loadpatents
name:-0.12161898612976
name:-0.095468044281006
name:-0.028243064880371
Nishida; Akio Patent Filings

Nishida; Akio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishida; Akio.The latest application filed is for "three-dimensional memory device with separated source-side lines and method of making the same".

Company Profile
36.97.99
  • Nishida; Akio - Yokkaichi JP
  • Nishida; Akio - Nagoya JP
  • Nishida; Akio - Tachikawa JP
  • Nishida; Akio - Kanagawa JP
  • Nishida; Akio - Tokyo JP
  • Nishida; Akio - Nagaokakyo N/A JP
  • Nishida; Akio - Takarazuka JP
  • NISHIDA; Akio - Nagaokakyo-shi JP
  • Nishida; Akio - Kyoto JP
  • Nishida; Akio - Kyoto-fu JP
  • NISHIDA; Akio - Kyoto-shi JP
  • Nishida; Akio - Takaraduka JP
  • Nishida, Akio - Toyonoka JP
  • Nishida, Akio - Tachikawa-shi JP
  • Nishida; Akio - Misato JP
  • Nishida; Akio - Ube JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Three-dimensional memory device with separated source-side lines and method of making the same
Grant 11,393,836 - Tsutsumi , et al. July 19, 2
2022-07-19
Three-dimensional Memory Device With Separated Source-side Lines And Method Of Making The Same
App 20220157842 - TSUTSUMI; Masanori ;   et al.
2022-05-19
Three-dimensional Memory Device With Separated Source-side Lines And Method Of Making The Same
App 20220157841 - TSUTSUMI; Masanori ;   et al.
2022-05-19
Three-dimensional device with bonded structures including a support die and methods of making the same
Grant 11,276,708 - Nishida , et al. March 15, 2
2022-03-15
Three-dimensional Memory Device Having Support-die-assisted Source Power Distribution And Method Of Making Thereof
App 20220013518 - KIM; Kwang-Ho ;   et al.
2022-01-13
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
Grant 11,201,107 - Okina , et al. December 14, 2
2021-12-14
Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer
Grant 11,195,781 - Okina , et al. December 7, 2
2021-12-07
Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof
Grant 11,133,297 - Kim , et al. September 28, 2
2021-09-28
Three-dimensional device with bonded structures including a support die and methods of making the same
Grant 11,069,703 - Nishida , et al. July 20, 2
2021-07-20
Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same
Grant 11,011,506 - Hosoda , et al. May 18, 2
2021-05-18
Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same
Grant 10,957,680 - Yada , et al. March 23, 2
2021-03-23
Bifurcated memory die module semiconductor device
Grant 10,923,462 - Hirano , et al. February 16, 2
2021-02-16
Three-dimensional memory device containing a replacement buried source line and methods of making the same
Grant 10,923,496 - Mushiga , et al. February 16, 2
2021-02-16
Bonded assembly including a semiconductor-on-insulator die and methods for making the same
Grant 10,903,164 - Nishida January 26, 2
2021-01-26
Bonded Die Assembly Using A Face-to-back Oxide Bonding And Methods For Making The Same
App 20200402990 - NISHIKAWA; Masatoshi ;   et al.
2020-12-24
Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same
Grant 10,833,100 - Sugiura , et al. November 10, 2
2020-11-10
Bonded Die Assembly Using A Face-to-back Oxide Bonding And Methods For Making The Same
App 20200335512 - NISHIKAWA; Masatoshi ;   et al.
2020-10-22
Bonded assembly containing memory die bonded to integrated peripheral and system die and methods for making the same
Grant 10,811,058 - Zhang , et al. October 20, 2
2020-10-20
Bonded assembly including a semiconductor-on-insulator die and methods for making the same
Grant 10,804,202 - Nishida October 13, 2
2020-10-13
Three-dimensional memory device containing a replacement buried source line and methods of making the same
Grant 10,797,070 - Mushiga , et al. October 6, 2
2020-10-06
Three-dimensional memory device having stressed vertical semiconductor channels and method of making the same
Grant 10,797,061 - Nishida , et al. October 6, 2
2020-10-06
Three-dimensional memory device having stressed vertical semiconductor channels and method of making the same
Grant 10,797,060 - Sharangpani , et al. October 6, 2
2020-10-06
Bonded die assembly using a face-to-back oxide bonding and methods for making the same
Grant 10,797,062 - Nishikawa , et al. October 6, 2
2020-10-06
Three-dimensional Device With Bonded Structures Including A Support Die And Methods Of Making The Same
App 20200295043 - Nishida; Akio ;   et al.
2020-09-17
Bonded Assembly Including A Semiconductor-on-insulator Die And Methods For Making The Same
App 20200294918 - Nishida; Akio
2020-09-17
Three-dimensional Device With Bonded Structures Including A Support Die And Methods Of Making The Same
App 20200286875 - NISHIDA; Akio ;   et al.
2020-09-10
Bonded Assembly Including A Semiconductor-on-insulator Die And Methods For Making The Same
App 20200266146 - Nishida; Akio
2020-08-20
Bonded Structure Including A Performance-optimized Support Chip And A Stress-optimized Three-dimensional Memory Chip And Method
App 20200258876 - A1
2020-08-13
Bonded Three-dimensional Memory Devices And Methods Of Making The Same By Replacing Carrier Substrate With Source Layer
App 20200258817 - A1
2020-08-13
Bonded Three-dimensional Memory Devices And Methods Of Making The Same By Replacing Carrier Substrate With Source Layer
App 20200258816 - A1
2020-08-13
Three-dimensional memory device containing drain-select-level air gap and methods of making the same
Grant 10,741,576 - Nishikawa , et al. A
2020-08-11
Bonded Assembly Containing Memory Die Bonded To Integrated Peripheral And System Die And Methods For Making The Same
App 20200251149 - Kind Code
2020-08-06
Three-dimensional Memory Device Including A Deformation-resistant Edge Seal Structure And Methods For Making The Same
App 20200235123 - SUGIURA; Kenji ;   et al.
2020-07-23
Semiconductor Die Stacking Using Vertical Interconnection By Through-dielectric Via Structures And Methods For Making The Same
App 20200227397 - YADA; Shinsuke ;   et al.
2020-07-16
Three-dimensional device with bonded structures including a support die and methods of making the same
Grant 10,714,497 - Nishida , et al.
2020-07-14
Three-dimensional Memory Device Containing A Replacement Buried Source Line And Methods Of Making The Same
App 20200219895 - MUSHIGA; Mitsuteru ;   et al.
2020-07-09
Three-dimensional Memory Device Containing A Replacement Buried Source Line And Methods Of Making The Same
App 20200219896 - MUSHIGA; Mitsuteru ;   et al.
2020-07-09
Vertical chip interposer and method of making a chip assembly containing the vertical chip interposer
Grant 10,700,028 - Nishida
2020-06-30
Three-dimensional Memory Device Having Stressed Vertical Semiconductor Channels And Method Of Making The Same
App 20200194446 - NISHIDA; Akio ;   et al.
2020-06-18
Three-dimensional Memory Device Having Stressed Vertical Semiconductor Channels And Method Of Making The Same
App 20200194445 - SHARANGPANI; Rahul ;   et al.
2020-06-18
Three-dimensional memory device including a deformation-resistant edge seal structure and methods for making the same
Grant 10,665,607 - Sugiura , et al.
2020-05-26
Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same
Grant 10,665,580 - Hosoda , et al.
2020-05-26
Three-dimensional Memory Device Having Support-die-assisted Source Power Distribution And Method Of Making Thereof
App 20200066703 - KIM; Kwang-Ho ;   et al.
2020-02-27
Three-dimensional Memory Device Containing Drain-selct-level Air Gap And Methods Of Making The Same
App 20200058673 - NISHIKAWA; Masatoshi ;   et al.
2020-02-20
Three-dimensional NAND memory containing dual protrusion charge trapping regions and methods of manufacturing the same
Grant 10,516,025 - Nishikawa , et al. Dec
2019-12-24
Three-dimensional memory device containing hydrogen diffusion blocking structures and method of making the same
Grant 10,515,897 - Nishikawa , et al. Dec
2019-12-24
Three-dimensional Nand Memory Containing Dual Protrusion Charge Trapping Regions And Methods Of Manufacturing The Same
App 20190386108 - NISHIKAWA; Masatoshi ;   et al.
2019-12-19
Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof
Grant 10,510,738 - Kim , et al. Dec
2019-12-17
Three-dimensional Memory Device Containing Hydrogen Diffusion Blocking Structures And Method Of Making The Same
App 20190355663 - NISHIKAWA; Masatoshi ;   et al.
2019-11-21
Bifurcated Memory Die Module Semiconductor Device
App 20190341375 - Hirano; Toshiki ;   et al.
2019-11-07
Vertical Chip Interposer And Method Of Making A Chip Assembly Containing The Vertical Chip Interposer
App 20190252361 - NISHIDA; Akio
2019-08-15
Three-dimensional Memory Device Having Support-die-assisted Source Power Distribution And Method Of Making Thereof
App 20190221557 - KIM; Kwang-Ho ;   et al.
2019-07-18
Field effect transistors having different stress control liners and method of making the same
Grant 10,355,100 - Ueda , et al. July 16, 2
2019-07-16
Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same
Grant 10,354,980 - Mushiga , et al. July 16, 2
2019-07-16
Three-dimensional memory device containing bonded chip assembly with through-substrate via structures and method of making the same
Grant 10,354,987 - Mushiga , et al. July 16, 2
2019-07-16
Three-dimensional memory device with through-stack contact via structures and method of making thereof
Grant 10,283,566 - Sel , et al.
2019-05-07
Three-dimensional memory device containing bonded memory die and peripheral logic die and method of making thereof
Grant 10,283,493 - Nishida
2019-05-07
Three-dimensional ReRAM memory device employing replacement word lines and methods of making the same
Grant 10,224,373 - Sel , et al.
2019-03-05
Methods And Apparatus For Three-dimensional Nonvolatile Memory
App 20190034125 - Sel; Jongsun ;   et al.
2019-01-31
Three-dimensional Reram Memory Device Employing Replacement Word Lines And Methods Of Making The Same
App 20190006418 - SEL; Jongsun ;   et al.
2019-01-03
Three-dimensional Memory Device With Through-stack Contact Via Structures And Method Of Making Thereof
App 20180350879 - Sel; Jongsun ;   et al.
2018-12-06
Methods and apparatus for vertical bit line structures in three-dimensional nonvolatile memory
Grant 9,673,304 - Sano , et al. June 6, 2
2017-06-06
Semiconductor integrated circuit device with reduced leakage current
Grant 9,530,485 - Osada , et al. December 27, 2
2016-12-27
Silicided bit line for reversible-resistivity memory
Grant 9,443,910 - Fujiwara , et al. September 13, 2
2016-09-13
Method For Manufacturing A Semiconductor Device
App 20160204116 - Kawashima; Yoshiyuki ;   et al.
2016-07-14
Semiconductor device and manufacturing method thereof
Grant 9,356,110 - Inoue , et al. May 31, 2
2016-05-31
Method of manufacturing semiconductor device
Grant 9,349,743 - Nakanishi , et al. May 24, 2
2016-05-24
Method for manufacturing a semiconductor device
Grant 9,324,726 - Kawashima , et al. April 26, 2
2016-04-26
Method Of Manufacturing Semiconductor Device
App 20160064226 - Kawashima; Yoshiyuki ;   et al.
2016-03-03
Method Of Manufacturing Semiconductor Device
App 20160043098 - Nakanishi; Nobuto ;   et al.
2016-02-11
Method For Manufacturing A Semiconductor Device
App 20160035734 - Kawashima; Yoshiyuki ;   et al.
2016-02-04
Semiconductor Integrated Circuit Device With Reduced Leakage Current
App 20150357026 - OSADA; Kenichi ;   et al.
2015-12-10
Semiconductor integrated circuit device with reduced leakage current
Grant 9,111,636 - Osada , et al. August 18, 2
2015-08-18
Semiconductor Integrated Circuit Device with Reduced Leakage Current
App 20150155031 - OSADA; Kenichi ;   et al.
2015-06-04
Semiconductor Device And Manufacturing Method Thereof
App 20140353740 - Nishida; Akio ;   et al.
2014-12-04
Semiconductor Device And Manufacturing Method Thereof
App 20140312406 - INOUE; Masao ;   et al.
2014-10-23
Semiconductor integrated circuit device with reduced leakage current
Grant 8,797,791 - Osada , et al. August 5, 2
2014-08-05
Method of manufacturing nonvolatile semiconductor device
Grant 8,669,172 - Yonemochi , et al. March 11, 2
2014-03-11
Isolated switching power supply apparatus including primary-side and secondary-side digital control circuits
Grant 8,587,970 - Uno , et al. November 19, 2
2013-11-19
Semiconductor Integrated Circuit Device With Reduced Leakage Current
App 20130229860 - Osada; Kenichi ;   et al.
2013-09-05
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Grant 8,476,138 - Chakihara , et al. July 2, 2
2013-07-02
Semiconductor integrated circuit device with reduced leakage current
Grant 8,437,179 - Osada , et al. May 7, 2
2013-05-07
Semiconductor Integrated Circuit Device With Reduced Leakage Current
App 20120257443 - Osada; Kenichi ;   et al.
2012-10-11
Method Of Manufacturing Nonvolatile Semiconductor Device
App 20120238089 - YONEMOCHI; Yasuaki ;   et al.
2012-09-20
Semiconductor integrated circuit device with reduced leakage current
Grant 8,232,589 - Osada , et al. July 31, 2
2012-07-31
Method of manufacturing nonvolatile semiconductor device
Grant 8,211,777 - Yonemochi , et al. July 3, 2
2012-07-03
Semiconductor Integrated Circuit Device with Reduced Leakage Current
App 20120113709 - Osada; Kenichi ;   et al.
2012-05-10
Semiconductor integrated circuit device with reduced leakage current
Grant 8,125,017 - Osada , et al. February 28, 2
2012-02-28
Method Of Manufacturing A Semiconductor Integrated Circuit Device
App 20110250752 - Chakihara; Hiraku ;   et al.
2011-10-13
Semiconductor Memory Device And A Method Of Manufacturing The Same, A Method Of Manufacturing A Vertical Misfet And A Vertical Misfet, And A Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20110230041 - CHAKIHARA; Hiraku ;   et al.
2011-09-22
Isolated Switching Power Supply Apparatus
App 20110222318 - UNO; Yoshiyuki ;   et al.
2011-09-15
Semiconductor integrated circuit device with reduced leakage current
App 20110215414 - Osada; Kenichi ;   et al.
2011-09-08
Method of manufacturing a semiconductor integrated circuit device
Grant 7,985,678 - Chakihara , et al. July 26, 2
2011-07-26
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Grant 7,972,920 - Chakihara , et al. July 5, 2
2011-07-05
Discharge tube lighting apparatus
Grant 7,973,497 - Nishida , et al. July 5, 2
2011-07-05
Semiconductor integrated circuit device with reduced leakage current
Grant 7,964,484 - Osada , et al. June 21, 2
2011-06-21
Semiconductor integrated circuit device
Grant 7,893,505 - Nishida , et al. February 22, 2
2011-02-22
Method Of Manufacturing A Semiconductor Integrated Circuit Device
App 20110021022 - Chakihara; Hiraku ;   et al.
2011-01-27
Method of manufacturing a semiconductor integrated circuit device
Grant 7,833,905 - Chakihara , et al. November 16, 2
2010-11-16
Nonvolatile Semiconductor Device And Method Of Manufacturing Nonvolatile Semiconductor Device
App 20100190330 - YONEMOCHI; Yasuaki ;   et al.
2010-07-29
Semiconductor Memory Device and a Method of Manufacturing the Same, A Method of Manufacturing a Vertical MISFET and a Vertical MISFET, and a Method of Manufacturing a Semiconductor Device and a Semiconductor Device
App 20100136778 - Chakihara; Hiraku ;   et al.
2010-06-03
Power supply unit
Grant 7,719,139 - Uno , et al. May 18, 2
2010-05-18
Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device
Grant 7,705,392 - Yonemochi , et al. April 27, 2
2010-04-27
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Grant 7,701,020 - Chakihara , et al. April 20, 2
2010-04-20
Nonvolatile Semiconductor Device And Method Of Manufacturing Nonvolatile Semiconductor Device
App 20100044772 - YONEMOCHI; Yasuaki ;   et al.
2010-02-25
Semiconductor Chip Having Gettering Layer, And Method For Manufacturing The Same
App 20090286354 - MATSUKAWA; KAZUHITO ;   et al.
2009-11-19
Method Of Manufacturing A Semiconductor Integrated Circuit Device
App 20090275193 - Chakihara; Hiraku ;   et al.
2009-11-05
Semiconductor integrated circuit device with reduced leakage current
App 20090269899 - OSADA; Kenichi ;   et al.
2009-10-29
Method of manufacturing a semiconductor integrated circuit device
Grant 7,595,266 - Chakihara , et al. September 29, 2
2009-09-29
Semiconductor Integrated Circuit Device And Method Of Manufacturing The Same
App 20090218608 - NISHIDA; Akio ;   et al.
2009-09-03
Semiconductor chip having gettering layer, and method for manufacturing the same
Grant 7,582,950 - Matsukawa , et al. September 1, 2
2009-09-01
Power Supply Unit
App 20090200870 - Uno; Yoshiyuki ;   et al.
2009-08-13
Semiconductor integrated circuit device with reduced leakage current
Grant 7,569,881 - Osada , et al. August 4, 2
2009-08-04
Discharge Tube Lighting Apparatus
App 20090160352 - NISHIDA; Akio ;   et al.
2009-06-25
Semiconductor Memory Device And A Method Of Manufacturing The Same, A Method Of Manufacturing A Vertical Misfet And A Vertical Misfet, And A Method Of Manufacturing A Semiconductor Device And A Semiconductor Device
App 20090140342 - CHAKIHARA; Hiraku ;   et al.
2009-06-04
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Grant 7,495,289 - Chakihara , et al. February 24, 2
2009-02-24
Method of manufacturing a semiconductor integrated circuit device
Grant 7,488,639 - Nishida , et al. February 10, 2
2009-02-10
Method of Manufacturing A Semiconductor Integrated Circuit Device
App 20080268639 - Chakihara; Hiraku ;   et al.
2008-10-30
Switching power supply device and electronic apparatus
Grant 7,433,208 - Nishida , et al. October 7, 2
2008-10-07
Semiconductor integrated circuit device with reduced leakage current
App 20080203437 - Osada; Kenichi ;   et al.
2008-08-28
Semiconductor integrated circuit device and a method of manufacturing the same
Grant 7,411,238 - Nishida , et al. August 12, 2
2008-08-12
Method of manufacturing a semiconductor integrated circuit device
Grant 7,402,475 - Chakihara , et al. July 22, 2
2008-07-22
Semiconductor integrated circuit device with reduced leakage current
Grant 7,388,238 - Osada , et al. June 17, 2
2008-06-17
Semiconductor Integrated Circuit Device And A Method Of Manufacturing The Same
App 20080128855 - NISHIDA; Akio ;   et al.
2008-06-05
Switching Power Supply Device and Electronic Apparatus
App 20080049472 - Nishida; Akio ;   et al.
2008-02-28
Semiconductor integrated circuit device and manufacturing method thereof
Grant 7,221,056 - Yamamoto , et al. May 22, 2
2007-05-22
Switching power supply unit
App 20070091647 - Takemura; Hiroshi ;   et al.
2007-04-26
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Grant 7,190,031 - Chakihara , et al. March 13, 2
2007-03-13
Semiconductor device and a method of manufacturing the same
Grant 7,179,737 - Nishida , et al. February 20, 2
2007-02-20
Semiconductor integrated circuit device and a method of manufacturing the same
App 20070034968 - Nishida; Akio ;   et al.
2007-02-15
Semiconductor memory device and method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Grant 7,161,215 - Chakihara , et al. January 9, 2
2007-01-09
Semiconductor integrated circuit device and a method of manufacturing the same
Grant 7,145,194 - Nishida , et al. December 5, 2
2006-12-05
Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device
App 20060231884 - Yonemochi; Yasuaki ;   et al.
2006-10-19
Semiconductor integrated circuit device with reduced leakage current
App 20060226449 - Osada; Kenichi ;   et al.
2006-10-12
Semiconductor memory device and method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
App 20060208319 - Chakihara; Hiraku ;   et al.
2006-09-21
Method of manufacturing a semiconductor integrated circuit device
Grant 7,109,126 - Chakihara , et al. September 19, 2
2006-09-19
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
App 20060202286 - Chakihara; Hiraku ;   et al.
2006-09-14
Semiconductor memory device using vertical-channel transistors
Grant 7,098,478 - Takaura , et al. August 29, 2
2006-08-29
Semiconductor integrated circuit device with reduced leakage current
Grant 7,087,942 - Osada , et al. August 8, 2
2006-08-08
SRAM having an improved capacitor
Grant 7,067,864 - Nishida , et al. June 27, 2
2006-06-27
Semiconductor integrated circuit device and method of manufacturing the same
App 20060128094 - Nishida; Akio ;   et al.
2006-06-15
Semiconductor integrated circuit device
Grant 7,045,864 - Funayama , et al. May 16, 2
2006-05-16
Semiconductor integrated circuit device with reduced leakage current
App 20060076610 - Osada; Kenichi ;   et al.
2006-04-13
Method of manufacturing a semiconductor integrated circuit device
App 20060057795 - Chakihara; Hiraku ;   et al.
2006-03-16
Semiconductor integrated circuit device with reduced leakage current
Grant 6,998,674 - Osada , et al. February 14, 2
2006-02-14
Semiconductor chip having gettering layer, and method for manufacturing the same
App 20060022321 - Matsukawa; Kazuhito ;   et al.
2006-02-02
Semiconductor memory device using vertical-channel transistors
App 20050253143 - Takaura, Norikatsu ;   et al.
2005-11-17
Semiconductor integrated circuit equipment and its manufacture method
App 20050230716 - Moriya, Satoshi ;   et al.
2005-10-20
Semiconductor device and method of manufacturing thereof
Grant 6,953,728 - Murakami , et al. October 11, 2
2005-10-11
Semiconductor memory device using vertical-channel transistors
Grant 6,943,373 - Takaura , et al. September 13, 2
2005-09-13
Semiconductor integrated circuit device with reduced leakage current
App 20050174141 - Osada, Kenichi ;   et al.
2005-08-11
Fly-back converter with constant pulse width and variable duty cycle using a capacitor in control circuit
Grant 6,922,345 - Nishida , et al. July 26, 2
2005-07-26
Switching power supply unit and electronic apparatus using the same
Grant 6,898,090 - Nishida , et al. May 24, 2
2005-05-24
Semiconductor integrated circuit device including MISFETs each with a gate electrode extended over a boundary region between an active region and an element isolation trench
Grant 6,897,499 - Nishida , et al. May 24, 2
2005-05-24
Semiconductor integrated circuit device with reduced leakage current
Grant 6,885,057 - Osada , et al. April 26, 2
2005-04-26
Semiconductor integrated circuit device and manufacturing method thereof
App 20050073051 - Yamamoto, Naoki ;   et al.
2005-04-07
Semiconductor device and a method of manufacturing the same
App 20050059236 - Nishida, Akio ;   et al.
2005-03-17
Method of manufacturing a semiconductor integrated circuit device
App 20040242014 - Chakihara, Hiraku ;   et al.
2004-12-02
Semiconductor device and method of manufacturing thereof
App 20040198002 - Murakami, Eiichi ;   et al.
2004-10-07
Semiconductor integrated circuit device and a method of manufacturing the same
App 20040164360 - Nishida, Akio ;   et al.
2004-08-26
Semiconductor memory device using vertical-channel transistors
App 20040084676 - Takaura, Norikatsu ;   et al.
2004-05-06
Semiconductor device and method of manufacturing thereof
Grant 6,727,146 - Murakami , et al. April 27, 2
2004-04-27
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
App 20040043550 - Chakihara, Hiraku ;   et al.
2004-03-04
Switching power supply unit and electronic apparatus using the same
App 20040037093 - Nishida, Akio ;   et al.
2004-02-26
Semiconductor integrated circuit device and production method therefor
App 20040009639 - Nishida, Akio ;   et al.
2004-01-15
Method of manufacturing a semiconductor integrated circuit device
Grant 6,677,194 - Yamanaka , et al. January 13, 2
2004-01-13
Semiconductor memory device using vertical-channel transistors
Grant 6,670,642 - Takaura , et al. December 30, 2
2003-12-30
Switching power supply unit having a regulator circuit and electronic apparatus using the same
Grant 6,611,436 - Nishida , et al. August 26, 2
2003-08-26
Semiconductor integrated circuit device and a method of manufacturing thereof
App 20030141558 - Nishida, Akio ;   et al.
2003-07-31
Semiconductor memory device using vertical-channel transistors
App 20030136978 - Takaura, Norikatsu ;   et al.
2003-07-24
Semiconductor integrated circuit device
Grant 6,586,807 - Nishida , et al. July 1, 2
2003-07-01
Semiconductor device and method of manufacturing thereof
App 20030054613 - Murakami, Eiichi ;   et al.
2003-03-20
Switching power supply unit
Grant 6,532,159 - Nishida , et al. March 11, 2
2003-03-11
Switching power supply unit
Grant 6,529,392 - Nishida , et al. March 4, 2
2003-03-04
Semiconductor integrated circuit device
App 20030006433 - Funayama, Kota ;   et al.
2003-01-09
Method of manufacturing a semiconductor integrated circuit device
App 20020187596 - Yamanaka, Toshiaki ;   et al.
2002-12-12
Switching power supply and electronic apparatus using the same
App 20020186572 - Nishida, Akio ;   et al.
2002-12-12
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