
regions 742 or gate electrodes 754) of the semiconductor devices
710 (e.g., CMOS devices), and are located at the level of the lower
level dielectric layers 760. Only a subset of the active nodes is
illustrated in FIG. 1 for clarity. Through-stack contact via
structures (not shown in FIG. 1) can be subsequently formed
directly on the lower metal interconnect structures 780 to provide
electrical connection to memory devices to be subsequently formed.
In one embodiment, the pattern of the lower metal interconnect
structures 780 can be selected such that the topmost lower metal
line structures 788 (which are a subset of the lower metal
interconnect structures 780 located at the topmost portion of the
lower metal interconnect structures 780) can provide landing pad
structures for the through-stack contact via structures to be
subsequently formed.
[0083] Referring to FIG. 2, an alternating stack of first material
layers and second material layers is subsequently formed. Each
first material layer can include a first material, and each second
material layer can include a second material that is different from
the first material. In case at least another alternating stack of
material layers is subsequently formed over the alternating stack
of the first material layers and the second material layers, the
alternating stack is herein referred to as a first-tier alternating
stack. The level of the first-tier alternating stack is herein
referred to as a first-tier level, and the level of the alternating
stack to be subsequently formed immediately above the first-tier
level is herein referred to as a second-tier level, etc.
[0084] The first-tier alternating stack can include first
insulating layers 132 as the first material layers, and first
spacer material layers as the second material layers. In one
embodiment, the first spacer material layers can be sacrificial
material layers that are subsequently replaced with electrically
conductive layers. In another embodiment, the first spacer material
layers can be electrically conductive layers that are not
subsequently replaced with other layers. While the present
disclosure is described using embodiments in which sacrificial
material layers are replaced with electrically conductive layers,
in other embodiments the spacer material layers are formed as
electrically conductive layers (thereby obviating the need to
perform replacement processes).
[0085] In one embodiment, the first material layers and the second
material layers can be first insulating layers 132 and first
sacrificial material layers 142, respectively. In one embodiment,
each first insulating layer 132 can include a first insulating
material, and each first sacrificial material layer 142 can include
a first sacrificial material. An alternating plurality of first
insulating layers 132 and first sacrificial material layers 142 is
formed over the planar semiconductor material layer 10. As used
herein, a "sacrificial material" refers to a material that is
removed during a subsequent processing step. As used herein, an
alternating stack of first elements and second elements refers to a
structure in which instances of the first elements and instances of
the second elements alternate. Each instance of the first elements
that is not an end element of the alternating plurality is adjoined
by two instances of the second elements on both sides, and each
instance of the second elements that is not an end element of the
alternating plurality is adjoined by two instances of the first
elements on both ends. The first elements may have the same
thickness thereamongst, or may have different thicknesses. The
second elements may have the same thickness thereamongst, or may
have different thicknesses. The alternating plurality of first
material layers and second material layers may begin with an
instance of the first material layers or with an instance of the
second material layers, and may end with an instance of the first
material layers or with an instance of the second material layers.
In one embodiment, an instance of the first elements and an
instance of the second elements may form a unit that is repeated
with periodicity within the alternating plurality.
[0086] The first-tier alternating stack (132, 142) can include
first insulating layers 132 composed of the first material, and
first sacrificial material layers 142 composed of the second
material, which is different from the first material. The first
material of the first insulating layers 132 can be at least one
insulating material. Insulating materials that can be used for the
first insulating layers 132 include, but are not limited to silicon
oxide (including doped or undoped silicate glass), silicon nitride,
silicon oxynitride, organosilicate glass (OSG), spin-on dielectric
materials, dielectric metal oxides that are commonly known as high
dielectric constant (high-k) dielectric oxides (e.g., aluminum
oxide, hafnium oxide, etc.) and silicates thereof, dielectric metal
oxynitrides and silicates thereof, and organic insulating
materials. In one embodiment, the first material of the first
insulating layers 132 can be silicon oxide.
[0087] The second material of the first sacrificial material layers
142 is a sacrificial material that can be removed selective to the
first material of the first insulating layers 132. As used herein,
a removal of a first material is "selective to" a second material
if the removal process removes the first material at a rate that is
at least twice the rate of removal of the second material. The
ratio of the rate of removal of the first material to the rate of
removal of the second material is herein referred to as a
"selectivity" of the removal process for the first material with
respect to the second material.
[0088] The first sacrificial material layers 142 may comprise an
insulating material, a semiconductor material, or a conductive
material. The second material of the first sacrificial material
layers 142 can be subsequently replaced with electrically
conductive electrodes which can function, for example, as control
gate electrodes of a vertical NAND device. In one embodiment, the
first sacrificial material layers 142 can be material layers that
comprise silicon nitride.
[0089] In one embodiment, the first insulating layers 132 can
include silicon oxide, and sacrificial material layers can include
silicon nitride sacrificial material layers. The first material of
the first insulating layers 132 can be deposited, for example, by
chemical vapor deposition (CVD). For example, if silicon oxide is
used for the first insulating layers 132, tetraethylorthosilicate
(TEOS) can be used as the precursor material for the CVD process.
The second material of the first sacrificial material layers 142
can be formed, for example, CVD or atomic layer deposition
(ALD).
[0090] The thicknesses of the first insulating layers 132 and the
first sacrificial material layers 142 can be in a range from 20 nm
to 50 nm, although lesser and greater thicknesses can be used for
each first insulating layer 132 and for each first sacrificial
material layer 142. The number of repetitions of the pairs of a
first insulating layer 132 and a first sacrificial material layer
142 can be in a range from 2 to 1,024, and typically from 8 to 256,
although a greater number of repetitions can also be used. In one
embodiment, each first sacrificial material layer 142 in the
first-tier alternating stack (132, 142) can have a uniform
thickness that is substantially invariant within each respective
first sacrificial material layer 142.
[0091] A first insulating cap layer 170 is subsequently formed over
the stack (132, 142). The first insulating cap layer 170 includes a
dielectric material, which can be any dielectric material that can
be used for the first insulating layers 132. In one embodiment, the
first insulating cap layer 170 includes the same dielectric
material as the first insulating layers 132. The thickness of the
insulating cap layer 170 can be in a range from 20 nm to 300 nm,
although lesser and greater thicknesses can also be used.
[0092] Referring to FIG. 3, the first insulating cap layer 170 and
the first-tier alternating stack (132, 142) can be patterned to
form first stepped surfaces in the word line contact via region
200. The word line contact via region 200 can include a respective
first stepped area in which the first stepped surfaces are formed,
and a second stepped area in which additional stepped surfaces are
to be subsequently formed in a second-tier structure (to be
subsequently formed over a first-tier structure) and/or additional
tier structures. The first stepped surfaces can be formed, for
example, by forming a mask layer with an opening therein, etching a
cavity within the levels of the first insulating cap layer 170, and
iteratively expanding the etched area and vertically recessing the
cavity by etching each pair of a first insulating layer 132 and a
first sacrificial material layer 142 located directly underneath
the bottom surface of the etched cavity within the etched area. A
dielectric material can be deposited to fill the first stepped
cavity to form a first-tier retro-stepped dielectric material
portion 165. As used herein, a "retro-stepped" element refers to an
element that has stepped surfaces and a horizontal cross-sectional
area that increases monotonically as a function of a vertical
distance from a top surface of a substrate on which the element is
present. The first-tier alternating stack (132, 142) and the
first-tier retro-stepped dielectric material portion 165
collectively constitute a first-tier structure, which is an
in-process structure that is subsequently modified.
[0093] Referring to FIGS. 4A and 4B, an inter-tier dielectric layer
180 may be optionally deposited over the first-tier structure (132,
142, 165, 170). The inter-tier dielectric layer 180 includes a
dielectric material such as silicon oxide. The thickness of the
inter-tier dielectric layer 180 can be in a range from 30 nm to 300
nm, although lesser and greater thicknesses can also be used.
Locations of steps S in the first-tier alternating stack (132, 142)
are illustrated as dotted lines.
[0094] First-tier memory openings 149 and first tier support
openings 119 can be formed. The first-tier memory openings 149 and
the first-tier support openings 119 extend through the first-tier
alternating stack (132, 142) at least to a top surface of the
planar semiconductor material layer 10. The first-tier memory
openings 149 can be formed in the memory array region 100 at
locations at which memory stack structures including vertical
stacks of memory elements are to be subsequently formed. The
first-tier support openings 119 can be formed in the word line
contact via region 200. For example, a lithographic material stack
(not shown) including at least a photoresist layer can be formed
over the first insulating cap layer 170 (and the optional
inter-tier dielectric layer 180, if present), and can be
lithographically patterned to form openings within the lithographic
material stack. The pattern in the lithographic material stack can
be transferred through the first insulating cap layer 170 (and the
optional inter-tier dielectric layer 180), and through the entirety
of the first-tier alternating stack (132, 142) by at least one
anisotropic etch that uses the patterned lithographic material
stack as an etch mask. Portions of the first insulating cap layer
170 (and the optional inter-tier dielectric layer 180), and the
first-tier alternating stack (132, 142) underlying the openings in
the patterned lithographic material stack are etched to form the
first-tier memory openings 149 and the first-tier support openings
119. In other words, the transfer of the pattern in the patterned
lithographic material stack through the first insulating cap layer
170 and the first-tier alternating stack (132, 142) forms the
first-tier memory openings 149 and the first-tier support openings
119.
[0095] In one embodiment, the chemistry of the anisotropic etch
process used to etch through the materials of the first-tier
alternating stack (132, 142) can alternate to optimize etching of
the first and second materials in the first-tier alternating stack
(132, 142). The anisotropic etch can be, for example, a series of
reactive ion etches or a single etch (e.g., CF.sub.4/O.sub.2/Ar
etch). The sidewalls of the first-tier memory openings 149 and the
support openings 119 can be substantially vertical, or can be
tapered. Subsequently, the patterned lithographic material stack
can be subsequently removed, for example, by ashing.
[0096] Optionally, the portions of the first-tier memory openings
149 and the first-tier support openings 119 at the level of the
inter-tier dielectric layer 180 can be laterally expanded by an
isotropic etch. For example, if the inter-tier dielectric layer 180
comprises a dielectric material (such as borosilicate glass) having
a greater etch rate than the first insulating layers 132 (that can
include undoped silicate glass), an isotropic etch (such as a wet
etch using HF) can be used to expand the lateral dimensions of the
first-tier memory openings at the level of the inter-tier
dielectric layer 180. The portions of the first-tier memory
openings 149 (and the first-tier support openings 119) located at
the level of the inter-tier dielectric layer 180 may be optionally
widened to provide a larger landing pad for second-tier memory
openings to be subsequently formed through a second-tier
alternating stack (to be subsequently formed prior to formation of
the second-tier memory openings).
[0097] Referring to FIG. 5, sacrificial memory opening fill
portions 148 can be formed in the first-tier memory openings 149,
and sacrificial support opening fill portions 118 can be formed in
the first-tier support openings 119. For example, a sacrificial
fill material layer is deposited in the first-tier memory openings
149 and the first-tier support openings 119. The sacrificial fill
material layer includes a sacrificial material which can be
subsequently removed selective to the materials of the first
insulator layers 132 and the first sacrificial material layers 142.
In one embodiment, the sacrificial fill material layer can include
a semiconductor material such as silicon (e.g., a-Si or
polysilicon), a silicon-germanium alloy, germanium, a III-V
compound semiconductor material, or a combination thereof.
Optionally, a thin etch stop layer (such as a silicon oxide layer
having a thickness in a range from 1 nm to 3 nm) may be used prior
to depositing the sacrificial fill material layer. The sacrificial
fill material layer may be formed by a non-conformal deposition or
a conformal deposition method. In another embodiment, the
sacrificial fill material layer can include amorphous silicon or a
carbon-containing material (such as amorphous carbon or
diamond-like carbon) that can be subsequently removed by
ashing.
[0098] Portions of the deposited sacrificial material can be
removed from above the first insulating cap layer 170 (and the
optional inter-tier dielectric layer 180, if present). For example,
the sacrificial fill material layer can be recessed to a top
surface of the first insulating cap layer 170 (and the optional
inter-tier dielectric layer 180) using a planarization process. The
planarization process can include a recess etch, chemical
mechanical planarization (CMP), or a combination thereof. The top
surface of the first insulating layer 170 (and optionally layer 180
if present) can be used as an etch stop layer or a planarization
stop layer. Each remaining portion of the sacrificial material in a
first-tier memory opening 149 constitutes a sacrificial memory
opening fill portion 148. Each remaining portion of the sacrificial
material in a first-tier support opening 119 constitutes a
sacrificial support opening fill portion 118. The top surfaces of
the sacrificial memory opening fill portions 148 and the
sacrificial support opening fill portions 118 can be coplanar with
the top surface of the inter-tier dielectric layer 180 (or the
first insulating cap layer 170 if the inter-tier dielectric layer
180 is not present). The sacrificial memory opening fill portion
148 and the sacrificial support opening fill portions 118 may, or
may not, include cavities therein.
[0099] Referring to FIG. 6, a second-tier structure can be formed
over the first-tier structure (132, 142, 170, 148, 118). The
second-tier structure can include an additional alternating stack
of insulating layers and spacer material layers, which can be
sacrificial material layers. For example, a second alternating
stack (232, 242) of material layers can be subsequently formed on
the top surface of the first alternating stack (132, 142). The
second stack (232, 242) includes an alternating plurality of third
material layers and fourth material layers. Each third material
layer can include a third material, and each fourth material layer
can include a fourth material that is different from the third
material. In one embodiment, the third material can be the same as
the first material of the first insulating layer 132, and the
fourth material can be the same as the second material of the first
sacrificial material layers 142.
[0100] In one embodiment, the third material layers can be second
insulating layers 232 and the fourth material layers can be second
spacer material layers that provide vertical spacing between each
vertically neighboring pair of the second insulating layers 232. In
one embodiment, the third material layers and the fourth material
layers can be second insulating layers 232 and second sacrificial
material layers 242, respectively. The third material of the second
insulating layers 232 may be at least one insulating material. The
fourth material of the second sacrificial material layers 242 may
be a sacrificial material that can be removed selective to the
third material of the second insulating layers 232. The second
sacrificial material layers 242 may comprise an insulating
material, a semiconductor material, or a conductive material. The
fourth material of the second sacrificial material layers 242 can
be subsequently replaced with electrically conductive electrodes
which can function, for example, as control gate electrodes of a
vertical NAND device.
[0101] In one embodiment, each second insulating layer 232 can
include a second insulating material, and each second sacrificial
material layer 242 can include a second sacrificial material. In
this case, the second stack (232, 242) can include an alternating
plurality of second insulating layers 232 and second sacrificial
material layers 242. The third material of the second insulating
layers 232 can be deposited, for example, by chemical vapor
deposition (CVD). The fourth material of the second sacrificial
material layers 242 can be formed, for example, CVD or atomic layer
deposition (ALD).
[0102] The third material of the second insulating layers 232 can
be at least one insulating material. Insulating materials that can
be used for the second insulating layers 232 can be any material
that can be used for the first insulating layers 132. The fourth
material of the second sacrificial material layers 242 is a
sacrificial material that can be removed selective to the third
material of the second insulating layers 232. Sacrificial materials
that can be used for the second sacrificial material layers 242 can
be any material that can be used for the first sacrificial material
layers 142. In one embodiment, the second insulating material can
be the same as the first insulating material, and the second
sacrificial material can be the same as the first sacrificial
material.
[0103] The thicknesses of the second insulating layers 232 and the
second sacrificial material layers 242 can be in a range from 20 nm
to 50 nm, although lesser and greater thicknesses can be used for
each second insulating layer 232 and for each second sacrificial
material layer 242. The number of repetitions of the pairs of a
second insulating layer 232 and a second sacrificial material layer
242 can be in a range from 2 to 1,024, and typically from 8 to 256,
although a greater number of repetitions can also be used. In one
embodiment, each second sacrificial material layer 242 in the
second stack (232, 242) can have a uniform thickness that is
substantially invariant within each respective second sacrificial
material layer 242.
[0104] Second stepped surfaces in the second stepped area can be
formed in the word line contact via region 200 using a same set of
processing steps as the processing steps used to form the first
stepped surfaces in the first stepped area with suitable adjustment
to the pattern of at least one masking layer. A second-tier
retro-stepped dielectric material portion 265 can be formed over
the second stepped surfaces in the word line contact via region
200.
[0105] A second insulating cap layer 270 can be subsequently formed
over the second alternating stack (232, 242). The second insulating
cap layer 270 includes a dielectric material that is different from
the material of the second sacrificial material layers 242. In one
embodiment, the second insulating cap layer 270 can include silicon
oxide. In one embodiment, the first and second sacrificial material
layers (142, 242) can comprise silicon nitride.
[0106] Generally speaking, at least one alternating stack of
insulating layers (132, 232) and spacer material layers (such as
sacrificial material layers (142, 242)) can be formed over the
planar semiconductor material layer 10, and at least one
retro-stepped dielectric material portion (165, 265) can be formed
over the staircase regions on the at least one alternating stack
(132, 142, 232, 242).
[0107] Optionally, drain-select-level shallow trench isolation
structures 72 can be formed through a subset of layers in an upper
portion of the second-tier alternating stack (232, 242). The second
sacrificial material layers 242 that are cut by the
select-drain-level shallow trench isolation structures 72
correspond to the levels in which drain-select-level electrically
conductive layers are subsequently formed. The drain-select-level
shallow trench isolation structures 72 include a dielectric
material such as silicon oxide.
[0108] Referring to FIGS. 7A and 7B, second-tier memory openings
249 and second tier support openings 219 extending through the
second-tier structure (232, 242, 270, 265) are formed in areas
overlying the sacrificial memory opening fill portions 148. A
photoresist layer can be applied over the second-tier structure
(232, 242, 270, 265), and can be lithographically patterned to form
a same pattern as the pattern of the sacrificial memory opening
fill portions 148 and the sacrificial support opening fill portions
118, i.e., the pattern of the first-tier memory openings 149 and
the first-tier support openings 119. Thus, the lithographic mask
used to pattern the first-tier memory openings 149 and the
first-tier support openings 119 can be used to pattern the
second-tier memory openings 249 and the second-tier support
openings 219. An anisotropic etch can be performed to transfer the
pattern of the lithographically patterned photoresist layer through
the second-tier structure (232, 242, 270, 265). In one embodiment,
the chemistry of the anisotropic etch process used to etch through
the materials of the second-tier alternating stack (232, 242) can
alternate to optimize etching of the alternating material layers in
the second-tier alternating stack (232, 242). The anisotropic etch
can be, for example, a series of reactive ion etches. The patterned
lithographic material stack can be removed, for example, by ashing
after the anisotropic etch process.
[0109] A top surface of an underlying sacrificial memory opening
fill portion 148 can be physically exposed at the bottom of each
second-tier memory opening 249. A top surface of an underlying
sacrificial support opening fill portion 118 can be physically
exposed at the bottom of each second-tier support opening 219.
After the top surfaces of the sacrificial memory opening fill
portions 148 and the sacrificial support opening fill portions 118
are physically exposed, an etch process can be performed, which
removes the sacrificial material of the sacrificial memory opening
fill portions 148 and the sacrificial support opening fill portions
118 selective to the materials of the second-tier alternating stack
(232, 242) and the first-tier alternating stack (132, 142) (e.g.,
C.sub.4F.sub.8/O.sub.2/Ar etch).
[0110] Upon removal of the sacrificial memory opening fill portions
148, each vertically adjoining pair of a second-tier memory opening
249 and a first-tier memory opening 149 forms a continuous cavity
that extends through the first-tier alternating stack (132, 142)
and the second-tier alternating stack (232, 242). Likewise, upon
removal of the sacrificial support opening fill portions 118, each
vertically adjoining pair of a second-tier support opening 219 and
a first-tier support opening 119 forms a continuous cavity that
extends through the first-tier alternating stack (132, 142) and the
second-tier alternating stack (232, 242). The continuous cavities
are herein referred to as memory openings (or inter-tier memory
openings) and support openings (or inter-tier support openings),
respectively. A top surface of the planar semiconductor material
layer 10 can be physically exposed at the bottom of each memory
opening and at the bottom of each support openings. Locations of
steps S in the first-tier alternating stack (132, 142) and the
second-tier alternating stack (232, 242) are illustrated as dotted
lines.
[0111] Referring to FIG. 8, memory opening fill structures 58 are
formed within each memory opening, and support pillar structures 20
are formed within each support opening. The memory opening fill
structures 58 and the support pillar structures 20 can include a
same set of components, and can be formed simultaneously.
[0112] FIGS. 9A-9H provide sequential cross-sectional views of a
memory opening 49 or a support opening (119, 219) during formation
of a memory opening fill structure 58 or a support pillar structure
20. While a structural change in a memory opening 49 is illustrated
in FIGS. 9A-9H, it is understood that the same structural change
occurs in each memory openings 49 and in each of the support
openings (119, 219) during the same set of processing steps.
[0113] Referring to FIG. 9A, a memory opening 49 in the exemplary
device structure of FIG. 14 is illustrated. The memory opening 49
extends through the first-tier structure and the second-tier
structure. Likewise, each support opening (119, 219) extends
through the first-tier structure and the second-tier structure.
[0114] Referring to FIG. 9B, an optional pedestal channel portion
(e.g., an epitaxial pedestal) 11 can be formed at the bottom
portion of each memory opening 49 and each support openings (119,
219), for example, by a selective semiconductor deposition process.
In one embodiment, the pedestal channel portion 11 can be doped
with electrical dopants of the same conductivity type as the planar
semiconductor material layer 10. In one embodiment, at least one
source select gate electrode can be subsequently formed by
replacing each sacrificial material layer (142, 242) located below
the horizontal plane including the top surfaces of the pedestal
channel portions 11 with a respective conductive material layer. A
cavity 49' is present in the unfilled portion of the memory opening
49 (or of the support opening) above the pedestal channel portion
11. In one embodiment, the pedestal channel portion 11 can comprise
single crystalline silicon. In one embodiment, the pedestal channel
portion 11 can have a doping of the same as the conductivity type
of the planar semiconductor material layer 10.
[0115] Referring to FIG. 9C, a stack of layers including a blocking
dielectric layer 52, a charge storage layer 54, a tunneling
dielectric layer 56, and an optional first semiconductor channel
layer 601 can be sequentially deposited in the memory openings
49.
[0116] The blocking dielectric layer 52 can include a single
dielectric material layer or a stack of a plurality of dielectric
material layers. In one embodiment, the blocking dielectric layer
can include a dielectric metal oxide layer consisting essentially
of a dielectric metal oxide. As used herein, a dielectric metal
oxide refers to a dielectric material that includes at least one
metallic element and at least oxygen. The dielectric metal oxide
may consist essentially of the at least one metallic element and
oxygen, or may consist essentially of the at least one metallic
element, oxygen, and at least one non-metallic element such as
nitrogen. In one embodiment, the blocking dielectric layer 52 can
include a dielectric metal oxide having a dielectric constant
greater than 7.9, i.e., having a dielectric constant greater than
the dielectric constant of silicon nitride.
[0117] Non-limiting examples of dielectric metal oxides include
aluminum oxide (Al.sub.2O.sub.3), hafnium oxide (HfO.sub.2),
lanthanum oxide (LaO.sub.2), yttrium oxide (Y.sub.2O.sub.3),
tantalum oxide (Ta.sub.2O.sub.5), silicates thereof, nitrogen-doped
compounds thereof, alloys thereof, and stacks thereof. The
dielectric metal oxide layer can be deposited, for example, by
chemical vapor deposition (CVD), atomic layer deposition (ALD),
pulsed laser deposition (PLD), liquid source misted chemical
deposition, or a combination thereof. The thickness of the
dielectric metal oxide layer can be in a range from 1 nm to 20 nm,
although lesser and greater thicknesses can also be used. The
dielectric metal oxide layer can subsequently function as a
dielectric material portion that blocks leakage of stored
electrical charges to control gate electrodes. In one embodiment,
the blocking dielectric layer 52 includes aluminum oxide. In one
embodiment, the blocking dielectric layer 52 can include multiple
dielectric metal oxide layers having different material
compositions.
[0118] Alternatively or additionally, the blocking dielectric layer
52 can include a dielectric semiconductor compound such as silicon
oxide, silicon oxynitride, silicon nitride, or a combination
thereof. In one embodiment, the blocking dielectric layer 52 can
include silicon oxide. In this case, the dielectric semiconductor
compound of the blocking dielectric layer 52 can be formed by a
conformal deposition method such as low pressure chemical vapor
deposition, atomic layer deposition, or a combination thereof. The
thickness of the dielectric semiconductor compound can be in a
range from 1 nm to 20 nm, although lesser and greater thicknesses
can also be used. Alternatively, the blocking dielectric layer 52
can be omitted, and a backside blocking dielectric layer can be
formed after formation of backside recesses on surfaces of memory
films to be subsequently formed.
[0119] Subsequently, the charge storage layer 54 can be formed. In
one embodiment, the charge storage layer 54 can be a continuous
layer or patterned discrete portions of a charge trapping material
including a dielectric charge trapping material, which can be, for
example, silicon nitride. Alternatively, the charge storage layer
54 can include a continuous layer or patterned discrete portions of
a conductive material such as doped polysilicon or a metallic
material that is patterned into multiple electrically isolated
portions (e.g., floating gates), for example, by being formed
within lateral recesses into sacrificial material layers (142,
242). In one embodiment, the charge storage layer 54 includes a
silicon nitride layer. In one embodiment, the sacrificial material
layers (142, 242) and the insulating layers (132, 232) can have
vertically coincident sidewalls, and the charge storage layer 54
can be formed as a single continuous layer.
[0120] In another embodiment, the sacrificial material layers (142,
242) can be laterally recessed with respect to the sidewalls of the
insulating layers (132, 232), and a combination of a deposition
process and an anisotropic etch process can be used to form the
charge storage layer 54 as a plurality of memory material portions
that are vertically spaced apart. While the present disclosure is
described using an embodiment in which the charge storage layer 54
is a single continuous layer, in other embodiments the charge
storage layer 54 is replaced with a plurality of memory material
portions (which can be charge trapping material portions or
electrically isolated conductive material portions) that are
vertically spaced apart.
[0121] The charge storage layer 54 can be formed as a single charge
storage layer of homogeneous composition, or can include a stack of
multiple charge storage layers. The multiple charge storage layers,
if used, can comprise a plurality of spaced-apart floating gate
material layers that contain conductive materials (e.g., metal such
as tungsten, molybdenum, tantalum, titanium, platinum, ruthenium,
and alloys thereof, or a metal silicide such as tungsten silicide,
molybdenum silicide, tantalum silicide, titanium silicide, nickel
silicide, cobalt silicide, or a combination thereof) and/or
semiconductor materials (e.g., polycrystalline or amorphous
semiconductor material including at least one elemental
semiconductor element or at least one compound semiconductor
material). Alternatively or additionally, the charge storage layer
54 may comprise an insulating charge trapping material, such as one
or more silicon nitride segments. Alternatively, the charge storage
layer 54 may comprise conductive nanoparticles such as metal
nanoparticles, which can be, for example, ruthenium nanoparticles.
The charge storage layer 54 can be formed, for example, by chemical
vapor deposition (CVD), atomic layer deposition (ALD), physical
vapor deposition (PVD), or any suitable deposition technique for
storing electrical charges therein. The thickness of the charge
storage layer 54 can be in a range from 2 nm to 20 nm, although
lesser and greater thicknesses can also be used.
[0122] The tunneling dielectric layer 56 includes a dielectric
material through which charge tunneling can be performed under
suitable electrical bias conditions. The charge tunneling may be
performed through hot-carrier injection or by Fowler-Nordheim
tunneling induced charge transfer depending on the mode of
operation of the monolithic three-dimensional NAND string memory
device to be formed. The tunneling dielectric layer 56 can include
silicon oxide, silicon nitride, silicon oxynitride, dielectric
metal oxides (such as aluminum oxide and hafnium oxide), dielectric
metal oxynitride, dielectric metal silicates, alloys thereof,
and/or combinations thereof. In one embodiment, the tunneling
dielectric layer 56 can include a stack of a first silicon oxide
layer, a silicon oxynitride layer, and a second silicon oxide
layer, which is commonly known as an ONO stack. In one embodiment,
the tunneling dielectric layer 56 can include a silicon oxide layer
that is substantially free of carbon or a silicon oxynitride layer
that is substantially free of carbon. The thickness of the
tunneling dielectric layer 56 can be in a range from 2 nm to 20 nm,
although lesser and greater thicknesses can also be used.
[0123] The optional first semiconductor channel layer 601 includes
a semiconductor material such as at least one elemental
semiconductor material, at least one III-V compound semiconductor
material, at least one II-VI compound semiconductor material, at
least one organic semiconductor material, or other semiconductor
materials known in the art. In one embodiment, the first
semiconductor channel layer 601 includes amorphous silicon or
polysilicon. The first semiconductor channel layer 601 can be
formed by a conformal deposition method such as low pressure
chemical vapor deposition (LPCVD). The thickness of the first
semiconductor channel layer 601 can be in a range from 2 nm to 10
nm, although lesser and greater thicknesses can also be used. A
cavity 49' is formed in the volume of each memory opening 49 that
is not filled with the deposited material layers (52, 54, 56,
601).
[0124] Referring to FIG. 9D, the optional first semiconductor
channel layer 601, the tunneling dielectric layer 56, the charge
storage layer 54, the blocking dielectric layer 52 are sequentially
anisotropically etched using at least one anisotropic etch process.
The portions of the first semiconductor channel layer 601, the
tunneling dielectric layer 56, the charge storage layer 54, and the
blocking dielectric layer 52 located above the top surface of the
second insulating cap layer 270 can be removed by the at least one
anisotropic etch process. Further, the horizontal portions of the
first semiconductor channel layer 601, the tunneling dielectric
layer 56, the charge storage layer 54, and the blocking dielectric
layer 52 at a bottom of each cavity 49' can be removed to form
openings in remaining portions thereof. Each of the first
semiconductor channel layer 601, the tunneling dielectric layer 56,
the charge storage layer 54, and the blocking dielectric layer 52
can be etched by a respective anisotropic etch process using a
respective etch chemistry, which may, or may not, be the same for
the various material layers.
[0125] Each remaining portion of the first semiconductor channel
layer 601 can have a tubular configuration. The charge storage
layer 54 can comprise a charge trapping material or a floating gate
material. In one embodiment, each charge storage layer 54 can
include a vertical stack of charge storage regions that store
electrical charges upon programming. In one embodiment, the charge
storage layer 54 can be a charge storage layer in which each
portion adjacent to the sacrificial material layers (142, 242)
constitutes a charge storage region.
[0126] A surface of the pedestal channel portion 11 (or a surface
of the planar semiconductor material layer 10 in case the pedestal
channel portions 11 are not used) can be physically exposed
underneath the opening through the first semiconductor channel
layer 601, the tunneling dielectric layer 56, the charge storage
layer 54, and the blocking dielectric layer 52. Optionally, the
physically exposed semiconductor surface at the bottom of each
cavity 49' can be vertically recessed so that the recessed
semiconductor surface underneath the cavity 49' is vertically
offset from the topmost surface of the pedestal channel portion 11
(or of the semiconductor material layer 10 in case pedestal channel
portions 11 are not used) by a recess distance. A tunneling
dielectric layer 56 is located over the charge storage layer 54. A
set of a blocking dielectric layer 52, a charge storage layer 54,
and a tunneling dielectric layer 56 in a memory opening 49
constitutes a memory film 50, which includes a plurality of charge
storage regions (comprising the charge storage layer 54) that are
insulated from surrounding materials by the blocking dielectric
layer 52 and the tunneling dielectric layer 56. In one embodiment,
the first semiconductor channel layer 601, the tunneling dielectric
layer 56, the charge storage layer 54, and the blocking dielectric
layer 52 can have vertically coincident sidewalls.
[0127] Referring to FIG. 9E, a second semiconductor channel layer
602 can be deposited directly on the semiconductor surface of the
pedestal channel portion 11 or the semiconductor material layer 10
if the pedestal channel portion 11 is omitted, and directly on the
first semiconductor channel layer 601. The second semiconductor
channel layer 602 includes a semiconductor material such as at
least one elemental semiconductor material, at least one III-V
compound semiconductor material, at least one II-VI compound
semiconductor material, at least one organic semiconductor
material, or other semiconductor materials known in the art. In one
embodiment, the second semiconductor channel layer 602 includes
amorphous silicon or polysilicon. The second semiconductor channel
layer 602 can be formed by a conformal deposition method such as
low pressure chemical vapor deposition (LPCVD). The thickness of
the second semiconductor channel layer 602 can be in a range from 2
nm to 10 nm, although lesser and greater thicknesses can also be
used. The second semiconductor channel layer 602 may partially fill
the cavity 49' in each memory opening, or may fully fill the cavity
in each memory opening.
[0128] The materials of the first semiconductor channel layer 601
and the second semiconductor channel layer 602 are collectively
referred to as a semiconductor channel material. In other words,
the semiconductor channel material is a set of all semiconductor
material in the first semiconductor channel layer 601 and the
second semiconductor channel layer 602.
[0129] Referring to FIG. 9F, in case the cavity 49' in each memory
opening is not completely filled by the second semiconductor
channel layer 602, a dielectric core layer 62L can be deposited in
the cavity 49' to fill any remaining portion of the cavity 49'
within each memory opening. The dielectric core layer 62L includes
a dielectric material such as silicon oxide or organosilicate
glass. The dielectric core layer 62L can be deposited by a
conformal deposition method such as low pressure chemical vapor
deposition (LPCVD), or by a self-planarizing deposition process
such as spin coating.
[0130] Referring to FIG. 9G, the horizontal portion of the
dielectric core layer 62L can be removed, for example, by a recess
etch from above the top surface of the second insulating cap layer
270. Each remaining portion of the dielectric core layer 62L
constitutes a dielectric core 62. Further, the horizontal portion
of the second semiconductor channel layer 602 located above the top
surface of the second insulating cap layer 270 can be removed by a
planarization process, which can use a recess etch or chemical
mechanical planarization (CMP). Each remaining portion of the
second semiconductor channel layer 602 can be located entirety
within a memory opening 49 or entirely within a support opening
(119, 219).
[0131] Each adjoining pair of a first semiconductor channel layer
601 and a second semiconductor channel layer 602 can collectively
form a vertical semiconductor channel 60 through which electrical
current can flow when a vertical NAND device including the vertical
semiconductor channel 60 is turned on. A tunneling dielectric layer
56 is surrounded by a charge storage layer 54, and laterally
surrounds a portion of the vertical semiconductor channel 60. Each
adjoining set of a blocking dielectric layer 52, a charge storage
layer 54, and a tunneling dielectric layer 56 collectively
constitute a memory film 50, which can store electrical charges
with a macroscopic retention time. In some embodiments, a blocking
dielectric layer 52 may not be present in the memory film 50 at
this step, and a blocking dielectric layer may be subsequently
formed after formation of backside recesses. As used herein, a
macroscopic retention time refers to a retention time suitable for
operation of a memory device as a permanent memory device such as a
retention time in excess of 24 hours.
[0132] Referring to FIG. 9H, the top surface of each dielectric
core 62 can be further recessed within each memory opening, for
example, by a recess etch to a depth that is located between the
top surface of the second insulating cap layer 270 and the bottom
surface of the second insulating cap layer 270. Drain regions 63
can be formed by depositing a doped semiconductor material within
each recessed region above the dielectric cores 62. The drain
regions 63 can have a doping of a second conductivity type that is
the opposite of the first conductivity type. For example, if the
first conductivity type is p-type, the second conductivity type is
n-type, and vice versa. The dopant concentration in the drain
regions 63 can be in a range from 5.0.times.10.sup.19/cm.sup.3 to
2.0.times.10.sup.21/cm.sup.3, although lesser and greater dopant
concentrations can also be used. The doped semiconductor material
can be, for example, doped polysilicon. Excess portions of the
deposited semiconductor material can be removed from above the top
surface of the second insulating cap layer 270, for example, by
chemical mechanical planarization (CMP) or a recess etch to form
the drain regions 63.
[0133] Each combination of a memory film 50 and a vertical
semiconductor channel 60 (which is a vertical semiconductor
channel) within a memory opening 49 constitutes a memory stack
structure 55. The memory stack structure 55 is a combination of a
semiconductor channel, a tunneling dielectric layer, a plurality of
memory elements comprising portions of the charge storage layer 54,
and an optional blocking dielectric layer 52. Each combination of a
pedestal channel portion 11 (if present), a memory stack structure
55, a dielectric core 62, and a drain region 63 within a memory
opening 49 constitutes a memory opening fill structure 58. Each
combination of a pedestal channel portion 11 (if present), a memory
film 50, a vertical semiconductor channel 60, a dielectric core 62,
and a drain region 63 within each support opening (119, 219) fills
the respective support openings (119, 219), and constitutes a
support pillar structure 20.
[0134] The first-tier structure (132, 142, 170, 165), the
second-tier structure (232, 242, 270, 265), the inter-tier
dielectric layer 180, the memory opening fill structures 58, and
the support pillar structures 20 collectively constitute a
memory-level assembly. The memory-level assembly is formed over the
planar semiconductor material layer 10 such that the planar
semiconductor material layer 10 includes horizontal semiconductor
channels electrically connected to vertical semiconductor channels
60 within the memory stack structures 55.
[0135] Referring to FIGS. 10A and 10B, a first contact level
dielectric layer 280 can be formed over the memory-level assembly.
The first contact level dielectric layer 280 is formed at a contact
level through which various contact via structures are subsequently
formed to the drain regions 63 and the various electrically
conductive layers that replaces the sacrificial material layers
(142, 242) in subsequent processing steps.
[0136] First through-stack via cavities 585 can be formed with the
memory array region 100, for example, by applying and patterning of
a photoresist layer to form openings therein, and by
anisotropically etching the portions of the first contact level
dielectric layer 280, the alternating stacks (132, 146, 232, 246),
and the at least one second dielectric material layer 768 that
underlie the openings in the photoresist layer. In one embodiment,
each of the first through-stack via cavities 585 can be formed
within a respective three-dimensional memory array so that each
first through-stack via cavities 585 is laterally surrounded by
memory opening fill structures 58. In one embodiment, one or more
of the first through-stack via cavities 585 can be formed through
the drain-select-level shallow trench isolation structures 72, as
shown in FIG. 10B. However, other locations may also be selected.
In one embodiment, the first-through-stack via cavities 585 can be
formed within areas of openings in the planar semiconductor
material layer 10 and the optional planar conductive material layer
6. The bottom surface of each first through-stack via cavity 585
can be formed at, or above, the silicon nitride layer 766. In one
embodiment, the silicon nitride layer 766 can be used as an etch
stop layer during the anisotropic etch process that forms the first
through-stack via cavities. In this case, the bottom surface of
each first through-stack via cavity 585 can be formed at the
silicon nitride layer 766, and the silicon nitride layer 766 can be
physically exposed at the bottom of each first through-stack via
cavity 585.
[0137] Referring to FIG. 11, a dielectric material is deposited in
the first through-stack via cavities 585. The dielectric material
can include a silicon-oxide based material such as undoped silicate
glass, doped silicate glass, or a flowable oxide material. The
dielectric material can be deposited by a conformal deposition
method such as chemical vapor deposition or spin coating. A void
may be formed within an unfilled portion of each first
through-stack via cavity 585. Excess portion of the deposited
dielectric material may be removed from above a horizontal plane
including the top surface of the first contact level dielectric
layer 280, for example, by chemical mechanical planarization or a
recess etch. Each remaining dielectric material portion filling a
respective one of the first through-stack via cavity 585
constitutes a through-stack insulating material portion 584. The
through-stack insulating material portions 584 contact sidewalls of
the alternating stacks (132, 146, 232, 246), and may contact the
silicon nitride layer 766.
[0138] Referring to FIGS. 12A and 12B, backside contact trenches 79
are subsequently formed through the first contact level dielectric
layer 280 and the memory-level assembly. For example, a photoresist
layer can be applied and lithographically patterned over the first
contact level dielectric layer 280 to form elongated openings that
extend along a first horizontal direction hd1. An anisotropic etch
is performed to transfer the pattern in the patterned photoresist
layer through the first contact level dielectric layer 280 and the
memory-level assembly to a top surface of the planar semiconductor
material layer 10. The photoresist layer can be subsequently
removed, for example, by ashing.
[0139] The backside contact trenches 79 extend along the first
horizontal direction hd1, and thus, are elongated along the first
horizontal direction hd1. The backside contact trenches 79 can be
laterally spaced one from another along a second horizontal
direction hd2, which can be perpendicular to the first horizontal
direction hd1. The backside contact trenches 79 can extend through
the memory array region (e.g., a memory plane) 100 and the word
line contact via region 200. The first subset of the backside
contact trenches 79 laterally divides the memory-level assembly
(e.g., into memory blocks).
[0140] Referring to FIGS. 13A and 13B, an etchant that selectively
etches the materials of the first and second sacrificial material
layers (142, 242) with respect to the materials of the first and
second insulating layers (132, 232), the first and second
insulating cap layers (170, 270), and the material of the outermost
layer of the memory films 50 can be introduced into the backside
contact trenches 79, for example, using an isotropic etch process.
First backside recesses are formed in volumes from which the first
sacrificial material layers 142 are removed. Second backside
recesses are formed in volumes from which the second sacrificial
material layers 242 are removed. In one embodiment, the first and
second sacrificial material layers (142, 242) can include silicon
nitride, and the materials of the first and second insulating
layers (132, 232), can be silicon oxide. In another embodiment, the
first and second sacrificial material layers (142, 242) can include
a semiconductor material such as germanium or a silicon-germanium
alloy, and the materials of the first and second insulating layers
(132, 232) can be selected from silicon oxide and silicon
nitride.
[0141] The isotropic etch process can be a wet etch process using a
wet etch solution, or can be a gas phase (dry) etch process in
which the etchant is introduced in a vapor phase into the backside
contact trench 79. For example, if the first and second sacrificial
material layers (142, 242) include silicon nitride, the etch
process can be a wet etch process in which the first exemplary
structure is immersed within a wet etch tank including phosphoric
acid, which etches silicon nitride selective to silicon oxide,
silicon, and various other materials used in the art. In case the
sacrificial material layers (142, 242) comprise a semiconductor
material, a wet etch process (which may use a wet etchant such as a
KOH solution) or a dry etch process (which may include gas phase
HCl) may be used.
[0142] Each of the first and second backside recesses can be a
laterally extending cavity having a lateral dimension that is
greater than the vertical extent of the cavity. In other words, the
lateral dimension of each of the first and second backside recesses
can be greater than the height of the respective backside recess. A
plurality of first backside recesses can be formed in the volumes
from which the material of the first sacrificial material layers
142 is removed. A plurality of second backside recesses can be
formed in the volumes from which the material of the second
sacrificial material layers 242 is removed. Each of the first and
second backside recesses can extend substantially parallel to the
top surface of the substrate 8. A backside recess can be vertically
bounded by a top surface of an underlying insulating layer (132 or
232) and a bottom surface of an overlying insulating layer (132 or
232). In one embodiment, each of the first and second backside
recesses can have a uniform height throughout.
[0143] In one embodiment, a sidewall surface of each pedestal
channel portion 11 can be physically exposed at each bottommost
first backside recess after removal of the first and second
sacrificial material layers (142, 242). Further, a top surface of
the planar semiconductor material layer 10 can be physically
exposed at the bottom of each backside contact trench 79. An
annular dielectric spacer (not shown) can be formed around each
pedestal channel portion 11 by oxidation of a physically exposed
peripheral portion of the pedestal channel portions 11. Further, a
semiconductor oxide potion (not shown) can be formed from each
physically exposed surface portion of the planar semiconductor
material layer 10 concurrently with formation of the annular
dielectric spacers.
[0144] A backside blocking dielectric layer (not shown) can be
optionally deposited in the backside recesses and the backside
contact trenches 79 and over the first contact level dielectric
layer 280. The backside blocking dielectric layer can be deposited
on the physically exposed portions of the outer surfaces of the
memory stack structures 55. The backside blocking dielectric layer
includes a dielectric material such as a dielectric metal oxide,
silicon oxide, or a combination thereof. If used, the backside
blocking dielectric layer can be formed by a conformal deposition
process such as atomic layer deposition or chemical vapor
deposition. The thickness of the backside blocking dielectric layer
can be in a range from 1 nm to 60 nm, although lesser and greater
thicknesses can also be used.
[0145] At least one conductive material can be deposited in the
plurality of backside recesses, on the sidewalls of the backside
contact trench 79, and over the first contact level dielectric
layer 280. The at least one conductive material can include at
least one metallic material, i.e., an electrically conductive
material that includes at least one metallic element.
[0146] A plurality of first electrically conductive layers 146 can
be formed in the plurality of first backside recesses, a plurality
of second electrically conductive layers 246 can be formed in the
plurality of second backside recesses, and a continuous metallic
material layer (not shown) can be formed on the sidewalls of each
backside contact trench 79 and over the first contact level
dielectric layer 280. Thus, the first and second sacrificial
material layers (142, 242) can be replaced with the first and
second conductive material layers (146, 246), respectively.
Specifically, each first sacrificial material layer 142 can be
replaced with an optional portion of the backside blocking
dielectric layer and a first electrically conductive layer 146, and
each second sacrificial material layer 242 can be replaced with an
optional portion of the backside blocking dielectric layer and a
second electrically conductive layer 246. A backside cavity is
present in the portion of each backside contact trench 79 that is
not filled with the continuous metallic material layer.
[0147] The metallic material can be deposited by a conformal
deposition method, which can be, for example, chemical vapor
deposition (CVD), atomic layer deposition (ALD), electroless
plating, electroplating, or a combination thereof. The metallic
material can be an elemental metal, an intermetallic alloy of at
least two elemental metals, a conductive nitride of at least one
elemental metal, a conductive metal oxide, a conductive doped
semiconductor material, a conductive metal-semiconductor alloy such
as a metal silicide, alloys thereof, and combinations or stacks
thereof. Non-limiting exemplary metallic materials that can be
deposited in the backside recesses include tungsten, tungsten
nitride, titanium, titanium nitride, tantalum, tantalum nitride,
cobalt, and ruthenium. In one embodiment, the metallic material can
comprise a metal such as tungsten and/or metal nitride. In one
embodiment, the metallic material for filling the backside recesses
can be a combination of titanium nitride layer and a tungsten fill
material. In one embodiment, the metallic material can be deposited
by chemical vapor deposition or atomic layer deposition.
[0148] Residual conductive material can be removed from inside the
backside contact trenches 79. Specifically, the deposited metallic
material of the continuous metallic material layer can be etched
back from the sidewalls of each backside contact trench 79 and from
above the first contact level dielectric layer 280, for example, by
an anisotropic or isotropic etch. Each remaining portion of the
deposited metallic material in the first backside recesses
constitutes a first electrically conductive layer 146. Each
remaining portion of the deposited metallic material in the second
backside recesses constitutes a second electrically conductive
layer 246. Each electrically conductive layer (146, 246) can be a
conductive line structure.
[0149] A subset of the second electrically conductive layers 246
located at the levels of the drain-select-level shallow trench
isolation structures 72 constitutes drain select gate electrodes. A
subset of the first electrically conductive layers 146 located at
each level of the annular dielectric spacers (not shown)
constitutes source select gate electrodes. A subset of the
electrically conductive layer (146, 246) located between the drain
select gate electrodes and the source select gate electrodes can
function as combinations of a control gate and a word line located
at the same level. The control gate electrodes within each
electrically conductive layer (146, 246) are the control gate
electrodes for a vertical memory device including the memory stack
structure 55.
[0150] Each of the memory stack structures 55 comprises a vertical
stack of memory elements located at each level of the electrically
conductive layers (146, 246). A subset of the electrically
conductive layers (146, 246) can comprise word lines for the memory
elements. The semiconductor devices in the underlying peripheral
device region 700 can comprise word line switch devices configured
to control a bias voltage to respective word lines. The
memory-level assembly is located over the substrate semiconductor
layer 9. The memory-level assembly includes at least one
alternating stack (132, 146, 232, 246) and memory stack structures
55 vertically extending through the at least one alternating stack
(132, 146, 232, 246). Each of the at least one an alternating stack
(132, 146, 232, 246) includes alternating layers of respective
insulating layers (132 or 232) and respective electrically
conductive layers (146 or 246). The at least one alternating stack
(132, 146, 232, 246) comprises staircase regions that include
terraces in which each underlying electrically conductive layer
(146, 246) extends farther along the first horizontal direction hd1
than any overlying electrically conductive layer (146, 246) in the
memory-level assembly.
[0151] Dopants of a second conductivity type, which is the opposite
of the first conductivity type of the planar semiconductor material
layer 10, can be implanted into a surface portion of the planar
semiconductor material layer 10 to form a source region 61
underneath the bottom surface of each backside contact trench 79.
An insulating spacer 74 including a dielectric material can be
formed at the periphery of each backside contact trench 79, for
example, by deposition of a conformal insulating material (such as
silicon oxide) and a subsequent anisotropic etch. The first contact
level dielectric layer 280 may be thinned due to a collateral etch
during the anisotropic etch that removes the vertical portions of
horizontal portions of the deposited conformal insulating material.
A horizontal semiconductor channel 59 can be provided between each
source region 61 and a neighboring group of pedestal channel
portion 11.
[0152] A conformal insulating material layer can be deposited in
the backside contact trenches 79, and can be anisotropically etched
to form insulating spacers 74. The insulating spacers 74 include an
insulating material such as silicon oxide, silicon nitride, and/or
a dielectric metal oxide. A cavity laterally extending along the
first horizontal direction hd1 is present within each insulating
spacer 74.
[0153] A backside contact via structure can be formed in the
remaining volume of each backside contact trench 79, for example,
by deposition of at least one conductive material and removal of
excess portions of the deposited at least one conductive material
from above a horizontal plane including the top surface of the
first contact level dielectric layer 280 by a planarization process
such as chemical mechanical planarization or a recess etch. The
backside contact via structures are electrically insulated in all
lateral directions, and is laterally elongated along the first
horizontal direction hd1. As such, the backside contact via
structures are herein referred to as laterally-elongated contact
via structures 76. As used herein, a structure is "laterally
elongated" if the maximum lateral dimension of the structure along
a first horizontal direction is greater than the maximum lateral
dimension of the structure along a second horizontal direction that
is perpendicular to the first horizontal direction at least by a
factor of 5.
[0154] Optionally, each laterally-elongated contact via structure
76 may include multiple backside contact via portions such as a
lower backside contact via portion and an upper backside contact
via portion. In an illustrative example, the lower backside contact
via portion can include a doped semiconductor material (such as
doped polysilicon), and can be formed by depositing the doped
semiconductor material layer to fill the backside contact trenches
79 and removing the deposited doped semiconductor material from
upper portions of the backside contact trenches 79. The upper
backside contact via portion can include at least one metallic
material (such as a combination of a TiN liner and a W fill
material), and can be formed by depositing the at least one
metallic material above the lower backside contact via portions,
and removing an excess portion of the at least one metallic
material from above the horizontal plane including the top surface
of the first contact level dielectric layer 280. The first contact
level dielectric layer 280 can be thinned and removed during a
latter part of the planarization process, which may use chemical
mechanical planarization (CMP), a recess etch, or a combination
thereof. Each laterally-elongated contact via structure 76 can be
formed through the memory-level assembly and on a respective source
region 61. The top surface of each laterally-elongated contact via
structure 76 can located above a horizontal plane including the top
surfaces of the memory stack structures 55.
[0155] Referring to FIGS. 14A and 14B, a second contact level
dielectric layer 282 can be optionally formed over the first
contact level dielectric layer 280. The second contact level
dielectric layer 282 includes a dielectric material such as silicon
oxide or silicon nitride. The thickness of the second contact level
dielectric layer 282 can be in a range from 30 nm to 300 nm,
although lesser and greater thicknesses can also be used.
[0156] Drain contact via structures 88 contacting the drain regions
63 can extend through the contact level dielectric layers (280,
282) and the second insulating cap layer 270 in the memory array
region 100. A source connection via structure 91 can extend through
the contact level dielectric layers (280, 282) to provide
electrical connection to the laterally-elongated contact via
structures 76.
[0157] Various contact via structures can be formed through the
contact level dielectric layers (280, 282) and the retro-stepped
dielectric material portions (165, 265). For example, word line
contact via structures 86 can be formed in the word line contact
region 200. A subset of the word line contact via structures 86
contacting the second electrically conductive layers 246 extends
through the second-tier retro-stepped dielectric material portion
265 in the word line contact region 200, and does not extend
through the first-tier retro-stepped dielectric material portion
165. Another subset of the word line contact via structures 86
contacting the first electrically conductive layers 146 extends
through the second-tier retro-stepped dielectric material portion
265 and through the first-tier retro-stepped dielectric material
portion 165 in the word line contact region 200.
[0158] Referring to FIG. 15, a photoresist layer is applied over
the second contact level dielectric layer 282, and is
lithographically patterned to form openings that overlie the
through-stack insulating material portions 584 in the memory array
region 100, and additional memory openings in which layers of the
alternating stacks (132, 146, 232, 246) are absent, i.e., in a
peripheral region 400 located outside the memory array region 100
and the contact region 200. For example, the peripheral region may
surround memory array region 100 and/or the contact region 200
and/or may be located on one or more sides of the memory array
region 100 and/or the contact region 200. In one embodiment, the
areas of the openings in the memory array region 100 may be
entirely within the areas of the through-stack insulating material
portions 584. In one embodiment, the areas of the openings outside
the areas of the memory array region 100 and the contact region 200
(e.g., the areas of the openings in the peripheral region 400) may
be within areas of openings in the planar semiconductor material
layer 10 and the optional planar conductive material layer 6.
[0159] Via cavities (487, 587) are formed by an anisotropic etch
process that transfers the pattern of the openings in the
photoresist layer to the top surfaces of the topmost lower metal
line structures 788. Specifically, second through-stack via
cavities 587 are formed through the through-stack insulating
material portions 584 such that a remaining portion of each
through-stack insulating material portion 584 after formation of
the second through-stack via cavities 587 constitutes a
through-stack insulating spacer 586. In one embodiment, the second
through-stack via cavities 587 can be formed using an anisotropic
etch process that includes a first etch step that etches the
dielectric material of the through-stack insulating material
portions 584 selective to silicon nitride, and a second etch step
that etches a physically exposed portion of the silicon nitride
layer 766. The first etch step uses the silicon nitride layer 766
as an etch stop layer. Thus, the via cavities 587 are etched
through the insulating material (e.g., silicon oxide) of the
through-stack insulating material portions 584, rather than through
the electrically conductive layers (e.g., tungsten and/or titanium
nitride layers) (146, 246). Etching silicon oxide of portions 584
is easier than etching refractory metal and/or refractory metal
nitride layers (146, 246). Furthermore, etching the opening 585
through the alternating stack of insulating layers (132, 232) such
as silicon oxide, and sacrificial material layers (142, 242) such
as silicon nitride before forming the electrically conductive
layers (146, 246) easier than etching the opening through the
electrically conductive layers (146, 246). Thus, by forming and
filling the openings 585 with an insulating material (e.g., with
portions 584) before replacing the sacrificial material layers with
the electrically conductive layers makes it easier to subsequently
form the second through-stack via cavities 587 through the
insulating material after replacing the sacrificial material layers
with the electrically conductive layers, instead of etching the
cavities 587 through the electrically conductive layers.
[0160] Each through-stack insulating spacer 586 can have a
substantially cylindrical shape. Depending on the lithographic
alignment of the pattern of the openings in the photoresist layer
and the through-stack insulating material portions 584, the second
through-stack via cavities 587 may, or may not, have a lateral
offset from the geometrical center of a respective one of the
through-stack insulating material portion 584. Thus, the
through-stack insulating spacers 586 may, or may not, have a
uniform thickness around the vertical axis passing through the
geometrical center thereof as a function of an azimuthal angle. In
other words, the through-stack insulating spacers 586 may have the
same thickness irrespective of the azimuthal angle in the case of
perfect lithographic alignment, or may have an azimuthally-varying
thickness that is measured between the inner sidewall and the outer
sidewall of a respective through-stack insulating spacer 586. The
second through-stack via cavities 587 are formed through the
silicon nitride layer 766. A top surface of a lower metal line
structure (such as a topmost lower metal liner structure 788) can
be physically exposed at the bottom of each second through-stack
via cavity 587.
[0161] Further, through-dielectric via cavities 487 can be formed
in the peripheral region through the contact level dielectric
layers (280, 282), the retro-stepped dielectric material portions
(165, 265), the at least one second dielectric material layer 768,
and the silicon nitride layer 766 to a top surface of a respective
one of the topmost lower metal liner structures 788. The
through-dielectric via cavities 487 can be formed concurrently with
formation of the second through-stack via cavities 587 using a same
photolithography and anisotropic etch processes. In one embodiment,
the through-dielectric via cavities 487 can pass through openings
in the planar semiconductor material layer 10 and the optional
planar conductive material layer 6. The photoresist layer can be
removed, for example, by ashing.
[0162] Referring to FIGS. 16A and 16B, at least one conductive
material can be simultaneously deposited in the second
through-stack via cavities 587 and the through-dielectric via
cavities 487. The at least one conductive material can include, for
example, a metallic nitride liner (such as a TiN liner) and a metal
fill material (such as W, Cu, Al, Ru, or Co). Excess portions of
the at least one conductive material can be removed from outside
the second through-stack via cavities 587 and the
through-dielectric via cavities 487. For example, excess portions
of the at least one conductive material can be removed from above
the top surface of the second contact level dielectric layer 282 by
a planarization process such as chemical mechanical planarization
and/or a recess etch. Each remaining portion of the at least one
conductive material in the second through-stack via cavities 587
constitutes a through-stack contact via structure 588 that contacts
a top surface of a respective one of the topmost lower metal line
structure 788. Each remaining portion of the at least one
conductive material in the through-dielectric via cavities 487 that
contacts a top surface of a respective one of the topmost lower
metal line structure 788 constitutes a through-dielectric contact
via structure 488. Each through-stack contact via structure 588 can
be formed within a respective second through-stack via cavity 587
and inside a respective through-stack insulating spacer 586. Thus,
through-stack contact via structures 588 are formed through the
alternating stacks (132, 146, 232, 246), the at least one second
dielectric material layer 768, and the silicon nitride layer 766,
and directly on a top surface of a lower metal line structure (such
as a topmost lower metal line structure 788). In this embodiment,
each through-stack contact via structure 588 extends through the
second contact level dielectric layer 282 and the silicon nitride
layer (i.e., the hydrogen barrier layer) 766, while the respective
through-stack insulating spacer 586 does not extend through the
second contact level dielectric layer 282 and the silicon nitride
layer (i.e., the hydrogen barrier layer) 766.
[0163] Referring to FIG. 17, at least one upper interconnect level
dielectric layer 284 can be formed over the contact level
dielectric layers (280, 282). Various upper interconnect level
metal structures can be formed in the at least one upper
interconnect level dielectric layer 284. For example, the various
upper interconnect level metal structures can include line level
metal interconnect structures (96, 98, 99). The line level metal
interconnect structures (96, 98, 99) can include first upper metal
line structures 99 that contact a top surfaces of a respective one
of the through-stack contact via structures 588, second upper metal
line structures 96 that contact a top surface of a respective one
of the through-dielectric contact via structures 488, and bit lines
98 that contact a respective one of the drain contact via
structures 88 and extend along the second horizontal direction
(e.g., bit line direction) hd2 and perpendicular to the first
horizontal direction (e.g., word line direction) hd1. In one
embodiment, a subset of the first upper metal line structures 99
may be used to provide electrical connections through the source
connection via structures 91 described above to the
laterally-elongated contact via structures 76 and to the source
regions 61. In one embodiment, a subset of the second upper metal
line structures 96 may contact, or are electrically coupled to, a
respective pair of a word line contact via structure 86 and a
through-dielectric contact via structure 488.
[0164] At least a subset of the upper metal interconnect structures
(which include the line level metal interconnect structures (96,
98, 99)) is formed over the three-dimensional memory array. The
upper metal interconnect structures comprise an upper metal line
structure (such as a first upper metal line structure 99) that is
formed directly on a through-stack contact via structure 588. A set
of conductive structures including the through-stack contact via
structure 588 and a lower metal line structure (such as a topmost
lower metal line structure 788) provides an electrically conductive
path between the at least one semiconductor device 710 on the
substrate semiconductor layer and the upper metal line structure. A
through-dielectric contact via structure 488 can be provided
through the retro-stepped dielectric material portions (165, 265),
the at least one second dielectric material layer 768, and the
silicon nitride layer 766 and directly on a top surface of another
lower metal line structure (e.g., another topmost lower metal line
structure 788) of the lower metal interconnect structures 780.
[0165] In one embodiment, the semiconductor structure further
comprises: a terrace region including stepped surfaces of layers of
the alternating stack (132, 232, 146, 246); a retro-stepped
dielectric material portion (165 or 265) overlying the stepped
surfaces and located at levels of the alternating stack (132, 232,
146, 246) and above the at least one second dielectric material
layer 768; and a through-dielectric contact via structure 488
vertically extending through the retro-stepped dielectric material
portion (165 or 265), the at least one second dielectric material
layer 768, and the silicon nitride layer 766 and contacting a top
surface of another lower metal line structure 788 of the lower
metal interconnect structures 780. In one embodiment, a
through-stack contact via structure 588 is laterally spaced from
each layer within the alternating stack (132, 232, 146, 246) by a
through-stack insulating spacer 586. Alternatively, the
through-dielectric contact via structure 488 directly contacts the
retro-stepped dielectric material portion (165 or 265) and the at
least one second dielectric material layer 768 (as illustrated in
FIG. 17).
[0166] In one embodiment, the memory stack structures 55 can
comprise memory elements of a vertical NAND device. The
electrically conductive layers (146, 246) can comprise, or can be
electrically connected to, a respective word line of the vertical
NAND device. The substrate 8 can comprises a silicon substrate. The
vertical NAND device can comprise an array of monolithic
three-dimensional NAND strings over the silicon substrate. At least
one memory cell in a first device level of the array of monolithic
three-dimensional NAND strings is located over another memory cell
in a second device level of the array of monolithic
three-dimensional NAND strings. The silicon substrate can contain
an integrated circuit comprising the word line driver circuit and a
bit line driver circuit for the memory device. The array of
monolithic three-dimensional NAND strings can comprise a plurality
of semiconductor channels, wherein at least one end portion (such
as a vertical semiconductor channel 60) of each of the plurality of
semiconductor channels (59, 11, 60) extends substantially
perpendicular to a top surface of the semiconductor substrate 8, a
plurality of charge storage elements (comprising portions of the
memory material layer 54 located at each word line level), each
charge storage element located adjacent to a respective one of the
plurality of semiconductor channels (59, 11, 60), and a plurality
of control gate electrodes (comprising a subset of the electrically
conductive layers (146, 246) having a strip shape extending
substantially parallel to the top surface of the substrate 8 (e.g.,
along the first horizontal direction hd1), the plurality of control
gate electrodes comprise at least a first control gate electrode
located in the first device level and a second control gate
electrode located in the second device level.
[0167] The first exemplary structure of FIG. 17 can be a memory and
logic die 1000, which can be subsequently bonded to a logic die
using copper-to-copper bonding. Generally speaking, a memory and
logic die 1000 can include a three-dimensional memory device and
peripheral logic devices 710 located in the peripheral device
region 700 used driver circuit devices for the three-dimensional
memory device. The peripheral logic devices 710 (i.e., driver
circuit devices) can include word line decoder circuitry, word line
switching circuitry, bit line decoder circuitry, bit line sensing
and/or switching circuitry, power supply/distribution circuitry,
data buffer and/or latch, or any other semiconductor circuitry that
can be implemented outside a memory array structure for a memory
device. For example, the peripheral logic devices 710 can include
word line drivers that drive a respective one of the word lines
(146, 246), bit line drivers that drive a respective one of the bit
lines 98, and a sense amplifier circuitry electrically connected to
the bit lines 98 and configured to read a state of selected memory
elements within the three-dimensional array of memory elements.
[0168] The three-dimensional memory device includes a
three-dimensional array of memory elements (such as portions of
charge storage layers 54 in the memory film 50 located at levels of
the electrically conductive layers (146, 246) and a vertical
semiconductor channel 60). The three-dimensional memory device can
include word lines comprising the electrically conductive layers
(146, 246) and bit lines 98 for individually accessing the memory
elements within the three-dimensional array of memory elements. The
line level metal interconnect structures (96, 98, 99) may include
interconnection bonding pads attached to, or integrated into, one
or more of the first upper metal line structures 99, the second
upper metal line structures 96, and the bit lines 98. As used
herein, an "interconnection bonding pad" refers to a bonding pad
that can be used to form an electrical signal interconnection path
when bonded to a mating bonding pad. An interconnection bonding pad
may be a memory-side bonding pad when the interconnection bonding
pad is located on the side of a memory device and is configured to
mate another interconnection bonding pad connected to a peripheral
logic device, or may be a logic-side bonding pad when the
interconnection pad is located on the side of a peripheral logic
device and is configured to mate another interconnection bonding
pad connected to a memory device. Such interconnection bonding pads
can be used to bond the memory and logic die 1000 to a logic die
including a matching set of interconnection bonding pads.
Alternatively, additional dielectric layers can be formed above the
line level interconnect structures (96, 98, 99), and
interconnection bonding pads can be included in such additional
dielectric layers and electrically connected to the line level
interconnect structures (96, 98, 99) by additional electrically
conductive line and/or via structures.
[0169] The various semiconductor devices formed on the substrate 8
may be omitted in some embodiments. FIG. 18 illustrates an
alternative embodiment of the first exemplary structure during
manufacture of a memory-only die 1000', which does not include
peripheral logic devices on the top surface of the substrate 8, and
includes a three-dimensional memory device including a
three-dimensional array of memory elements. As in the case of the
first exemplary structure of FIG. 17, the line level metal
interconnect structures (96, 98, 99) may include interconnection
bonding pads attached to, or integrated into, one or more of the
first upper metal line structures 99, the second upper metal line
structures 96, and the bit lines 98. Alternatively, additional
dielectric layers can be formed above the line level interconnect
structures (96, 98, 99), and interconnection bonding pads can be
included in such additional dielectric layers and electrically
connected to the line level interconnect structures (96, 98, 99) by
additional electrically conductive line and/or via structures. Such
interconnection bonding pads can be used to bond the memory-only
die 1000' to a logic die including a matching set of
interconnection bonding pads. In one embodiment, the
interconnection bonding pads can include memory-side bonding pads.
The set of dielectric material layers embedding memory-side bonding
pads is collectively referred to as a memory dielectric material
layer. Generally speaking, the memory dielectric material layer can
be formed over, or under, the three-dimensional array of memory
elements. The memory-side bonding pads are included in the memory
dielectric material layer, and are electrically connected to a
respective node within the three-dimensional memory device.
[0170] Referring to FIG. 19, a second exemplary structure is
illustrated, which includes a logic die 2000. The logic die 2000
includes a peripheral logic circuitry that includes complementary
metal oxide semiconductor (CMOS) devices 2710 containing PMOS and
NMOS field effect transistors located on a semiconductor substrate
2009. In one embodiment, the semiconductor substrate 2009 can be a
silicon wafer. The CMOS devices can include active regions 2730,
which include source regions and drain regions separated by
respective channel regions 2746 included within the semiconductor
substrate 2009. The CMOS devices can include gate structures 2750,
each of which includes a vertical stack of a gate dielectric and a
gate electrode. At least one dielectric material layer, which can
be a plurality of dielectric material layers, is formed over the
CMOS devices, which is herein referred to as a logic dielectric
material layer 2760. Metal interconnect structures 2780 (which are
herein referred to as second metal interconnect structures) can be
formed in the logic dielectric material layer 2760. The metal
interconnect structures 2780 can include metal via structures 2784
and metal line structures 2786, each of which can be included in
the logic dielectric material layer 2760 and in electrical contact
with the active regions 2730 or gate structures 2750 of the CMOS
devices 2710. The logic dielectric material layer 2760 overlies the
CMOS devices 2710 in an upright position, and underlies the CMOS
devices 2710 in an upside-down position.
[0171] Bonding pads (2792, 2794) can be formed in a surface portion
of the logic dielectric material layer 2760 such that the top
surface of each bonding pad (2792, 2794) is physically exposed at
the top surface of the logic dielectric material layer 2760. The
bonding pads (2792, 2794) can include logic-side bonding pads 2792
and through-substrate via contact pads 2794. Each of the bonding
pads (2792, 2794) is included in the logic dielectric material
layer 2760, and can be electrically connected to a respective node
(e.g., active regions 2730 or gate structures 2750) within the CMOS
devices 2710 through the metal interconnect structures 2780.
[0172] A three-dimensional memory device including a
three-dimensional array of memory elements can be provided in a
memory and logic die 1000 or in a memory-only die 1000'. The memory
and logic dies 1000 and the memory-only dies 1000' are collectively
referred to as memory-containing dies (1000, 1000'). In one
embodiment, the CMOS devices can include word line drivers that
drive a respective one of the word lines comprising the
electrically conductive layers (146, 246) within a
memory-containing die (1000, 1000'), bit line drivers that can
drive a respective one of the bit lines 98 located in the
memory-containing die (1000, 1000') upon subsequent bonding of the
logic die 2000 with the memory-containing die (1000, 1000'), and a
sense amplifier circuitry electrically connected to the bit lines
98 and configured to read a state of selected memory elements
within the three-dimensional array of memory elements upon
subsequent bonding of the logic die 2000 with the memory-containing
die (1000, 1000').
[0173] Referring to FIG. 20, the backside of the logic die 2000 can
be optionally thinned. The thinning of the backside of the logic
die 2000 can be effected by grinding, etching, and/or polishing the
backside of the semiconductor substrate 2009. The thickness of the
semiconductor substrate 2009 after thinning can be in a range from
30 microns to 200 microns, although lesser and greater thicknesses
can also be used. In one embodiment, a sacrificial protective
material layer may be applied over the top surface of the logic
dielectric material layer 2760 during thinning and subsequently
removed.
[0174] Referring to FIG. 21, memory-side bonding pads 1792 can be
provided on any of the memory-containing dies (1000, 1000')
described above. As discussed above, the memory-side bonding pads
1792 can be integrated into the line level metal interconnect
structures (96, 98, 99), or may be formed above the line level
metal interconnect structures (96, 98, 99) at a different level and
electrically connected to the line level metal interconnect
structures (96, 98, 99). Generally, a memory dielectric material
layer 1760 is formed above a three-dimensional array of memory
elements. The memory dielectric material layer 1760 can include
contact level dielectric layers (280, 282) and at least one upper
interconnect level dielectric layer 284 as shown in FIGS. 17 and
18, and any additional dielectric material layer formed
thereabove.
[0175] Memory-side metal interconnect structures 1780 (which are
herein referred to first metal interconnect structures) formed in
the memory dielectric material layer 1760 can include line level
metal interconnect structures (96, 98, 99) and various contact via
structures (86, 88, 586, 488), and may include additional line
level structures and/or additional via level structures. The
memory-side bonding pads 1792 can be formed on the uppermost
elements of the memory interconnect structures 1780. Top surfaces
of the memory-side bonding pads 1792 can be coplanar with the top
surface of the memory dielectric material layer 1760.
[0176] Generally, the pattern of the memory-side bonding pads 1792
and the pattern of the logic-side bonding pads 2792 can be selected
such that the pattern of the memory-side bonding pads 1792 and the
mirror image of the pattern of the logic-side bonding pads 2792
have an areal overlap at each location at which electrical
connection is to be made between a memory-side bonding pad 1792 and
a logic-side bonding pad 2792 upon bonding. In some embodiments,
the pattern of the memory-side bonding pads 1792 in the
memory-containing die (1000, 1000') may be the mirror image of the
pattern of the logic-side bonding pads 2792 in the logic die
2000.
[0177] The thickness of each memory-side bonding pad 1792 can be in
a range from 50 nm to 1,000 nm, such as from 100 nm to 500 nm,
although lesser and greater thicknesses can also be used. The
thickness of each logic-side bonding pad 2792 can be in a range
from 50 nm to 1,000 nm, such as from 100 nm to 500 nm, although
lesser and greater thicknesses can also be used. The memory-side
bonding pads 1792 and the logic-side bonding pads 2792 may have a
circular horizontal cross-sectional shape, a rectangular horizontal
cross-sectional shape, an elliptical horizontal cross-sectional
shape, or any horizontal cross-sectional shape of a closed
generally curvilinear two-dimensional geometrical shape. The
maximum lateral dimensions of the first and second bonding pads
(1792, 2792) can be in a range from 2 microns to 60 microns, such
as from 5 microns to 20 microns, although lesser and greater
maximum lateral dimensions can also be used.
[0178] Referring to FIG. 22, the memory-only die 1000' of FIG. 21
and the logic die 2000 of FIG. 20 can be bonded using
copper-to-copper bonding to provide a first exemplary bonded
assembly (1000', 2000). The memory-only die 1000' and the logic die
2000 can be positioned such that memory-side bonding pads 1792 face
the logic-side bonding pads 2792. Optionally, argon plasma
treatment can be performed on the surfaces of the memory-side
bonding pads 1792 and the logic-side bonding pads 2792 to clean the
surfaces prior to bonding. The memory-side bonding pads 1792 in the
memory-only die 1000' can be disposed directly on the logic-side
bonding pads 2792 in the logic die 2000. Copper interdiffusion can
be induced by annealing the memory-only die 1000' and the logic die
2000 while matching pairs of memory-side bonding pads 1792 and
logic-side bonding pads 2792 remain in physical contact. Multiple
bonded pairs (1792, 2792) of a respective memory-side bonding pad
1792 and a respective logic-side bonding pad 2792 can be formed at
an interface between the memory-only die 1000' and the logic die
2000.
[0179] Optionally, the backside of the substrate 8 can be thinned
after the bonding step. The thickness of the substrate 8 after
thinning may be in a range from 30 microns to 100 microns, although
lesser and greater thicknesses can also be used.
[0180] The first exemplary bonded assembly includes a functional
three-dimensional memory device located in the memory-only die
1000' that is electrically connected to a peripheral logic device
in the logic die 2000. As such, the first exemplary bonded assembly
(1000', 2000) is configured to provide control signals from the
logic die 2000 to the memory-only die 1000' through the multiple
bonded pairs of pads (1792, 2792), and to provide sense signals
from the memory-only die 1000' to the logic die 2000 through the
multiple bonded pairs of pads (1792, 2792). The multiple bonded
pairs (1792, 2792) of a respective memory-side bonding pad 1792 and
a respective logic-side bonding pad 2792 can function as
bidirectional signal flow channels for control signals and sense
signals.
[0181] In one embodiment, the three-dimensional array of memory
elements can be located within a two-dimensional array of vertical
NAND strings, and each vertical NAND string in the array of
vertical NAND strings can include charge storage elements
controlled by word lines comprising the electrically conductive
layers (146, 246) and a vertical semiconductor channel 60 of which
an end portion is electrically connected to a respective bit line
98 through a drain region 63. A first subset of the memory-side
bonding pads 1792 can be electrically connected to a respective bit
line 98, and a second subset of the memory-side bonding pads 1792
can be electrically connected to a respective word line.
[0182] In one embodiment shown in FIG. 21, the memory-only die
1000' can include a semiconductor material layer 10 contacting an
end of each vertical semiconductor channel 60 of the vertical NAND
strings, and metal interconnect structures 780 that are vertically
spaced from the semiconductor material layer 10, and are more
proximal to the semiconductor material layer 10 than to the
vertical semiconductor channels 60. In this case, the metal
interconnect structures 780 can be included in an interconnect
level dielectric material layer 760 located on an opposite side of
the semiconductor material layer 10 with respect to the memory
dielectric material layer 1760. In other words, the interconnect
level dielectric material layer 760 can be located underneath the
semiconductor material layer 10 and the memory dielectric material
layer 1760 can be located above the semiconductor material layer
10, or vice versa. Thus, the semiconductor material layer 10 is
located between the interconnect level dielectric material layer
760 and the memory dielectric material layer 1760.
[0183] In case field effect transistors are not formed on the
substrate semiconductor layer 9, the substrate semiconductor layer
9 may be replaced with any carrier substrate that may include a
semiconductor material, a conductive material, or an insulating
material. Such a carrier substrate merely needs to provide
mechanical strength for supporting the three-dimensional memory
devices thereupon. In one embodiment, the memory-only die 1000' can
include a carrier substrate in lieu of the substrate semiconductor
layer 9, which can be located on the interconnect level dielectric
material layer 760. In one embodiment, the carrier substrate does
not include any field effect transistor therein or directly
thereupon. The vertical field effect transistors in the
three-dimensional memory device within the memory-only die 1000'
can be vertically spaced from the carrier substrate by the
interconnect level dielectric material layer 760.
[0184] Referring to FIG. 23, at least one through-substrate via
structure 2796 can be formed through the semiconductor substrate
2009 and the logic dielectric material layer 2760, and directly on
a backside surface of a respective one of the through-substrate via
contact pads 2794. A backside insulating layer (not shown) may be
optionally formed on the backside of the semiconductor substrate 8
as needed. At least one through-substrate via cavity can be formed
through the optional backside insulating layer, the semiconductor
substrate 2009, and the logic dielectric material layer 2760 by an
anisotropic etch process using a patterned etch mask layer with
suitable openings therein. An insulating liner can be formed within
each through-substrate via cavity by conformal deposition of an
insulating liner layer and by an anisotropic etch that removes
horizontal portions of the insulating liner layer. At least one
conductive material can be deposited in each remaining volume of
the at least one through-substrate via cavity. Excess portions of
the at least one conductive material can be removed from above the
backside surface of the semiconductor substrate 2009 to provide a
through-substrate via structure 2796 within a respective insulating
liner. A bonding pad 2799 can be formed on the backside of the
semiconductor substrate 2009.
[0185] Generally, a through-substrate via contact pad 2794 can be
formed in the logic dielectric material layer 2760. The front
surface of the through-substrate via contact pad 2794 can contact
the memory-only die 1000' (for example, the top surface of the
memory dielectric material layer 1760) upon bonding the first and
the logic dies (1000', 2000). A through-substrate via structure
2796 extending through the semiconductor substrate 2009 and the
logic dielectric material layer 2760 of the logic die 2000 can be
formed directly on a backside surface of the through-substrate via
contact pad 2796. A bonding pad 2799 can be formed on the backside
of the semiconductor substrate 2009 and on the through-substrate
via structure 2796.
[0186] In the structure illustrated in FIG. 23, the memory-only die
1000' is a first die comprising a three-dimensional memory device
including a three-dimensional array of memory elements, a first
dielectric material layer (i.e., the memory dielectric material
layer 1760) overlying (in an upright position), or underlying (in
an upside-down position), the three-dimensional array of memory
elements, and first bonding pads (i.e., the memory-side bonding
pads 1792) included in the first dielectric material layer 1760 and
electrically connected to a respective node within the
three-dimensional memory device. The logic die 2000 is a second die
comprising a semiconductor substrate 2009, a peripheral logic
circuitry that includes complementary metal oxide semiconductor
(CMOS) devices located on the semiconductor substrate 2009, a
second dielectric material layer (i.e., a logic dielectric material
layer 2760) overlying (in the upright position), or underlying (in
the upside-down position), the CMOS devices, and second bonding
pads (i.e., the logic-side bonding pads 2792) included in the
second dielectric material layer 2760 and electrically connected to
a respective node within the CMOS devices. The first bonding pads
1792 are bonded with the second bonding pads 2792 through copper
interdiffusion to provide multiple bonded pairs (1792, 2792) of a
respective first bonding pad 1792 and a respective second bonding
pad 2792 at an interface between the first die 1000' and the second
die 2000. Control signals flow from the second die 2000 to the
first die 1000 through the multiple bonded pairs (1792, 2792), and
sense signals flow from the first die 1000' to the second die 2000
through the multiple bonded pairs (1792, 2792).
[0187] The gate structures 1750 of the CMOS devices 2710 are
located between the memory array region 100 of the
memory-containing die (1000, 1000') and the semiconductor substrate
2009 containing the active regions 2730 separated by a channel 2746
of the logic die 2000. In other words, the gate electrodes 1754 of
the CMOS devices 2710 of the logic die 2000 are located upside-down
below the source, drain and channel regions (2730, 2746) of the
same CMOS devices 2710 with respect to the top of the substrate 8
of the memory-containing die (1000, 1000').
[0188] Referring to FIG. 24, an alternative embodiment of the first
exemplary bonded assembly is illustrated, which can be formed by
bonding a memory and logic die 1000 including first exemplary
structure of FIG. 17 as modified by formation of memory-side
bonding pads 1792 (formed, for example, using the processing steps
of FIG. 21) and the logic die 2000 including the second exemplary
structure of FIG. 20. In this case, metal interconnect structures
780 can be included in an interconnect level dielectric material
layer 760 located on an opposite side of the semiconductor material
layer 10 with respect to the memory dielectric material layer 1760.
Thus, the semiconductor material layer 10 is located between the
interconnect level dielectric material layer 760 and the memory
dielectric material layer 1760. The logic die 2000 includes a
semiconductor substrate 2009. The memory and logic die 1000 can
include an additional semiconductor substrate (which can include a
substrate semiconductor layer 9) located on the interconnect level
dielectric material layer 760. An additional peripheral logic
circuitry that includes additional CMOS devices can be located on
the additional semiconductor substrate 8, and can be electrically
coupled to at least one node of the three-dimensional memory device
located in the memory and logic die 1000.
[0189] In this embodiment, the peripheral logic circuitry of the
logic die 2000 can include very low voltage (VLV) CMOS devices
2710, while the peripheral logic circuitry of the logic and
memory-containing die 1000 can include low voltage (LV) and high
voltage (HV) CMOS devices 710 located in the peripheral device
region 700. The VLV CMOS devices 2710 are configured to be operated
at a lower voltage than the LV and HV CMOS devices 710. In one
embodiment, the gate dielectric 1752 of the VLV CMOS devices 2710
can be thinner than the gate dielectric 752 of the LV and/or HV
CMOS devices 710. The gate structures 750 of the LV and/or HV CMOS
devices 710 are located between the memory array region 100 and the
semiconductor substrate 8 containing the active regions 742
separated by a channel 746. The gate structures 1750 of the VLV
devices 2710 are located between the memory array region 100 and
the semiconductor substrate 2009 containing the active regions 2730
separated by a channel 2746 of the logic die 2000.
[0190] In the structure illustrated in FIG. 24, the memory and
logic die 1000 is a first die comprising a three-dimensional memory
device including a three-dimensional array of memory elements, a
first dielectric material layer (i.e., the memory dielectric
material layer 1760) overlying (in an upright position), or
underlying (in an upside-down position), the three-dimensional
array of memory elements, and first bonding pads (i.e., the
memory-side bonding pads 1792) included in the first dielectric
material layer 1760 and electrically connected to a respective node
within the three-dimensional memory device. The logic die 2000 is a
second die comprising a semiconductor substrate 2009, a peripheral
logic circuitry that includes complementary metal oxide
semiconductor (CMOS) devices located on the semiconductor substrate
2009, a second dielectric material layer (i.e., a logic dielectric
material layer 2760) overlying (in the upright position), or
underlying (in the upside-down position), the CMOS devices, and
second bonding pads (i.e., the logic-side bonding pads 2792)
included in the second dielectric material layer 2760 and
electrically connected to a respective node within the CMOS
devices. The first bonding pads 1792 are bonded with the second
bonding pads 2792 through copper interdiffusion to provide multiple
bonded pairs (1792, 2792) of a respective first bonding pad 1792
and a respective second bonding pad 2792 at an interface between
the first die 1000 and the second die 2000. Control signals flow
from the second die 2000 to the first die 1000 through the multiple
bonded pairs (1792, 2792), and sense signals flow from the first
die 1000 to the second die 2000 through the multiple bonded pairs
(1792, 2792).
[0191] Referring to FIG. 25, at least one through-substrate via
structure 2796 can be formed through the semiconductor substrate
2009 and the logic dielectric material layer 2760, and directly on
a backside surface of a respective one of the through-substrate via
contact pads 2794. A backside insulating layer (not shown) may be
optionally formed on the backside of the semiconductor substrate 8
as needed. At least one through-substrate via cavity can be formed
through the optional backside insulating layer, the semiconductor
substrate 2009, and the logic dielectric material layer 2760 by an
anisotropic etch process using a patterned etch mask layer with
suitable openings therein. An insulating liner can be formed within
each through-substrate via cavity by conformal deposition of an
insulating liner layer and by an anisotropic etch that removes
horizontal portions of the insulating liner layer. At least one
conductive material can be deposited in each remaining volume of
the at least one through-substrate via cavity. Excess portions of
the at least one conductive material can be removed from above the
backside surface of the semiconductor substrate 2009 to provide a
through-substrate via structure 2796 within a respective insulating
liner. A bonding pad 2799 can be formed on the backside of the
semiconductor substrate 2009. The bonding pads 2799 can be used to
form packaging bond structures, which may include C4 bonding
structures or wire bonding structures for placement of the first
exemplary structure into a package such as a ceramic package or a
laminated package.
[0192] Referring to FIG. 26, a memory-only die 3000 and a memory
and logic die 1000 are illustrated prior to bonding. The
memory-only die 3000 may be derived from the memory-only die 1000'
illustrated in FIG. 18 by including memory-side bonding pads 1792
at the level of the lower metal interconnect structures 780. In
this case, any carrier substrate may be used in lieu of the
substrate semiconductor layer 9 of FIG. 18. The carrier substrate
may be subsequently removed from below the lower level dielectric
layers 760. For example, a silicon substrate using a thin
hydrogen-implanted layer or sacrificial bonding layer near a top
surface may be used as the carrier substrate, and bottom portion of
the silicon substrate may be cleaved off during an anneal process
after formation of the memory-only die 1000'. A remaining thin
layer of silicon and bottom portions of the lower level dielectric
layers 760 can be subsequently removed by a planarization process,
which can use a wet etch process and/or chemical mechanical
planarization. For example, the thin layer of silicon can be etched
by a wet etch process using a KOH solution, and the bottom portions
of the lower level dielectric layers 760 can be removed by a wet
etch using hot phosphoric acid and/or hydrofluoric acid. A touch-up
chemical mechanical planarization process can be used to physically
expose the bottom surfaces of the memory-side bonding pads 1792
that are present at the level of the lower metal interconnect
structures 780. The remaining portions of the lower level
dielectric layer 760 constitutes a memory dielectric material layer
3760, in which the memory-side bonding pads 1792 are included. An
upper portion of the memory-only die 3000 can include an
interconnect dielectric material layer 1860 embedding memory-side
metal interconnect structures 1780 and bonding pads 1892. The
bonding pads 1892 may be subsequently used to bond another die (not
illustrated) to the memory-only die 3000. Alternatively, the
bonding pads 1892 can be used to form packaging bond structures,
which may include C4 bonding structures or wire bonding structures
for placement of the second exemplary structure into a package such
as a ceramic package or a laminated package.
[0193] The memory and logic die 1000 of FIG. 26 may include the
same elements as the memory and logic die 1000 of FIG. 24 except
that the dielectric material at a top portion of the memory and
logic die 1000 are used as a logic dielectric material layer 2760
and the bonding pads included therein are used as logic-side
bonding pads 2792 (since the logic and memory-containing die 1000
contains the peripheral logic devices 710 in region 700). The
logic-side bonding pads 2792 can be arranged to match the mirror
image of the memory-side bonding pads 1792 in the memory-only die
3000.
[0194] Referring to FIG. 27, the memory-only die 3000 and the
memory and logic die 1000 can be bonded using copper-to-copper
bonding to provide a second exemplary bonded assembly (3000, 1000).
The memory-only die 3000 and the memory and logic die 1000 can be
positioned such that memory-side bonding pads 1792 face the
logic-side bonding pads 2792. Optionally, argon plasma treatment
can be performed on the surfaces of the memory-side bonding pads
1792 and the logic-side bonding pads 2792 to clean the surfaces
prior to bonding. The memory-side bonding pads 1792 in the
memory-only die 3000 can be disposed directly on the logic-side
bonding pads 2792 in the memory and logic die 1000. Copper
interdiffusion can be induced by annealing the memory-only die 3000
and the memory and logic die 1000 while matching pairs of
memory-side bonding pads 1792 and logic-side bonding pads 2792
remain in physical contact. Multiple bonded pairs (1792, 2792) of a
respective memory-side bonding pad 1792 and a respective logic-side
bonding pad 2792 can be formed at an interface between the
memory-only die 3000 and the memory and logic die 1000.
[0195] The second exemplary bonded assembly includes a functional
three-dimensional memory device located in the memory-only die 3000
that is electrically connected to a peripheral logic device in the
logic and logic die 1000. As such, the second exemplary bonded
assembly (3000, 1000) is configured to provide control signals from
the memory and logic die 1000 to the memory-only die 3000 through
the multiple bonded pairs (1792, 2792), and to provide sense
signals from the memory-only die 3000 to the memory and logic die
1000 through the multiple bonded pairs (1792, 2792). The multiple
bonded pairs (1792, 2792) of a respective memory-side bonding pad
1792 and a respective logic-side bonding pad 2792 can function as
bidirectional signal flow channels for control signals and sense
signals.
[0196] In one embodiment, the three-dimensional array of memory
elements can be located within a two-dimensional array of vertical
NAND strings, and each vertical NAND string in the array of
vertical NAND strings can include charge storage elements
controlled by word lines comprising the electrically conductive
layers (146, 246) and a vertical semiconductor channel 60 of which
an end portion is connected to a respective bit line 98. A first
subset of the memory-side bonding pads 1792 can be electrically
connected to a respective bit line 98, and a second subset of the
memory-side bonding pads 1792 can be electrically connected to a
respective word line.
[0197] In the second exemplary bonded assembly, the memory-only die
3000 is a first die comprising a three-dimensional memory device
including a three-dimensional array of memory elements, a first
dielectric material layer (i.e., the memory dielectric material
layer 3760) overlying (in an upside-down position), or underlying
(in an upright position), the three-dimensional array of memory
elements, and first bonding pads (i.e., the memory-side bonding
pads 1792) included in the first dielectric material layer 3760 and
electrically connected to a respective node within the
three-dimensional memory device. The memory and logic die 1000 is a
second die comprising a semiconductor substrate 8, a peripheral
logic circuitry that includes complementary metal oxide
semiconductor (CMOS) devices 710 located on the semiconductor
substrate 8, a second dielectric material layer (i.e., a logic
dielectric material layer 2760) overlying (in the upright
position), or underlying (in the upside-down position), the CMOS
devices, and second bonding pads (i.e., the logic-side bonding pads
2792) included in the second dielectric material layer 2760 and
electrically connected to a respective node within the CMOS
devices. The first bonding pads 1792 are bonded with the second
bonding pads 2792 through copper interdiffusion to provide multiple
bonded pairs (1792, 2792) of a respective first bonding pad 1792
and a respective second bonding pad 2792 at an interface between
the first die 3000 and the second die 2000. Control signals flow
from the second die 2000 to the first die 3000 through the multiple
bonded pairs (1792, 2792), and sense signals flow from the first
die 3000 to the second die 2000 through the multiple bonded pairs
(1792, 2792).
[0198] In one embodiment, the second die (i.e., the memory and
logic chip 1000) further includes an additional three-dimensional
memory device including a three-dimensional array of additional
memory elements. The three-dimensional array of additional memory
elements is located within a two-dimensional array of additional
vertical NAND strings. The additional vertical NAND strings
comprise charge storage elements (such as portions of the charge
storage layers 54 located at levels of the electrically conductive
layers (146, 246)) controlled by additional word lines and
additional bit lines. The CMOS devices located on the semiconductor
substrate 8 include a driver circuit for the additional word lines
and a driver circuit for the additional bit lines in the memory and
logic chip 1000, as well as the driver circuit for the word lines
and the driver circuit for the bit lines in the memory-only chip
3000.
[0199] In some embodiment, the multiple bonded pairs (1792, 2792)
of the respective first bonding pad 1792 and the respective second
bonding pad 2792 can include a first subset of the multiple bonded
pairs (1792, 2792) that provides electrical connection between a
respective word line in the first die 3000 and a respective word
line in the second die 1000, and a second subset of multiple bonded
pairs (1792, 2792) that provides electrical connection between a
respective bit line 98 in the first die 3000 and a respective bit
line 98 in the second die 1000.
[0200] In one embodiment, the semiconductor material layer 10 in
the first die 3000 is more proximal to the interface between the
first die 3000 and the second die 1000 than the two-dimensional
array of vertical NAND strings in the first die 3000 is to the
interface between the first die 3000 and the second die 1000. The
three-dimensional memory device in the first die comprises word
line contact via structures 86 including proximal end surfaces 86P
that are proximal to the interface between the first die 3000 and
the second die 1000 and distal end surfaces 86D that are distal
from the interface between the first die 3000 and the second die
1000. The distal end surfaces 86D of the word line contact via
structures 86 can be located within a same horizontal plane, and
can be equidistant from the interface between the first die 3000
and the second die 1000.
[0201] Referring to FIG. 28, an alternative embodiment of the
second exemplary bonded assembly can be formed by modifying the
memory-only die 3000 illustrated in FIG. 27 to provide memory-side
bonding pads 1792 and a memory dielectric material layer 1760 in
lieu of the combination of the interconnect dielectric material
layer 1860 and the bonding pads 1892 at an upper portion of the
memory-only die 3000. The bonding pads 1892 may be subsequently
used to bond another die (not illustrated) to the memory-only die
3000. A bottom portion of the memory-only die 3000 can include
lower metal interconnect structures 780 included in a lower level
dielectric layer 760 as illustrated in FIG. 18. As in the case of
the memory-only die 3000, a carrier substrate and a bottom portion
of the lower level dielectric layer 760 can be removed to
physically expose surfaces of the lower metal interconnect
structures 780, which may include bonding pads that can be used to
form packaging bond structures such as C4 bonding structures or
wire bonding structures for placement of the alternate embodiment
of the second exemplary structure into a package such as a ceramic
package or a laminated package.
[0202] The memory-only die 3000 can be flipped upside down to face
the memory and logic die 1000. The memory-only die 3000 and the
memory and logic die 1000 can be bonded using copper-to-copper
bonding to provide a second exemplary bonded assembly (3000, 1000).
The memory-only die 3000 and the memory and logic die 1000 can be
positioned such that memory-side bonding pads 1792 face the
logic-side bonding pads 2792. Optionally, argon plasma treatment
can be performed on the surfaces of the memory-side bonding pads
1792 and the logic-side bonding pads 2792 to clean the surfaces
prior to bonding. The memory-side bonding pads 1792 in the
memory-only die 3000 can be disposed directly on the logic-side
bonding pads 2792 in the memory and logic die 1000. Copper
interdiffusion can be induced by annealing the memory-only die 3000
and the memory and logic die 1000 while matching pairs of
memory-side bonding pads 1792 and logic-side bonding pads 2792
remain in physical contact. Multiple bonded pairs (1792, 2792) of a
respective memory-side bonding pad 1792 and a respective logic-side
bonding pad 2792 can be formed at an interface between the
memory-only die 3000 and the memory and logic die 1000.
[0203] The second exemplary bonded assembly includes a functional
three-dimensional memory device located in the memory-only die 3000
that is electrically connected to a peripheral logic device in the
logic and logic die 1000. As such, the second exemplary bonded
assembly (3000, 1000) is configured to provide control signals from
the memory and logic die 1000 to the memory-only die 3000 through
the multiple bonded pairs (1792, 2792), and to provide sense
signals from the memory-only die 3000 to the memory and logic die
1000 through the multiple bonded pairs (1792, 2792). The multiple
bonded pairs (1792, 2792) of a respective memory-side bonding pad
1792 and a respective logic-side bonding pad 2792 can function as
bidirectional signal flow channels for control signals and sense
signals.
[0204] In the configuration illustrated in FIG. 28, the
semiconductor material layer 10 in the first die (i.e., the
memory-only die 3000) is more distal from the interface between the
first die 3000 and the second die (i.e., the memory and logic die
1000) than the two-dimensional array of vertical NAND strings in
the first die 3000 is from the interface between the first die 3000
and the second die 1000. The three-dimensional memory device in the
first die 3000 comprises word line contact via structures 86
including proximal end surfaces 86P that are proximal to the
interface between the first die 3000 and the second die 1000 and
distal end surfaces 86D that are distal from the interface between
the first die 3000 and the second die 1000. The proximal end
surfaces 86P of the word line contact via structures 86 can be
located within a same horizontal plane, and can be equidistant from
the interface between the first die 3000 and the second die
1000.
[0205] Referring to FIG. 29, a third exemplary bonded assembly
(2000, 1000', 3000) is illustrated. In this case, the lower level
dielectric layers 760 in the memory-only die 1000' of FIG. 21 can
be modified to embed additional logic-side bonding pads 4792 in
lieu of, or in addition to, lower metal interconnect structures
780. The modified memory-only die 1000' is bonded with the logic
die 2000 illustrated in FIG. 20 to provide a first exemplary bonded
assembly (2000, 1000') illustrated in FIG. 23 with the modification
of presence of logic-side bonding pads 4792 in lieu of, or in
addition to, lower metal interconnect structures 780.
[0206] Specifically, the substrate semiconductor layer 9 in the
first exemplary bonded assembly (2000, 1000') of FIG. 23 can be
removed to physically expose a bottom surface of the lower level
dielectric layers 760. For example, a silicon substrate using a
thin hydrogen-implanted layer or sacrificial bonding layer near a
top surface may be used as the substrate semiconductor layer 9, and
bottom portion of the silicon substrate may be cleaved off during
an anneal process before, or after, bonding the memory-only die
1000' and the logic die 2000. A remaining thin layer of silicon and
bottom portions of the lower level dielectric layers 760 can be
subsequently removed by a planarization process, which can use a
wet etch process and/or chemical mechanical planarization. For
example, the thin layer of silicon can be etched by a wet etch
process using a KOH solution, and the bottom portions of the lower
level dielectric layers 760 can be removed by a wet etch using hot
phosphoric acid and/or hydrofluoric acid. A touch-up chemical
mechanical planarization process can be used to physically expose
the bottom surfaces of the logic-side bonding pads 4792 that are
present at the level of the lower metal interconnect structures
780. The remaining portions of the lower level dielectric layer 760
functions as a logic dielectric material layer embedding the
logic-side bonding pads 4792.
[0207] A memory-only die 3000, which is a third die, is provided.
The memory-only die 3000 can be the same as the memory-only die
3000 of FIG. 26 within the modification that the memory dielectric
material layer 3760 embeds memory-side bonding pads 5792 that are
configured to mate with the logic-side bonding pads 4792 located in
the memory-only die 1000'.
[0208] The first exemplary bonded assembly (2000, 1000') and the
memory-only die 3000 can be bonded using copper-to-copper bonding
to provide the third exemplary bonded assembly (2000, 1000', 3000).
The first exemplary bonded assembly (2000, 1000') and the
memory-only die 3000 can be positioned such that memory-side
bonding pads 5792 face the logic-side bonding pads 4792.
Optionally, argon plasma treatment can be performed on the surfaces
of the memory-side bonding pads 5792 and the logic-side bonding
pads 4792 to clean the surfaces prior to bonding. The memory-side
bonding pads 5792 in the first exemplary bonded assembly (2000,
1000') can be disposed directly on the logic-side bonding pads 4792
in the memory-only die 3000. Copper interdiffusion can be induced
by annealing the first exemplary bonded assembly (2000, 1000') and
the memory-only die 3000 while matching pairs of memory-side
bonding pads 5792 and logic-side bonding pads 4792 remain in
physical contact. Multiple bonded pairs (5792, 4792) of a
respective memory-side bonding pad 5792 and a respective logic-side
bonding pad 4792 can be formed at an interface between the first
exemplary bonded assembly (2000, 1000') and the memory-only die
3000. The third exemplary bonded assembly (2000, 1000', 3000) of a
first die 1000', a second die 2000, and a third die 3000 includes
vertical interconnections provided by a first set of bonded pairs
(1792, 2792) of a respective memory-side bonding pad 1792 and a
respective logic-side bonding pad 2792 and a second set of bonded
pairs (5792, 4792) of a respective memory-side bonding pad 5792 and
a respective logic-side bonding pad 4792.
[0209] In the structure illustrated in FIG. 29, the memory-only die
1000' is a first die comprising a three-dimensional memory device
including a three-dimensional array of memory elements, a first
dielectric material layer (i.e., the memory dielectric material
layer 1760) overlying (in an upright position), or underlying (in
an upside-down position), the three-dimensional array of memory
elements, and first bonding pads (i.e., the memory-side bonding
pads 1792) included in the first dielectric material layer 1760 and
electrically connected to a respective node within the
three-dimensional memory device. The logic die 2000 is a second die
comprising a semiconductor substrate 2009, a peripheral logic
circuitry that includes complementary metal oxide semiconductor
(CMOS) devices located on the semiconductor substrate 2009, a
second dielectric material layer (i.e., a logic dielectric material
layer 2760) overlying (in the upright position), or underlying (in
the upside-down position), the CMOS devices, and second bonding
pads (i.e., the logic-side bonding pads 2792) included in the
second dielectric material layer 2760 and electrically connected to
a respective node within the CMOS devices. The first bonding pads
1792 are bonded with the second bonding pads 2792 through copper
interdiffusion to provide multiple bonded pairs (1792, 2792) of a
respective first bonding pad 1792 and a respective second bonding
pad 2792 at an interface between the first die 1000' and the second
die 2000. Control signals flow from the second die 2000 to the
first die 1000 through the multiple bonded pairs (1792, 2792), and
sense signals flow from the first die 1000' to the second die 2000
through the multiple bonded pairs (1792, 2792).
[0210] The first die, i.e., the memory-only die 1000', includes
third bonding pads, i.e., the logic-side bonding pads 4792, located
on an opposite side of the first bonding pads, i.e., the
memory-side bonding pads 1792, with respect to the semiconductor
material layer 10 in the first die 1000'. The third die, i.e., the
memory-only die 3000, includes an additional three-dimensional
memory device including a three-dimensional array of additional
memory elements and fourth bonding pads, i.e., the memory-side
bonding pads 5792, connected to a respective node of the additional
three-dimensional memory device. The third bonding pads 4792 are
bonded with the fourth bonding pads 5792 through copper
interdiffusion to provide additional multiple bonded pairs (4792,
5792) of a respective third bonding pad 4792 and a respective
fourth bonding pad 5792 at an interface between the first die 1000'
and the third die 3000.
[0211] In one embodiment, the three-dimensional array of additional
memory elements is located within a two-dimensional array of
additional vertical NAND strings in the third die 3000, and each
additional vertical NAND string in the array of vertical NAND
strings comprises respective charge storage elements controlled by
additional word lines and a respective vertical semiconductor
channel 60 of which an end portion is connected to one of
additional bit lines 98 in the third die 3000. The peripheral logic
circuitry containing CMOS devices 710 located on the semiconductor
substrate 2009 of the second die 2000 includes a driver circuit for
the additional word lines and a driver circuit for the additional
bit lines 98 in the third die 3000.
[0212] FIGS. 30A-30F are sequential vertical cross-sectional views
of an exemplary structure during bonding of two dies according to
an embodiment of the present disclosure.
[0213] Referring to FIG. 30A, a first die or a first bonded
assembly {1000, 1000', 3000, or (2000, 1000')) including first
bonding pads 1792, which may be memory-side bonding pads 1792, is
provided. A second die or a second bonded assembly (1000, 2000)
including second bonding pads 2792, which may be logic-side bonding
pads 2792, is provided.
[0214] Referring to FIG. 30B, the first die or the first bonded
assembly {1000, 1000', 3000, or (2000, 1000')) and the second die
or the second bonded assembly (1000, 2000) can be positioned such
that memory-side bonding pads 1792 face the logic-side bonding pads
2792.
[0215] Referring to FIG. 30C, after, or prior to, positioning the
first die or the first bonded assembly {1000, 1000', 3000, or
(2000, 1000')) and the second die or the second bonded assembly
(1000, 2000) to face each other, argon plasma treatment can be
performed on the surfaces of the memory-side bonding pads 1792 and
the logic-side bonding pads 2792 to clean the physically exposed
surfaces of the memory-side bonding pads 1792 and the logic-side
bonding pads 2792.
[0216] Referring to FIG. 30D, the memory-side bonding pads 1792 in
the first die or the first bonded assembly {1000, 1000', 3000, or
(2000, 1000')) can be disposed directly on the logic-side bonding
pads 2792 in the second die or the second bonded assembly (2000,
3000). Copper interdiffusion can be induced by annealing the
memory-only die 1000' or the memory and logic die 1000 in contact
with the logic die 2000 while matching pairs of memory-side bonding
pads 1792 and logic-side bonding pads 2792 remain in physical
contact. The temperature of the thermal anneal can be in a range
from 250 degrees Celsius to 400 degrees Celsius, although lower and
higher temperatures can also be used. Multiple bonded pairs (1792,
2792) of a respective memory-side bonding pad 1792 and a respective
logic-side bonding pad 2792 can be formed at an interface between
the first die or the first bonded assembly {1000, 1000', 3000, or
(2000, 1000')) and the second die or the second bonded assembly
(2000, 3000).
[0217] Referring to FIG. 30E, one or both of the first die or the
first bonded assembly {1000, 1000', 3000, or (2000, 1000')) and the
second die or the second bonded assembly (1000, 2000) can be
thinned as needed.
[0218] Referring to FIG. 30F, the processing steps of FIG. 23 or
FIG. 25 can be performed to form through-substrate via structures
2796 and bonding pads 2799, which may include C4 bonding structures
or wire bonding structures for placement of the second exemplary
structure into a package such as a ceramic package or a laminated
package. Thus, the bonded assembly formed by the processing steps
of FIGS. 30A-30F can be packaged within a single semiconductor
package including a single set of lead frames using C4 bonding
methods or wire bonding methods.
[0219] FIGS. 31A-31D illustrate various configurations of areal
overlap in a bonded assembly of a first die or a first bonded
assembly {1000, 1000', 3000, or (2000, 1000')) and a second die or
a second bonded assembly (1000, 2000) according to various
embodiments of the present disclosure. The first die or the first
bonded assembly {1000, 1000', 3000, or (2000, 1000')) and the
second die or the second bonded assembly (1000, 2000) may have
substantially the same areas as illustrated in FIG. 31A, or may
have different areas as illustrated in FIG. 31B. A single first die
or a single first bonded assembly {1000, 1000', 3000, or (2000,
1000')) can be bonded to a single second die or a single second
bonded assembly (1000, 2000) as illustrated in FIG. 31A or FIG.
31B. Alternatively, a single first die or a single first bonded
assembly {1000, 1000', 3000, or (2000, 1000')) can be bonded to
multiple second dies or multiple second bonded assemblies (2000,
3000) as illustrated in FIG. 31C. Yet alternatively, multiple first
dies or multiple first bonded assemblies {1000, 1000', 3000, or
(2000, 1000')) can be bonded to a single second die or a single
second bonded assembly (1000, 2000) as illustrated in FIG. 31D.
[0220] In an alternative embodiment, a separate bonding layer or
direct die to die contact can be used instead of the bonding pad
bonding to bond the dies into die assembly. Thus, the embodiment of
the present disclosure are not limited to bonding pad to bonding
pad diffusion bonding.
[0221] According to various embodiments of the present disclosure
and referring to all drawings of the present disclosure, a
semiconductor structure is provided, which comprises: a first die
(1000, 1000', 3000) comprising a three-dimensional memory device
including a three-dimensional array of memory elements, a first
dielectric material layer (1760, 3760) overlying, or underlying,
the three-dimensional array of memory elements, and first bonding
pads 1792 included in the first dielectric material layer and
electrically connected to a respective node within the
three-dimensional memory device; and a second die 2000 comprising a
semiconductor substrate 2009, a peripheral logic circuitry that
includes complementary metal oxide semiconductor (CMOS) devices
located on the semiconductor substrate 2009, a second dielectric
material layer 2760 overlying, or underlying, the CMOS devices
2710, and second bonding pads 2792 included in the second
dielectric material layer 2760 and electrically connected to a
respective node within the CMOS devices.
[0222] The first bonding pads 1792 are bonded with the second
bonding pads 2792 through copper interdiffusion to provide multiple
bonded pairs (1792, 2792) of a respective first bonding pad 1792
and a respective second bonding pad 2792 at an interface between
the first die (1000, 1000', 3000) and the second die 2000. Control
signals flow from the second die 2000 to the first die (1000,
1000', 3000) through the multiple bonded pairs (1792, 2792). Sense
signals flow from the first die (1000, 1000', 3000) to the second
die 2000 through the multiple bonded pairs (1792, 2792).
[0223] In one embodiment, the three-dimensional memory device
comprises word lines comprising the electrically conductive layers
(146, 246) and bit lines 98 for individually accessing the memory
elements within the three-dimensional array of memory elements. The
CMOS devices 710 comprise word line drivers that drive a respective
one of the word lines, bit line drivers that drive a respective one
of the bit lines 98, and a sense amplifier circuitry electrically
connected to the bit lines 98 and configured to read a state of
selected memory elements within the three-dimensional array of
memory elements.
[0224] The semiconductor structure can further include: a
through-substrate via structure 2796 extending through the
semiconductor substrate 2009 and the second dielectric material
layer 2009 of the second die 2000; a through-substrate via contact
pad 2794 included in the second dielectric material layer 2760,
contacting the through-substrate via structure 2796, and having a
horizontal surface within a plane of the interface between the
first die (1000, 1000', 3000) and the second die 2000; and a
bonding pad 2799 located on the semiconductor substrate 2009 and
contacting the through-substrate via structure 2796.
[0225] According to an aspect of the present disclosure, a method
of forming a bonded assembly of a three-dimensional memory device
is provided. A memory-containing die (1000 or 1000') including a
three-dimensional array of memory elements is provided as described
above. A memory dielectric material layer 1760 is formed on a first
side of the three-dimensional array of memory elements, which may
comprise portions of charge storage layers 54 located at the levels
of the electrically conductive layers (146, 246). Memory-side
bonding pads 1792 are included in the memory dielectric material
layer 1760, and are electrically connected to a respective node
within the three-dimensional memory device.
[0226] A logic die 2000 is provided, which includes a peripheral
circuitry (comprising a subset of the CMOS devices 2710) configured
to control operation of the three-dimensional array of memory
elements, logic dielectric material layers 2760 located on a first
side of the peripheral circuitry, and logic-side bonding pads 2792
included in the logic dielectric material layers 2760 and
electrically connected to a respective node of the peripheral
circuitry.
[0227] Referring to FIGS. 32 and 33, an exemplary layout of a logic
die 2000 is illustrated. The logic die 2000 can be used as one of
bonded dies in a bonded assembly {(1000', 2000) or (1000, 2000)} of
various embodiments of the present disclosure.
[0228] Referring to FIG. 32, the peripheral circuitry of the logic
die 2000 can include sense amplifier and bit line driver circuits
located in areas labeled with "SA/BLS," word line driver circuits
located in areas labeled with "XDL," column direction logic control
circuits located in areas labeled with "YLOG," source power supply
circuits (e.g., source line bias voltage supply circuits) and well
(e.g., p-well in which the source, drain and channel regions of
peripheral circuitry transistors are located) bias voltage supply
circuits located in areas labeled with "CELSRC/CPWELL," electrical
connections from the source power supply circuits located between
SA/BLS in areas labeled with `Shunt," word line decoder circuits
(e.g., word line control transistors and low voltage decoders)
located in areas labeled with "WLTR/LVDEC," input/output control
circuits located in areas labeled with "IO_PADS," and other
miscellaneous circuits located in areas labeled with "MISC."
Bonding pads 2799 can be located within the areas of the
input/output control circuits on the backside of the semiconductor
substrate 2009 as illustrated in FIG. 29.
[0229] FIG. 33 is a layout of a first magnified region M1 within
the logic die 2000 of FIG. 32. Each sense amplifier and bit line
driver circuit includes sense amplifiers and bit line drivers
located in different areas. In one embodiment, the sense amplifiers
can be interlaced with bit line drivers along a horizontal
direction within the logic die 2000. In an illustrative layout, a
pair of sense amplifiers configured be connected to a pair of bit
lines 98 in a memory-containing die (1000 or 1000') can be located
within each area labeled with "2-SA," and a set of 8 bit line
drivers can be located within each area labeled with "8-BLS." A
unit cell including a set of four pairs of sense amplifiers and a
set of eight bit line drivers can be repeated along a horizontal
direction within each sense amplifier and bit line driver
circuit.
[0230] According to an aspect of the present disclosure, the
laterally-elongated contact via structures 76 (illustrated, for
example, in FIG. 18) in the memory-containing die (1000 or 1000')
can be used as components of a source line that distributes a
source power supply voltage across the memory-containing die (1000
or 1000'). A subset of the memory-side metal interconnect
structures 1780 located in the memory dielectric material layer
1760 and a subset of the memory-side bonding pads 1792 can be used
to provide electrical connections within the memory-containing die
(1000 or 1000') that distributes the source power supply voltage
across the memory-containing die (1000 or 1000').
[0231] Referring to FIGS. 34-39, a first exemplary configuration of
a second magnified region M2 within the first magnified region M1
of FIG. 33 is illustrated. FIG. 34 illustrates the overlay between
first metal line structures (884, 886) located at a first metal
line level and first metal via structures (814, 816) located at a
first metal via level that overlies the first metal line level.
FIG. 35 illustrates the overlay between the first metal via
structures (814, 816) located at the first metal via level and
second metal line structures (824A, 824B, 826) located at a second
metal line level that overlies the first metal via level. FIG. 36
illustrates the overlay between the second metal line structures
(824A, 824B, 826) located at the second metal line level and
pad-connection-level via structures (834A, 834B, 836) located at a
pad connection level that overlies the second metal line level.
FIG. 37 illustrates the overlay between the pad-connection-level
via structures (834A, 834B, 836) located at the pad connection
level and logic-side bonding pads 2792 located at a metal pad level
that overlies the pad connection level. FIG. 38 is a vertical
cross-sectional view along the vertical cross-sectional plane X-X'
of FIGS. 34, 35, 36, and 37 of the second magnified region M2. FIG.
39 is a composite view illustrating a subset of metal interconnect
structures in the second metal line level, the pad connection
level, and the metal pad level.
[0232] Each of the first metal line structures (884, 886), the
first metal via structures (814, 816), the second metal line
structures (824A, 824B, 826), the pad-connection-level via
structures (834A, 834B, 836), and the logic-side bonding pads 2792
can be included in the logic dielectric material layer 2760, which
can include a stack of multiple dielectric material sublayers that
are component layers of the logic dielectric material layer
2760.
[0233] The first metal line structures (884, 886) located at the
first metal line level include first source-connection metal line
structures 884 that are electrically connected to output nodes of
the source power supply circuit in the peripheral circuitry of the
logic die 2000, and first bit-line-connection metal line structures
886 that are electrically connected to nodes of a sense amplifier
and bit line driver circuit, for example, through
bit-line-connection contact via structures 806. The
bit-line-connection contact via structures 806 can be electrically
connected to gate electrodes, source regions, or drain regions of
complementary metal oxide semiconductor (CMOS) transistors in a
respective sense amplifier and bit line driver circuit.
[0234] The first metal via structures (814, 816) located at the
first metal via level include first source-connection metal via
structures 814 that contact a top surface of a respective one of
the first source-connection metal line structures 884, and first
bit-line-connection metal via structures 816 that contact a top
surface of a respective one of the first bit-line-connection metal
line structures 886.
[0235] The second metal line structures (824A, 824B, 826) located
at a second metal line level include line-level mesh structures
824A that may optionally contact a top surface of a respective
subset of the first source-connection metal via structures 814,
isolated source-connection line-level structures 824B that contact
a respective one of the first source-connection metal via
structures 814, and second bit-line-connection metal line
structures 826 that contact a top surface of a respective one of
the bit-line-connection metal via structures 816. As used herein, a
"mesh structure" refers to a structure having a general shape of a
mesh in which at least two sets of laterally-extending segments
that extend along different lateral directions are intertwined to
provide a network including a plurality of openings therein. The
line-level mesh structures 824A and subsets of the isolated
source-connection line-level structures 824B may alternate along a
horizontal direction of alternation of the sense amplifiers and
sets of bit line drivers. In one embodiment, each line-level mesh
structures 824A may contact a plurality of first source-connection
metal via structures 814.
[0236] The pad-connection-level via structures (834A, 834B, 836)
located at the pad connection level include mesh-interconnection
via structures 834A that contact a top surface of a respective one
of the line-level mesh structures 824A, second source-connection
metal via structures 834B that contact a top surface of a
respective one of the isolated source-connection line-level
structures 824B, and second bit-line-connection metal via
structures 836 that contact a top surface of a respective one of
the second bit-line-connection metal line structures 826.
[0237] The logic-side bonding pads 2792 can include at least one
pad-level mesh structure 2792A electrically connected to a source
power supply circuit within the peripheral circuitry through a
respective set of at least one second source-connection metal via
structure 834B. Each pad-level mesh structure 2792A can be
connected to a pair of line-level mesh structures 824A through a
respective set of mesh-interconnection via structures 834A. Thus,
each pad-level mesh structure 2792A can contact top surfaces of a
subset of the mesh-interconnection via structures 834A and a subset
of the second source-connection metal via structures 834B. Each of
the at least one pad-level mesh structure 2792A may include an
array of discrete openings therethrough. Further, the logic-side
bonding pads 2792 can comprise discrete logic-side bonding pads
2792B electrically isolated one from another and from the at least
one pad-level mesh structure 2792A. The discrete logic-side bonding
pads 2792B can contact a top surface of a respective one of the
second bit-line-connection metal line structures 826.
[0238] A memory-containing die (1000, 1000') described above can be
provided with memory-side bonding pads 1792. The memory-side
bonding pads 1792 can be arranged such that each of the memory-side
bonding pads 1792 can bond with a respective one of the at least
one pad-level mesh structure 2792A and the discrete logic-side
bonding pads 2792B. The at least one pad-level mesh structure 2792A
can be provided as a plurality of pad-level mesh structures 2792A
that are laterally spaced apart by groups of discrete logic-side
bonding pads 2792B. The logic-side bonding pads 2792 can be bonded
to a respective one, or a respective subset, of the memory-side
bonding pads 1792 using any of the methods described above. In one
embodiment, each of the discrete logic-side bonding pads 2792B can
be bonded to a respective one of the memory-side bonding pads 1792,
and each of the at least one pad-level mesh structure 2792A can be
bonded to a respective plurality of memory-side bonding pads 1792
that are electrically connected to the laterally-elongated contact
via structure 76 that are configured to distribute the source power
supply voltage that is provided by the source power supply circuits
in the peripheral circuitry of the logic die 2000.
[0239] The line-level mesh structures 824A can be included within
the logic dielectric material layers 2760, and can include a
plurality of openings therethrough. A subset of the
pad-connection-level via structures (834A, 834B, 836), such as the
mesh-interconnection via structures 834A, can contact a respective
one of the at least one pad-level mesh structure 2792A and a
respective one of the line-level mesh structures 824A. Another
subset of the pad-connection-level via structures (834A, 834B, 836)
such as the second bit-line-connection metal via structures 836 can
contact a respective one of the discrete logic-side bonding pads
2792B, and can be located at a same level as the
mesh-interconnection via structures 834A. A plurality of the second
bit-line-connection metal via structures 836 can be located between
a neighboring pair of the line-level mesh structures 824A. In one
embodiment, a plurality of pad-level mesh structures 2792A can
contact a respective subset of the pad-connection-level via
structures (834A, 834B, 836), which can include a respective subset
of the mesh-interconnection via structures 834A and a respective
subset of the second source-connection metal via structures 834B.
Each of the plurality of pad-level mesh structures 2792A can be
electrically connected to each of the line-level mesh structures
824A to provide a source power distribution network within the
logic die 2000 that spans the entire area of a memory array region
within the memory-containing die (1000, 1000') that is bonded to
the logic die 2000.
[0240] Referring to FIGS. 40-45, a second exemplary configuration
of a second magnified region M2 within the first magnified region
M1 of FIG. 33 is illustrated. FIG. 40 illustrates the overlay
between first metal line structures (884, 886) located at a first
metal line level and first metal via structures (814, 816) located
at a first metal via level that overlies the first metal line
level. FIG. 41 illustrates the overlay between the first metal via
structures (814, 816) located at the first metal via level and
second metal line structures (824, 826) located at a second metal
line level that overlies the first metal via level. FIG. 42
illustrates the overlay between the second metal line structures
(824, 826) located at the second metal line level and
pad-connection-level via structures (834, 836) located at a pad
connection level that overlies the second metal line level. FIG. 43
illustrates the overlay between the pad-connection-level via
structures (834, 836) located at the pad connection level and
logic-side bonding pads 2792 located at a metal pad level that
overlies the pad connection level. FIG. 44 is a vertical
cross-sectional view along the vertical cross-sectional plane X-X'
of FIGS. 40, 41, 42, and 43 of the second magnified region M2. FIG.
45 is a vertical cross-sectional view along the vertical
cross-sectional plane Y-Y' of FIGS. 40, 41, 42, and 43 of the
second magnified region M2.
[0241] Each of the first metal line structures (884, 886), the
first metal via structures (814, 816), the second metal line
structures (824, 826), the pad-connection-level via structures
(834, 836), and the logic-side bonding pads 2792 can be included in
the logic dielectric material layer 2760, which can include a stack
of multiple dielectric material sublayers that are component layers
of the logic dielectric material layer 2760.
[0242] The first metal line structures (884, 886) located at the
first metal line level include first source-connection metal line
structures 884 that are electrically connected to output nodes of
the source power supply circuit in the peripheral circuitry of the
logic die 2000, and first bit-line-connection metal line structures
886 that are electrically connected to nodes of a sense amplifier
and bit line driver circuit, for example, through
bit-line-connection contact via structures 806. The
bit-line-connection contact via structures 806 can be electrically
connected to gate electrodes, source regions, or drain regions of
complementary metal oxide semiconductor (CMOS) transistors in a
respective sense amplifier and bit line driver circuit.
[0243] The first metal via structures (814, 816) located at the
first metal via level include first source-connection metal via
structures 814 that contact a top surface of a respective one of
the first source-connection metal line structures 884, and first
bit-line-connection metal via structures 816 that contact a top
surface of a respective one of the first bit-line-connection metal
line structures 886.
[0244] The second metal line structures (824, 826) located at a
second metal line level include isolated source-connection
line-level structures 824 that contact a respective one of the
first source-connection metal via structures 814, and second
bit-line-connection metal line structures 826 that contact a top
surface of a respective one of the bit-line-connection metal via
structures 816.
[0245] The pad-connection-level via structures (834, 836) located
at the pad connection level include second source-connection metal
via structures 834 that contact a top surface of a respective one
of the isolated source-connection line-level structures 824, and
second bit-line-connection metal via structures 836 that contact a
top surface of a respective one of the second bit-line-connection
metal line structures 826.
[0246] The logic-side bonding pads 2792 can includes a pad-level
mesh structure 2792A electrically connected to a source power
supply circuit within the peripheral circuitry through the second
source-connection metal via structures 834. The pad-level mesh
structure 2792A can contact the top surface of each second
source-connection metal via structure 834. The pad-level mesh
structure 2792A may include an array of discrete openings
therethrough. Further, the logic-side bonding pads 2792 can
comprise discrete logic-side bonding pads 2792B electrically
isolated one from another and from the pad-level mesh structure
2792A. The discrete logic-side bonding pads 2792B can contact a top
surface of a respective one of the second bit-line-connection metal
line structures 826.
[0247] A memory-containing die (1000, 1000') described above can be
provided with memory-side bonding pads 1792. The memory-side
bonding pads 1792 can be arranged such that the each of the
memory-side bonding pads 1792 can bond with the pad-level mesh
structure 2792A or one of the discrete logic-side bonding pads
2792B. The pad-level mesh structure 2792A can be provided as a
plurality of pad-level mesh structures 2792A that are laterally
spaced apart by groups of discrete logic-side bonding pads 2792B.
The logic-side bonding pads 2792 can be bonded to a respective one,
or a respective subset, of the memory-side bonding pads 1792 using
any of the methods described above. In one embodiment, each of the
discrete logic-side bonding pads 2792B can be bonded to a
respective one of the memory-side bonding pads 1792, and the
pad-level mesh structure 2792A can be bonded to a respective
plurality of memory-side bonding pads 1792 that are electrically
connected to the laterally-elongated contact via structure 76 that
are configured to distribute the source power supply voltage that
is provided by the source power supply circuits in the peripheral
circuitry of the logic die 2000.
[0248] In one embodiment, a second bit-line-connection metal via
structure 836 (as illustrated in FIG. 45) can contact one of the
discrete logic-side bonding pads 2792B. A second
bit-line-connection metal line structure 826 can contact a bottom
surface of the second bit-line-connection metal via structure 836
and can laterally extend to a region underneath a portion of the
pad-level mesh structure 2792A, such as the region in which the
second bit-line-connection metal line structure 826 underlies the
pad-level mesh structure 2792A as illustrated in FIG. 44. A first
bit-line-connection metal via structure 816 can contact a bottom
surface of the second bit-line-connection metal line structure 826
(as illustrated in FIG. 44), and can be electrically connected to a
sense amplifier within the peripheral circuitry. The second
bit-line-connection metal line structure 826, the pad-level mesh
structure 2792A, and the first bit-line-connection metal via
structure 816 can overlap one another in a plan view (such as the
view of FIG. 41) along a direction perpendicular to an interface
between the memory-containing die (1000 or 1000') and the logic die
2000 as illustrated in FIG. 44. The sense amplifiers that underlie
the areas of the pad-level mesh structure 2792A can be connected to
the bit lines 98 in the memory-containing die (1000 or 1000')
without disrupting the lateral extent of the pad-level mesh
structure 2792A.
[0249] A subset of the pad-connection-level via structures (834,
836), such as the second bit-line-connection metal via structures
836, can contact a respective one of the discrete logic-side
bonding pads 2792B. In one embodiment, a single pad-level mesh
structure 2792A can contact each of the second source-connection
metal via structures 834. The single pad-level mesh structure 2792A
can provide a source power distribution network within the logic
die 2000 that spans the entire area of a memory array region within
the memory-containing die (1000, 1000') that is bonded to the logic
die 2000. In one embodiment, each of the discrete logic-side
bonding pads 2792B can be located within a respective opening
through the pad-level mesh structure 2792A.
[0250] Referring to all drawings and according to various
embodiments of the present disclosure, a three-dimensional memory
device having a bonded assembly is provided, which comprises: a
memory-containing die (1000 or 1000') comprising a
three-dimensional memory array of memory elements (which may be
embodied, for example, as portions of charge storage layers 54
located at levels of electrically conductive layers (146, 246)), a
memory dielectric material layer 1760 located on a first side of
the three-dimensional memory array, and memory-side bonding pads
1792 included in the memory dielectric material layer 1760 and
electrically connected to a respective node within the
three-dimensional memory array; and a logic die 2000 comprising a
peripheral circuitry configured to control operation of the
three-dimensional memory array, logic dielectric material layers
2760 located on a first side of the peripheral circuitry, and
logic-side bonding pads 2792 included in the logic dielectric
material layers 2760 and electrically connected to a respective
node of the peripheral circuitry and bonded to a respective one, or
a respective subset, of the memory-side bonding pads 1792. The
logic-side bonding pads 2792 comprise: a pad-level mesh structure
2792A electrically connected to a source power supply circuit
within the peripheral circuitry and including an array of discrete
openings therethrough; and discrete logic-side bonding pads 2792B
electrically isolated one from another and from the pad-level mesh
structure 2792A.
[0251] In one embodiment, the discrete logic-side bonding pads
2792B are electrically connected to a sense circuit within the
peripheral circuitry through a subset of metal interconnect
structures (836, 826, 816, 886, 806) included within the logic
dielectric material layers 2760.
[0252] In one embodiment, the sense circuit comprises multiple
groups of sense amplifiers (each of which may be located in an area
labeled "2-SA") that are laterally spaced apart one from another;
each group (such as a group located within four contiguous areas
labeled "2-SA") among the multiple groups of sense amplifiers
includes plural sense amplifiers; discrete logic-side bonding pads
2792B are arranged as groups of logic-side bonding pads 2792B that
overlie a respective group of sense amplifiers; and each group of
logic-side bonding pads 2792B includes plural logic-side bonding
pads that are connected to an input node of a respective one of the
sense amplifiers. Each among the multiple groups of sense
amplifiers can include two through sixteen, such as six through
twelve, for example eight sense amplifiers. The number of sense
amplifiers can be selected based on transistor pitch, bit line
pitch and other factors. Each group of logic-side bonding pads
2792B can include the same number (e.g., two through sixteen, such
as six through twelve, for example eight) of logic-side bonding
pads as there are sense amplifiers.
[0253] In one embodiment, the subset of metal interconnect
structures (836, 826, 816, 886, 806) comprises:
pad-connection-level via structures (such as second
bit-line-connection metal via structures 836) contacting a
respective one of the discrete logic-side bonding pads 2792B;
interconnect metal line structures (such as second
bit-line-connection metal line structures 826) contacting a
respective one of the pad-connection-level via structures; and
interconnect metal via structures (such as first
bit-line-connection metal via structures 816) contacting a
respective one of the interconnect metal line structures.
[0254] In one embodiment, the memory-side bonding pads 1792
comprise: a plurality of memory-side source connection bonding pads
electrically connected to source regions 61 within the
memory-containing die (1000 or 1000') and bonded to the pad-level
mesh structure 2792A; and a plurality of memory-side bit line
connection bonding pads electrically connected to bit lines 98
within the memory-containing die (1000 or 1000') and bonded to a
respective one of the discrete logic-side bonding pads 2792B.
[0255] In one embodiment, the logic die 2000 comprises: a
pad-connection-level via structure (such as a second
bit-line-connection metal via structure 836) contacting one of the
discrete logic-side bonding pads 2792B; an interconnect metal line
structure (such as a second bit-line-connection metal line
structure 826) contacting a bottom surface of the
pad-connection-level via structure and laterally extending to a
region underneath a portion of the pad-level mesh structure 2792A
(such as the region in which a second bit-line-connection metal
line structure 826 underlies the pad-level mesh structure 2792A as
illustrated in FIG. 44); an interconnect metal via structure (such
as a first bit-line-connection metal via structure 816 illustrated
in FIG. 44) contacting a bottom surface of the interconnect metal
line structure and electrically connected to a sense amplifier
within the peripheral circuitry. The interconnect metal line
structure (such as the second bit-line-connection metal line
structure 826 of FIG. 44), the pad-level mesh structure 2792A, and
the interconnect metal via structure (such as the first
bit-line-connection metal via structure 816 illustrated in FIG. 44)
overlap one another in a plan view (such as the view of FIG. 41)
along a direction perpendicular to an interface between the
memory-containing die (1000 or 1000') and the logic die 2000, and
the pad-level mesh structure 2792A is electrically isolated from
the interconnect metal via structure and the interconnect metal
line structure.
[0256] In one embodiment, the memory-containing die (1000 or 1000')
comprises: a two-dimensional array of memory stack structures 55
including a respective vertical semiconductor channel 60 and a
respective vertical stack of memory elements (comprising portions
of charge storage layers 54 located at levels of the electrically
conductive layers (146, 246)); source regions 61 electrically
connected to a first end of the vertical semiconductor channels 60;
and a first subset of memory-side metal interconnect structures
1780 electrically connecting the source regions 61 to a first
subset of the memory-side bonding pads 1792 that is bonded to the
pad-level mesh structure 2792A.
[0257] In one embodiment, the memory-containing die (1000 or 1000')
comprises: bit lines 98 electrically connected to a second end of a
respective subset of the vertical semiconductor channels 60; and a
second subset of memory-side metal interconnect structures 1780
connecting the bit lines 98 to a second subset of the memory-side
bonding pads 1792 that is bonded to the discrete logic-side bonding
pads 2792B.
[0258] In one embodiment, the three-dimensional memory array
includes a two-dimensional array of vertical NAND strings located
in the memory die; each vertical NAND string in the array of
vertical NAND strings comprises charge storage elements (such as
portions of charge storage layers 54 located at the levels of the
electrically conductive layers (146, 246)) controlled by word lines
(comprising a subset of the electrically conductive layers (146,
246)) and a vertical semiconductor channel 60; a first end portion
of each vertical semiconductor channel is electrically connected to
a respective source region 61 (for example, through a horizontal
channel portion 59); a second end portion of each vertical
semiconductor channel 60 is electrically connected to a respective
bit line; the pad-level mesh structure 2792A is electrically
connected to each of the source regions 61; and the discrete
logic-side bonding pads 2792B is electrically connected to a
respective one of the bit lines 98.
[0259] The various embodiments of the present disclosure provide a
source power supply network within a logic die 2000, and minimizes
the electrical wiring requirement for source power distribution
within the memory-containing die (1000 or 1000'). The electrical
connections for the bit lines 98 to the nodes of sense amplifiers
and bit line drivers in the periphery circuitry of the logic die
2000 can be provided by using openings within a pad-level mesh
structure 2792A or by using gaps between neighboring pairs of
pad-level mesh structures 2792A, thereby minimizing disruption of
the source power supply network on the side of the logic die
2000.
[0260] The various embodiments of the present disclosure provide
stacking of a memory-containing die and a logic die for
incorporation into a single semiconductor package, thereby reducing
the packaging cost and increasing the data transfer speed between
the memory-containing die and the logic die. Furthermore, thermal
cycling on the CMOS devices can be reduced by separately
manufacturing the memory-containing die and the logic die, and by
bonding the dies together after manufacturing the dies.
[0261] Although the foregoing refers to particular embodiments, it
will be understood that the disclosure is not so limited. It will
occur to those of ordinary skill in the art that various
modifications may be made to the disclosed embodiments and that
such modifications are intended to be within the scope of the
disclosure. Compatibility is presumed among all embodiments that
are not alternatives of one another. The word "comprise" or
"include" contemplates all embodiments in which the word "consist
essentially of" or the word "consists of" replaces the word
"comprise" or "include," unless explicitly stated otherwise. Where
an embodiment using a particular structure and/or configuration is
illustrated in the present disclosure, it is understood that the
claims may be practiced with any other compatible structures and/or
configurations that are functionally equivalent provided that such
substitutions are not explicitly forbidden or otherwise known to be
impossible to one of ordinary skill in the art. All of the
publications, patent applications and patents cited herein are
incorporated herein by reference in their entirety.
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