U.S. patent application number 11/929802 was filed with the patent office on 2008-06-05 for semiconductor integrated circuit device and a method of manufacturing the same.
Invention is credited to Hiraku Chakihara, Akio NISHIDA, Koichi Toba.
Application Number | 20080128855 11/929802 |
Document ID | / |
Family ID | 32866490 |
Filed Date | 2008-06-05 |
United States Patent
Application |
20080128855 |
Kind Code |
A1 |
NISHIDA; Akio ; et
al. |
June 5, 2008 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF
MANUFACTURING THE SAME
Abstract
In order to improve the soft error resistance of a memory cell
of an SRAM without increasing its chip size in deep through-holes
formed by perforating a silicon oxide film, there is a silicon
nitride film and a silicon oxide film, a capacitor element having a
TIN film serving as a lower electrode. This capacitor element is
connected between a storage node and a supply voltage line, between
a storage node and a reference voltage line, or between storage
nodes of the memory cell of the SRAM.
Inventors: |
NISHIDA; Akio; (Tachikawa,
JP) ; Chakihara; Hiraku; (Akishima, JP) ;
Toba; Koichi; (Tachikawa, JP) |
Correspondence
Address: |
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH SEVENTEENTH STREET, SUITE 1800
ARLINGTON
VA
22209-3873
US
|
Family ID: |
32866490 |
Appl. No.: |
11/929802 |
Filed: |
October 30, 2007 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
11584623 |
Oct 23, 2006 |
|
|
|
11929802 |
|
|
|
|
10781861 |
Feb 20, 2004 |
7145194 |
|
|
11584623 |
|
|
|
|
Current U.S.
Class: |
257/532 ;
257/E21.661; 257/E27.099; 257/E29.343 |
Current CPC
Class: |
H01L 27/11 20130101;
H01L 27/1104 20130101; H01L 27/105 20130101; H01L 27/1116 20130101;
G11C 11/4125 20130101 |
Class at
Publication: |
257/532 ;
257/E29.343 |
International
Class: |
H01L 29/92 20060101
H01L029/92 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 21, 2003 |
JP |
2003-044820 |
Claims
1. A semiconductor integrated circuit device comprising: a first
insulating film formed over a substrate; first openings formed in
the first insulating film; and a capacitor element having a first
conductive film formed along sidewalls and bottoms of the first
openings, a second insulating film formed over the first conductive
film formed over the sidewalls and the bottoms of the first
openings; wherein: the first conductive film functions as a lower
electrode, the second insulating film functions as a capacitor
insulating film, and the second conductive film functions as a
upper electrode.
2. The semiconductor integrated circuit device according to claim
1, further comprising: a third insulating film formed over the
second conductive film and fills in the first openings.
3. The semiconductor integrated circuit device according to claim
2, wherein: wiring trenches are formed in the first insulating
film, wiring lines fill the wiring trenches, and the third
insulating film is formed over the wiring lines.
4. The semiconductor integrated circuit device according to claim
2, wherein: third openings are formed in the first insulating film,
plugs fill the third openings, and the third insulating film is
formed over the wiring lines.
5. The semiconductor integrated circuit device according to claim
1, wherein the capacitor element constitutes an analog circuit.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a Divisional application of application
Ser. No. 11/584,623, filed Oct. 23, 2006, which is a Continuation
of application Ser. No. 10/781,861, filed Feb. 20, 2004, now U.S.
Pat. No. 7,145,194, which claims priority from JP 2003-044820,
filed Feb. 21, 2003, the contents of which are hereby incorporated
by reference into this application.
TECHNICAL FIELD
[0002] The present invention relates to a semiconductor integrated
circuit device and to a technique for use in the manufacture
thereof, and, more particularly, the invention relates to a
technique which is effective when applied to the manufacture of a
semiconductor integrated circuit device having a capacitor.
BACKGROUND OF THE INVENTION
[0003] An SRAM (Static Random Access Memory) is a type of RAM which
allows writing and reading operations at any time without a
refreshing operation when the electricity is on; and, it has a flip
flop circuit that is capable of storing 1 bit of information and
two information transfer MISFETs (Metal Insulator Semiconductor
Field Effect Transistors). The flip flop circuit has, for example,
a pair of drive MISFETs and a pair of load MISFETS.
[0004] In such a memory cell, soft errors due to, for example,
.alpha. rays become a problem. This phenomenon occurs when .alpha.
rays contained in the cosmic rays from outer space or alpha rays
emitted from a radioactive atom contained in the packaging material
of an LSI damage the information stored in the memory cell.
Addition of a capacitance to the information storage portion
(input/output portions of the flip flop circuit) in the memory cell
to increase the capacitance of the information storage portion is
under investigation as a countermeasure against this .alpha. ray
problem.
[0005] There is a potential danger that, as scaling-down of the
memory cell proceeds and the operating voltage lowers, the
capacitance which the memory cell itself possesses decreases and
soft errors which damage the information tend to occur.
[0006] For example, there is a technique (refer to, for example,
the below-listed Patent Document 1) of forming a capacitor between
two interconnects for cross-coupling input/output terminals of a
flip flop circuit for storing information, by adding two metal film
layers, which will constitute capacitor electrodes, and a thin
insulating film interposed therebetween, to increase the
capacitance of a storage node of the memory cell, thereby
preventing lowering of the soft error resistance.
Patent Document Japanese Patent Application Laid-Open No.
36252/1997
SUMMARY OF THE INVENTION
[0007] With miniaturization of memory cells due to high integration
thereof and size reduction of a semiconductor chip (which will
hereinafter simply be called a "chip"), the region in which a
capacitor element can be formed becomes smaller. Such a tendency
imposes a limitation on an increase in the capacitance of the
information storage portion.
[0008] When a capacitor is formed between two interconnects
cross-coupling input/output terminals of a flip flop circuit for
storing information by adding two metal film layers, which are to
serve as capacitor electrodes and a thin insulating film interposed
therebetween, a planar capacitor must be formed. A large plane area
becomes necessary to increase the capacitance, which inevitably
disturbs the scaling-down of the chip size.
[0009] An object of the present invention is to provide a technique
that is capable of improving the properties of a semiconductor
integrated circuit device.
[0010] The above-described and the other objects, and novel
features of the present invention will be apparent from the
description herein and the accompanying drawings.
[0011] An outline of the typical aspects of the present invention
will be described briefly.
[0012] In one aspect of the present invention, there is provided a
semiconductor integrated circuit device comprising a memory cell
having first and second transfer MISFETs, first and second drive
MISFETs and first and second load MISFETs, each disposed at an
intersection between a pair of complementary data lines and a word
line, the first drive MISFET and first load MISFET being
cross-coupled with the second drive MISFET and second load MISFET,
wherein:
[0013] the first and second transfer MISFETs and the first and
second drive MISFETs are formed over the main surface of a
semiconductor substrate;
[0014] a first insulating film is formed over the semiconductor
substrate and a first opening reaching a gate electrode of the
first and drive MISFETs and a drain of the first and second load
MISFETs is formed in the first insulating film;
[0015] a first capacitor element, having, as a lower electrode, a
first conductive film formed along the sidewall and bottom of the
first opening, as an insulator, a second insulating film formed
over the first conductive film, and as an upper electrode, a second
conductive film formed over the second insulating film, is formed
over the sidewall and bottom of the first opening;
[0016] over the first capacitor element, a supply voltage line, to
be electrically connected to the first and second drive MISFETs and
a reference voltage line to be electrically connected to the first
and second load MISFETs, are formed;
[0017] the lower electrode forms a first storage node of the memory
cell by electrically connecting a drain of the first drive MISFET,
a drain of the first load MISFET, a gate electrode of the second
drive MISFET and a gate electrode of the second load MISFET, and it
forms a second storage node of the memory cell by electrically
connecting a drain of the second drive MISFET, a drain of the
second load MISFET, a gate electrode of the first drive MISFET and
a gate electrode of the first load MISFET; and
[0018] the first capacitor element is electrically connected
between the first storage node and second storage node, and the
supply voltage line, between the first storage node and second
storage node, and the reference voltage line, or between the first
storage node and the second storage node.
[0019] The above-described semiconductor integrated circuit device
is manufactured by, for examples, a method including the following
steps (a) to (e):
[0020] (a) forming the first and second transfer MISFETs and the
first and second drive MISFETs over the main surface of a
semiconductor substrate;
[0021] (b) forming a first insulating film over the semiconductor
substrate, and making, in the first insulating film, a first
opening reaching a gate electrode of each of the first and second
drive MISFETs, and reaching a drain of the first and second load
MISFETs;
[0022] (c) forming a first conductive film over the sidewall and
bottom of the first opening, forming a first storage node of the
memory cell by electrically connecting, via the first conductive
film, the drain of the first drive MISFET, the drain of the first
load MISFET, the gate electrode of the second drive MISFET and the
gate electrode of the second load MISFET, and forming a second node
by electrically connecting, via the first conductive film, a drain
of the second drive MISFET, a drain of the second load MISFET, the
gate electrode of the first drive MISFET and a gate electrode of
the first load MISFET;
[0023] (d) forming a second insulating film over the first
conductive film, forming a second conductive film over the second
insulating film and forming a first capacitor element having the
first conductive film as a lower electrode, the second insulating
film serving as an insulator and the second conductive film serving
as an upper electrode; and
[0024] (e) forming a supply voltage line and a reference voltage
line over the first capacitor element.
BRIEF DESCRIPTION OF THE DRAWINGS
[0025] FIG. 1 is an equivalent circuit diagram of a memory cell of
an SRAM according to Embodiment 1 of the present invention;
[0026] FIG. 2 is an equivalent circuit diagram of another memory
cell of the SRAM according to Embodiment 1 of the present
invention;
[0027] FIG. 3 is an equivalent circuit diagram of a further memory
cell of the SRAM according to Embodiment 1 of the present
invention;
[0028] FIG. 4 is a fragmentary plan view illustrating a method of
manufacture of the SRAM according to Embodiment 1 of the present
invention;
[0029] FIG. 5 is fragmentary cross-sectional view taken along line
A-A in FIG. 4, showing a step in the manufacture of the SRAM
according to Embodiment 1 of the present invention;
[0030] FIG. 6 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 5;
[0031] FIG. 7 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 6;
[0032] FIG. 8 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 7;
[0033] FIG. 9 is a fragmentary plan view of the SRAM according to
Embodiment 1 of the present invention during its manufacture;
[0034] FIG. 10 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 8;
[0035] FIG. 11 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 10;
[0036] FIG. 12 is a fragmentary plan view of the SRAM according to
Embodiment 1 of the present invention during its manufacture;
[0037] FIG. 13 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 11;
[0038] FIG. 14 is a fragmentary plan view of the SRAM during a
manufacturing step following that in FIG. 12;
[0039] FIG. 15 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 13;
[0040] FIG. 16 is a fragmentary plan view of the SRAM during a
manufacturing step following that in FIG. 14;
[0041] FIG. 17 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 15;
[0042] FIG. 18 is a fragmentary plan view of another SRAM according
to Embodiment 1 of the present invention during its
manufacture;
[0043] FIG. 19 is a fragmentary plan view of the another SRAM
according to Embodiment 1 of the present invention during its
manufacture;
[0044] FIG. 20 is a fragmentary cross-sectional view of the another
SRAM according to Embodiment 1 of the present invention during its
manufacture;
[0045] FIG. 21 is a fragmentary cross-sectional view showing a step
in the manufacture of an SRAM according to Embodiment 2 of the
present invention;
[0046] FIG. 22 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 21;
[0047] FIG. 23 is a fragmentary plan view of the SRAM according to
Embodiment 2 of the present invention during its manufacture;
[0048] FIG. 24 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 22;
[0049] FIG. 25 is a fragmentary plan view of the SRAM during a
manufacturing step following that in FIG. 23;
[0050] FIG. 26 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 24;
[0051] FIG. 27 is a fragmentary plan view of the SRAM during a
manufacturing step following that in FIG. 25;
[0052] FIG. 28 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in FIG. 26;
[0053] FIG. 29 is a fragmentary plan view of another SRAM according
to Embodiment 2 of the present invention during its
manufacture;
[0054] FIG. 30 is a plan view of a chip having a semiconductor
integrated circuit device according to Embodiment 3 of the present
invention;
[0055] FIG. 31 is a schematic diagram of a reference power circuit
formed on the chip illustrated in FIG. 30,
[0056] FIG. 32 is a fragmentary cross-sectional view of a
semiconductor integrated circuit device which represents one
example of Embodiment 3 of the present invention;
[0057] FIG. 33 is a diagrammatic plan view of a capacitor element
compared with the above-described capacitor element formed in the
semiconductor integrated circuit device which represents one
example of Embodiment 3 of the present invention;
[0058] FIG. 34 is a cross-sectional view of the capacitor element
compared with the above-descried capacitor element formed in the
semiconductor integrated circuit device which represents one
example of Embodiment 3 of the present invention;
[0059] FIG. 35 is a fragmentary cross-sectional view of a
semiconductor integrated circuit device which represents another
example of Embodiment 3 of the present invention;
[0060] FIG. 36 is a fragmentary cross-sectional view showing a step
in the manufacture of the semiconductor integrated circuit device
which represents one example of Embodiment 3 of the present
invention;
[0061] FIG. 37 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 36;
[0062] FIG. 38 is a fragmentary plan view of the semiconductor
integrated circuit device which represents one example of
Embodiment 3 of the present invention during its manufacture;
[0063] FIG. 39 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device which represents one
example of Embodiment 3 of the present invention during its
manufacture;
[0064] FIG. 40 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 37;
[0065] FIG. 41 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 40;
[0066] FIG. 42 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 41;
[0067] FIG. 43 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 42;
[0068] FIG. 44 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device which represents one
example of Embodiment 3 of the present invention during its
manufacturing;
[0069] FIG. 45 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 43;
[0070] FIG. 46 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 45;
[0071] FIG. 47 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device which represents one
example of Embodiment 3 of the present invention during its
manufacture;
[0072] FIG. 48 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 46;
[0073] FIG. 49 is a fragmentary plan view of a semiconductor
integrated circuit device which represents another example of
Embodiment 3 of the present invention;
[0074] FIG. 50 is a fragmentary cross-sectional view showing a step
in the manufacture of a semiconductor integrated circuit device
according to Embodiment 4 of the present invention;
[0075] FIG. 51 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 50;
[0076] FIG. 52 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 51;
[0077] FIG. 53 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 52;
[0078] FIG. 54 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device according to Embodiment 4
of the present invention during its manufacture;
[0079] FIG. 55 is a fragmentary cross-sectional view showing a step
in the manufacture of a semiconductor integrated circuit device
according to Embodiment 5 of the present invention;
[0080] FIG. 56 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 55;
[0081] FIG. 57 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 56;
[0082] FIG. 58 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 57;
[0083] FIG. 59 is a fragmentary cross-sectional view of another
semiconductor integrated circuit device according to Embodiment 5
of the present invention during its manufacture;
[0084] FIG. 60 is a fragmentary cross-sectional view of the
semiconductor integrated circuit device during a manufacturing step
following that in FIG. 58;
[0085] FIG. 61 is a fragmentary cross-sectional view of another
example of the semiconductor integrated circuit device according to
Embodiment 5 of the present invention during its manufacture;
[0086] FIG. 62 is a fragmentary cross-sectional view of a further
example of the semiconductor integrated circuit device according to
Embodiment 5 of the present invention during its manufacture;
[0087] FIG. 63 is an equivalent circuit diagram of a memory cell of
an SRAM according to Embodiment 6 of the present invention;
[0088] FIG. 64 is an equivalent circuit diagram of another memory
cell of the SRAM according to Embodiment 6 of the present
invention;
[0089] FIG. 65 is an equivalent circuit diagram of a further memory
cell of the SRAM according to Embodiment 6 of the present
invention;
[0090] FIG. 66 is a fragmentary plan view illustrating a method of
manufacture of the SRAM according to Embodiment 6 of the present
invention;
[0091] FIG. 67 is a fragmentary cross-sectional view showing a step
in the manufacture of the SRAM according to Embodiment 6 of the
present invention;
[0092] FIG. 68 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 66;
[0093] FIG. 69 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 67;
[0094] FIG. 70 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 68;
[0095] FIG. 71 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 69;
[0096] FIG. 72 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 70;
[0097] FIG. 73 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 71;
[0098] FIG. 74 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 72;
[0099] FIG. 75 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that in shown FIG. 73;
[0100] FIG. 76 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 74;
[0101] FIG. 77 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 75;
[0102] FIG. 78 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 77;
[0103] FIG. 79 is a fragmentary plan view of the SRAM according to
Embodiment 6 of the present invention during its manufacture;
[0104] FIG. 80 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 78;
[0105] FIG. 81 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 80;
[0106] FIG. 82 is a fragmentary plan view of the SRAM according to
Embodiment 6 of the present invention during its manufacture;
[0107] FIG. 83 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 81;
[0108] FIG. 84 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 82;
[0109] FIG. 85 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 83;
[0110] FIG. 86 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 85;
[0111] FIG. 87 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 86;
[0112] FIG. 88 is a fragmentary plan view of the SRAM according to
Embodiment 6 of the present invention during its manufacture;
[0113] FIG. 89 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 87;
[0114] FIG. 90 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 88;
[0115] FIG. 91 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 89;
[0116] FIG. 92 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 90;
[0117] FIG. 93 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 91;
[0118] FIG. 94 is a fragmentary plan view of the SRAM during a
manufacturing step following that shown in FIG. 92;
[0119] FIG. 95 is a fragmentary cross-sectional view of the SRAM
during a manufacturing step following that shown in FIG. 93;
[0120] FIG. 96 is a fragmentary plan view of the SRAM according to
Embodiment 6 of the present invention during its manufacture;
[0121] FIG. 97 is a schematic circuit diagram showing one example
of an analog circuit according to Embodiment 7 of the present
invention;
[0122] FIG. 98 is a schematic circuit diagram showing another
example of the analog circuit according to Embodiment 7 of the
present invention;
[0123] FIG. 99 is a block diagram showing a further example of the
analog circuit according to Embodiment 7 of the present invention;
and
[0124] FIG. 100 is a fragmentary plan view of the SRAM according to
Embodiment 2 of the present invention during its manufacture.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0125] Various embodiments of the present invention will be
described specifically with reference to the accompanying drawings.
In all the drawings, members having a like function will be
identified by like reference numerals, and overlapping descriptions
thereof will be omitted.
[0126] FIGS. 1 to 3 are each an equivalent circuit diagram of a
memory cell of an SRAM according to the present invention. As
illustrated in these diagrams, the memory cell is disposed at the
intersection between a pair of complementary data lines (data line
DL and barred data line /DL) and a word line WL. The drive MISFETs
Qd1 and Qd2 and the transfer MISFETs Qt1 and Qt2 are n-channel type
MISFETs, while the load MISFETs Qp1 and Qp2 are p-channel type
MISFETs.
[0127] Of these six MISFETs constituting the memory cell MC, the
drive MISFET Qd1 and the load MISFET Qp1 constitute an inverter
INV1, and the drive MISFET Qd2 and the load MISFET Qp2 constitute
an inverter INV2. These paired inverters INV1 and INV2 have their
input/output terminals (storage nodes A1 and B1) cross-coupled to
constitute a flip-flop circuit serving as an information storage
portion for storing information of 1 bit. This flip-flop circuit
has one input/output terminal (the storage node A1) connected to
one of the source and drain of the transfer MISFET Qt1 and the
other input/output terminal (the storage node B1) connected to one
of the source and drain of the transfer MISFET Qt2. In other words,
the drain of the drive MISFET Qd1, the drain of the load MISFET
Qp1, the gate of the drive MISFET Qd2 and the gate of the load
MISFET Qp2 are electrically connected to each other and constitute
the storage node A1; while, the drain of the drive MISFET Qd2, the
drain of the load MISFET Qp2, the gate of the drive MISFET Qd1 and
the gate of the load MISFET Qp1 are electrically connected to each
other and constitute the storage node B1.
[0128] The other one of the source and drain of the transfer MISFET
Qt1 is connected to the data line DL, while the other one of the
source and drain of the transfer MISFET Qt2 is connected to the
data line /DL. The flip-flop circuit is, at one end thereof (each
of the sources of the load MISFETs Qp1 and Qp2), connected to a
supply voltage (Vcc) and, at the other end (each of the source
regions of the drive MISFETs Qd1 and Qd2), connected to a reference
voltage (ground (substrate) potential) Vss. The supply voltage Vcc
has a higher potential than the reference voltage Vss
(Vcc>Vss).
[0129] In the above-described circuit, a capacitor element C is
connected between the storage nodes A1,B1 and the supply voltage
Vcc (refer to FIG. 1), between the storage anodes A1,B1 and the
reference voltage Vss (refer to FIG. 2) or between the storage
anodes A1 and B1 (refer to FIG. 3). Such disposal of the capacitor
element C makes it possible to increase the capacitance of the
storage nodes A1,B1 of the memory cell MC and prevent lowering in
the soft error resistance, which will otherwise occur owing to
.alpha. radiation.
[0130] When the storage node A1 of the one inverter INV1 is at a
high ("H") potential, the drive MISFET Qd2 is turned ON and the
potential of the storage node B1 of the other inverter NV2 becomes
low ("L"). The drive MISFET Qd1 is therefore turned OFF and the
storage node A1 is held at a high ("H") potential. In other words,
the states of the storage nodes A1,B1 are latched by a latch
circuit having the paired inverters INV1,INV2 cross-connected, so
that the information is stored while the supply voltage is
applied.
[0131] The word line WL is connected to each gate of the transfer
MISFETs Qt1 and Qt2 and this word line WL controls ON and OFF
operation of them. More specifically, when the word line WL is at a
high potential ("H"), the transfer MISFETs Qt1 and Qt2 are ON so as
to electrically connect the flip flop circuit and the complementary
data lines (data lines DL,/DL), so that the potential state ("H" or
"L") of the storage nodes A1,B1 appears on the data lines DL,/DL
and is read out as the information of the memory cell MC.
[0132] In order to write information in the memory cell MC, the
information of the data lines DL,/DL is transmitted to the storage
nodes A1,B1 by setting the word line WL to the "H" potential level
and by turning the transfer MISFETs Qt1 and Qt2 ON.
[0133] A method of manufacture of the above-described SRAM of
Embodiment 1 will be described next based on FIGS. 4 to 17. In
FIGS. 4 to 17, even a plan view is, in some cases, hatched to
facilitate understanding of the manufacturing steps in the
fabrication of the SRAM of Embodiment 1.
[0134] As illustrated in FIGS. 4 and 5, an element isolation 2 is
formed over the main surface (element formation surface) of a
semiconductor substrate (which will hereinafter simply be called a
"substrate") 1. FIG. 4 is a plan view of the substrate 1
illustrating a region corresponding to about one memory cell, and
FIG. 5 is a cross-sectional view taken along a line A-A of FIG.
4.
[0135] This element isolation 2 can be formed, for example, in the
following manner. First, the main surface of a substrate 1 made of
p type single crystal silicon and having a specific resistance of
from about 1 to 10 .OMEGA.cm is etched to form a groove therein.
The substrate 1 is then thermally oxidized at about 1000.degree. C.
to form a thin silicon oxide film (not illustrated) over the inside
wall of the groove. This silicon oxide film is formed for the
purpose of repairing damage on the inside wall of the groove caused
by dry etching and, at the same time, relaxing stress appearing at
the interface between the substrate 1 and the silicon oxide film to
be embedded inside of the groove in the subsequent step. A silicon
oxide film 3 is then deposited as an insulating film over the
substrate 1 including the inside of the groove by, for example, CVD
(Chemical Vapor Deposition). The silicon oxide film 3 over the
groove is polished by chemical mechanical polishing (CMP) so as to
leave a portion of the silicon oxide film 3 inside of the groove,
whereby the element isolation 2 is formed.
[0136] After ion implantation of an impurity having a p type
conductivity (for example, B (boron)) and an impurity having an n
type conductivity (for example, P (phosphorus)) into the substrate
1, the substrate 1 is heat treated to diffuse these impurities in
the substrate 1 to form a p type well 4 and an n type well 5
therein. At this time, active regions An1,An2,Ap1,Ap2 which are
main surfaces of two p type wells 4 and 2 two n type wells 5 are
formed in the substrate 1 and these active regions are surrounded
by the element isolation 2.
[0137] As will be described later, of the six MISFETs (transfer
MISFETs Qt1,Qt2, drive MISFETs Qd1,Qd2 and the load MISFETs
Qp1,Qp2), concerning MISFETs of the n-channel type, the transfer
MISFET Qt1 and drive MISFET Qd1 are formed over the active region
Ap1 (p type well 3), and the transfer MISFETs Qt2 and the drive
MISFET Qd2 are formed over the active region Ap1 (p type well 3).
Concerning the MISFETs of the p-channel type, the load MISFET Qp2
is formed over the active region Ap1 (n type well 4), and the load
MISFET Qp1 is formed over the active region An2 (n type well 4). As
illustrated in FIG. 4, between the transfer MISFET Qt1 and drive
MISFET Qd1, and the transfer MISFET Qt2 and drive MISFET Qd2 in the
first direction, the load MISFETs Qp1,Qp2 are disposed, and the
channel length of each of these MISFETs is defined by the width in
the second direction crossing the first direction.
[0138] Next, after wet washing of the surface of the substrate 1 (p
type well 4 and n type well 5) with, for example, a hydrofluoric
acid detergent, the substrate 1 is heat treated to form, over the
surface of each of the p type well 4 and n type well 5, a clean
gate oxide film 7 serving as a gate insulating film.
[0139] A low resistance polycrystalline silicon film of about 100
nm thick is deposited, as a conductive film, by CVD over the
substrate 1. Using a photoresist film (not illustrated) that has
been patterned by photolithography as a mask, the polycrystalline
silicon film is etched to form gate electrodes 8, each made of a
polycrystalline silicon film. At this time, over the active region
Ap1, gate electrodes 8 of the respective transfer MISFET Qt1 and
the drive MISFET Qd1, which MISFETs will be formed later, are
formed, while over the active region Ap2, gate electrodes 8 of the
respective transfer MISFET Qt2 and the drive MISFET Qd2, which
MISFETs will be formed later, are formed. Over the active region
An1, a gate electrode 8 of the load MISFET Qp2, which MISFET will
be formed later, is formed, and over the active region An2, a gate
electrode 8 of the load MISFET Qp1, which MISFET will be formed
later, is formed (refer to FIG. 6). These gate electrodes are
formed to extend in a direction (first direction) perpendicular to
the line A-A of FIG. 6. The gate electrode 8 is formed to be common
to the load MISFET Qp1 and the drive MISFET Qd1, and to the load
MISFET Qp2 and the drive MISFET Qd2.
[0140] After deposition of a silicon oxide film over the substrate
1 by CVD, the silicon oxide film is anisotropically etched by
reactive ion etching (RIE) to form a sidewall spacer 9 over the
sidewall of the gate electrode 8. An impurity (for example, P)
having an n conductivity type is then introduced into both sides of
the gate electrode 8 in the upper part of the p type well 4 to form
n type semiconductor regions (source and drain, not illustrated) of
the drive MISFET Qd and the transfer MISFET Qt, while an impurity
(for example, B) having a p conductivity type is introduced into
the upper part of the n type well 4 to form p type semiconductor
regions (source and drain) 10 of the load MISFET Qp. Alternatively,
an LDD (lightly doped drain) structure may be formed by forming the
n type semiconductor regions and p type semiconductor regions of a
low concentration prior to the formation of the sidewall spacer 9
and forming the n type semiconductor regions and p type
semiconductor regions of a high concentration after the formation
of the sidewall spacer 9. By the steps so far mentioned, six
MISFETs (drive MISFETs Qd1,Qd2, transfer MISFETs Qt1,Qt2, and load
MISFETs Qp1,Qp2) constituting the memory cell MC are completed.
[0141] After washing the surface of the substrate 1, a Co film and
a Ti film are deposited successively over the substrate 1 by
sputtering. The substrate 1 is then heat treated to form a
CoSi.sub.2 layer 12 as a silicide layer over the n type
semiconductor regions, p type semiconductor regions 10 and gate
electrode 8. In this Embodiment 1, a means for forming such a
CoSi.sub.2 layer 12 is given as an example, but instead, a
refractory metal silicide layer such as NiSi.sub.x layer, WSi.sub.x
layer, MoSi.sub.x layer, TiSi.sub.x layer or TaSi.sub.x layer may
be formed using Ni (nickel), W (tungsten), Mo (molybdenum), Ti
(titanium) or Ta (tantalum).
[0142] After removal of unreacted portions of the Co film and Ti
film by etching, the substrate 1 is heat treated to lower the
resistance of the CoSi.sub.2 layer 12.
[0143] A silicon nitride film 17 of about 50 nm thick is then
deposited over the substrate 1 by, for example, CVD. This silicon
nitride film 17 plays the role of an etching stopper layer upon
formation of a contact hole, which will be described later.
[0144] An interlayer insulating film, for example, PSG (Phosphor
Silicate Glass) film (first insulating film) 20 is applied onto the
silicon nitride film 17, followed by heat treatment to planarize
the film. Over this PSG film 20, a silicon oxide film (first
insulating film) 21 is deposited by plasma CVD. Alternatively,
after deposition of the silicon oxide film 21 over the silicon
nitride film 17 without deposition of the PSG film 20, the surface
of the silicon oxide film 21 may be polished by CMP to planarize
the surface. A silicon nitride film 22 is then deposited over the
silicon oxide film 21 by, for example, CVD.
[0145] As illustrated in FIG. 6, by etching using a photoresist
film (not illustrated) as a mask, the silicon nitride film 22 is
patterned. After removal of the photoresist film, the silicon oxide
film 21 and the PSG film 20 are etched successively through a mask
of the silicon nitride film 22 to form an opening. The silicon
nitride film 22 and the silicon nitride film 17, exposed from the
bottom of the opening portion thereof, are etched to form a contact
hole (third opening) 25 over n type semiconductor regions, p type
semiconductor regions 10 and the gate electrode 8 of each of the
transfer MISFETs Qt1,Qt2.
[0146] Over the silicon oxide film 21 including the inside of the
contact hole 25, a Ti film of about 10 nm thick and a TiN film of
about 50 nm thick are deposited successively as a barrier film over
the silicon oxide film 21 including the inside of the contact hole
25, followed by heat treatment at 500 to 700.degree. C. for 1
minute. A W film (third conductive film) is deposited as a
conductive film over the silicon oxide film 21 and the barrier
films by CVD to fill the W film in the contact hole 25. The W film,
TiN film and Ti film over the silicon oxide film 21 are removed by
etch back or CMP to leave the W film, TiN film and Ti film inside
of the contact hole 25. By this step, a plug 26 having the TiN film
and Ti film as a barrier film and the W film 26 as a main
conductive layer is formed inside of the contact hole 25. A silicon
nitride film 27 is deposited over the substrate 1.
[0147] As illustrated in FIG. 7, using a photoresist film RESI1 as
a mask, the silicon nitride film 27, silicon oxide film 21 and PSG
film 20 are etched, followed by dry etching of the silicon nitride
film 17 to form an interconnect groove 31 over the n type
semiconductor regions and p type semiconductor regions 10. In one
memory cell, two such interconnect grooves (first openings) 31 are
formed. One interconnect groove 31 extends over the drain of the
drive MISFET Qd1 and the drain of the load MISFET Qp1 in the first
direction, turns toward the second direction, and then, extends
over the gate electrode 8 of the drive MISFET Qd2. The other
interconnect groove 31 extends over the drain of the drive MISFET
Qd2 and the drain of the drive load MISFET Qp2 in the first
direction, turns towards the second direction, and extends over the
gate electrode 8 of the drive MISFET Qd1. A plan view illustrating
a plane pattern of the interconnect groove 31 showing the L-shaped
extension will be shown on and after FIG. 9.
[0148] After removal of the photoresist film RESI1, a titanium
nitride (TiN) film (first conductive film) 32 that is about 50 nm
thick is deposited over the substrate 1 including the inside of the
interconnect groove 31 by, for example, sputtering as illustrated
in FIG. 8. A silicon nitride film (second insulating film) 33 that
is about 10 to 20 nm thick is deposited over the titanium nitride
(TiN) film 32 by, for example, CVD. A titanium nitride (TiN) film
(second conductive film) 34 that is about 50 nm thick is then
deposited over the silicon nitride film 33 by, for example,
sputtering. A W film 35 is deposited over the titanium nitride
(TiN) film 34 by, for example, CVD to fill the interconnect groove
31 with the titanium nitride (TiN) film 32, silicon nitride film 33
and W film 35.
[0149] As illustrated in FIGS. 9 and 10, the W film 35, titanium
nitride film 34, silicon nitride film 33 and titanium nitride film
32 over the silicon nitride film 27 are removed by CMP with the
silicon nitride film 27 serving as a terminal point of the
polishing. By this step, a capacitor element (first capacitor
element) C (refer to FIGS. 1 to 3) having the titanium nitride film
32, silicon nitride film 33 and titanium nitride film 34 as a lower
electrode, an insulator and an upper electrode, respectively, and
an interconnect 36 made of the W film 35 can be formed in the
interconnect groove 31. More specifically, the lower electrode
(titanium nitride film 32) of the capacitor element C is formed all
over the bottom and circumference of the interconnect groove 31,
and, at the same time, it forms a capacitance, together with the
upper electrode (titanium nitride film 34) of the capacitor element
C via the dielectric film (silicon nitride film 33) of the
capacitor element C. This enables the use of the bottom and
circumference of the sidewall of the groove 31 as a capacitor
element area, leading to an improvement in the capacitance.
[0150] In such a capacitor element C of Embodiment 1, the titanium
nitride film 32 not only serves as a lower electrode (titanium
nitride film 32) of the capacitor element C, but also can operate
as an interconnect (local interconnect) for electrically connecting
the gate electrode common to the drive MISFET Qd2 (or drive MISFET
Qd1) and the load MISFET Qp2 (or load MISFET Qp1), the drain
regions of the drive MISFET Qd1 (or drive MISFET Qd2) and the load
MISFET Qp1 (or load MISFET Qp2) and the storage node A1 (or storage
node B1). This brings about an improvement in the capacitance of
the capacitor element C without enlarging the memory size. The
titanium nitride film 34 can also operate as a barrier metal film
for the interconnect 36 made of the W film 35. Via such an
interconnect 36, the drain of the load MISFET Qp1 is electrically
connected to the drain of the drive MISFET Qd1 and the drain of the
load MISFET Qp2 is electrically connected to the drain of the drive
MISFET Qd2. In FIG. 9, the plug 26 and interconnect 36 (capacitor
element C) are hatched to facilitate a better understanding of the
positional relationship of these members.
[0151] By forming the capacitor element C while making use of the
bottom and circumference of the sidewall of the interconnect groove
31, the memory cell MC (refer to FIGS. 1 to 3) of the SRAM can be
added with a capacitance for preventing a lowering of the soft
error resistance due to .alpha. radiation without increasing the
memory cell area of the SRAM of Embodiment 1. In other words, even
if a capacitance for preventing lowering in the soft error
resistance is added to the memory cell MC of the SRAM, an increase
in the chip size of the memory cell MC of the SRAM of Embodiment 1,
which will otherwise occur thereby, can be suppressed.
[0152] For example, the capacitance of the capacitor element C can
be increased and higher soft error resistance can be realized by
thickening at least one of the PSG film 20 and silicon oxide film
21, in which a groove has been formed, to enlarge the areas of the
upper electrode and lower electrode of the capacitor element.
Alternatively, replacement of the silicon nitride film 33 with an
insulating film (for example, tantalum oxide film) having a higher
specific dielectric constant than that of the silicon nitride film
33 makes it possible to increase the capacitance of the capacitor
element C and realize a higher soft error resistance.
[0153] As illustrated in FIG. 11, the silicon nitride film 27 over
the silicon oxide film 21 is then removed by, for example, CMP.
[0154] As illustrated in FIGS. 12 and 13, a silicon oxide film is
deposited over the substrate 1 to form an interlayer insulating
film 38. Using a photoresist film (not illustrated) patterned by
photolithography as a mask, the interlayer insulating film 38 is
etched to form a contact hole 39 reaching the plug 26 and a contact
hole 40 reaching the interconnect 36. Upon formation, the opening
position of the contact hole 40 is adjusted so that the capacitor
element C is not exposed from the bottom of the contact hole
40.
[0155] Over the interlayer insulating film 38 including the insides
of the contact holes 39 and 40, a silicon nitride film 41 is
deposited. The thickness of the silicon nitride film 41 is adjusted
to as to be thicker than the total thickness of the titanium
nitride films 32 and 34 and silicon nitride film 33 constituting
the capacitor element C. The silicon nitride film 41 is
anisotropically etched to leave the silicon nitride film 41 only
over the sidewalls of the contact holes 39 and 40. If the opening
position of the contact hole 40 inevitably deviates in the
direction of the sidewall of the interconnect groove 31 and the
upper electrode and lower electrode of the capacitor element C are
exposed from the bottom of the contact hole 40, there is a fear,
upon formation of a plug in the contact hole 40 in the step
described later, of a short circuit occurring between the upper
electrode and lower electrode of the capacitor element C by the
plug. In this Embodiment 1, therefore, the silicon nitride film 41
is formed over the sidewall of the contact hole 40 as described
above for the purpose of preventing the occurrence of a short
circuit between the upper electrode and lower electrode of the
capacitor element C. In connection with this Embodiment 1,
formation of the silicon nitride film 41 over the sidewall of each
of the contact holes 39 and 40 offered as an example, but the
silicon nitride film 41 may be replaced with a silicon oxide film.
When a silicon oxide film is used, it can be left over the sidewall
of each of the contact holes 39 and 40 by forming the silicon oxide
film through a method that is capable of increasing the difference
in the etching rate between the silicon oxide film and the
interlayer insulating film 38.
[0156] Then, a TiN film that is about 10 nm thick and a TiN film
that is about 50 nm thick are successively deposited as a barrier
film over the interlayer insulating film 38 including the insides
of the contact holes 39 and 40 by, for example, sputtering,
followed by heat treatment at about from 500 to 700.degree. C. for
1 minute. A W film is deposited as a conductive film over the
barrier film and interlayer insulating film 38 by, for example, CVD
to fill the contact holes 39 and 40 with the W film. Then, the Ti
film, TiN film and W film over the interlayer insulating film 38
are removed to leave the Ti film, TiN film and W film in the
contact holes 39 and 40, whereby plugs 42 and 43 are formed in the
contact holes 39 and 40, respectively. In FIG. 12, the plugs 42 and
43 are hatched.
[0157] As illustrated in FIGS. 14 and 15, a Ti film, Al (aluminum)
film and titanium nitride film are deposited in this order over the
interlayer insulating film 38 successively as a conductive film.
Using a photoresist film (not illustrated) patterned by
photolithography as a mask, the Ti film, Al film and titanium
nitride film are etched to form interconnects 44 and 45. At this
time, the interconnect 44 is electrically connected, via the plugs
26 and 42, to any one of the source of each of the drive MISFETs
Qd1,Qd2, the source of each of the load MISFETs Qp1,Qp2, and the
source and drain of each of the transfer MISFETs Qt1,Qt2. The
interconnect 45 that is electrically connected to the gate
electrodes 8 of the respective transfer MISFETs Qt1,Qt2 via the
plugs 26 and 42 becomes a word line WL (refer to FIGS. 1 to 3). In
FIG. 14, the interconnects 44 and 45 are indicated with
hatching.
[0158] As illustrated in FIGS. 16 and 17, a silicon nitride film 46
is deposited over the interconnects 44 and 45 as well as over the
interlayer insulating film 38. By anisotropic etching of the
silicon nitride films 46, the silicon nitride film 46 is left only
over the sidewalls of the interconnects 44 and 45.
[0159] Then, a silicon oxide film is deposited over the substrate 1
to form an interlayer insulating film 47. Using a photoresist film
(not illustrated) patterned by photolithography, the interlayer
insulating film 47 is etched to form a contact hole 48 reaching the
interconnect 44 and a contact hole 49 reaching the plug 43.
[0160] When the opening position of the contact hole 49 deviates in
the direction of the sidewall of the interconnect 45 and the
interconnect 45 is exposed from the sidewall of the contact hole
49, there is a fear of inconvenience, such as the occurrence of a
short circuit, upon formation of a plug in the contact hole 49 in
the step which will be described later, between the plug and the
interconnect 45. In this Embodiment 1, a silicon nitride film 46,
which is a sidewall insulating film, is formed over the sidewall of
the interconnect 45, as described above for the purpose of
preventing exposure of the interconnect 45 from the sidewall of the
contact hole 49 upon opening of the contact hole 49 by making use
of a difference in the etching rate between the silicon nitride
film 46 and the silicon oxide film forming the interlayer
insulating film 47. This makes it possible to prevent in advance a
short circuit of the interconnect 45 and the plug to be formed
inside of the contact hole 49. In this Embodiment 1, the silicon
nitride film 46 is formed over the sidewalls of the interconnects
44 and 45, but the silicon nitride film 46 may be replaced by a
silicon oxide film. When a silicon oxide film is employed, on the
other hand, it can be left over the sidewalls of the interconnects
44 and 45 by using a method that is capable of widening the
difference in etching rate between the silicon oxide film and the
interlayer insulating film 47. After formation of the interconnects
44 and 45 and the sidewall insulating film (silicon nitride film
46), but prior to the formation of the interlayer insulating film
47, an etching stopper layer serving as a stopper upon etching of
the interlayer insulating film 47 may be deposited. The etching
stopper layer is made of, for example, a silicon nitride film that
is 100 nm thick or less. It facilitates control of an over etch
amount during the formation of the contact holes 48 and 49. It is
needless to say that in the below-described modification example or
another embodiment, such an etching stopper layer may be disposed
prior to the formation of the interlayer insulating film, such as
the interlayer insulating film 47.
[0161] Plugs 50 and 51 are then formed in the contact holes 48 and
49. These plugs 50 and 51 can be formed, for example, in a similar
step to that employed for the formation of the above-described
plugs 42 and 43.
[0162] Over the interlayer insulating film 47, an interconnect 52
to be connected to the plug 50 and an interconnect 53 to be
connected to the plug 50 and the plug 51 are formed to complete the
SRAM of this Embodiment 1. These interconnects 52 and 53 can be
formed, for example, in a similar step to that employed for the
formation of the interconnects 44 and 45. By repeating steps
similar to those employed for the formation of the interlayer
insulating film 47, plugs 50 and 51 and interconnects 52 and 53, a
multilayer interconnect may be formed. In FIG. 16, the
interconnects 52 and 53 are hatched.
[0163] By the interconnect 52, a reference voltage Vss is fed to
the source of each of the drive MISFETs Qd1,Qd2, while by the
interconnect 53, a supply voltage Vcc is fed to the source of each
of the load MISFETs Qp1,Qp2. By the interconnect 53, a supply
voltage Vcc is fed to the upper electrode (titanium nitride film 34
(refer to FIG. 10)) of the capacitor element C. The lower electrode
(titanium nitride film 32 (refer to FIG. 10)) of the capacitor
element C is electrically connected to the drain of each of the
drive MISFETs Qd1,Qd2 and the drain of each of the load MISFETs
Qp1,Qp2. As a result, the capacitor element C can be a capacitor
element that is electrically connected between the storage anodes
A1,B1 and the supply voltage Vcc. Interconnects 52 that is
electrically connected to the source and drain of the transfer
MISFETs Qt1,Qt2 serve as data lines DL,/DL, respectively. This
makes it possible to realize the circuit as illustrated in FIG.
1.
[0164] A method of formation of the capacitor element C, to be
electrically connected between the storage node Al and the storage
node B1, as illustrated in FIG. 3, will be described.
[0165] The steps of this method up to the deposition of the
titanium nitride (TiN) film (first conductive film) 32 and silicon
nitride film (second insulating film) 33, as illustrated in FIG. 8,
are similar to those employed above. Prior to the deposition of a
titanium nitride film 34, the silicon nitride film 33 is etched in
one of the two interconnect grooves 31, and in the silicon nitride
film 33, a through-hole TH reaching the titanium nitride film 32,
which will be the lower electrode of a capacitor element C, is
formed. When the titanium nitride film 34 to be the upper electrode
of the capacitor element C is formed in the presence of such a
through-hole TH, the titanium nitride film 34 reaches the
underlying titanium nitride film 32 through the through-hole TH in
one of the two interconnect grooves 31 to electrically connect the
titanium nitride film 32 and the titanium nitride film 34. The
subsequent steps are essentially similar to the above-described
ones, except that, as illustrated in FIGS. 19 and 20, the plane
patterns of the interconnects 52 and 53 are different from that
illustrated in FIG. 16. More specifically, the interconnect 53
(Vcc), which is electrically connected to the plug 50 and feeds a
supply voltage Vcc to the source of each of the load MISFETs
Qp1,Qp2, is disposed as an interconnect that is different from an
interconnect 53A for electrically connecting two plugs 51 and the
upper electrode 34 of the capacitor element C. By the interconnect
53A, two upper electrodes (titanium nitride films 34) formed in two
respective interconnect grooves 31 are electrically connected via
the plugs 51, and in the other one of the two interconnect grooves
31, the capacitor element C is formed. FIG. 18 illustrates an
example in which the lower electrode (titanium nitride film 32) of
the capacitor element C is electrically connected to the storage
node B1 and the upper electrode (titanium nitride film 34) of the
capacitor element C is electrically connected to the storage node
Al. In one of the two interconnect grooves 31, the lower electrode
(titanium nitride film 32) of the capacitor element C is
electrically connected to the storage node Al (or storage node B1)
and the upper electrode (titanium nitride film 34) is electrically
connected to the storage node B1 (or storage node Al) so that the
capacitor element C can be formed over the bottom and circumference
of the sidewall of the interconnect groove 31. This makes it
possible to constitute the capacitor element C as a capacitor that
is electrically connected between the storage node Al and storage
node B1. In short, the circuit as illustrated in FIG. 3 can be
realized.
[0166] Although not illustrated, an interconnect is formed for
electrically connecting the interconnect 53 (Vcc) to an
interconnect layer formed over the interconnects 52 and 53 via an
interlayer insulating film and for feeding the memory cell MC with
a supply voltage Vcc, for example.
[0167] The method of formation of the capacitor element C to be
electrically connected between the storage node Al and storage node
B1 is not limited to the above-described one. The capacitor element
C can be formed between the storage node Al and storage node B1
without disposing the through-hole TH illustrated in FIG. 18. In
this case, one of the electrodes of the capacitor element C is made
of a lower electrode (titanium nitride film 32) formed in one of
the interconnect grooves 31, while the other electrode is made of a
lower electrode (titanium nitride film 32) formed in the other
interconnect groove 31. Between these electrodes (titanium nitride
films 21) of the capacitor element C, a floating electrode
(titanium nitride film 34) is formed via a dielectric film (silicon
nitride film 33). The capacitance of the capacitor element becomes
smaller compared with that of the above-described capacitor element
between the storage nodes Al and B1, but the number of
manufacturing steps can be reduced.
Embodiment 2
[0168] A manufacturing method according to Embodiment 2 will be
described next with reference to FIGS. 21 to 28. In this Embodiment
2, some plan views are hatched to facilitate a better understanding
of the manufacturing steps used in the fabrication of the SRAM
according to Embodiment 2.
[0169] The manufacturing method of Embodiment 2 is similar to that
of Embodiment 1 in the manufacturing steps as illustrated in FIGS.
4 to 7.
[0170] Then, as illustrated in FIG. 21, a titanium nitride film 32
similar to the titanium nitride film 32 (refer to FIG. 8) of
Embodiment 1 is deposited over the substrate 1 including the inside
of the interconnect groove 31. By etching using a photoresist film
RESI2 patterned by photolithography as a mask, the titanium nitride
film 32 over the silicon nitride film 27 is removed, while leaving
a predetermined amount of it, and the titanium nitride film 32
(lower electrode of the capacitor element C) is left inside of the
interconnect groove 31.
[0171] After removal of the photoresist film RESI2, a silicon
nitride film 33 similar to the silicon nitride film 33 (refer to
FIG. 8) of Embodiment 1, and a titanium nitride film 34 similar to
the titanium nitride film 34 (refer to FIG. 8) are successively
deposited over the substrate 1 including the inside of the
interconnect groove 31. By etching using a photoresist film RESI3
patterned by photolithography as a mask, the silicon nitride film
33 which is to serve as an insulator (dielectric film) of the
capacitor element C, and the titanium nitride film 34 (upper
electrode of the capacitor element C) are patterned. By the steps
so far mentioned, the capacitor element C having the titanium
nitride film 32 as a lower electrode, the silicon nitride film 33
as an insulator and the titanium nitride film 34 as an upper
electrode can be formed. This patterning is carried out in such a
manner as to cover the titanium nitride film 32 (lower electrode)
with the silicon nitride film 33 and cause the silicon nitride film
33 and the titanium nitride film 34 (upper electrode) to extend
longer than the underlying titanium nitride film 32 on one side (in
FIG. 22, a side opposite to the side on which the plug 26 is
formed) over the silicon nitride film 27. The reason for this will
be described later.
[0172] In this embodiment, similar to the above-described
Embodiment 1, the lower electrode (titanium nitride film 32) of the
capacitor element C is formed over the bottom and circumference of
the sidewall of the interconnect groove 31, and, at the same time,
over the bottom and circumference of the sidewall of the
interconnect groove 31, it forms a capacitance, together with the
upper electrode (titanium nitride film 34) of the capacitor element
C via the dielectric film (silicon nitride film 33) of the
capacitor element C. This makes it possible to use the bottom and
circumference of the sidewall of the interconnect groove 31 as a
capacitance area, leading to an improvement in capacitance.
[0173] After removal of the photoresist film RESI3, a silicon oxide
film to be filled in the interconnect groove 31 is deposited over
the substrate 1, as illustrated in FIGS. 23 and 24, to form an
interlayer insulating film (fourth insulating film) 38. Using a
photoresist film (not illustrated) patterned by photolithography as
a mask, the interlayer insulating film 38 is etched to form a
contact hole 39 reaching the plug 26 and a contact hole (connecting
hole) 40 reaching the titanium nitride film 34, which serves as an
upper electrode of the capacitor element C, over the silicon
nitride film 27.
[0174] In the contact holes 39 and 40, plugs (conductive layers) 42
and 43 similar to the plugs 42 and 43 (refer to FIGS. 12 and 13) of
Embodiment 1 are formed. In FIG. 23, the plugs 42 and 43 are
hatched.
[0175] As described above, since the silicon nitride film 33 and
titanium nitride film 34 are patterned so that the silicon nitride
film 33 covers the titanium nitride film 32, and on the silicon
nitride film 27, the silicon nitride film 33 and titanium nitride
film 34 extend longer than the underlying titanium nitride film 32
on one side of the interconnect groove 31, the contact hole 40 does
not reach the titanium nitride film 32, making it possible to
prevent occurrence of an inconvenience, such as a short circuit
between the upper electrode and lower electrode of the capacitor
element by the plug 43. In addition, since the silicon nitride film
33 and titanium nitride film 34 are patterned to extend over the
silicon nitride film 27, and the contact hole 40 is made over the
titanium nitride film 27, a margin appears at the opening position
of the contact hole 40 in the plane. By this, a deviation of the
opening position of the contact hole 40 from a predetermined
position can be avoided, which makes it possible to prevent the
contact hole 40 from reaching the gate electrode 8 below the
interconnect groove 31, thereby preventing the occurrence of an
inconvenience, such a as short circuit between the plug 43 and gate
electrode 8.
[0176] As illustrated in FIGS. 25 and 26, a Ti film, Al film and
titanium nitride film are deposited successively in the order of
mention over the interlayer insulating film 38. With a photoresist
film (not illustrated) patterned by photolithography as a mask, the
Ti film, Al film and titanium nitride film are etched to form
interconnects 44 and 45. At this time, the interconnect 44 is
electrically connected to any one of the source of each of the
drive MISFETs Qd1,Qd2, the source of each of the load MISFETs
Qp1,Qp2 and the source and drain of each of the transfer MISFETs
Qt1,Qt2 via the plugs 26 and 42. Some of the interconnects 44 are
electrically connected to the upper electrode (titanium nitride
film 34) of the capacitor element C via the plug 43. The
interconnect 45 which electrically connects the gate electrodes 8
of the transfer MISFETs Qt1,Qt2 via the plugs 26 and 42 serves as a
word line WL (refer to FIGS. 1 to 3). In FIG. 25, the interconnects
44 and 45 are hatched.
[0177] As illustrated in FIGS. 27 and 28, an interlayer insulating
film 47, contact hole 48, plug 50 and interconnects 52 and 53 are
formed in similar steps to those described based on FIGS. 16 and 17
of Embodiment 1 to fabricate the SRAM of Embodiment 2. In
Embodiment 2, similar to Embodiment 1, by repeating the
above-described steps for the formation of the interlayer
insulating film 47, plug 50 and interconnect 52, a multilayer
interconnect may be formed. In FIG. 27, the interconnects 52 and 53
are hatched.
[0178] Via the interconnect 52, a reference voltage Vss is fed to
the source of each of the drive MISFETs Qd1,Qd2, while via the
interconnect 53, a supply voltage Vcc is fed to the drain of each
of the load MISFETs Qp1,Qp2. Via the interconnect 53, a supply
voltage Vcc is fed to the upper electrode (titanium nitride film 34
(refer to FIG. 22)) of the capacitor element C. The lower electrode
(titanium nitride film 32 (refer to FIG. 22)) of the capacitor
element C is electrically connected to the source of the load
MISFETs Qp1,Qp2. As a result, the capacitor element C is able to
have a capacitance that is electrically connected between the
storage nodes A1,B1 and the supply voltage Vcc. Interconnects 52
that are electrically connected to one of the source and drain of
the transfer MISFETs Qt1,Qt2 serve as data lines DL,/DL,
respectively. As a result, the circuit as illustrated in FIG. 1 in
Embodiment 1 can be realized.
[0179] Upon patterning of the titanium nitride film 34 (refer to
FIG. 22), which is to be an upper electrode of the capacitor
element C, the pattern adopted is a plane pattern as illustrated in
FIG. 29 in which the titanium nitride film 34 is electrically
connected not to the interconnect 53 (illustration in FIG. 29 is
omitted) but to the interconnect 52 (illustration in FIG. 29 is
omitted) to feed the upper electrode (titanium nitride film 34) of
the capacitor element C with a reference voltage Vss. This makes it
possible to cause the capacitor element C to have a capacitance
that is electrically connected between the storage nodes A1,B1 and
the reference voltage Vss, and the circuit as illustrated in FIG. 2
in Embodiment 1 can be realized.
[0180] Upon patterning of the titanium nitride film 34 (refer to
FIG. 22), which is to be an upper electrode of the capacitor
element C, by adopting a plane pattern as illustrated in FIG. 100
and integrating the upper electrodes (titanium nitride films 34) of
the capacitor elements C of two interconnect grooves 31, the
capacitor element C is able to have a capacitance that is
electrically connected between the storage node Al and the storage
node B1, and the circuit as illustrated in FIG. 3 in Embodiment 1
can be realized.
[0181] Also in this SRAM of Embodiment 2, similar advantages to
those of the SRAM of Embodiment 1 are available.
Embodiment 3
[0182] FIG. 30 is a plan view of a chip having a memory cell of an
SRAM formed thereon.
[0183] As illustrated in FIG. 30, a chip CHP has, disposed
thereover, a memory cell region MCA in which a memory cell of an
SRAM is to be formed, a random logic circuit region RCA, a CPU
(Central Processing Unit) region CA and a peripheral circuit region
ACA.
[0184] In the memory cell region MCA, there is a memory array
composed of a plurality of word lines and a plurality of bit lines
disposed in a matrix form, and a plurality of memory cells of an
SRAM disposed at the intersections between the word lines and bit
lines.
[0185] In the peripheral circuit region ACA, there are a word
driver, a control circuit, such as a data line selecting circuit,
an input circuit, an output circuit, an error-correcting circuit
for repairing defective memory cells, and a reference power circuit
(including step-down circuit).
[0186] FIG. 31 is a schematic diagram of the above-described
reference power circuit.
[0187] The reference power circuit SGC as illustrated in FIG. 31
serves to output a predetermined internal operating voltage Vddi
(for example, 1.5V) for causing action of the memory cell of an
SRAM and a predetermined data retention voltage (for example, 1 V)
for retaining data in the memory cell of the SRAM, responsive to
the input of a supply voltage Vcc (for example, 3.3V). In this
Embodiment 3, a capacitor element (second capacitor element) C1 is
electrically connected between ground potential and an interconnect
through which an internal operating voltage VDDi and data retention
voltage VDR are output from the reference power circuit SGC for the
purpose of preventing the output of the internal operating voltage
VDDi and data retention voltage VDR from becoming unstable, as
influenced by, for example, a power surge. The capacitor element C1
is required to have a large capacitance in order to prevent the
influence of a large distorted wave such as surge voltage.
[0188] FIG. 32 is a fragmentary cross-sectional view illustrating
the memory cell region MCA, the CPU region CA (random logic region
RLA) and the peripheral circuit region ACA.
[0189] The semiconductor integrated circuit device according to
Embodiment 3 is manufactured in substantially similar steps to
those employed in Embodiment 1 or 2. The manufacturing steps will
be described specifically later.
[0190] As illustrated in FIG. 32, in each of the memory cell region
(first region) MCA, CPU region CA (random logic region RLA) and
peripheral circuit region (second region) ACA, a p channel type
MISFET having p type semiconductor regions 10 as a source and drain
and an n channel type MISFET having n type semiconductor regions 11
as a source and drain are formed. In the peripheral circuit region
ACA, the above-described capacitor element C1 is formed in a hole
that is formed in an interlayer insulating film 38. The lower
electrode of this capacitor element C1 is electrically connected to
the n type semiconductor region via a plug 26. In this Embodiment
3, an interlayer insulating film 55 is formed over an interconnect
52, which is similar to the interconnect 52 as described in
connection with Embodiments 1 and 2; and, via a plug 57 formed in
the interlayer insulating film 55, the interconnect 52 is
electrically connected to an interconnect 58 which lies
thereover.
[0191] FIGS. 33 and 34 are a plan view and cross-sectional view,
respectively, of a capacitor element C11 having a so-called MOS
structure, with which the present inventors have compared the
above-described capacitor element C1. This capacitor element for
comparison has the above-described substrate 1 (p type well (which
may be an n type well)) as a lower electrode, a gate insulating
film 7 as an insulator and a gate electrode 8 as an upper
electrode.
[0192] According to the calculation by the present inventors, when
the electrode of the capacitor element C11 is 4.4 .mu.m by 56.7
.mu.m, the area of the electrode (area of the capacitor element C11
over the substrate 1) given by 4.34.times.56.7 is 246.078
.mu.m.sup.2. Supposing that the thickness of the gate oxide film 7
is, for example, 2 .mu.m, the capacitance of the capacitor element
C11 given by
3.9.times.8.854.times.10.sup.-12.times.246.078.times.10.sup.-12/2/10.sup.-
-9 is 4.2846 pF.
[0193] With regards to the capacitor element C1 of Embodiment 3, as
illustrated in FIG. 32, on the other hand, supposing that the
thickness of the interlayer insulating film 38 in which the
capacitor element C1 has been formed and the diameter of the hole
opened in the interlayer insulating film 38 for forming the
capacitor element C1 are, for example, 0.8 .mu.m and 0.18 .mu.m,
respectively, the capacitance of the capacitor element C1 given by
3.9.times.8.854.times.10.sup.-12.times.0.477594.times.10.sup.-12/2/10.sup-
.-9 is 8.2458fF. In other words, a capacitance similar to that of
the capacitor element C11 can be realized by arranging about 520
capacitor elements C1 of Embodiment 3.
[0194] Judging from the fact that these 520 capacitor elements C1
of Embodiment 3 can be formed by disposing them in 13 columns and
40 rows, when the capacitor elements C can be formed at the minimum
pitch of 0.18 .mu.m, the length of the 520 capacitor elements C1 in
the direction of columns given by 13.times.(0.18+0.18)+0.18 is 4.86
.mu.m, while their length in the direction of rows given by
40.times.(0.18+0.18)+0.18 is 14.58 .mu.m. The area of a region in
which 520 capacitor elements C1 are formed is 70.8588 .mu.m.sup.2,
given by 4.86.times.14.58. As result, the area in which the
capacitor element C1 is formed over the substrate 1 is about one
third of that of the capacitor element C11. In other words, use of
the capacitor element C1 of Embodiment 3 enables a reduction in the
size of a chip having the semiconductor integrated circuit device
of Embodiment 3.
[0195] FIG. 32 illustrates the memory cell (memory cell region MCA)
of an SRAM in which no capacitor element C (refer to FIG. 10 or
FIG. 22) as described in connection with Embodiment 1 or 2 has been
formed. As illustrated in FIG. 35, the memory cell (memory cell
region MCA) of an SRAM may have a capacitor element C formed
therein.
[0196] The manufacturing steps used in the fabrication of the
semiconductor integrated circuit device according to Embodiment 3
will be described next with reference to FIGS. 36 to 48. FIGS. 36
to 48 are enlarged views of a part of the peripheral circuit region
ACA of FIG. 32. In particular, FIG. 38 is a plan view of a region
in which the capacitor element C1 is to be formed. FIGS. 39, 44 and
47 are cross-sectional views of respective steps taken along a line
A-A of FIG. 38.
[0197] The steps in the manufacture of the semiconductor integrated
circuit device according to Embodiment 3 are similar to those in
Embodiment 1 up to the steps described with reference to FIGS. 4 to
6. Then, as illustrated in FIG. 36, a similar interlayer insulating
film 38 (refer to FIG. 13), contact hole 39 (refer to FIG. 13) and
plug 42 (refer to FIG. 13) to those described in connection with
Embodiment 1 are formed.
[0198] As illustrated in FIGS. 37 to 39, using a photoresist mask
(not illustrated) as a mask, the interlayer insulating film (first
insulating film) 38 and silicon nitride film (first insulating
film) 27 are etched to form a hole (second opening) VH reaching the
plug 26 at a position in which the capacitor element C1 (refer to
FIG. 33) is to be formed. The number of holes VH is plural, for
example, 13 columns.times.40 rows as described above. Over the
interlayer insulating film 38 including the inside of each of the
holes VH, a titanium nitride film 32 similar to the titanium
nitride film 32 (refer to FIG. 8) used in Embodiment 1 is
deposited, as illustrated in FIG. 40.
[0199] Then, as illustrated in FIG. 41, by etching using a
photoresist film RESI 4 patterned by photolithography as a mask,
the titanium nitride film 32 is patterned, by which a lower
electrode (titanium nitride film 32) of the capacitor element C1
which will be completed by later steps, is formed in the hole
VH.
[0200] After removal of the photoresist film RESI4, a silicon
nitride film 33 and a titanium nitride film 34 similar to the
silicon nitride film 33 (refer to FIG. 8) and titanium nitride film
34 (refer to FIG. 8) used in Embodiment 1 are deposited
successively over the interlayer insulating film 38 including the
inside of the hole VH.
[0201] As illustrated in FIGS. 43 and 44, using a photoresist film
RESI5 patterned by photolithography as a mask, the silicon nitride
film 33 and titanium nitride film 34 are patterned, by which a
capacitor element C1 having the titanium nitride film 32 as a lower
electrode, the silicon nitride film 33 serving as an insulator and
the titanium nitride film 34 serving as an upper electrode, is
formed in the hole VH. In this manner, the lower electrode
(titanium nitride film 32) of the capacitor element C is formed
over the bottom and the circumference of the sidewall of the hole
VH; and, at the same time, it constitutes a capacitance, together
with the upper electrode (titanium nitride film 34) of the
capacitor element C via a dielectric film (silicon nitride film 33)
of the capacitor element C, over the bottom and circumference of
the sidewall of the hole VH. This makes it possible to improve the
capacitance, because the bottom and circumference of the sidewall
of the hole VH can be used as a capacitance area.
[0202] In this Embodiment 3, the silicon nitride film 33 is
employed as an insulator of the capacitor element C1, but the
silicon nitride film 33 may be replaced with an insulating film
(for example, tantalum oxide film) having a higher dielectric
constant than the silicon nitride film 33. This makes it possible
to increase the capacitance of the capacitor element C1.
[0203] After removal of the photoresist film RESI5, a Ti film 44A
is deposited over the interlayer insulating film 38 including the
inside of the hole VH by, for example, sputtering, as illustrated
in FIG. 45. An Al film 44B for filling the hole VH therewith is
then deposited over the interlayer insulating film 38 by
sputtering. A titanium nitride film 44C is deposited over the Al
film 44B.
[0204] As illustrated in FIGS. 46 and 47, using a photoresist film
(not illustrated) patterned by photolithography as a mask, the Ti
film 44A, Al film 44B and titanium nitride film 44C are etched to
form an interconnect 44.
[0205] As illustrated in FIG. 48, an interlayer insulating film 47,
a contact hole 48, a plug 50 and an interconnect 52 are formed over
the interconnect 44 by steps similar to those employed for the
formation of the interlayer insulating film 38, contact hole 39,
plug 42 and interconnect 44. The interconnect 52 is electrically
connected to the interconnect 44 via the plug 50. By repeating the
above-described step, an interlayer insulating film 55 (refer to
FIG. 32), a plug 57 (refer to FIG. 32) and an interconnect 58
(refer to FIG. 32) are formed to fabricate the semiconductor
integrated circuit device of Embodiment 3.
[0206] In Embodiment 3, the hole VH having a circular plane for the
formation of the capacitor element C1 (refer to FIG. 38) is
described. Alternatively, it is possible to form a plurality of
grooves (second openings) VH1, instead of the hole VH, in the
interlayer insulating film 38 and to form the capacitor element C1
in these grooves VH1.
[0207] In Embodiment 3, the capacitor element C1 is formed using a
plurality of holes VH. Alternatively, it is possible to add, to a
chip CHP (refer to FIG. 30) having such a capacitor element C1
formed thereon, a capacitor element C11 having an MOS structure as
described above with reference to FIGS. 33 and 34. When the
capacitor element C11 having an MOS structure is formed, a gate
oxide film 7 which will be an insulator is formed by thermal
oxidation so that the insulator thus formed is thinner than that of
the capacitor element C1 of Embodiment 3. When the area of the
capacitive electrode is equal, the capacitance of the capacitor
element C11 can be made greater than that of the capacitor element
C11.
Embodiment 4
[0208] In Embodiment 4, the capacitor element C1 (refer to FIG. 43)
described in connection with Embodiment 3 is formed by another
manufacturing method.
[0209] The semiconductor integrated circuit device of Embodiment 4
is manufactured in a similar manner to Embodiment 3 up to the steps
described with reference to FIGS. 36 and 40.
[0210] Then, an amorphous silicon film (first conductive film) 32A
having an impurity of an n conductivity type, such as having P
(phosphorus) doped therein, is deposited over the titanium nitride
film 32 by CVD, as illustrated in FIG. 50. Under a vacuum
atmosphere, an SiH.sub.4 (monosilane) gas is fed to the surface of
the amorphous silicon film 32A, followed by heat treatment of the
substrate 1. By this treatment, the amorphous silicon film 32A is
made polycrystalline and has a roughened surface (by silicon
grains).
[0211] As illustrated in FIG. 51, by etching using a photoresist
film RESI4 as a mask, the amorphous silicon film 32A and titanium
nitride film 32 are patterned, by which the lower electrode of the
capacitor element C which will be completed by later steps is
formed in the hole VH.
[0212] After removal of the photoresist film RESI4, in a similar
manner to that described in connection with Embodiment 3, by using
FIG. 42, a silicon nitride film 33 and a titanium nitride film 34
are deposited successively over the interlayer insulating film 38
including the inside of the hole VH. As illustrated in FIGS. 53 and
54, by etching using a photoresist film RESI5 as a mask, the
silicon nitride film 33 and titanium nitride film 34 are patterned
to form, in the hole VH, a capacitor element C1 having the titanium
nitride film 32 and amorphous silicon film 32A as a lower
electrode, the silicon nitride film 33 as an insulator and the
titanium nitride film 343 as an upper electrode. FIG. 54 is a
cross-sectional view of a region in which the capacitor element C1
is to be formed.
[0213] By such a method of formation of the capacitor element C1
according to Embodiment 4, the surface of the lower electrode
(amorphous silicon film 32A) of the capacitor element C1 is
roughened, making it possible to increase the electrode area of the
capacitor element C1 by about twice or greater. According to the
capacitor element C1 of Embodiment 4, therefore, a capacitance
greater than that of the capacitor element C1 in Embodiment 3 is
available.
[0214] Then, the semiconductor integrated circuit device of
Embodiment 4 is manufactured by steps similar to those described
with reference to FIGS. 45 to 48 in Embodiment 3.
[0215] Such a roughening of the lower electrode of the capacitor
element C1 also may be applied to the manufacture of the capacitor
element C of Embodiment 1 or 2. If it is applied, a greater
capacitance can be attained even in Embodiment 1 or 2.
Embodiment 5
[0216] In Embodiment 5, a capacitor element similar to the
capacitor element C1 (refer to FIG. 43) described in connection
with Embodiment 3 is formed by another manufacturing method.
[0217] The semiconductor integrated circuit device of Embodiment 5
is manufactured in a similar manner to Embodiment 1 up to the steps
described with reference to FIGS. 4 to 6. Then, using a photoresist
film (not illustrated) patterned by photolithography, the silicon
oxide film 21 and PSG film 20 over the element isolation 2 (silicon
oxide film 3) are etched to form a hole (second opening) 25A
reaching the silicon nitride film (third insulating film) 17. In
this Embodiment 5, similar to the holes VH in Embodiment 3, the
number of holes 25A is plural. For example, they are arranged in a
plane by 13 columns and 40 rows (refer to FIG. 59 which will be
described later).
[0218] As illustrated in FIG. 56, a titanium nitride film (first
conductive film) 26A similar to the titanium nitride film 32 (refer
to FIG. 8) as provided in Embodiment 1 is deposited over the
substrate 1 including the inside of the hole 25A. By etching using
a photoresist film as a mask, the titanium nitride film 26A is then
patterned.
[0219] As illustrated in FIG. 57, a silicon nitride film (second
insulating film) 26B and a titanium nitride film (second conductive
film) 26C similar to the silicon nitride film 33 (refer to FIG. 8)
and the titanium nitride film 34 (refer to FIG. 8) are deposited
over the substrate 1 including the inside of the hole 25A. By
etching using a photoresist film as a mask, the titanium nitride
film 26C is patterned to form, in the hole 25A, a capacitor element
Ca having the titanium nitride film 26A as an upper electrode, the
silicon nitride film 26B as an insulator and the titanium nitride
film 26C as an upper electrode. In this manner, the lower electrode
(titanium nitride film 26A) of the capacitor element C is formed
over the bottom and circumference of the sidewall of the hole 25A,
and at the same time, over the bottom and the circumference of the
sidewall of the hole 25A, so that it forms a capacitance together
with the upper electrode (titanium nitride film 26C) of the
capacitor element C via a dielectric film (silicon nitride film
26B) of the capacitor element C. This makes it possible to use the
bottom and the circumference of the sidewall of the hole 26A as a
capacitance area, leading to an improvement in capacitance.
[0220] In this Embodiment 5, the capacitor element C1 exists over
the element isolation (silicon oxide film 3) so that a plug for
extracting each of the upper electrode and lower electrode of the
capacitor element C1 must be formed over the silicon oxide film 21.
In Embodiment 5, patterning of the titanium nitride films 26A,26C
is carried out so as to form the lower electrode to extend over the
silicon oxide film 21 and so that the upper electrode will not
extend over the lower electrode in a region in which a plug (formed
in later steps) to be connected to the lower electrode is formed,
while patterning is conducted so that the upper electrode extends
over the silicon oxide film 21 and the lower electrode does not
extend thereover in a region in which a plug (formed in later
steps) connected to the upper electrode is formed. By patterning
the upper electrode and lower electrode, as described above, in a
region in which a plug connected to the upper electrode is formed,
it is possible to prevent an inconvenience, such as short circuit,
via the plug, between the upper electrode and the lower electrode,
which will otherwise occur because the contact hole in which the
plug is formed reaches the lower electrode.
[0221] As illustrated in FIGS. 58 and 59, an interlayer insulating
film 38 is formed by depositing, for example, a silicon oxide film
over the substrate 1. FIG. 59 is a cross-sectional view of a region
in which a capacitor element C1 has been formed. As illustrated in
the diagram, a plurality of holes 25A have been formed in the
interlayer insulating film 38. The holes 25A are formed as
illustrated in FIG. 38 or FIG. 39 of the above-described
embodiment. Then, using a photoresist film as a mask, the
interlayer insulating film 38 and the silicon nitride film 26B are
etched to make a contact hole 39 reaching the plug 26, a contact
hole 39A reaching the upper electrode (titanium nitride film 26C)
of the capacitor element C1 and a contact hole 39B reaching the
lower electrode (titanium nitride film 26A) of the capacitor
element C1. By steps similar to those employed for the formation of
the plug 42 (refer to FIG. 13) in Embodiment 1, plugs (conductive
layers) 42, 42A, and 42B are formed in the contact holes 39, 39A,
and 39B, respectively.
[0222] The upper electrode (titanium nitride film 26C) and lower
electrode (titanium nitride film 26C) of the capacitor element C1
are places through which no large electric current passes, but on
which only a bias is applied, so that the plugs 42A,42B are only
required to be formed to have a contact with the upper electrode
and lower electrode at their side portions thereof, respectively.
In other words, in this Embodiment 5, the contact holes 39A,39B may
reach the silicon oxide film 21, going through the titanium nitride
films 26A,26C and silicon nitride film 26B.
[0223] As illustrated in FIG. 60, by steps similar to those
employed for the formation of the interconnect 44 (refer to FIG.
15), interlayer insulating film 47 (refer to FIG. 17), plug 50
(refer to FIG. 17) and interconnect 52 (refer to FIG. 17) in
Embodiment 1, an interconnect 44, an interlayer insulating film 47,
a plug 50 and an interconnect 52 are formed to fabricate the
semiconductor integrated circuit device of Embodiment 5.
[0224] In this Embodiment 5, the capacitor element C1 formed in the
undermost interconnect layer or plug layer was described, but it
may be formed in the upper layer.
[0225] FIGS. 61 and 62 each illustrates the capacitor element C1
formed in an interconnect layer near the top layer (the second top
layer). In FIG. 61, uppermost-level interconnects MU1,MU2,MU3
having Al (aluminum) as a main conductive layer are illustrated,
while in FIG. 62, the uppermost-level interconnects MU1,MU2,MU3 are
formed by filling, in an interconnect groove formed in the
insulating film, a conductive material having Cu (copper) as a main
conductive material. In FIGS. 61 and 62, interconnect layers
ML1,ML2 below the uppermost-level interconnects MU1,MU2,MU3 are
formed by (damascene method) filling, interconnect grooves formed
in the interlayer insulating films ILD1,ILD3, with a conductive
material having Cu or W as a main conductive layer by, for example,
CMP, and plugs PLG1 to PLG4 are formed in these interconnect layers
by filling, in connecting holes formed in interlayer insulating
films ILD0,ILD2, a conductive material having Cu or W as a main
conductive layer by, for example, CMP.
[0226] The capacitor element C1 is formed in a plurality of grooves
(second openings) T formed in the interlayer insulating film ILD1
which is on the same level with the underlying interconnect layer
ML1. It has, similar to the capacitor element of FIG. 59, a lower
electrode (titanium nitride film 26A), an insulator (silicon
nitride film 26B) and an upper electrode (titanium nitride film
26C). The groove (second opening) T is formed as illustrated in
FIG. 38 or 39 of Embodiment 3.
[0227] In this manner, the lower electrode (titanium nitride film
26A) of the capacitor element C is formed over the bottom and
circumference of the sidewall of a plurality of the grooves (second
openings) T and at the same time, constitutes a capacitance,
together with the upper electrode (titanium nitride film 26C) of
the capacitor element C via the dielectric film (silicon nitride
film 26B) of the capacitor element C. This makes it possible to
heighten the capacitance, because the bottom and circumference of
the sidewall of the grooves (second openings) T can be used as a
capacitance area.
[0228] The uppermost-level interconnect MU2 is electrically
connected to the upper electrode (titanium nitride 26C) of the
capacitor element C1 via the plug PLG1 having Cu or W (tungsten) as
a main conductive layer, while the uppermost-level interconnect MU3
is electrically connected to the lower electrode (titanium nitride
film 26A) of the capacitor element C1 via the plug PLG2 similar to
PLUG1. The uppermost-level interconnect MU1 has electrical
continuity with the underlying interconnect layers ML1,ML2 via
plugs PLGs 3,4 having Cu or W as a main conductive layer. FIGS. 61
and 62 illustrate the interconnect layers ML1,ML2 that are formed
by filling, in interconnect grooves formed in an insulating film, a
conductive material having Cu or W as a main conductive layer. It
is also possible to form them by using Al as a main conductive
layer as the uppermost-level interconnects MU1,MU2,MU3 illustrated
in FIG. 61. The interconnect MU2 may be formed by filling an
interconnect with a conductive material having Cu or W as a main
conductive layer.
[0229] By Embodiment 5, similar advantages to those of Embodiment 3
are available.
[0230] It is possible to apply the structure of the capacitor
element C of Embodiment 4 to the capacitor element C1 of Embodiment
5, by which a greater capacitance can be attained.
Embodiment 6
[0231] FIGS. 63 to 65 are equivalent circuit diagrams of the memory
cell of an SRAM according to Embodiment 6. As illustrated in FIGS.
63 to 65, the memory cell (MC) of this SRAM has two transfer
MISFETs (TR1,TR2), two drive MISFETs (DR1,DR2) and two vertical
MISFETs (SV1,SV2), each disposed at the intersections between a
pair of complementary data lines (BLT,BLB) and a word line
(WL).
[0232] Of the six MISFETs constituting the memory cell (MC), the
two transfer MISFETs (TR1,TR2) and two drive MISFETs (DR1,DR2) are
n channel type MISFETs, while the two vertical MISFETs (SV1,SV2)
are p channel type MISFETs. These vertical MISFETs (SV1,SV2)
correspond to load MISFETs of a known complete CMOS type SRAM, but
in contrast to the ordinary load MISFET, they have a vertical
structure, as will be described later, and, at the same time, they
are disposed over the formation regions of the drive MISFETs
(DR1,DR2) and transfer MISFETs (TR1,TR2).
[0233] The drive MISFET (DR1) and the vertical MISFET (SV1) of the
memory cell (MC) constitute an inverter INV1, and the drive MISFET
(DR2) and the vertical MISFET (SV2) constitute a second inverter
INV2. These paired inverters INV1 and INV2 are cross-coupled in the
memory cell (MC) and constitute a flip-flop circuit serving as an
information storage portion for storing information of 1 bit.
[0234] More specifically, the drain of the drive MISFET (DR1), the
drain of the vertical MISFET (SV1), the gate of the drive MISFET
(DR2) and the gate of the vertical MISFET (SV2) are electrically
connected to each other and constitute one storage node (A) of the
memory cell, while the drain of the drive MISFET (DR2), the drain
of the vertical MISFET (SV2), the gate of the drive MISFET (DR1)
and the gate of the vertical MISFET (SV1) are electrically
connected to each other and constitute the other storage node (B)
of the memory cell.
[0235] One of the input/output terminals of the flip flop circuit
is electrically connected to one of the source and drain of the
transfer MISFET (TR1) and the other input/output terminal is
electrically connected to one of the source and drain of the
transfer MISFET (TR2). The other one of the source and drain of the
transfer MISFET (TR1) is electrically connected to one data line
BLT of the paired complementary data lines, and the other one of
the source and drain of the transfer MISFET (TR2) is electrically
connected to the other data line BLB of the paired complementary
data lines. One end of the flip flop circuit, that is, the source
of two vertical MISFETs (SV1,SV2), is electrically connected to a
supply voltage line (Vdd) for feeding a supply voltage (Vdd) that
is higher in potential than a reference voltage (Vss), for example,
3V. The other end of the flip flop circuit, that is, the source of
each of the two drive MISFETs (DR1,DR2), is electrically connected
to a reference voltage line (Vss) for feeding the reference voltage
(Vss), for example, 0 V. The gate electrode of each of the transfer
MISFETs (TR1,TR2) is electrically connected to the word line (WL).
The above-described memory cell (MC) stores data by turning one of
a pair of storage nodes (A,B) High and the other one Low.
[0236] In the above-described circuit, a capacitor element C is
connected between the storage nodes (A,B) and supply voltage (Vdd)
(refer to FIG. 63), between the storage nodes (A,B) and reference
voltage Vss (refer to FIG. 64), or between the storage nodes (A,B)
(refer to FIG. 65). Such disposal of the capacitor element C makes
it possible to increase the capacitance of the storage nodes (A,B)
of the memory cell and prevent a lowering of the soft error
resistance.
[0237] Retention, reading and writing operations of the information
in the memory cell (MC) are essentially similar to those of a known
complete CMOS SRAM. More specifically, upon reading of the
information, a supply voltage (Vdd) is applied to a selected word
line (WL) to turn the transfer MISFETs (TR1,TR2) ON and a potential
difference between the pair of storage nodes (A,B) is read from the
complementary data lines (BLT,BLB). Upon writing, a supply voltage
(Vdd) is applied to a selected word line (WL) to turn the transfer
MISFETs (TR1,TR2) ON and, at the same time, to connect one of the
complementary data lines (BLT,BLB) to a supply voltage (Vdd) and
the other one to a reference voltage (Vss), by which ON and OFF
operations of the drive MISFETs (DR1,DR2) are inverted.
[0238] Based on FIGS. 66 to 95, a detailed structure of the SRAM
according to Embodiment 6, as well as its manufacturing method,
will be described next. In each cross-sectional view illustrating
steps of the manufacturing method used in fabrication of the SRAM,
a portion indicated by A,A is a cross-section of the memory cell
taken along a line A-A of each related plan view, a portion
indicated by B,B is a cross-section of the memory cell taken along
a line B-B of each related plan view, a portion indicated by C,C is
a cross-section of the memory cell taken along a line C-C of each
related plan view and the other portion is a partial cross-section
of a peripheral circuit region.
[0239] The peripheral circuit of the SRAM has an n channel MISFET
and a p channel MISFET. These two MISFETs have a substantially
similar structure except that their conductivity types are reverse
relative to each other. In the diagrams, one conductivity type (p
channel MISFET) is shown. In each plan view (plan view of a memory
array), only main conductive layers constituting the memory cell
and connected regions thereof are illustrated, but an insulating
film formed between the conductive layers or the like is omitted in
principle. In each plan view, a rectangular region surrounded by
four marks (+) represents an occupied area of one memory cell. By
the n channel and p channel MISFETs constituting the peripheral
circuit, circuits such as an X decoder circuit, Y decoder circuit,
sense amplifier circuit, input/output circuit and logic circuit are
formed. Not only these circuits, but also logic circuits, such as a
microprocessor and a CPU, may be formed.
[0240] As illustrated in FIGS. 66 and 67, an isolation groove 102
is formed in an element isolation region over the main surface of a
substrate 101 made of, for example, p type single crystal silicon.
This isolation groove 102 is formed, for example, by dry etching
the main surface of the substrate 101 to form a groove, depositing
an insulating film, such as a silicon oxide film 103, over the
substrate 101 including the inside of this groove by CVD, and
polishing and removing an unnecessary portion of the silicon oxide
film 103 outside the groove so as to leave the silicon oxide film
103 inside of the groove. By forming this isolation groove 102, an
island-like active region (L) having its periphery defined by the
isolation groove 102 is formed over the main surface of the
substrate 101 of the memory array.
[0241] Then, phosphorus (P) is introduced into a portion of the
substrate 101, while boron (B) is introduced into another portion,
followed by heat treatment of the substrate 101 to diffuse these
impurities in the substrate 101, by which a p type well 104 and an
n type well 105 are formed in the main surface of the substrate
101. As illustrated in FIG. 66, not the n type well 105, but the p
type well 104 is formed in the substrate 101 of the memory array
region. In the substrate 101 of the peripheral circuit region, the
n type well 105 and an unillustrated p type well are formed.
[0242] By thermal oxidation of the substrate 101, a gate insulating
film 106, that is about 3 nm to 4 nm thick and is made of, for
example, silicon oxide, is formed over the surface of each of the p
type well 104 and n type well 105. Then, an n type polycrystalline
silicon film is formed, as a conductive film, over the gate
insulating film 106 of the p type well 104, while a p type
polycrystalline silicon film is formed, as a conductive film, over
the gate insulating film 106 of the n type well 105. A silicon
oxide film is then deposited as a cap insulating film over each of
the n type polycrystalline silicon film and p type polycrystalline
silicon film by, for example, CVD.
[0243] The n type polycrystalline silicon film and p type
polycrystalline silicon film are formed, for example, by depositing
a non-doped polycrystalline silicon film (or amorphous silicon
film) over the gate insulating film 106 by CVD, introducing
phosphorus (or arsenic) into the non-doped polycrystalline silicon
film (or amorphous silicon film) over the p type well 104 and boron
into the non-doped polycrystalline silicon film (or amorphous
silicon film) over the n type well 105.
[0244] By dry etching of the n type polycrystalline silicon film
and p type polycrystalline silicon film, gate electrodes 107A,
107B, each made of an n type polycrystalline silicon film, are
formed over the p type well 104 in the memory array and a gate
electrode 107C made of a p type polycrystalline silicon film is
formed over the n type well 105 in the peripheral circuit region.
Over the p type well 104 in the peripheral circuit region, a gate
electrode made of an n type polycrystalline silicon film is formed,
but is not illustrated.
[0245] A gate electrode 107A constitutes the gate electrode of each
of the transfer MISFETs (TR1,TR2), a gate electrode 107B
constitutes the gate electrode of each of the drive MISFETs
(DR1,DR2), and a gate electrode 107C constitutes the gate electrode
of the p channel type MISFET of the peripheral circuit.
[0246] The gate electrodes 107A, 107B, 107C are formed, for
example, by patterning the cap insulating film to have the same
planar shapes as the gate electrodes 107A, 107B, 107C by dry
etching using a photoresist film as a mask, and then dry etching
the n type polycrystalline silicon film and p type polycrystalline
silicon film using the patterned cap insulating film with a mask.
Silicon oxide for the formation of the cap insulating film has a
greater etching selectivity to polycrystalline silicon than to the
photoresist so that the gate electrodes 107A, 107B, 107C having a
minute gate length can be patterned with good accuracy compared
with successive etching of the cap insulating film and
polycrystalline silicon film using a photoresist film as a
mask.
[0247] Into the p type well 104, phosphorus or arsenic is
introduced as an n type impurity to form n.sup.- type semiconductor
regions 109 of a relatively low concentration, while boron is
introduced into the n type well 105 as a p type impurity to form
p.sup.- type semiconductor regions (illustration is omitted) of a
relatively low concentration. These n.sup.- type semiconductor
regions 109 are formed to impart the source and drain regions of
each of the transfer MISFETs (TR1,TR2), drive MISFETs (DR1,DR2) and
the n channel MISFET of the peripheral circuit with an LDD (Lightly
Doped Drain) structure, while the p.sup.- type semiconductor
regions are formed to impart the source and drain regions of the p
channel MISFET of the peripheral circuit with an LDD structure.
[0248] Over the sidewall of each gate electrode 107A, 107B, 107C, a
sidewall spacer 113 made of an insulating film is formed. The
sidewall spacer 113 is formed, for example, by depositing a silicon
oxide film and a silicon nitride film over the substrate 101 by
CVD, followed by anisotropic etching of these silicon nitride film
and silicon oxide film. At this time, by etching the cap insulating
film covering the upper surface of each of the gate electrodes
107A, 107B, 107C and the silicon oxide film (gate insulating film
106) over the surface of the substrate 101, the surface of each of
the gate electrodes 107A, 107B, 107C and the surface of each of the
n.sup.- type semiconductor regions 109 and p.sup.- type
semiconductor regions are exposed.
[0249] Phosphorus or arsenic is then introduced as an n type
impurity into the p type well 104 to form n.sup.+ type
semiconductor regions 114 of a relatively high concentration, while
boron is introduced into the n type well 105 as a p type impurity
to form p.sup.+ type semiconductor regions 115 of a relatively high
concentration. The n.sup.+ type semiconductor regions 114 that are
formed in the p type well 104 of the memory array constitute the
source and drain of each of the transfer MISFETs (TR1,TR2) and the
drive MISFETs (DR1,DR2), while the p.sup.+ type semiconductor
regions 115 formed in the n type well 105 of the peripheral circuit
region constitute the source and drain of the p channel type
MISFET. Into an unillustrated p type well of the peripheral circuit
region, phosphorus or arsenic is introduced as an n type impurity
to form n.sup.+ type semiconductor regions of a relatively high
concentration which constitute the source and drain of the n
channel type MISFET.
[0250] A cobalt (Co) film is then deposited over the substrate 101
by sputtering. The substrate 101 is then heat treated to cause a
silicide reaction on the interface between the Co film and the gate
electrodes 107A, 107B, 107C and between the Co film and the
substrate 101, followed by removal of an unreacted portion of the
Co film by etching, by which a Co silicide layer which is a
silicide layer is formed over the surface of the gate electrodes
107A, 107B, 107C and the surface of the source and drain (n.sup.+
type semiconductor region 114, p.sup.+ type semiconductor region
115). By the steps so far mentioned, the n channel type transfer
MISFETs (TR1,TR2), and drive MISFETs (DR1,DR2) are formed in the
memory array, while the p channel type MISFET (Qp) and n channel
type MISFET (not illustrated) are formed in the peripheral circuit
region.
[0251] As illustrated in FIG. 66, the transfer MISFET (TR1) and
drive MISFET (DR1) are disposed so as to be separated from the
transfer MISFET (TR2) and drive MISFET (DR2) in a lateral direction
(X direction) in the diagram via an element isolation, and, at the
same time, they are disposed so as to be point symmetrical relative
to the central point of the memory cell formation region. The gate
electrode 107B of each of the drive MISFET (DR2) and drive MISRFET
(DR1) is disposed to extend in the lateral direction (X direction)
of this diagram. In the X direction, the gate electrode 107B will
have one terminal on the element isolation between the transfer
MISFET (TR1) and drive MISFET (DR1) and between the transfer MISFET
(TR2) and drive MISFET (DR1). Over this end, each of the vertical
MISFETs (SV1,SV2), which will be described later, is formed.
[0252] A silicon nitride film 119 and a silicon oxide film 120 are
deposited as an insulating film covering MISFETs
(TR1,TR2,DR1,DR2,Qp) by, for example, CVD, followed by
planarization of the surface of the silicon oxide film 120 by
chemical mechanical polishing.
[0253] As illustrated in FIGS. 68 and 69, using a photoresist film
as a mask, the silicon oxide film 120 and the silicon nitride film
119 are dry etched to form a contact hole 121 over the gate
electrode 107A of the transfer MISFETs (TR1,TR2), a contact hole
122 over the gate electrode 107B of the drive MISFETs (DR1,DR2),
contact holes 123, 124, 125 over the source and drain (n.sup.+ type
semiconductor regions 114) of each of the transfer MISFETs
(TR1,TR2) and drive MISFETs (DR1,DR2), and contact holes 126 and
127 over each of the gate electrode 107C and the source and drain
(p.sup.+ type semiconductor regions 115) of the p channel type
MISFET (Qp) of the peripheral circuit region.
[0254] Inside of the contact holes 121 to 127, a plug 128 is
formed. This plug 128 is formed, for example, by depositing a
titanium (Ti) film and a titanium nitride (TiN) film over the
silicon oxide film 120 including the insides of the contact holes
121 to 127 by sputtering, depositing a TiN film and, as a metal
film, a tungsten (W) film by CVD and then removing the W film, TiN
film and Ti film outside the contact holes 121 to 127 by CMP.
[0255] As illustrated in FIGS. 70 and 71, after deposition of a
silicon nitride film 129 and a silicon oxide film 130 over the
substrate 101 as an insulating film by CVD, the silicon oxide film
130 and silicon nitride film 129 are dry etched using a photoresist
film as a mask to form grooves 131 to 137 over the contact holes
121 to 127, respectively. Of these grooves 131 to 137, the grooves
132 and 133 formed in the memory array are formed to extend over
both the contact hole 122 and the contact hole 123, as illustrated
in FIG. 70.
[0256] Intermediate conductive layers 141 to 145 are formed inside
of the grooves 131 to 135 that are formed in the memory array,
respectively, and first-level interconnects 146 and 147 are formed
inside of the grooves 136 and 137 that are formed in the peripheral
circuit region, respectively. The intermediate conductive layers
141 to 145 and first-level interconnects 146 and 147 are formed,
for example, by depositing a TiN film over the silicon oxide film
130 including the insides of the grooves 131 to 137 by sputtering,
followed by deposition of a W film as a metal film by CVD. Then,
the W film and TiN film outside the grooves 131 to 137 are removed
by CMP.
[0257] Of the intermediate conductive layers 141 to 145 that are
formed in the memory array, the intermediate conductive layer 141
is used for electrically connecting the gate electrode 107A of each
of the transfer MISFETs (TR1,TR2) to a word line (WL) which will be
formed later. The intermediate conductive layer is used for
electrically connecting the n.sup.+ type semiconductor region 114
(one of the source and drain) of each of the transfer MISFETs
(TR1,TR2) to the complementary data lines (BLT,BLT). The
intermediate conductive layer 145 is used for electrically
connecting the n.sup.+ type semiconductor region 114 (source) of
each of the drive MISFETs (DR1,DR2) to a reference voltage line
(Vss) which will be formed later.
[0258] One (intermediate conductive layer 142) of a pair of the
intermediate conductive layers 142 and 143 formed almost at the
center part of each memory cell region is used as a local
interconnect for electrically connecting the n.sup.+ type
semiconductor region 114 constituting one of the source and drain
of the transfer MISFET (TR1) and drain of the drive MISFET (DR1),
the gate electrode 107B of the drive MISFET (DR2) and a lower
semiconductor layer (drain) of the vertical MISFET (SV1) which will
be formed later. The other layer (intermediate conductive layer
143) is used as a local interconnect for electrically connecting
the n.sup.+ type semiconductor region 114 constituting one of the
source and drain of the transfer MISFET (TR2) and drain of the
drive MISFET (DR2), gate electrode 107B of the drive MISFET (DR1)
and a lower semiconductor layer (drain) of the vertical MISFET
(SV2) which will be formed later.
[0259] The intermediate conductive layers 141 to 145 are each made
of a metal film, such as a W film. This makes it possible to reduce
the number of manufacturing steps in the fabrication of the SRAM
and the number of masks used therefor, because metal interconnects
(first-level interconnects 146 and 147) of the peripheral circuit
can be formed simultaneously with the formation of the intermediate
conductive layers 141 to 145.
[0260] As illustrated in FIGS. 72 and 73, a barrier layer 148 is
formed over the surface of each of the intermediate conductive
layers 142 and 143. This barrier layer 148 is formed mainly in a
region, of the surface region of the intermediate conductive layers
142 and 143, existing below a region in which the vertical MISFETs
(SV1,SV2) are formed. The barrier layer 148 is formed by depositing
a WN film over the substrate 101 by sputtering and then patterning
the WN film by dry etching using a photoresist film as a mask. In
such a manner, the barrier layer 148, which is capable of
preventing occurrence of an undesired silicide reaction on the
interface between the silicon film and the intermediate conductive
layers 142 and 143 is interposed between the silicon film and the W
film constituting the intermediate conductive layers 142 and
143.
[0261] The barrier layer 148 may not only be made of the WN film, a
Ti film, and a TiN film, but also of a laminate of WN and W films,
or a laminate of TiN and W films. The thin Ti-based film features
better adhesion with a silicon oxide film than the WN film. The WN
film, on the other hand, is immobilized easily by oxidation so that
it is unlikely to contaminate apparatuses and can be handled
conveniently. The film can be selected, depending on which is
important, adhesion or convenience. When a barrier film is required
in a step with less fear of fluctuations in the properties of the
MISFET even if a thin Ti film is re-deposited on the substrate 101
as an interconnect formation step after the formation of MISFET,
use of not a WN film, but a thin Ti-based film is recommended.
[0262] By constituting the intermediate conductive layers 142 and
143 from a metal film such as tungsten (W) and forming a vertical
MISFET made of a silicon film over the intermediate conductive
layers 142 and 143 via the barrier layer 148, the connection
resistance between MISFETs can be lowered, the properties of the
memory cell can be improved and the memory size can be reduced.
Instead of forming the barrier layer 148, the surface of the
intermediate conductive layers 142 and 143 made of tungsten may be
nitrided into tungsten nitride. Then, a mask for the formation of
the barrier layer 148 becomes unnecessary.
[0263] After deposition of a silicon nitride film 149 over the
substrate 101 by CVD, a polycrystalline silicon film (or amorphous
silicon film) is deposited over the silicon nitride film 149 by
CVD. This silicon nitride film 149 is used as an etching stopper
film, upon etching of a silicon oxide film to be deposited over the
silicon nitride film 149 in a later step, for preventing etching of
the underlying silicon oxide film 130 (refer to FIG. 71). Upon or
after formation of the polycrystalline silicon film, boron is doped
thereinto in order to match its conductivity type with that of the
polycrystalline silicon film constituting the gate electrode of the
vertical MISFETs (SV1,SV2) which will be formed later.
[0264] By dry etching using a photoresist film as a mask, the
polycrystalline silicon film is patterned to form a pair of gate
extraction electrodes 151a, 151b over the silicon nitride film 149.
The gate extraction electrodes 151a, 151b are disposed in a region
adjacent to the vertical MISFETs (SV1,SV2) which will be formed
later, and they are used for connecting the gate electrode of each
of the vertical MISFETs (SV1,SV2) to the transfer MISFETs (TR1,TR2)
and drive MISFETs (DR1,DR2) which lie therebelow.
[0265] As illustrated in FIGS. 74 and 75, a silicon oxide film 152
is deposited, as an insulating film, over the silicon nitride film
148 by CVD to cover the gate extraction electrodes 151a, 151b.
Using a photoresist film as a mask, the silicon oxide film 152 is
dry etched to form a through-hole 153 in the silicon oxide film 152
in an upper region of the barrier layer 148, that is, in a region
in which the vertical MISFETs (SV1,SV2) are formed.
[0266] Then, a sidewall spacer 154 made of an insulating film are
formed over the sidewall of the through-hole 153. The sidewall
spacer 154 is formed by depositing a silicon oxide film over the
silicon oxide film 152 including the inside of the through-hole 153
by CVD and then anisotropically etching the silicon oxide film to
leave it over the sidewall of the through-hole 153. At this time,
the etching of the silicon oxide film is followed by etching of the
silicon nitride film 149 on the bottom of the through-hole 153 to
expose the barrier layer 148 from the bottom of the through-hole
153.
[0267] By reducing the diameter of the through-hole 153 by forming
the sidewall spacer 154 made of an insulating film over the
sidewall, the through-hole 153 has a smaller size than that of the
barrier layer 148 as illustrated in FIG. 74. Even if the position
of the through-hole 153 deviates from the barrier layer 148, owing
to misalignment of the photomask, only the barrier layer 148 can be
exposed from the bottom of the through-hole 153, making it possible
to maintain a contact area between the barrier layer 148 and a plug
to be formed inside of the through-hole 53 in the subsequent
step.
[0268] A plug 155 is then formed inside of the through-hole 153.
This plug 155 is formed by depositing a polycrystalline silicon
film (or amorphous silicon film) over the silicon oxide film 152
including the inside of the through-hole 153 by CVD and then
removing the polycrystalline silicon film (or amorphous silicon
film) outside the through-hole 153 by CMP (or etch back). In order
to match the conductivity type of the polycrystalline silicon film
(amorphous silicon film) constituting the plug 155 with that of a
polycrystalline silicon film constituting a lower semiconductor
layer of the vertical MISFETs (SV1,SV2) which will be formed later,
boron is doped upon or after film formation.
[0269] The plug 155 formed inside of the through-hole 153 is
electrically connected, via the barrier layer 148, to the
underlying intermediate conductive layers 142 and 143. It is
possible to prevent occurrence of an undesired silicide reaction on
the interface between the plug 155 and intermediate conductive
layers 142 and 143 by interposing the barrier layer 148 made of a
WN film between the polycrystalline silicon film (or amorphous
silicon film) constituting the plug 155 and the W film constituting
the intermediate conductive layers 142 and 143. As an alternative
to making the plug 155 of a polycrystalline silicon film (or
amorphous silicon film), it may be made of tungsten, followed by
conversion into tungsten nitride by nitriding treatment. This makes
it possible to omit a mask for the formation of the barrier layer
148.
[0270] As illustrated in FIGS. 76 and 77, a p type silicon film
157, a silicon film 158 and a p type silicon film 159 are
successively deposited over the silicon oxide film 152. These three
silicon film layers (157, 158, 159) are formed in the following
manner. An amorphous silicon film doped with boron and a non-doped
amorphous silicon film are deposited successively by CVD, followed
by heat treatment of these amorphous silicon films so as to
crystallize the same to form the p type silicon film 157 and
silicon film 158. After introduction, into the silicon film, of an
n type or p type impurity for the channel formation, an amorphous
silicon film doped with boron is deposited over the resulting
silicon film by CVD, followed by heat treatment to crystallize the
amorphous silicon film, thereby to form the p type silicon film
159.
[0271] By crystallizing the amorphous silicon film to form these
three silicon film layers (157, 158, 159), crystal grains in the
film can be made greater than those of the polycrystalline silicon
film, which brings about an improvement in the properties of the
vertical MISFETs (SV1,SV2). Upon introduction of the channel
forming impurity into the silicon film 158, it is possible to form
a through insulating film made of a silicon oxide film over the
surface of the silicon film 158 and then introduce the impurity
through this through-insulating film. The amorphous silicon film
may be crystallized upon a thermal oxidation step for the formation
of a gate insulating film, which will be described later.
[0272] After successive deposition of a silicon oxide film 161 and
a silicon nitride film 162 over the p type silicon film by CVD, the
silicon nitride film 162 is dry etched using a photoresist film as
a mask so as to leave the silicon nitride film 162 over a region in
which the vertical MISFETs (SV1,SV2) are to be formed. This silicon
nitride film 162 serves as a mask upon etching of the three silicon
film layers (157, 158, 159). Since the etching selectivity of
silicon nitride to silicon is greater than it is to the
photoresist, three silicon film layers (157, 158, 159) can be
patterned with good accuracy compared with etching using the
photoresist film as a mask.
[0273] Using the silicon nitride film 162 as a mask, the three
silicon film layers (157, 158, 159) are dry etched to form
laminates (P1,P2) in a square pole form, each having a lower
semiconductor layer made of the p type silicon film 157, an
intermediate semiconductor layer made of the silicon film 158 and
an upper semiconductor layer made of the p type silicon film
159.
[0274] The p type silicon film 157 which is a lower semiconductor
layer of the laminate (P1) constitutes the drain of the vertical
MISFET (SV1), while the p type silicon film 159 which is an upper
semiconductor layer constitutes its source. The silicon film 158,
which is an intermediate semiconductor layer lying between the
lower semiconductor layer and the upper semiconductor layer,
substantially constitutes the substrate of the vertical MISFET
(SV1) and the sidewall of it constitutes a channel region. The p
type silicon film 157, which is a lower semiconductor layer of the
laminate (P2), constitutes the drain of the vertical MISFET (SV2),
and the p type silicon film 159, which is an upper semiconductor
layer, constitutes the source. The silicon film 158 which is an
intermediate semiconductor layer substantially constitutes the
substrate of the vertical MISFET (SV2) and the sidewall of it
constitutes a channel region.
[0275] In a plan view, the laminate (P1) is disposed so as to
overlap with the through-hole 153, the barrier layer 148, an end
portion of the intermediate conductive layer 142, the contact hole
122 and an end portion of the gate electrode 107B of the drive
MISFET DR2, which lie under the laminate. The laminate (P2) is
disposed so as to overlap with the through-hole 153, the barrier
layer 148, an end portion of the intermediate conductive layer 143,
the contact hole 122 and an end portion of the gate electrode 107B
of the drive MISFET DR1, which lie under the laminate.
[0276] The three silicon film layers (157, 158, 159) are dry
etched, for example, by forming a taper, as illustrated in FIG. 77,
for example, on the bottom of the sidewall of each of the laminates
(P1,P2) to make the area of the lower part (the p type silicon film
157 as the lower semiconductor layer) of each of the laminates
(P1,P2) greater than that of the upper part (the silicon film 158
as an intermediate semiconductor layer and the p type silicon film
159 as an upper semiconductor layer). This makes it possible to
prevent a decrease in the contact area between the plug 155 and the
lower semiconductor layer (p type silicon film 157) inside of the
through-hole 153 even if the position of each of the laminates
(P1,P2) deviates from the through-hole 153 owing to misalignment of
a photomask, leading to prevention of a rise in the contact
resistance between the lower semiconductor layer (p type silicon
film 157) and the plug 155.
[0277] Upon formation of the laminates (P1,P2), one or plural
tunnel insulating film layers, each composed of a silicon nitride
film or the like, may be disposed at a portion of the silicon film
158 in the vicinity of the interface between the p type silicon
film 159, which is an upper semiconductor layer, and the silicon
film 158, which is an intermediate semiconductor layer, or in the
vicinity of the interface between the p type silicon film 157,
which is a lower semiconductor layer, and the silicon film 158.
This makes it possible to prevent diffusion, inside of the
intermediate semiconductor layer, of an impurity in the p type
silicon films (157, 159) constituting the lower and upper
semiconductor layers, bringing about an improvement in the
performance of the vertical MISFETs (SV1,SV2). In this case, the
tunnel insulating film is formed to have a thickness that is thin
enough (several nm or less) to suppress a lowering in the drain
current (Ids) of the vertical MISFETs (SV1,SV2).
[0278] As illustrated in FIG. 78, by thermal oxidation of the
substrate 101, a gate insulating film 163 made of a silicon oxide
film is formed over the surface of the sidewall of each of the
lower semiconductor layer (p type silicon film 157), the
intermediate semiconductor layer (silicon film 158) and upper
semiconductor layer (p type silicon film 159) constituting each of
the laminates (P1,P2). At this time, there is no danger of the
surface of each of the gate extraction electrodes 151a, 151b and
the plug 155 in the through-hole 153, which are formed below the
laminates (P1,P2) and made of a polycrystalline silicon film, being
oxidized and having an increased resistance, because the gate
extraction electrodes 151a, 151b and the plug 155 in the
through-hole 153 are covered with a silicon-oxide-based insulating
film (silicon oxide film 152, sidewall spaces 154). Between each of
the laminates (P1,P2) and the silicon nitride film 162 thereover, a
silicon oxide film 161 is formed so that contact between the
silicon nitride film 162 with a gate insulating film 163 to be
formed over the upper semiconductor layer is prevented, making it
possible to avoid a reduction in withstand voltage of the gate
insulating film 163 in the vicinity of the upper end portion of the
laminates (P1,P2).
[0279] The gate insulating film 163 on the sidewall of each of the
laminates (P1,P2) is formed, for example, by low-temperature
thermal oxidation (for example, wet oxidation) at 800.degree. C. or
less. The formation method is not limited thereto, but the film may
be made of a silicon oxide film deposited by CVD, or a high
dielectric film, such as hafnium (HfO.sub.2) or tantalum oxide
(Ta.sub.2O.sub.5) deposited by CVD. When such a film is employed,
the gate insulating film 163 can be formed at a temperature lower
than the above, making it possible to suppress fluctuations of a
threshold voltage of the vertical MISFETs (SV1,SV2) resulting from
diffusion of impurities.
[0280] Then, as a conductive film constituting a portion of the
gate electrode of each of the vertical MISFETs (SV1,SV2) over the
sidewall of the laminates (P1,P2) in the square pole form and the
silicon nitride film 162 thereover, a first polycrystalline silicon
layer 164 is formed, for example. This first polycrystalline
silicon layer 164 is formed by depositing a polycrystalline silicon
film over the silicon oxide film 152 by CVD, and by anisotropically
etching the resulting polycrystalline silicon film to leave it in
the sidewall spacer form so as to encompass therewith the sidewall
of each of the square-pole laminates (P1,P2) and the silicon
nitride film 162. The first polycrystalline silicon layer 164
constituting a portion of the gate electrode is formed in self
alignment with the square-pole laminates (P1,P2) and gate
insulating film 163 so that the memory cell size can be reduced.
Into the polycrystalline silicon film constituting the first
polycrystalline silicon layer 164, boron is doped to impart it with
p conductivity.
[0281] When the first polycrystalline silicon layer 164 is formed
by etching of the polycrystalline silicon film, the etching of the
polycrystalline silicon film is followed by the etching of the
silicon oxide film 152 lying therebelow, by which the silicon oxide
film 152 in a region other than a region just below the square-pole
laminates (P1,P2) is removed to expose the gate extraction
electrodes 151a, 151b and the silicon oxide film 149. The silicon
oxide film 152 remains between the lower end portion of the first
polycrystalline silicon layer 164 and the gate extraction
electrodes 151a, 151b so that the first polycrystalline silicon
layer 164 is not electrically connected to the gate extraction
electrodes 151a, 151b.
[0282] Then, a second polycrystalline silicon layer 165 is formed,
for example, as a conductive film over the surface of the first
polycrystalline silicon layer 164. This second polycrystalline
silicon layer 165 is formed by depositing a polycrystalline silicon
film over the silicon oxide film 152 by CVD, and anisotropically
etching this polycrystalline silicon film to leave it in the form
of a sidewall spacer so as to encompass the surface of the first
polycrystalline silicon layer 164. The polycrystalline silicon film
constituting the second polycrystalline silicon layer 165 is doped
with boron to impart it with p conductivity.
[0283] The polycrystalline silicon film constituting the second
polycrystalline silicon layer 165 is deposited over the sidewall of
the silicon oxide film 152 remaining just below the square-pole
laminates (P1,P2) or the surface of the gate extraction electrodes
151a, 151b so that by anisotropic etching of this polycrystalline
silicon film, the lower end portion thereof is brought into contact
with the surface of the gate extraction electrodes 151a, 151b.
[0284] Since the second polycrystalline silicon layer 165 which is
electrically connected, at the lower end portion thereof, to the
gate extraction electrodes 151a, 151b is thus formed in self
alignment with the first polycrystalline silicon layer 164, the
memory size can be reduced.
[0285] By the steps so far described, the gate electrode 166 of
each of the vertical MISFETs (SV1,SV2) made of a laminate of the
first polycrystalline silicon layer 164 and the second
polycrystalline silicon film 165 is formed over the sidewall of
each of the square-pole laminates (P1,P2) and the silicon nitride
film 162. This gate electrode 166 is electrically connected to the
gate extraction electrodes 151a, 151b via the second
polycrystalline silicon layer 165 constituting a portion of the
gate electrode.
[0286] In this manner, the first polycrystalline silicon layer 164
constituting a portion of the gate electrode (166) is formed, in
the form of a sidewall spacer, in self alignment with the
square-pole laminates (P1,P2) and the gate insulating film 163,
while the second polycrystalline silicon layer 165 which is
electrically connected, at the lower end portion thereof, to the
gate extraction electrodes 151a, 151b is formed, in the form of a
sidewall spacer, in self alignment with the first polycrystalline
silicon layer 164, which enables a reduction of the memory size. In
other words, the gate electrode (166) is formed in self alignment
with the square-pole laminates (P1,P2) and the gate insulating film
163. The gate electrode (166) is connected in self alignment with
the gate extraction electrode 151a, which enables a reduction in
memory size.
[0287] When the gate electrode 166 is composed of two conductive
film layers (first polycrystalline silicon layer 164 and second
polycrystalline silicon layer 165) as described above, the second
polycrystalline layer 165 may be replaced with a W silicide film or
W film to impart to the gate electrode 166 a low-resistance
silicide structure or polymetal structure.
[0288] As illustrated in FIGS. 79 and 80, after a silicon oxide
film 170 is deposited, as an insulating film, over the substrate
101 by CVD, its surface is planarized by CMP. The silicon oxide
film (first insulating film) 170 is deposited so as to have a
surface height after planarization that is higher than that of the
silicon nitride film 162, by which etching of the surface of the
silicon nitride film 162 can be avoided upon planarization.
[0289] After etching of the silicon oxide film 170 to retreat its
surface height to a level lower than the upper end of each of the
laminates (P1,P2), the gate electrode 166 formed over the sidewall
of each of the laminates (P1,P2) and the silicon nitride film 162
is etched to lower its upper end.
[0290] The above-described etching of the gate electrode 166 is
performed for preventing a short-circuit between the gate electrode
166 and a supply voltage line to be formed over the laminates
(P1,P2) later. The upper end portion of the gate electrode 166 is
therefore lowered to a position lower than the upper end portion of
the p type silicon film 159 serving as an upper semiconductor
layer. For the purpose of preventing an offset between the gate
electrode 166 and the upper semiconductor layer (source (p type
silicon film 159)), however, the etching amount is controlled so
that the upper end portion of the gate electrode 166 exists above
the upper end portion of the silicon film 158 serving as an
intermediate semiconductor layer.
[0291] By the steps so far described, p channel type vertical
MISFETs (SV1,SV2) are formed, having laminates (P1,P2) composed of
the p type silicon film 157 serving as a lower semiconductor layer
(drain), the silicon film 158 serving as an intermediate
semiconductor layer (substrate) and the p type silicon film 159
serving as an upper semiconductor layer (source), and the gate
insulating film 163 and gate electrode 166 formed over the sidewall
of the laminates (P1,P2).
[0292] As illustrated in FIG. 81, after formation of the sidewall
spacer 171 over the side walls of the gate electrode 166 of each of
the vertical MISFETs (SV1,SV2) and the p type silicon film 159
serving as an upper semiconductor layer, each exposed above the
silicon oxide film 170, and the silicon nitride film 162 lying over
the p type silicon film, a silicon nitride film (first insulating
film) 172 is deposited over the silicon oxide film 170 by CVD. The
sidewall spacer 171 is formed by anisotropic etching of the silicon
oxide film deposited by CVD.
[0293] A silicon oxide film (first insulating film) 173 is
deposited by CVD over the silicon nitride film 172, followed by
planarization of the surface of the silicon oxide film 173 by
CMP.
[0294] As illustrated in FIGS. 82 and 83, the silicon oxide film
173, silicon nitride film 172 and silicon oxide film 170 are dry
etched using a photoresist film as a mask to form through-holes
(third openings) 174, 175, 176 from which the surface of the
intermediate conductive layers 141, 144, 145 are exposed,
respectively, and a through-hole (third opening) 177 from which the
surfaces of the first-level interconnects 146, 147 of the
peripheral circuit are exposed.
[0295] As illustrated in FIGS. 84 and 85, a plug 178 is formed
inside of each of the through-holes 174 to 177. This plug 78 is
formed, for example, by depositing a Ti film and a TiN film over
the silicon oxide film 173 including the insides of the
through-holes 174 to 177 by sputtering, depositing a TiN film and a
W film by CVD and then, removing the W film, TiN film and Ti film
outside the through-holes 174 to 177 by CMP.
[0296] Using a photoresist film as a mask, the silicon oxide film
173, silicon nitride film 172 and silicon oxide film 170 are dry
etched to form a through-hole (first opening) 179 from which the
surface of each of the gate extraction electrode 151a and
intermediate conductive layer 142 are exposed and a through-hole
(first opening) 180 from which the surface of each of the gate
extraction electrode 151b and intermediate conductive layer 143 are
exposed.
[0297] As illustrated in FIG. 86, a TiN film (first conductive
film) 181A that is about 50 nm thick is deposited over the silicon
oxide film 173 including the insides of the through-holes 179 and
180 by sputtering. Using a photoresist film as a mask, the TiN film
181A is dry etched to leave the TiN film 181A inside of the
through-holes 179 and 180. By this TiN film 181A, a potential can
be gained from the drive MISFETs DR1,DR2 and transfer MISFETs
TR1,TR2.
[0298] As illustrated in FIG. 87, a silicon nitride film (second
insulating film) 181B that is about 10 nm to 20 nm thick is
deposited over the silicon oxide film 173 including the insides of
the through-holes 179 and 180 and TiN film 181A by CVD. Over the
silicon nitride film 181B, then, a TiN film (second conductive
film) 181C that is about 50 nm thick is deposited by, for example,
sputtering.
[0299] By dry etching using a photoresist film as a mask, the TiN
film 181C is patterned as illustrated in FIGS. 88 and 89. Using
another photoresist mask, the silicon nitride film 181B is
patterned by dry etching, by which a capacitor element (first
capacitor element) C having the TiN film 181A as a lower electrode,
the silicon nitride film 181B as an insulator and the TiN film 181C
as an upper electrode is formed in the through-holes 179 and 180.
The lower electrode of this capacitor element C is electrically
connected to the gate extraction electrodes 151a, 152b. In such a
capacitor element C of Embodiment 6, the TiN film 181A can function
not only as a lower electrode (TiN film 181A) of the capacitor
element C but also as an interconnect for electrically connecting
the gate electrode of each of the drive MISFET DR2 (or drive MISFET
DR1) and vertical MISFET SV2 (or vertical MISFET SV1) to a storage
node A (storage node B). The upper electrode (TiN film 181C) of the
capacitor element C is electrically connected to the p type silicon
film 159 serving as an upper semiconductor layer (source) of the
vertical MISFETs (SV1,SV2) via a plug which will be formed later.
In short, the upper electrode of the capacitor element C is
electrically connected to a supply voltage line (Vdd), which will
be described later, together with a plug formation step. In FIG.
88, the TiN film 181C remaining after patterning is illustrated as
a region surrounded by a dashed line.
[0300] As described above, the lower electrode (TiN film 181A) of
the capacitor element C is formed over the bottom and circumference
of the sidewall inside of each of the through-holes 179 and 180,
and, at the same time, it constitutes, together with the upper
electrode (TiN film 181C) of the capacitor element C, a capacitance
via a dielectric film (silicon nitride film 181B) of the capacitor
element C. Such a constitution makes it possible to use the bottom
and circumference of the sidewall of each of the through-holes 179
and 180 as a capacitance area, leading to an improvement of the
capacitance. In addition, by forming the capacitor element C while
making use of the through-holes 179 and 180, the memory cell of the
SRAM (refer to FIGS. 63 to 65) can be provided with a capacitance
sufficient to prevent lowering of the soft error resistance without
increasing the memory cell area of the SRAM of Embodiment 6. In
other words, even if the capacitance for preventing lowering of the
soft error resistance is added to the memory cell of the SRAM, it
is possible to suppress a size increase of the chip having a memory
cell of the SRAM of Embodiment 6.
[0301] In Embodiment 6, the two silicon oxide film layers 173 and
170 are formed to cover the plug 155 for electrically connecting
the vertical MISFETs SV1,SV2 to the intermediate conductive layers
142 and 143, and the p type silicon film 157, silicon film 158, p
type silicon film 159 and silicon nitride films 162 and 172
constituting the vertical MISFETs SV1,SV2. The total thickness of
the two silicon oxide film layers 173 and 170 therefore becomes
greater so that the through-holes 179 and 180 formed to penetrate
through the silicon oxide films 173 and 170 are deep (have a high
aspect ratio). A capacitor element C having a large electrode area
can therefore be formed in the through-holes 179 and 180. In other
words, since a capacitor element C having a large capacitance can
be formed according to Embodiment 6, a SRAM having higher a soft
error resistance can be manufactured.
[0302] In this Embodiment 6, a silicon nitride film 181B is
employed as an example of the insulator, but it may be replaced
with a tantalum oxide film or a silicon oxide film. In particular,
use of a tantalum oxide film increases the capacitance of the
capacitor element C because it has a high specific dielectric
constant, leading to actualization of higher soft error resistance
in the SRAM of Embodiment 6. Alternatively, it is also possible to
increase the capacitance of the capacitor element C by using the
amorphous silicon film 32A (refer to FIG. 50) doped with an
impurity as described in connection with Embodiment 4 to roughen
the surface of the upper electrode, thereby increasing the
electrode area of the capacitor element C.
[0303] As illustrated in FIGS. 90 and 91, after deposition of a
silicon oxide film 182 as an insulating film over the silicon oxide
film 173 by CVD, the silicon oxide film 182 is filled in the
through-holes 179 and 180. Then, the surface of the silicon oxide
film 182 is planarized by CMP to relax step differences on the
surface. Since the aspect ratio of the through-holes 179 and 180 is
large, the through-holes 179 and 180 are not necessarily filled
completely with the silicon oxide film 182. The presence of some
spaces, if any, in the silicon oxide film 182 inside of the
through-holes 179 and 180 does not pose any problem if the silicon
oxide film 182 does not open at the opening portions of the
through-holes 179 and 180 and seals the opening portion of the
through-holes 179 and 180 completely.
[0304] By dry etching using a photoresist film as a mask, the
silicon oxide film 182, TIN film 181C (refer to FIG. 89), silicon
nitride film 181B (refer to FIG. 89), silicon oxide film 173 and
silicon nitride films 172 and 162, each over the laminates (P1,P2),
are removed to form a through-hole 183 from which the p type
silicon film 159 serving as an upper semiconductor layer (source)
of the vertical MISFETs (SV1,SV2) is exposed.
[0305] Upon dry etching, after etching is once stopped when the
silicon oxide film 182, TiN film 181C, silicon nitride film 181B
and silicon oxide film 173 over the laminates (P1,P2) are removed,
the silicon nitride films 172 and 162 are etched. Since the
sidewall spacer 171 made of a silicon oxide film is formed over the
sidewall of the silicon nitride film 162 and p type silicon film
159, the upper portion of the gate electrode 166 is protected by
the side wall spacer 171 from etching of the silicon nitride films
172 and 162 and exposure of the gate electrode 166 is prevented,
even if the relative position of the p type silicon film 159
serving as an upper semiconductor layer deviates from the
through-hole 183, for example, in the direction of a line B-B owing
to misalignment of a photomask.
[0306] The silicon oxide film 182 and silicon nitride film 181B
covering the upper portion of the through-hole 177 of the
peripheral circuit are etched to form a through-hole 184, by which
the surface of the plug 178 filled in the through-hole 177 is
exposed. In addition, by etching the silicon oxide film 182
covering the upper portion of the through-holes 174 to 176 formed
in the memory array to form a through-hole 185, the surface of the
plug 178 filled in the through-holes 174 to 176 is exposed.
[0307] A plug 186 is then formed inside of each of the
through-holes 183 to 185. The plug 186 is formed, for example, by
depositing a TiN film over the silicon oxide film 182 including the
inside of the through-holes 183 to 185 by sputtering, depositing a
TiN film and W film by CVD and then removing the TiN film and W
film outside the through-hole 183 to 185 by CMP.
[0308] By the formation of the plug 186, the upper electrode (TiN
film 181C (refer to FIG. 89)) of the capacitor element C is
connected to the side surface of the plug 186 which is to be
connected with the p type silicon film 159 serving as an upper
semiconductor layer (source) of the vertical MISFETs (SV1,SV2). It
is not necessary to cause a large current to pass through the
capacitor element C, but it is only necessary to apply an adequate
voltage to the capacitor element C, so that a large contact area is
not required between the plug 186 and the upper electrode of the
capacitor element C.
[0309] As illustrated in FIGS. 92 and 93, after deposition of a
silicon carbide film 187 and a silicon oxide film 188 over the
silicon oxide film 182 by CVD, the silicon oxide film 188 and
silicon carbide film 187 over the through-holes 183, 184, 185 are
dry etched using a photoresist film as a mask, by which
interconnect grooves 189 are formed. As illustrated in FIG. 92, the
interconnect groove 189 formed over the through-hole 183 lying
above the vertical MISFETs (SV1,SV2) and two interconnect grooves
189 formed adjacent to both sides of the above-described
interconnect groove 189 each has a planar strip-shaped pattern
extending in the Y direction. Four interconnect grooves 189 are
formed at the end portions of the memory cell, each having a
rectangular plane pattern having a long side in the Y
direction.
[0310] A supply voltage line 190 (Vdd) is formed inside of the
interconnect grooves 189 running above the vertical MISFETs
(SV1,SV2), while a second-level interconnect 191 is formed inside
of the interconnect grooves 189 in the peripheral circuit region.
One (date line BLT) of the complementary data lines (BLT,BLB) is
formed inside of the interconnect groove 189 running above the
n.sup.+ type semiconductor regions 114 (source, drain) of the
transfer MISFET (TR1) and drive MISFET (DR1) and the plug 178,
while the other one (data line BLB) of the complementary data lines
(BLT,BLB) is formed inside of the interconnect groove 189 running
above the n.sup.+ type semiconductor regions 114 (source, drain) of
the transfer MISFET (TR2) and drive MISFET (DR2) and the plug 178.
Interconnects 192 (illustrated in FIG. 94) are formed inside of the
four interconnect grooves 189 that are formed at the end portions
of the memory cell.
[0311] The supply voltage line 190 (Vdd), complementary data lines
(BLT,BLB), second-level interconnect 191 and extraction
interconnect 192 are formed by depositing a tantalum nitride (TaN)
film or Ta film as a conductive barrier film over the silicon oxide
film 188 including the inside of the interconnect groove 189 by,
for example, sputtering, depositing a Cu film, which is a metal
film, by sputtering or plating and then removing an unnecessary
portion of the Cu film and TaN film outside the interconnect groove
189 by CMP.
[0312] The supply voltage line (Vdd) is electrically connected to
the p type silicon film 159, which is an upper semiconductor layer
(source) of the vertical MISFETs (SV1,SV2), via the plug 186. One
(data line BLT) of the complementary data lines (BLT,BLB) is
electrically connected to the n.sup.+ semiconductor region 114
(either one of the source and drain) of the transfer MISFET (TR1)
via the plugs 186 and 178, intermediate conductive layer 144 and
plug 128, while the other one (data line BLB) is electrically
connected to the n.sup.+ semiconductor region 114 (the other one of
the source and drain) of the transfer MISFET (TR2) via the plugs
186 and 178, intermediate conductive layer 144 and plug 128.
[0313] As illustrated in FIGS. 94 and 95, a reference voltage line
193 (Vss) and a word line (WL) are formed over the interconnect
layer having the supply voltage line 190 (Vdd), complementary data
lines (BLT,BLB), second-level interconnect 191 and extraction
interconnect 192. The reference voltage line 193 (Vss) and word
line (WL) have a stripped planar pattern extending in the X
direction of FIG. 9.
[0314] The reference voltage line 193 (Vss) and word line (WL) are
formed, for example, by depositing an insulating film 194 over the
silicon oxide film 188, forming an interconnect groove 195 in this
insulating film 194, depositing a Cu film and TaN film over the
insulating film 194 including the inside of the interconnect groove
195 in the above-described manner, and removing an unnecessary
portion of the Cu film and TaN film outside the interconnect groove
195 by CMP. The insulating film 194 is constituted of a laminate of
a silicon oxide film, a silicon carbide film and a silicon oxide
film deposited by CVD. Upon formation of the interconnect groove
195 in the insulating film 194, an opening 195a is made in the
interconnect groove 195 above each of the four extraction
interconnects 192 formed at the end portion of the memory cell and
through the opening 195a, a portion of each of the four extraction
interconnects is exposed from the bottom of the interconnect groove
195.
[0315] The reference voltage line 193 (Vss) is electrically
connected to the n.sup.+ semiconductor region 114 (source) of each
of the drive MISFETs (DR1,DR2) via the extraction interconnect 192,
plugs 186 and 178, intermediate conductive layer 144 and plug 128.
The word line (WL) is electrically connected to the n.sup.+
semiconductor region 114 (the other one of the source and drain) of
each of the transfer MISFETs (DR1,DR2) via the extraction
interconnect 192, plugs 186 and 178, intermediate conductive layer
144 and plug 128. By the steps so far described, the SRAM of
Embodiment 6 is completed and the circuit shown in FIG. 63 can be
actualized. The upper electrode (TiN film 181C) of the capacitor
element C is electrically connected to the source voltage line 190
(Vdd) and it always serves as a supply voltage (Vdd), making it
possible to cause the capacitor element C to generate a capacitance
when the storage nodes (A,B) are at 0 V (Low).
[0316] As illustrated in FIG. 96, patterning of the TiN film 181C
which serves an upper electrode of the capacitor element C, is
carried out to electrically connect it to the reference voltage
line 193 (Vss) without forming an electric connection with the
supply voltage line (190). In other words, patterning of the TiN
film 181C is carried out so as not to connect to the plug 186 which
is formed in the through-hole 183 and is electrically connected to
the supply voltage line 190 (Vdd), but to connect to the side
surface of the plug 186 which is formed in the through-hole 186 and
is electrically connected to the reference voltage line 190 (Vdd).
By this patterning, the circuit as illustrated in FIG. 64 can be
actualized. The upper electrode (TiN film 181C) of the capacitor
element C is electrically connected to the reference voltage line
193 (Vss), and its voltage always becomes a reference voltage so
that the capacitor element C can be caused to generate capacitance
when the storage nodes (A,B) are high.
Embodiment 7
[0317] FIGS. 97 to 99 are circuit diagrams or block diagrams
illustrating examples of the analog circuit of Embodiment 7. In
this Embodiment 7, a capacitor element formed in a similar manner
to, for example, that employed for the capacitor element C1 (refer
to FIG. 32) which is formed in the peripheral circuit region ACA
(refer to FIG. 32) in connection with Embodiment 3 is applied as a
capacitor element of these analogue circuits.
[0318] FIG. 97 illustrates one example of a sample hold circuit
according to Embodiment 7. This sample hold circuit has a switch
SW1 for signal sample, a hold condenser Ch for holding a voltage
and a buffer amplifier BAMP having a gain of 1. When the switch S1
is closed (sample mode), an input voltage becomes an output voltage
as is. When the switch S1 is open (hold mode), the voltage of the
hold condenser Ch becomes an output voltage. Since the hold
condenser Ch maintains the voltage upon sampling, the input voltage
upon sampling is maintained as the output voltage until the next
sample mode.
[0319] FIG. 98 illustrates one example of a primary filter (low
pass filter) circuit according to Embodiment 7. This primary filter
circuit has, for example, a circuit block CB including a resistance
component and a condenser CL1. An input voltage from which an
unnecessary high-frequency component has been removed by this
primary filter circuit is an output voltage.
[0320] FIG. 99 illustrates one example of a PLL (Phase Locked Loop)
circuit according to Embodiment 7. This PLL circuit has, for
example, a phase comparator circuit PC, a charge pump CP, a loop
filter LF having a resistance R and condenser CL2, and a voltage
controlled oscillator VCO having a ring oscillator RO. The phase
comparator PC outputs a differential signal voltage, representing a
phase difference between a reference clock to be input and a PLL
clock (output clock) from the voltage controlled oscillator VCO.
This differential signal voltage is transmitted to the loop filter
LF via the charge pump. After an unnecessary high-frequency
component is removed by the loop filter LF, the voltage is applied
to a control voltage terminal of the voltage controlled oscillator.
The voltage controlled oscillator changes the frequency of the
output clock so as to decrease the difference in the frequency
between the reference clock and the output clock. When the
frequency of the output clock becomes equal to that of the
reference clock by repeating the above-described operation, the
above-described phase difference becomes 0 and the loop keeps a
stable state (phase locked state), by which the operation is
completed. The loop filter LF also serves to determine the response
characteristics and stationary characteristics.
[0321] The hold condenser Ch and condensers CL1,CL2 require a
relatively large capacitance in order to prevent a surge or output
of a high-frequency noise and to stabilize the output voltage. When
such a hold condenser Ch and condensers CL1,CL2 having a large
capacitance are each formed as a capacitor element having, for
example, a similar constitution to that of the capacitor element
C11, as described using FIGS. 33 and 34 in connection with
Embodiment 3, the area of the capacitor element on the chip
increases, inevitably leading to an increase in the size of the
chip having the analog circuit of Embodiment 7. By forming each of
the hold condenser Ch and condensers CL1,CL2 as a capacitor element
having a similar constitution to that of the capacitor element C1,
as described in connection with Embodiment 3, therefore, the area
of the hold condenser Ch and condensers CL1,CL2 on the chip can be
reduced greatly. In other words, the area necessary for the
formation of the analog circuit of Embodiment 7 can be reduced
drastically so that the size of the chip having the analogue
circuit of Embodiment 7 can be decreased.
[0322] The present invention have been described specifically based
on various Embodiments. The present invention is not limited to or
by these embodiments, and it is needless to say that it can be
modified to an extent not departing from the gist of the
invention.
[0323] In Embodiments 1 to 5, interconnects having an Al film as a
main conductive layer were described as examples, but interconnects
may be formed by making an interconnect formation groove in an
interlayer insulating film and filling the groove with a conductive
film composed mainly of copper.
[0324] Of the aspects of the invention disclosed with reference to
the present embodiments, typical ones will next be described
briefly.
[0325] In a semiconductor integrated circuit device comprising a
memory cell having first and second transfer MISFETs, first and
second drive MISFETs, and first and second load MISFETs, each
disposed at an intersection between a pair of complementary data
lines and a word line, the first drive MISFET and the first load
MISFET being cross-coupled with the second drive MISFET and second
load MISFET,
[0326] the first and second transfer MISFETs and the first and
second drive MISFETs are formed over the main surface of a
semiconductor substrate,
[0327] a first insulating film is formed over the semiconductor
substrate and a first opening is formed in the first insulating
film,
[0328] a first capacitor element having, as a lower electrode, a
first conductive film formed along the sidewall and bottom of the
first opening, as a capacitor, a second insulating film formed over
the first conductive film, and as an upper electrode, a second
conductive film formed over the second insulating film is formed
over the sidewall and bottom of the first opening,
[0329] a supply voltage line to be electrically connected to the
first and second load MISFETs, the first and second drive MISFETs
and a reference voltage line are formed over the first capacitor
element,
[0330] the lower electrode constitutes a first storage node of the
memory cell by electrically connecting a drain of the first drive
MISFET, a drain of the first load MISFET, a gate electrode of the
second drive MISFET and a gate electrode of the second load MISFET,
and a second storage node of the memory cell by electrically
connecting a drain of the second drive MISFET, a drain of the
second load MISFET, a gate electrode of the first drive MISFET and
a gate electrode of the first load MISFET,
[0331] the first capacitor element is electrically connected
between the first storage node and second storage node, and the
supply voltage line, between the first storage node and second
storage node, and the reference voltage line, or between the first
storage node and the second storage node, and
[0332] the first opening reaches the gate electrode of the each of
first and second drive MISFETs and the drain of each of the first
and second load MISFETs.
[0333] In the above-described semiconductor integrated circuit
device, the first conductive film contains silicon and at the
interface between the first insulating film and the second
insulating film, the first conductive film has silicon grains.
[0334] In a semiconductor integrated circuit device comprising a
memory cell having first and second transfer MISFETs, first and
second drive MISFETs and first and second load MISFETs, each
disposed at an intersection between a pair of complementary data
lines and a word line, the first drive MISFET and first load MISFET
being cross-coupled with the second drive MISFET and second load
MISFET,
[0335] the first and second transfer MISFETs and the first and
second drive MISFETs are formed over the main surface of a
semiconductor substrate,
[0336] a first insulating film is formed over the semiconductor
substrate and a first opening is formed in the first insulating
film,
[0337] a first capacitor element having, as a lower electrode, a
first conductive film formed along the sidewall and bottom of the
first opening, as an insulator, a second insulating film formed
over the first conductive film, and as an upper electrode, a second
conductive film formed over the second insulating film is formed
over the sidewall and bottom of the first opening,
[0338] a supply voltage line to be electrically connected to the
first and second load MISFETs, the first and second drive MISFETs
and a reference voltage line are formed over the first capacitor
element,
[0339] the lower electrode constitutes a first storage node of the
memory cell by electrically connecting a drain of the first drive
MISFET, a drain of the first load MISFET, a gate electrode of the
second drive MISFET and a gate electrode of the second load MISFET,
and a second storage node of the memory cell by electrically
connecting a drain of the second drive MISFET, a drain of the
second load MISFET, a gate electrode of the first drive MISFET and
a gate electrode of the first load MISFET,
[0340] the first capacitor element is electrically connected
between the first storage node and second storage node, and the
supply voltage line, between the first storage node and second
storage node, and the reference voltage line, or between the first
storage node and the second storage node, and
[0341] the first and second load MISFETs are formed at a position
higher than that of each of the first and second transfer MISFETs,
and the first and second drive MISFETs, the first load MISFET has a
source, channel region and a drain which is formed in a first
laminate and extends in a direction perpendicular to the main
surface of the semiconductor substrate, and a gate electrode formed
over the sidewall of the first laminate via a gate insulating film,
the second load MISFET has a source, channel region and a drain
which is formed in a second laminate and extends in a direction
perpendicular to the main surface of the semiconductor substrate
and a gate electrode formed over the sidewall of the second
laminate via a gate insulating film; and the first insulating film
is formed to cover the first and second load MISFETs.
[0342] In the above-described semiconductor integrated circuit
device, the first conductive film contains silicon and at the
interface between the first insulating film and the second
insulating film, the first conductive film has silicon grains.
[0343] In a semiconductor integrated circuit device comprising a
memory cell having first and second transfer MISFETs, first and
second drive MISFETs and first and second load MISFETs, each
disposed at an intersection between a pair of complementary data
lines and a word line, the first drive MISFET and first load MISFET
being cross-coupled with the second drive MISFET and second load
MISFET,
[0344] the first and second transfer MISFETs and the first and
second drive MISFETs are formed over the main surface of a
semiconductor substrate,
[0345] a first insulating film is formed over the semiconductor
substrate and a first opening is formed in the first insulating
film,
[0346] a first capacitor element having, as a lower electrode, a
first conductive film formed along the sidewall and bottom of the
first opening, as an insulator, a second insulating film formed
over the first conductive film, and as an upper electrode, a second
conductive film formed over the second insulating film is formed
over the sidewall and bottom of the first opening,
[0347] a supply voltage line to be electrically connected to the
first and second load MISFETs, the first and second drive MISFETs
and a reference voltage line are formed over the first capacitor
element,
[0348] the lower electrode constitutes a first storage node of the
memory cell by electrically connecting a drain of the first drive
MISFET, a drain of the first load MISFET, a gate electrode of the
second drive MISFET and a gate electrode of the second load MISFET,
and a second storage node of the memory cell by electrically
connecting a drain of the second drive MISFET, a drain of the
second load MISFET, a gate electrode of the first drive MISFET and
a gate electrode of the first load MISFET,
[0349] the first capacitor element is electrically connected
between the first storage node and second storage node, and the
supply voltage line, between the first storage node and second
storage node, and the reference voltage line, or between the first
storage node and the second storage node, the memory cell is formed
in a first region over the main surface of the semiconductor
substrate and a power supply circuit is formed in a second region
over the main surface of the semiconductor substrate,
[0350] in a second opening formed in the first insulating film in
the second region, a second capacitor element having, as a lower
electrode, the first conductive film formed along the sidewall and
bottom of the second opening, as an insulator, the second
insulating film formed over the first conductive film, and as an
upper electrode, the second conductive film formed over the second
insulating film, and
[0351] the power supply circuit feeds the memory cell with an
operating voltage and the second capacitor element is electrically
connected between the operating voltage and ground voltage.
[0352] In the above-described semiconductor integrated circuit
device, the first conductive film contains silicon and at the
interface between the first insulating film and the second
insulating film, the first conductive film has silicon grains.
[0353] In a semiconductor integrated circuit device comprising a
memory cell having first and second transfer MISFETs, first and
second drive MISFETs and first and second load MISFETs, each
disposed at an intersection between a pair of complementary data
lines and a word line, the first drive MISFET and first load MISFET
being cross-coupled with the second drive MISFET and second load
MISFET, and a power supply circuit,
[0354] the memory cell is formed in a first region over the main
surface of the semiconductor substrate and the power supply circuit
is formed in a second region over the main surface of the
semiconductor substrate,
[0355] a first insulating film is formed over the semiconductor
substrate,
[0356] in a second opening formed in the first insulating film in
the second region, a second capacitor element having, as a lower
electrode, a first conductive film formed along the sidewall and
bottom of the second opening, as an insulator, a second insulating
film formed over the first conductive film, and as an upper
electrode, a second conductive film formed over the second
insulating film is formed,
[0357] the power supply circuit feeds the memory cell with an
operating voltage, and the second capacitor element is electrically
connected between the operating voltage and ground voltage.
[0358] In the above-described semiconductor integrated circuit
device, the first conductive film contains silicon and at the
interface between the first insulating film and the second
insulating film, the first conductive film has silicon grains.
[0359] A semiconductor integrated circuit device, comprising a
first insulating film formed over a semiconductor substrate and a
second opening formed in the first insulating film,
[0360] wherein over the sidewall and the bottom of the second
opening, a capacitor element having, as a lower electrode, a first
conductive film formed along the sidewall and bottom of the second
opening, as an insulator, a second insulating film formed over the
first conductive film, and as an upper electrode, a second
conductive film formed over the second insulating film is formed,
and the capacitor element constitutes an analog circuit.
[0361] In the above-described semiconductor integrated circuit
device, the first conductive film contains silicon and at the
interface between the first insulating film and the second
insulating film, the first conductive film has silicon grains.
[0362] A manufacturing method of a semiconductor integrated circuit
device comprising a memory cell having first and second transfer
MISFETs, first and second drive MISFETs and first and second load
MISFETs, each disposed at an intersection between a pair of
complementary data lines and a word line, the first drive MISFET
and first load MISFET being cross-coupled with the second drive
MISFET and second load MISFET, which comprises:
[0363] (a) forming the first and second transfer MISFETs and the
first and second drive MISFETs over the main surface of a
semiconductor substrate,
[0364] (b) forming a first insulating film over the semiconductor
substrate and making a first opening in the first insulating
film,
[0365] (c) forming a first conductive film over the sidewall and
bottom of the first opening, forming a first node of the memory
cell by electrically connecting, via the first conductive film, a
drain of the first drive MISFET, a drain of the first load MISFET,
a gate electrode of the second drive MISFET and a gate electrode of
the second load MISFET, and forming a second node by electrically
connecting, via the first conductive film, a drain of the second
drive MISFET, a drain of the second load MISFET, a gate electrode
of the first drive MISFET and a gate electrode of the first load
MISFET,
[0366] (d) forming a second insulating film over the first
conductive film, forming a second conductive film over the second
insulating film and forming a first capacitor element having the
first conductive film as a lower electrode, the second insulating
film as an insulator and the second conductive film as an upper
electrode, and
[0367] (e) forming a supply voltage line and a reference voltage
line over the first capacitor element, wherein:
[0368] the first capacitor element electrically connects between
the first storage node and second storage node, and the supply
voltage line, between the first storage node and second storage
node, and the reference voltage line, or between the first storage
node and the second storage node.
[0369] In the above-described manufacturing method, the first
conductive film is formed by steps including:
[0370] (c1) forming, over the first insulating film including the
inside of the first opening, an amorphous silicon film containing
an impurity, and
[0371] (c2) feeding the surface of the amorphous silicon film with
an SiH.sub.4-gas-containing gas in an atmosphere of reduced
pressure.
[0372] A manufacturing method of a semiconductor integrated circuit
device comprising a memory cell having first and second transfer
MISFETs, first and second drive MISFETs and first and second load
MISFETs, each disposed at an intersection between a pair of
complementary data lines and a word line, the first drive MISFET
and first load MISFET being cross-coupled with the second drive
MISFET and second load MISFET, which comprises:
[0373] (a) forming the first and second transfer MISFETs and the
first and second drive MISFETs over the main surface of a
semiconductor substrate,
[0374] (b) forming a first insulating film over the semiconductor
substrate and making a first opening formed in the first insulating
film,
[0375] (c) forming a first conductive film over the sidewall and
bottom of the first opening, forming a first storage node of the
memory cell by electrically connecting, via the first conductive
film, a drain of the first drive MISFET, a drain of the first load
MISFET, a gate electrode of the second drive MISFET and a gate
electrode of the second load MISFET, and forming a second storage
node by electrically connecting, via the first conductive film, a
drain of the second drive MISFET, a drain of the second load
MISFET, a gate electrode of the first drive MISFET and a gate
electrode of the first load MISFET,
[0376] (d) forming a second insulating film over the first
conductive film, forming a second conductive film over the second
insulating film and forming a first capacitor element having the
first conductive film as a lower electrode, the second insulating
film as an insulator and the second conductive film as an upper
electrode, and
[0377] (e) forming a supply voltage line and a reference voltage
line over the first capacitor element,
[0378] said first capacitor element being electrically connected
between the first storage node and second storage node, and the
supply voltage line, between the first storage node and second
storage node, and the reference voltage line, or between the first
storage node and the second storage node, and
[0379] forming the memory cell in a first region over the main
surface of the semiconductor substrate and forming a power supply
circuit for feeding an operating voltage to the memory cell in a
second region over the main surface of the semiconductor
substrate,
[0380] (f) forming a second opening in the first insulating film in
the second region, and
[0381] (g) forming the first conductive film along the sidewall and
bottom of the second opening portion, forming the second insulating
film over the first conductive film in the second opening, and
forming the second conductive film over the second insulating film
in the second opening to form a second capacitor element which has
the first conductive film as a lower electrode, the second
insulating film as an insulator and the second conductive film as
an upper electrode and is connected between the power supply
circuit and memory cell, and a ground potential.
[0382] In the above-described method, the first conductive film is
formed by the steps including:
[0383] (c1) forming, over the first insulating film including the
inside of the first opening, an amorphous silicon film including an
impurity, and (c2) feeding the surface of the amorphous silicon
film with an SiH.sub.4-containing gas in an atmosphere of reduced
pressure to form silicon grains over the surface of the amorphous
silicon film.
[0384] The above-described manufacturing method further comprises a
step of forming a third insulating film over the semiconductor
substrate prior the step (b), said first opening and second opening
being formed so that the bottom of at least one of them reaches the
third insulating film and the first conductive film and second
conductive film are formed to extend over the first insulating
film, and the step (d) further comprises:
[0385] (d1) forming a fourth insulating film over the first
insulating film,
[0386] (d2) perforating the fourth insulating film to form a
connecting hole reaching the first conductive film which extends
over the first insulating film and another connecting hole reaching
the second conductive film which extends over the first insulating
film, and (d3) forming a conductive layer in the connecting
holes.
[0387] A manufacturing method of a semiconductor integrated circuit
device having a memory cell having first and second transfer
MISFETs, first and second drive MISFETs and first and second load
MISFETs, each disposed at an intersection between a pair of
complementary data lines and a word line, the first drive MISFET
and first load MISFET being cross-coupled with the second drive
MISFET and second load MISFET; and a power supply circuit for
feeding the memory cell an operating voltage, which comprises:
[0388] forming the memory cell in a first region over the main
surface of a semiconductor substrate, forming the power supply
circuit in a second region over the main surface of the
semiconductor substrate,
[0389] (a) forming a first insulating film over the semiconductor
substrate,
[0390] (b) forming a second opening in the first insulating film in
the second region,
[0391] (c) forming a first conductive film along the sidewall and
bottom of the second opening, forming a second insulating film over
the first conductive film, forming a second conductive film over
the second insulating film, and forming a second capacitor element
which has the first conductive film as a lower electrode, the
second insulating film as an insulator and the second conductive
film as an upper electrode and is electrically connected between
the power supply circuit and memory cell, and a ground
potential.
[0392] In the above-described method, the first conductive film is
formed by the steps including:
[0393] (c1) forming, over the first insulating film including the
inside of the first opening, an amorphous silicon film containing
an impurity, and
[0394] (c2) feeding the surface of the amorphous silicon film with
an SiH.sub.4-containing gas in an atmosphere of reduced pressure to
form silicon grains on the surface of he amorphous silicon
film.
[0395] The above-described manufacturing method further comprises a
step of forming a third insulating film over the semiconductor
substrate prior the step (a), forming the second opening so as to
reach, at the bottom thereof, the third insulating film, forming
the first conductive film and second conductive film to extend over
the first insulating film;
[0396] (d) a step of forming a fourth insulating film over the
first insulating film,
[0397] (e) perforating the fourth insulating film to form a
connecting hole reaching the first conductive film extending over
the first insulating film and another connecting hole reaching the
second conductive film extending over the first insulating film,
and
[0398] (f) forming a conductive layer in the connecting hole.
[0399] A manufacturing method of a semiconductor integrated circuit
device, which comprises:
[0400] (a) forming a first insulating film over a semiconductor
substrate,
[0401] (b) forming a second opening in the first insulating
film,
[0402] (c) forming a first conductive film along the sidewall and
bottom of the second opening, forming a second insulating film over
the first conductive film, forming a second conductive film over
the second insulating film, and forming a second capacitor element
having the first conductive film as a lower electrode, the second
insulating film as an insulator and the second conductive film as
an upper electrode, and forming an analog circuit by using the
capacitor element, wherein the first conductive film is formed by
the steps including:
[0403] (c1) forming, over the first insulating film including the
inside of the first opening, an amorphous silicon film containing
an impurity, and
[0404] (c2) feeding the surface of the amorphous silicon film with
an SiH.sub.4-containing gas in an atmosphere of reduced pressure to
form silicon grains on the surface of the amorphous silicon
film.
[0405] The above-described manufacturing method further comprises
forming a third insulating film over the semiconductor substrate
prior the step (a), forming the second opening so as to reach, at
the bottom thereof, the third insulating film, forming the first
conductive film and second conductive film to extend over the first
insulating film,
[0406] (d) forming a fourth insulating film over the first
insulating film,
[0407] (e) perforating the fourth insulating film to form a
connecting hole reaching the first conductive film extending over
the first insulating film and another connecting hole reaching the
second conductive film extending over the first insulating film,
and
[0408] (f) forming a conductive layer in the connecting hole.
[0409] A semiconductor integrated circuit device comprises a first
insulating film formed over a semiconductor substrate, a plurality
of second openings formed in the first insulating film, and a
capacitor element which is formed over the sidewall and bottom of
the plurality of second openings and has, as a lower electrode, a
first conductive film formed along the sidewall and bottom of the
second openings, as an insulator, a second insulating film formed
over the first conductive film, and, as an upper electrode, a
second conductive film formed over the second insulating film in
the plurality of second openings, wherein the first insulating film
has a plurality of interconnect grooves formed therein and an
interconnect is formed in each of the interconnect grooves.
[0410] Of the advantages disclosed by the present embodiments,
typical ones will next be described briefly.
[0411] By forming a hole in an insulating film formed over a
semiconductor substrate and forming a capacitor element in the
hole, the capacitance can be formed over the bottom and
circumference of the sidewall of the hole. The capacitance of the
capacitor element and, in turn, properties of the semiconductor
integrated circuit device can therefore be improved without an
increase in the chip size. In addition, soft error resistance of
the memory cell of an SRAM against .alpha. radiation can be
heightened, leading to an improvement in the reliability of the
memory cell.
[0412] Advantages available by the typical inventions of the
present inventions disclosed by the present application will next
be described briefly.
[0413] In short, the properties of the semiconductor integrated
circuit device can be improved.
* * * * *