U.S. patent application number 15/852989 was filed with the patent office on 2019-06-27 for assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel materia.
The applicant listed for this patent is Micron Technology, Inc.. Invention is credited to Daniel Billingsley, David Ross Economy, Yongjun Jeff Hu, Haoyu Li, Everett A. McTeer, John Mark Meldrim, Christopher W. Petz.
Application Number | 20190198519 15/852989 |
Document ID | / |
Family ID | 66950593 |
Filed Date | 2019-06-27 |
![](/patent/app/20190198519/US20190198519A1-20190627-D00000.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00001.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00002.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00003.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00004.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00005.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00006.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00007.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00008.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00009.png)
![](/patent/app/20190198519/US20190198519A1-20190627-D00010.png)
View All Diagrams
United States Patent
Application |
20190198519 |
Kind Code |
A1 |
Economy; David Ross ; et
al. |
June 27, 2019 |
Assemblies Having Vertically-Extending Structures, and Methods of
Forming Assemblies Having Vertically-Extending Channel Material
Pillars
Abstract
Some embodiments include an assembly which has channel material
pillars, and which has memory cells along the channel material
pillars. A conductive structure is under the channel material
pillars. The conductive structure has doped semiconductor material
in direct contact with bottom regions of the channel material
pillars. One or more of magnesium, scandium, yttrium and lanthanide
elements is along the bottom regions of the channel material
pillars. Some embodiments include methods of forming assemblies. A
structure is formed, and a mass is formed against an upper surface
of the structure. Plugs are formed within openings in the mass. The
plugs comprise a second material over a first material. The first
material includes one or more of magnesium, scandium, yttrium and
lanthanide elements. Openings are formed to terminate on the first
material, and are then extended through the first material. Channel
material pillars are formed within the openings.
Inventors: |
Economy; David Ross; (Boise,
ID) ; Meldrim; John Mark; (Boise, ID) ; Li;
Haoyu; (Boise, ID) ; Hu; Yongjun Jeff; (Boise,
ID) ; Petz; Christopher W.; (Boise, ID) ;
Billingsley; Daniel; (Meridian, ID) ; McTeer; Everett
A.; (Eagle, ID) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Micron Technology, Inc. |
Boise |
ID |
US |
|
|
Family ID: |
66950593 |
Appl. No.: |
15/852989 |
Filed: |
December 22, 2017 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 27/11519 20130101;
H01L 21/31144 20130101; H01L 21/31105 20130101; H01L 27/1157
20130101; H01L 27/11565 20130101; H01L 27/11582 20130101; H01L
27/11556 20130101; H01L 21/76831 20130101 |
International
Class: |
H01L 27/11582 20060101
H01L027/11582; H01L 27/11556 20060101 H01L027/11556; H01L 21/768
20060101 H01L021/768; H01L 21/311 20060101 H01L021/311; H01L
27/11565 20060101 H01L027/11565; H01L 27/11519 20060101
H01L027/11519 |
Claims
1. An assembly, comprising: channel material pillars which extend
vertically; memory cells along the channel material pillars; a
conductive structure under the channel material pillars and
comprising doped semiconductor material in direct contact with
bottom regions of the channel material pillars; and scandium along
the bottom regions of the channel material pillars.
2-3. (canceled)
4. An assembly, comprising: channel material pillars which extend
vertically; memory cells along the channel material pillars; a
conductive structure under the channel material pillars and
comprising doped semiconductor material in direct contact with
bottom regions of the channel material pillars; one or more of
magnesium, scandium, yttrium and lanthanide elements along the
bottom regions of the channel material pillars; and wherein said
one or more of the magnesium, the scandium, the yttrium and the
lanthanide elements are within annular structures which extend
around the bottom regions of the channel material pillars.
5. The assembly of claim 4 wherein the annular structures comprise
the magnesium.
6. The assembly of claim 5 wherein the annular structures comprise
the magnesium as magnesium oxide.
7. The assembly of claim 4 wherein the bottom regions of the
channel material pillars include terminal ends of the channel
material pillars, and include non-terminal segments above the
terminal ends; and wherein the annular structures are along the
non-terminal segments and not along the terminal ends.
8. The assembly of claim 7 wherein void regions are under the
annular structures.
9. The assembly of claim 4 wherein the bottom regions of the
channel material pillars include terminal ends of the channel
material pillars; and wherein the annular structures are along the
terminal ends.
10. An assembly comprising: a horizontally-extending structure
comprising a first semiconductor material; one or more
vertically-extending structures over the horizontally-extending
structure and comprising a second semiconductor material; the
second semiconductor material of said one or more
vertically-extending structures directly contacting the first
semiconductor material of the horizontally-extending structure
along terminal ends of the one or more vertically-extending
structures; said terminal ends of the one or more
vertically-extending structures being comprised by bottom regions
of the one or more vertically-extending structures; and scandium
along the bottom regions of the one or more vertically-extending
structures.
11. The assembly of claim 10 wherein the first and second
semiconductor materials comprise a same composition as one
another.
12. The assembly of claim 10 wherein the first and second
semiconductor materials comprise different compositions relative to
one another.
13. The assembly of claim 10 wherein both the first semiconductor
material and the second semiconductor material comprise
silicon.
14. (canceled)
15. An assembly comprising: a horizontally-extending structure
comprising a first semiconductor material; one or more
vertically-extending structures over the horizontally-extending
structure and comprising a second semiconductor material; the
second semiconductor material of said one or more
vertically-extending structures directly contacting the first
semiconductor material of the horizontally-extending structure
along terminal ends of the one or more vertically-extending
structures; said terminal ends of the one or more
vertically-extending structures being comprised by bottom regions
of the one or more vertically-extending structures; one or more of
magnesium, scandium, yttrium and lanthanide elements along the
bottom regions of the one or more vertically-extending structures;
and wherein said one or more of the magnesium, the scandium, the
yttrium and the lanthanide elements are within annular structures
which extend around the bottom regions of the one or more
vertically-extending structures.
16. The assembly of claim 15 wherein the annular structures
comprise the magnesium.
17. The assembly of claim 15 wherein the bottom regions of the one
or more vertically-extending structures include non-terminal
segments above the terminal ends; and wherein the annular
structures are along the non-terminal segments and not along the
terminal ends.
18. The assembly of claim 17 wherein void regions are under the
annular structures.
19. The assembly of claim 15 wherein the annular structures are
along the terminal ends.
20-30. (canceled)
Description
TECHNICAL FIELD
[0001] Assemblies having vertically-extending structures, and
methods of forming assemblies having vertically-extending channel
material pillars. The assemblies may include one or more of
magnesium, scandium, yttrium and lanthanide elements along bottom
regions of the vertically-extending structures.
BACKGROUND
[0002] Memory provides data storage for electronic systems. Flash
memory is one type of memory, and has numerous uses in modern
computers and devices. For instance, modern personal computers may
have BIOS stored on a flash memory chip. As another example, it is
becoming increasingly common for computers and other devices to
utilize flash memory in solid state drives to replace conventional
hard drives. As yet another example, flash memory is popular in
wireless electronic devices because it enables manufacturers to
support new communication protocols as they become standardized,
and to provide the ability to remotely upgrade the devices for
enhanced features.
[0003] NAND may be a basic architecture of flash memory, and may be
configured to comprise vertically-stacked memory cells.
[0004] Before describing NAND specifically, it may be helpful to
more generally describe the relationship of a memory array within
an integrated arrangement. FIG. 1 shows a block diagram of a prior
art device 100 which includes a memory array 102 having a plurality
of memory cells 103 arranged in rows and columns along with access
lines 104 (e.g., wordlines to conduct signals WL0 through WLm) and
first data lines 106 (e.g., bitlines to conduct signals BL0 through
BLn). Access lines 104 and first data lines 106 may be used to
transfer information to and from the memory cells 103. A row
decoder 107 and a column decoder 108 decode address signals A0
through AX on address lines 109 to determine which ones of the
memory cells 103 are to be accessed. A sense amplifier circuit 115
operates to determine the values of information read from the
memory cells 103. An I/O circuit 117 transfers values of
information between the memory array 102 and input/output (I/O)
lines 105. Signals DQ0 through DQN on the I/O lines 105 can
represent values of information read from or to be written into the
memory cells 103. Other devices can communicate with the device 100
through the I/O lines 105, the address lines 109, or the control
lines 120. Memory control unit 118 controls memory operations
performed on the memory cells 103 utilizing signals on the control
lines 120. The device 100 can receive supply voltage signals Vcc
and Vss on a first supply line 130 and a second supply line 132,
respectively. The device 100 includes a select circuit 140 and an
input/output (I/O) circuit 117. The select circuit 140 can respond,
via the I/O circuit 117, to signals CSEL1 through CSELn to select
signals on the first data lines 106 and the second data lines 113
that can represent the values of information to be read from or to
be programmed into the memory cells 103. The column decoder 108 can
selectively activate the CSEL1 through CSELn signals based on the
AO through AX address signals on the address lines 109. The select
circuit 140 can select the signals on the first data lines 106 and
the second data lines 113 to provide communication between the
memory array 102 and the I/O circuit 117 during read and
programming operations.
[0005] The memory array 102 of FIG. 1 may be a NAND memory array,
and FIG. 2 shows a block diagram of a three-dimensional NAND memory
device 200 which may be utilized for the memory array 102 of FIG.
1. The device 200 comprises a plurality of strings of
charge-storage devices. In a first direction (Z-Z'), each string of
charge-storage devices may comprise, for example, thirty-two
charge-storage devices stacked over one another with each
charge-storage device corresponding to one of, for example,
thirty-two tiers (e.g., Tier0-Tier31). The charge-storage devices
of a respective string may share a common channel region, such as
one formed in a respective pillar of semiconductor material (e.g.,
polysilicon) about which the string of charge-storage devices is
formed. In a second direction (X-X'), each first group of, for
example, sixteen first groups of the plurality of strings may
comprise, for example, eight strings sharing a plurality (e.g.,
thirty-two) of access lines (i.e., "global control gate (CG)
lines", also known as wordlines, WLs). Each of the access lines may
couple the charge-storage devices within a tier. The charge-storage
devices coupled by the same access line (and thus corresponding to
the same tier) may be logically grouped into, for example, two
pages, such as P0/P32, P1/P33, P2/P34 and so on, when each
charge-storage device comprises a cell capable of storing two bits
of information. In a third direction (Y-Y'), each second group of,
for example, eight second groups of the plurality of strings, may
comprise sixteen strings coupled by a corresponding one of eight
data lines. The size of a memory block may comprise 1,024 pages and
total about 16 MB (e.g., 16 WLs.times.32 tiers.times.2 bits=1,024
pages/block, block size=1,024 pages.times.16 KB/page=16 MB). The
number of the strings, tiers, access lines, data lines, first
groups, second groups and/or pages may be greater or smaller than
those shown in FIG. 2.
[0006] FIG. 3 shows a cross-sectional view of a memory block 300 of
the 3D NAND memory device 200 of FIG. 2 in an X-X' direction,
including fifteen strings of charge-storage devices in one of the
sixteen first groups of strings described with respect to FIG. 2.
The plurality of strings of the memory block 300 may be grouped
into a plurality of subsets 310, 320, 330 (e.g., tile columns),
such as tile column.sub.I, tile column.sub.j and tile column.sub.K,
with each subset (e.g., tile column) comprising a "partial block"
of the memory block 300. A global drain-side select gate (SGD) line
340 may be coupled to the SGDs of the plurality of strings. For
example, the global SGD line 340 may be coupled to a plurality
(e.g., three) of sub-SGD lines 342, 344, 346 with each sub-SGD line
corresponding to a respective subset (e.g., tile column), via a
corresponding one of a plurality (e.g., three) of sub-SGD drivers
332, 334, 336. Each of the sub-SGD drivers 332, 334, 336 may
concurrently couple or cut off the SGDs of the strings of a
corresponding partial block (e.g., tile column) independently of
those of other partial blocks. A global source-side select gate
(SGS) line 360 may be coupled to the SGSs of the plurality of
strings. For example, the global SGS line 360 may be coupled to a
plurality of sub-SGS lines 362, 364, 366 with each sub-SGS line
corresponding to the respective subset (e.g., tile column), via a
corresponding one of a plurality of sub-SGS drivers 322, 324, 326.
Each of the sub-SGS drivers 322, 324, 326 may concurrently couple
or cut off the SGSs of the strings of a corresponding partial block
(e.g., tile column) independently of those of other partial blocks.
A global access line (e.g., a global CG line) 350 may couple the
charge-storage devices corresponding to the respective tier of each
of the plurality of strings. Each global CG line (e.g., the global
CG line 350) may be coupled to a plurality of sub-access lines
(e.g., sub-CG lines) 352, 354, 356 via a corresponding one of a
plurality of sub-string drivers 312, 314 and 316. Each of the
sub-string drivers may concurrently couple or cut off the
charge-storage devices corresponding to the respective partial
block and/or tier independently of those of other partial blocks
and/or other tiers. The charge-storage devices corresponding to the
respective subset (e.g., partial block) and the respective tier may
comprise a "partial tier" (e.g., a single "tile") of charge-storage
devices. The strings corresponding to the respective subset (e.g.,
partial block) may be coupled to a corresponding one of sub-sources
372, 374 and 376 (e.g., "tile source") with each sub-source being
coupled to a respective power source.
[0007] The NAND memory device 200 is alternatively described with
reference to a schematic illustration of FIG. 4.
[0008] The memory array 200 includes wordlines 202.sub.1 to
202.sub.N, and bitlines 228.sub.1 to 228.sub.M.
[0009] The memory array 200 also includes NAND strings 206.sub.1 to
206.sub.M. Each NAND string includes charge-storage transistors
208.sub.1 to 208.sub.N. The charge-storage transistors may use
floating gate material (e.g., polysilicon) to store charge, or may
use charge-trapping material (such as, for example, silicon
nitride, metallic nanodots, etc.) to store charge.
[0010] The charge-storage transistors 208 are located at
intersections of wordlines 202 and strings 206. The charge-storage
transistors 208 represent non-volatile memory cells for storage of
data. The charge-storage transistors 208 of each NAND string 206
are connected in series source-to-drain between a source-select
device (e.g., source-side select gate, SGS) 210 and a drain-select
device (e.g., drain-side select gate, SGD) 212. Each source-select
device 210 is located at an intersection of a string 206 and a
source-select line 214, while each drain-select device 212 is
located at an intersection of a string 206 and a drain-select line
215. The select devices 210 and 212 may be any suitable access
devices, and are generically illustrated with boxes in FIG. 1.
[0011] A source of each source-select device 210 is connected to a
common source line 216. The drain of each source-select device 210
is connected to the source of the first charge-storage transistor
208 of the corresponding NAND string 206. For example, the drain of
source-select device 210.sub.1 is connected to the source of
charge-storage transistor 208.sub.1 of the corresponding NAND
string 206.sub.1. The source-select devices 210 are connected to
source-select line 214.
[0012] The drain of each drain-select device 212 is connected to a
bitline (i.e., digit line) 228 at a drain contact. For example, the
drain of drain-select device 212.sub.1 is connected to the bitline
228.sub.1. The source of each drain-select device 212 is connected
to the drain of the last charge-storage transistor 208 of the
corresponding NAND string 206. For example, the source of
drain-select device 212.sub.1 is connected to the drain of
charge-storage transistor 208.sub.N of the corresponding NAND
string 206.sub.1.
[0013] The charge-storage transistors 208 include a source 230, a
drain 232, a charge-storage region 234, and a control gate 236. The
charge-storage transistors 208 have their control gates 236 coupled
to a wordline 202. A column of the charge-storage transistors 208
are those transistors within a NAND string 206 coupled to a given
bitline 228. A row of the charge-storage transistors 208 are those
transistors commonly coupled to a given wordline 202.
[0014] Three-dimensional integrated memory assemblies (e.g.,
three-dimensional NAND) may have vertical channel pillars extending
to horizontal wiring (e.g., source lines). It can be difficult to
achieve uniform contact between the channel pillars and the
associated horizontal wiring. It would be desirable to develop
improved methods for fabricating integrated memory assemblies such
that desired contact between the channel material pillars and the
horizontal wiring is achieved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0015] FIG. 1 shows a block diagram of a prior art memory device
having a memory array with memory cells.
[0016] FIG. 2 shows a schematic diagram of the prior art memory
array of FIG. 1 in the form of a 3D NAND memory device.
[0017] FIG. 3 shows a cross sectional view of the prior art 3D NAND
memory device of FIG. 2 in an X-X' direction.
[0018] FIG. 4 is a schematic of a prior art NAND memory array.
[0019] FIGS. 5-8 are diagrammatic cross-sectional views of example
assemblies comprising regions of example memory arrays.
[0020] FIG. 5A is a top-down cross-sectional view along the line
A-A of FIG. 5.
[0021] FIGS. 9-16 are diagrammatic cross-sectional views of regions
of an example construction at example process stages of an example
method for fabricating an example memory array.
[0022] FIGS. 17 and 18 are diagrammatic cross-sectional views of
regions of an example construction at example process stages of an
example method for fabricating an example memory array. The process
stage of FIG. 17 may follow that of FIG. 13.
[0023] FIGS. 19-22 are diagrammatic cross-sectional views of
regions of an example construction at example process stages of an
example method for fabricating an example memory array. The process
stage of FIG. 19 may follow that of FIG. 9.
DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS
[0024] Some embodiments include methods in which segments of
etch-stop material are provided along locations of a conductive
structure (e.g., a source line) where electrical contact to channel
material pillars is desired. The etch-stop material may comprise
one or more of magnesium, scandium, yttrium and lanthanide
elements. Openings may be extended through a stack of alternating
first and second levels, and to the etch-stop material.
Subsequently, the openings may be extended through the etch-stop
material to the conductive structure, and then the channel material
pillars may be formed within the openings. Memory cells may be
formed along the channel material pillars to form a memory array,
such as a three-dimensional NAND memory array. In some embodiments,
some of the etch-stop material may remain along bottom regions of
the channel material pillars in the finished memory array. Example
embodiments are described with reference to FIGS. 5-22.
[0025] Referring to FIG. 5, a region of an assembly 10 is
illustrated. The assembly 10 includes a plurality of
vertically-stacked memory cells 12. Such memory cells may be NAND
memory cells, and may be part of a NAND memory array.
[0026] The memory cells include channel material 14, tunneling
material 16, charge-storage material 18, and charge-blocking
material 20.
[0027] The channel material 14 is configured as
vertically-extending channel material pillars 22. In the
illustrated embodiment, the pillars 22 are "hollow" in that they
have voids 24 extending therein. Such voids are filled with
insulative material 26. In other embodiments, the pillars 22 may be
solid rather than being in the illustrated hollow
configuration.
[0028] The memory cells 12 may be considered to be arranged along
the channel material pillars 22.
[0029] The channel material 14 may comprise any suitable
composition(s); and in some embodiments may comprise one or more of
silicon, germanium, III/V semiconductor materials (e.g., gallium
phosphide), semiconductor oxides, etc.
[0030] The tunneling material 16 is sometimes referred to as gate
dielectric. The tunneling material 16 may comprise any suitable
composition(s); and in some embodiments may comprise, for example,
one or more of silicon dioxide, aluminum oxide, hafnium oxide,
zirconium oxide, etc.
[0031] The charge-storage material 18 may comprise any suitable
composition(s); and in some embodiments may comprise
charge-trapping materials, such as silicon nitride, silicon
oxynitride, conductive nanodots, etc. In alternative embodiments
(not shown), the charge-storage material 18 may be configured as
floating gate material (such as, for example, polycrystalline
silicon).
[0032] The charge-blocking material 20 may comprise any suitable
composition(s); and in some embodiments may comprise one or more of
silicon dioxide, aluminum oxide, hafnium oxide, zirconium oxide,
etc.
[0033] The insulative material 26 may comprise any suitable
composition(s); and in some embodiments may comprise silicon
dioxide.
[0034] The channel material pillars 22 extend through a stack 28 of
alternating insulative levels 30 and conductive levels 32.
[0035] The conductive levels 32 comprise conductive material 33.
Such conductive material may comprise, for example, one or more of
various metals (for example, tungsten, titanium, etc.),
metal-containing compositions (for example, metal nitride, metal
carbide, metal silicide, etc.), and conductively-doped
semiconductor materials (for example, conductively-doped silicon,
conductively-doped germanium, etc.). For instance, the conductive
levels 30 may comprise n-type doped polycrystalline silicon (i.e.,
n-type doped polysilicon) of SONOS
(semiconductor-oxide-nitride-oxide-semiconductor), or metal of
MONOS (metal-oxide-nitride-oxide-semiconductor); with an example
MONOS being TANOS (tantalum-alumina-nitride-oxide-semiconductor).
In some embodiments, the conductive levels 32 may comprise titanium
nitride around a metallic core, with the metallic core comprising
tungsten or tantalum.
[0036] The conductive levels 32 may correspond to wordlines, and
may comprise control gates 34 for the memory cells 12. In some
embodiments, the vertically-stacked memory cells 12 are configured
as NAND strings, with the number of memory cells 12 in the
individual strings being determined by the number of conductive
levels 32. The NAND strings may comprise any suitable number of
memory cell levels. For instance, the NAND strings may have 8
memory cell levels, 16 memory cell levels, 32 memory cell levels,
64 memory cell levels, 512 memory cell levels, 1024 memory cell
levels, etc.
[0037] The insulative levels 30 comprise insulative material 31.
Such insulative material may comprise any suitable composition or
combination of compositions; and may, for example, comprise,
consist essentially of, or consist of silicon dioxide.
[0038] The levels 30 and 32 may be of any suitable thicknesses; and
may be the same thickness as one another, or different thicknesses
relative to one another.
[0039] The channel material pillars 22 extend through an insulative
mass 36 and contact a conductive structure 38.
[0040] A gap is provided between the stack 28 and the insulative
mass 36 to indicate that there may be additional materials and/or
components provided within the assembly 10 which are not shown. For
instance, source-side select gates may be provided within the
illustrated gap between the stack 28 and insulative mass 36.
[0041] The insulative mass 36 may comprise any suitable
composition(s) such as, for example, silicon dioxide.
[0042] The conductive structure 38 may correspond to a source line
analogous to the source line 216 discussed above with reference to
FIG. 4. The conductive structure 38 may comprise any suitable
composition(s). In some embodiments, the illustrated region of the
conductive structure 38 comprises conductively-doped semiconductor
material 40 (for instance, n-type silicon). In some embodiments,
the conductively-doped semiconductor material 40 may be over and
directly against a metal-containing material (not shown). For
instance, the conductive structure 38 may comprise doped
semiconductor material 40 over a metal-containing material (such
as, for example, a material comprising one or more of titanium
nitride, tungsten, tantalum nitride, etc.).
[0043] In some embodiments, the conductive structure 38 may be
considered to be representative of a horizontally-extending
structure, and the semiconductor material 40 may be referred to as
a first semiconductor material. The channel material pillars 22 may
be considered to be representative of vertically-extending
structures over the horizontally-extending structure 38, and may be
considered to comprise a second semiconductor material 14. The
first and second semiconductor materials 40 and 14 may be the same
composition as one another in some embodiments (for instance, both
may comprise n-type doped silicon), or may be different
compositions than one another (for instance, one may primarily
comprise germanium while the other primarily comprises
silicon).
[0044] Although three vertically-extending structures 22 are
illustrated in FIG. 5, it is to be understood that any suitable
number of vertically-extending structures may be associated with
the horizontally-extending structure 38. Generally, there will be
at least one vertically-extending structure 22 associated with the
horizontally-extending structure 38.
[0045] The terms "vertically-extending" and
"horizontally-extending" are utilized relative to one another to
indicate that the structure 38 extends primarily along a horizontal
direction, while the structures 22 extend primarily along the
vertical directions. In some embodiments, the structures 22 may be
absolutely vertical, and the structure 38 may be absolutely
horizontal, so that the structures 22 extend orthogonally relative
to the structure 38. In other embodiments, the structures 22 may
extend substantially orthogonally relative to the structure 38,
with the term "substantially orthogonal" meaning orthogonal to
within reasonable tolerances of fabrication and measurement.
[0046] The channel material pillars 22 have bottom regions 42
within the insulative mass 36. Such bottom regions include terminal
ends 43 of the pillars 22, and include non-terminal segments 45
above the terminal ends. The terminal ends 43 directly contact the
conductive material 40 of the conductive structure 38, and the
non-terminal segments 45 are above the terminal ends 43.
[0047] The bottom regions 42 have a vertical dimension H. Such
vertical dimension may be any suitable vertical dimension; and in
some embodiments may be less than or equal to about 150
(nanometers) nm, less than or equal to about 100 nm, or less than
or equal to about 50 nm. The channel material pillars 22 may have
any suitable total height; and in some embodiments may have a total
height of at least about 1 micron (.mu.), at least about 2.mu.,
etc. Accordingly, the bottom region 42 of the channel material
pillars is a small percentage of the overall height of the channel
material pillars.
[0048] Each of the channel material pillars 22 is adjacent a
structure 44, with the structures 44 being outwardly displaced
relative to the charge-blocking material 20 in the illustrated
embodiment. The bottom regions 42 of the pillars 22 may be defined
to be the regions of pillars 22 that are at or below an elevational
level of the uppermost surfaces of the structures 44. FIG. 5A is a
view along the line A-A of FIG. 5 and shows that each structure 44
is an annular ring surrounding one of the channel material pillars
22.
[0049] The structures 44 comprise etch-stop material 46 (with a
purpose of the etch-stop material being described in more detail
below with reference to FIGS. 13 and 14). In some embodiments, the
etch-stop material 46 may comprise one or more of magnesium (Mg),
scandium (Sc), yttrium (Y) and lanthanide elements. The term
"lanthanide elements" means the 15 rare earth elements having
atomic numbers 57 through 71; and specifically includes lanthanum
(La), cerium (Ce), praseodymium (Pr), neodymium (Nd), promethium
(Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb),
dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), ytterbium
(Yb) and lutetium (Lu). In some applications, the material 46 may
comprise oxides of one or more of Mg, Sc, Y, La, Ce, Pr, Nd, Pm,
Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Tb and Lu. For instance, in some
embodiments the material 46 may comprise, consist essentially of,
or consist of one or more of magnesium oxide, cerium oxide and
lanthanum oxide.
[0050] The structures 44 are along the bottom regions 42 of the
channel material pillars 22. In the embodiment of FIG. 5, the
structures 44 are along the terminal ends 43 of the channel
material pillars 22, and are also along the non-terminal segments
45. Accordingly, the elements within the composition of structures
44 may be detected along the terminal ends of the channel material
pillars 22, as well as along the non-terminal segments 45 with
appropriate analytical analysis of the configuration of FIG. 5.
[0051] The structures 44 are angled relative to the
vertically-extending charge-blocking material 20, and regions of
the structures 44 are spaced from the charge-blocking material 20
by an intervening material 48. The intervening material 48 may
comprise any suitable composition(s); and in some embodiments may
comprise, consist essentially of, or consist of silicon
dioxide.
[0052] The stack 28 and conductive structure 38 are shown to be
supported over a base 50. The base 50 may comprise semiconductor
material; and may, for example, comprise, consist essentially of,
or consist of monocrystalline silicon. The base 50 may be referred
to as a semiconductor substrate. The term "semiconductor substrate"
means any construction comprising semiconductive material,
including, but not limited to, bulk semiconductive materials such
as a semiconductive wafer (either alone or in assemblies comprising
other materials), and semiconductive material layers (either alone
or in assemblies comprising other materials). The term "substrate"
refers to any supporting structure, including, but not limited to,
the semiconductor substrates described above. In some applications,
the base 50 may correspond to a semiconductor substrate containing
one or more materials associated with integrated circuit
fabrication. Such materials may include, for example, one or more
of refractory metal materials, barrier materials, diffusion
materials, insulator materials, etc.
[0053] A gap is provided between the structure 38 and the base 50
to indicate that other components and materials may be provided
between the structure 38 and the base 50.
[0054] The configuration of FIG. 5 shows the channel material
pillars 22 extending to an upper surface of the conductive
structure 38. In other embodiments, the channel material pillars 22
may penetrate into the conductive material 40 of the conductive
structure 38, as shown in FIG. 6. In such embodiments, the
structures 44 may also penetrate into the material 40 of the
conductive structure 38 (as shown in FIG. 6). Accordingly, the
composition of the structures 44 may penetrate into the conductive
material 40 and be detectable as extending into the conductive
material 40; with such composition including one or more of Mg, Sc,
Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Tb and Lu
and some embodiments.
[0055] In the illustrated embodiment of FIG. 6, the bottom regions
42 of the channel material pillars 22 are shown to include portions
of the channel material pillars which extend into the conductive
material 40 of the conductive structure 38, as well as portions of
the channel material pillars within the insulative mass 36.
[0056] In some embodiments, some of the material 46 of structures
44 may be removed with a wet etch (described below with reference
to FIG. 17) so that the remaining material 46 is over a void
region. Examples of such embodiments are shown in FIGS. 7 and 8.
FIG. 7 shows a configuration analogous to that of FIG. 5, but the
material 46 of structures 44 is over void regions 52. Accordingly,
the material 46 is along non-terminal segments 45 of the channel
material pillars 22, but is not along the terminal ends 43 of the
channel material pillars. FIG. 8 shows a configuration analogous to
that of FIG. 6, but differs from FIG. 6 in that the material 46 of
structures 44 is over void regions 52.
[0057] The assemblies discussed above with reference to FIGS. 5-8
may be formed with any suitable processing. Example processing is
described with reference to FIGS. 9-22.
[0058] Referring to FIG. 9, construction 10 is shown at a process
stage after the horizontally-extending structure 38 has been formed
across the base 50 (the base 50 is shown in FIG. 1, but is not
shown in FIG. 9 in order to simplify FIG. 9 and the drawings which
follow). The structure 38 includes the material 40. The material 40
comprises conductively-doped semiconductor material; such as, for
example, n-type polysilicon. In some embodiments, the material 40
may be referred to as a first semiconductor material.
[0059] The structure 38 comprises an upper surface 39 along the
material 40, and the mass 36 is formed across such upper surface.
In the illustrated embodiment, the mass 36 is directly against the
upper surface 39 of the material 40.
[0060] The mass 36 may comprise any suitable material. For
instance, the mass 36 may comprise, consist essentially of, or
consist of silicon dioxide. In some embodiments, the mass 36 may be
referred to as an insulative mass.
[0061] Referring to FIG. 10, openings 54 are formed through the
mass 36 to the upper surface 39 of the material 40. Although the
openings 54 are shown extending only to the upper surface of the
material 40, in other embodiments the openings 54 may penetrate
into the material 40.
[0062] Referring to FIG. 11, the openings 54 are lined with the
material 46 to narrow the openings, and the narrowed openings are
then filled with material 48. Subsequently, planarization (e.g.,
chemical-mechanical polishing) may be conducted to form the
illustrated planarized surface 55 extending across the mass 36 and
the materials 46 and 48. The materials 46 and 48 may be referred to
as first and second materials, respectively; and may comprise the
compositions described above relative to FIG. 5. In some example
embodiments, the second material 48 may comprise, consist
essentially of, or consist of silicon dioxide. In some example
embodiments, the first material 46 may comprise one or more of
magnesium, scandium, yttrium and lanthanide elements incorporated
into one or more oxides.
[0063] The first and second materials 46 and 48 together form plugs
56 within the openings 54.
[0064] Referring to FIG. 12, a stack 58 is formed over the mass 36
and plugs 56. The stack 58 comprises first levels 60 and second
levels 62 which alternate with one another. The levels 60 comprise
material 61, and the levels 62 comprise material 63. In some
embodiments, the materials 61 and 63 may be the same as the
materials 31 and 33, respectively, of FIG. 5. Thus, the stack 58 of
FIG. 12 may be the same as the stack 28 of FIG. 5. Alternatively,
the levels 60 may comprise insulative material (for instance, the
same material as levels 30 of FIG. 5; and in some embodiments may
comprise silicon dioxide), and the levels 62 may comprise
sacrificial material (e.g., silicon nitride) suitable for
utilization in gate replacement methodologies.
[0065] Referring to FIG. 13, openings 64 are formed to extend
through the stack 58, and through the second material 48 of the
plugs 56 (with the plugs 56 being shown in FIG. 12). The openings
64 terminate on the first material 46. In some embodiments, the
material 46 may be referred to as an etch-stop material in that
such material stops the downward progression of the etch utilized
to form openings 64.
[0066] Referring to FIG. 14, the openings 64 are extended through
the material 46. Such exposes regions of the upper surface 39 of
the semiconductor material 40. Although the openings 64 are shown
stopping at the upper surface 39 of semiconductor material 40, in
other embodiments the openings may extend into the semiconductor
material 40.
[0067] An advantage of utilizing the etch-stop material 46 is that
such may enable all of the openings 64 to be uniformly formed to
substantially identical depths (with the term "substantially
identical" meaning identical to within reasonable tolerances of
fabrication and measurement). As integration density increases, it
is desired to form openings 64 to increasingly higher critical
dimensions. It can be difficult to fabricate all of the openings to
be of substantially uniform depths as one another unless the
openings are formed with the multi-step processing of FIGS. 13 and
14. Specifically, the openings 64 are first formed with a process
having a stop point defined by the etch-stop material 46.
Accordingly, to the extent that there is variation in the etch rate
across the openings 64, the variation will not matter in the end
because all of the openings terminate at a common depth defined by
the etch-stop material 46. The openings are then extended with a
second process which penetrates through the etch-stop material 46.
The second process may be a timed process, and will be a relatively
short etch since the openings are only extended by a minor amount.
Accordingly, there will be little (if any) variation of the depths
to which the openings 64 penetrate during the second process since
the second process is too short of an etch to enable large amounts
of variation to manifest across the openings.
[0068] It is noted that some conventional processes fabricate
openings analogous to the openings 64 by utilizing the mass 36 as
an etch-stop material. In other words, the conventional methods
lack the plugs 56 of FIG. 11, and instead utilize the entire mass
36 as an etch-stop material. A problem with such conventional
methods is that they may not be cost-effective when utilizing the
specialized etch-stop materials described herein. Instead, the
conventional methods typically utilize aluminum oxide as the
etch-stop material. In contrast, methodologies described herein may
cost-effectively utilize oxides of one or more of magnesium,
scandium, yttrium and lanthanide elements. Such may provide at
least a 10-fold enhancement of etch selectivity as compared to
aluminum oxide for the etches utilized to form openings 64 (e.g.,
for etches penetrating through silicon dioxide of levels 60 and
silicon nitride of levels 62).
[0069] Referring to FIG. 15, the vertically-extending channel
material pillars 22 are formed within the openings 64, together
with the tunneling material 16, charge-storage material 18, and
charge-blocking material 20. The channel material pillars 22
comprise the channel material 14; which in some embodiments may be
referred to as a second semiconductor material. The second
semiconductor material 14 may be compositionally the same as the
first semiconductor material 40, or may be compositionally
different from the first semiconductor material 40. For instance,
in some embodiments the second semiconductor material 14 and the
first semiconductor material 40 may both comprise silicon. In other
embodiments, one of the first and second semiconductor materials 14
and 40 may comprise, consist essentially of, or consist of silicon;
while the other comprises a different semiconductor material.
[0070] Referring to FIG. 16, the sacrificial material 63 of FIG. 15
is replaced with conductive material 33. Accordingly, the stack 58
becomes a stack 28 of the type described above with reference to
FIG. 5. The material 61 of levels 60 of FIG. 16 may be the same
material 31 as utilized for the insulative levels 30 of FIG. 5.
[0071] In some embodiments the material 63 (FIG. 15) of stack 58
may comprise conductive material analogous to the conductive
material 33. In such embodiments, the gate replacement described
relative to FIG. 16 may be omitted.
[0072] The assembly of FIG. 16 comprises the structures 44 along
the bottom regions 42 of the channel material pillars 22. The
structures 44 comprise the etch-stop material 46, and are in a
configuration analogous to that described above with reference to
FIG. 5. In other embodiments, void regions may be formed beneath
the etch-stop material 46 analogous to the embodiment of FIG. 7
(with the void regions of FIG. 7 being shown as void regions 52).
FIGS. 17 and 18 describe example processing which may be utilized
to form such void regions.
[0073] Referring to FIG. 17, construction 10 is shown at a process
stage which may follow that of FIG. 13; and which may be
alternative to that of FIG. 14. The process stage of FIG. 14
utilized a substantially anisotropic etch to penetrate through the
etch-stop material 46. In contrast, the process stage of FIG. 17
shows a configuration resulting after an isotropic etch is utilized
to penetrate through the etch-stop material 46. The isotropic etch
forms void regions 52, and in the shown embodiment leaves remaining
portions of the etch-stop material 46 over the void regions. In
other embodiments, the isotropic etching may remove an entirety of
the etch-stop material 46.
[0074] FIG. 18 shows a process stage subsequent to that of FIG. 17,
and analogous to that of FIG. 16. The construction 10 of FIG. 18
may be identical to that described above with reference to FIG.
7.
[0075] The embodiment of FIG. 11 shows the etch-stop material 46
configured as a liner extending conformally along inner surfaces of
the openings 54. In other embodiments, the etch-stop material may
be deposited as a layer along lower regions of the openings. For
instance, FIG. 19 shows construction 10 at a process stage which
may follow that of FIG. 9. Openings 54a have been formed through
mass 36 and filled with materials 46 and 48.
[0076] The openings 54a of FIG. 19 have a different shape than the
openings 54 of FIG. 10 (and specifically have straight sidewalls
rather than the tapered sidewalls of the openings 54). In other
embodiments, openings having tapered sidewalls may be utilized
instead of the openings 54a having the straight sidewalls at the
processing stage of FIG. 19. Also, it is noted that in some
embodiments the openings 54 of FIG. 10 may be replaced with
openings having straight sidewalls analogous to the openings 54a of
FIG. 19.
[0077] The materials 46 and 48 together form plugs 56a analogous to
the plugs 56 of FIG. 12.
[0078] The construction of FIG. 19 is at a processing stage
analogous to that of FIG. 12, and comprises the stack 58.
[0079] Referring to FIG. 20, openings 64 are formed to extend
through the stack 58, and through the material 48 of the plugs 56a
(with the plugs 56a being shown in FIG. 19). The openings 64
terminate on the etch-stop material 46.
[0080] Referring to FIG. 21, the openings 64 are extended through
etch-stop material 46 (FIG. 20) with an isotropic etch which
removes all of the material 46. In the illustrated embodiment, the
openings 64 stop on the upper surface 39 of the conductive
structure 38. In other embodiments, the openings may penetrate into
the conductive material 40 of the conductive structure 38.
[0081] Referring to FIG. 22, the channel material pillars 22 are
formed within openings 64 (FIG. 21), together with the tunneling
material 16, charge-storage material 18 and charge-blocking
material 20. Also, sacrificial material 63 (FIG. 21) is replaced
with conductive material 33 to form a stack 28 of alternating
insulative levels and conductive levels.
[0082] The illustrated embodiment shows the charge-blocking
material 20 extending to under the material 48 of plugs 56a (with
the plugs being described above with reference to FIG. 19). In
other embodiments, the material 20 may extend only partially under
the material 48 to leave voids under the material 48.
[0083] The assemblies and structures discussed above may be
utilized within integrated circuits (with the term "integrated
circuit" meaning an electronic circuit supported by a semiconductor
substrate); and may be incorporated into electronic systems. Such
electronic systems may be used in, for example, memory modules,
device drivers, power modules, communication modems, processor
modules, and application-specific modules, and may include
multilayer, multichip modules. The electronic systems may be any of
a broad range of systems, such as, for example, cameras, wireless
devices, displays, chip sets, set top boxes, games, lighting,
vehicles, clocks, televisions, cell phones, personal computers,
automobiles, industrial control systems, aircraft, etc.
[0084] Unless specified otherwise, the various materials,
substances, compositions, etc. described herein may be formed with
any suitable methodologies, either now known or yet to be
developed, including, for example, atomic layer deposition (ALD),
chemical vapor deposition (CVD), physical vapor deposition (PVD),
etc.
[0085] The terms "dielectric" and "insulative" may be utilized to
describe materials having insulative electrical properties. The
terms are considered synonymous in this disclosure. The utilization
of the term "dielectric" in some instances, and the term
"insulative" (or "electrically insulative") in other instances, may
be to provide language variation within this disclosure to simplify
antecedent basis within the claims that follow, and is not utilized
to indicate any significant chemical or electrical differences.
[0086] The particular orientation of the various embodiments in the
drawings is for illustrative purposes only, and the embodiments may
be rotated relative to the shown orientations in some applications.
The descriptions provided herein, and the claims that follow,
pertain to any structures that have the described relationships
between various features, regardless of whether the structures are
in the particular orientation of the drawings, or are rotated
relative to such orientation.
[0087] The cross-sectional views of the accompanying illustrations
only show features within the planes of the cross-sections, and do
not show materials behind the planes of the cross-sections, unless
indicated otherwise, in order to simplify the drawings.
[0088] When a structure is referred to above as being "on" or
"against" another structure, it can be directly on the other
structure or intervening structures may also be present. In
contrast, when a structure is referred to as being "directly on" or
"directly against" another structure, there are no intervening
structures present.
[0089] Structures (e.g., layers, materials, etc.) may be referred
to as "extending vertically" to indicate that the structures
generally extend upwardly from an underlying base (e.g.,
substrate). The vertically-extending structures may extend
substantially orthogonally relative to an upper surface of the
base, or not.
[0090] Some embodiments include an assembly which has channel
material pillars, and memory cells along the channel material
pillars. A conductive structure is under the channel material
pillars. The conductive structure has doped semiconductor material
in direct contact with bottom regions of the channel material
pillars. One or more of magnesium, scandium, yttrium and lanthanide
elements is along the bottom regions of the channel material
pillars.
[0091] Some embodiments include an assembly having a
horizontally-extending structure comprising a first semiconductor
material, and having one or more vertically-extending structures
over the horizontally-extending structure and comprising a second
semiconductor material. The second semiconductor material of said
one or more vertically-extending structures directly contacts the
first semiconductor material of the horizontally-extending
structure along terminal ends of the one or more
vertically-extending structures. The terminal ends of the one or
more vertically-extending structures are comprised by bottom
regions of the one or more vertically-extending structures. One or
more of magnesium, scandium, yttrium and lanthanide elements is
along the bottom regions of the one or more vertically-extending
structures.
[0092] Some embodiments include a method of forming an assembly. A
horizontally-extending structure is formed, with the
horizontally-extending structure comprising first semiconductor
material. A mass is formed across an upper surface of the first
semiconductor material and is directly against the upper surface of
the first semiconductor material. Openings are formed to extend
through the mass. Plugs are formed within the openings. The plugs
comprise a second material over a first material. The first
material includes one or more of magnesium, scandium, yttrium and
lanthanide elements. The second material is compositionally
different from the first material. A stack of alternating first and
second levels is formed over the mass and the plugs. Openings are
formed through the stack and the second material of the plugs. The
openings terminate on the first material of the plugs. The openings
are extended through the first material of the plugs. After the
openings are extended through the first material,
vertically-extending channel material pillars are formed within the
openings. The vertically-extending channel material pillars
comprise second semiconductor material.
[0093] In compliance with the statute, the subject matter disclosed
herein has been described in language more or less specific as to
structural and methodical features. It is to be understood,
however, that the claims are not limited to the specific features
shown and described, since the means herein disclosed comprise
example embodiments. The claims are thus to be afforded full scope
as literally worded, and to be appropriately interpreted in
accordance with the doctrine of equivalents.
* * * * *