| Patent | Date |
|---|
Conductive Structures, Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures, and Methods of Forming Conductive Structures
App 20220037358 - Lomeli; Nancy M. ; et al. | 2022-02-03 |
Assemblies Which Include Wordlines Having a First Metal-Containing Material at Least Partially Surrounding a Second Metal-Containing Material and Having Different Crystallinity than the Second Metal-Containing Material
App 20220028996 - Greenlee; Jordan D. ; et al. | 2022-01-27 |
Conductive Interconnects Suitable for Utilization in Integrated Assemblies, and Methods of Forming Conductive Interconnects
App 20210384422 - Greenlee; Jordan D. ; et al. | 2021-12-09 |
Conductive structures, assemblies having vertically-stacked memory cells over conductive structures, and methods of forming conductive structures
Grant 11,177,276 - Lomeli , et al. November 16, 2 | 2021-11-16 |
Assemblies which include wordlines having a first metal-containing material at least partially surrounding a second metal-containing material and having different crystallinity than the second metal-containing material
Grant 11,158,718 - Greenlee , et al. October 26, 2 | 2021-10-26 |
Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects
Grant 11,127,899 - Greenlee , et al. September 21, 2 | 2021-09-21 |
Ohmic Contacts For Semiconductor Structures
App 20210257526 - Hu; Yongjun Jeff ; et al. | 2021-08-19 |
Assemblies Having Conductive Structures with Three or More Different Materials
App 20210202710 - Economy; David Ross ; et al. | 2021-07-01 |
Methods Of Forming Tungsten Structures
App 20210183651 - Economy; David Ross ; et al. | 2021-06-17 |
Methods used in forming an array of elevationally-extending transistors
Grant 11,031,417 - Greenlee , et al. June 8, 2 | 2021-06-08 |
Ohmic contacts for semiconductor structures
Grant 10,998,481 - Hu , et al. May 4, 2 | 2021-05-04 |
Integrated Assemblies Having Barrier Material Between Silicon-Containing Material and Another Material Reactive with Silicon
App 20210091009 - Datta; Devesh Kumar ; et al. | 2021-03-25 |
Assemblies having conductive structures with three or more different materials
Grant 10,957,775 - Economy , et al. March 23, 2 | 2021-03-23 |
Methods of forming integrated assemblies
Grant 10,943,921 - Greenlee , et al. March 9, 2 | 2021-03-09 |
Methods of Filling Openings with Conductive Material, and Assemblies Having Vertically-Stacked Conductive Structures
App 20210066332 - Greenlee; Jordan D. ; et al. | 2021-03-04 |
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars
Grant 10,916,564 - Economy , et al. February 9, 2 | 2021-02-09 |
Assemblies Having Conductive Structures with Three or More Different Materials
App 20210005732 - Economy; David Ross ; et al. | 2021-01-07 |
Methods of forming tungsten structures
Grant 10,847,367 - Economy , et al. November 24, 2 | 2020-11-24 |
Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures
Grant 10,840,255 - Greenlee , et al. November 17, 2 | 2020-11-17 |
Assemblies Which Include Wordlines Having a First Metal-Containing Material at Least Partially Surrounding a Second Metal-Containing Material and Having Different Crystallinity than the Second Metal-Containing Material
App 20200328284 - Greenlee; Jordan D. ; et al. | 2020-10-15 |
Conductive Interconnects Suitable for Utilization in Integrated Assemblies, and Methods of Forming Conductive Interconnects
App 20200328348 - Greenlee; Jordan D. ; et al. | 2020-10-15 |
Methods Used In Forming An Array Of Elevationally-Extending Transistors
App 20200312880 - Greenlee; Jordan D. ; et al. | 2020-10-01 |
Gate stacks
Grant 10,777,651 - Hu , et al. Sept | 2020-09-15 |
Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Materia
App 20200266210 - Economy; David Ross ; et al. | 2020-08-20 |
Source material for electronic device applications
Grant 10,731,273 - Meldrim , et al. | 2020-08-04 |
Methods used in forming an array of elevationally-extending transistors
Grant 10,727,250 - Greenlee , et al. | 2020-07-28 |
Methods Of Forming Tungsten Structures
App 20200211843 - Economy; David Ross ; et al. | 2020-07-02 |
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars
Grant 10,700,091 - Economy , et al. | 2020-06-30 |
Methods of Forming Integrated Assemblies
App 20200161332 - Greenlee; Jordan D. ; et al. | 2020-05-21 |
Methods of Filling Openings with Conductive Material, and Assemblies Having Vertically-Stacked Conductive Structures
App 20200152651 - Greenlee; Jordan D. ; et al. | 2020-05-14 |
Conductive Structures, Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures, and Methods of Forming Cond
App 20200075620 - Lomeli; Nancy M. ; et al. | 2020-03-05 |
Methods of filling horizontally-extending openings of integrated assemblies
Grant 10,573,661 - Greenlee , et al. Feb | 2020-02-25 |
Assemblies having vertically-stacked conductive structures
Grant 10,559,579 - Greenlee , et al. Feb | 2020-02-11 |
Ohmic Contacts For Semiconductor Structures
App 20200035891 - Hu; Yongjun Jeff ; et al. | 2020-01-30 |
Integrated assemblies and methods of forming integrated assemblies
Grant 10,546,848 - Billingsley , et al. Ja | 2020-01-28 |
Source Material For Electronic Device Applications
App 20190360120 - Meldrim; John Mark ; et al. | 2019-11-28 |
Integrated Assemblies and Methods of Forming Integrated Assemblies
App 20190355711 - Billingsley; Daniel ; et al. | 2019-11-21 |
Conductive components and memory assemblies
Grant 10,475,810 - Bandyopadhyay , et al. Nov | 2019-11-12 |
Methods Used In Forming An Array Of Elevationally-Extending Transistors
App 20190333933 - Greenlee; Jordan D. ; et al. | 2019-10-31 |
Methods of Filling Openings with Conductive Material, and Assemblies Having Vertically-Stacked Conductive Structures
App 20190333924 - Greenlee; Jordan D. ; et al. | 2019-10-31 |
Ohmic contacts for semiconductor structures
Grant 10,446,727 - Hu , et al. Oc | 2019-10-15 |
Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Materia
App 20190304996 - Economy; David Ross ; et al. | 2019-10-03 |
Conductive structures and assemblies having vertically-stacked memory cells over conductive structures
Grant 10,424,596 - Lomeli , et al. Sept | 2019-09-24 |
Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures
Grant 10,361,214 - Greenlee , et al. | 2019-07-23 |
Methods used in forming an array of elevationally-extending transistors
Grant 10,361,216 - Greenlee , et al. | 2019-07-23 |
Methods of Filling Horizontally-Extending Openings of Integrated Assemblies
App 20190221580 - Greenlee; Jordan D. ; et al. | 2019-07-18 |
Assemblies having vertically-extending structures
Grant 10,355,014 - Economy , et al. July 16, 2 | 2019-07-16 |
Integrated assemblies and methods of forming integrated assemblies
Grant 10,354,989 - Billingsley , et al. July 16, 2 | 2019-07-16 |
Source material for electronic device applications
Grant 10,344,398 - Meldrim , et al. July 9, 2 | 2019-07-09 |
Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Materia
App 20190198519 - Economy; David Ross ; et al. | 2019-06-27 |
Conductive Structures, Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures, and Methods of Forming Cond
App 20190198518 - Lomeli; Nancy M. ; et al. | 2019-06-27 |
Methods of Filling Openings with Conductive Material, and Assemblies Having Vertically-Stacked Conductive Structures
App 20190189630 - Greenlee; Jordan D. ; et al. | 2019-06-20 |
Method and apparatus for improved etch stop layer or hard mask layer of a memory device
Grant 10,304,749 - Petz , et al. | 2019-05-28 |
Methods of filling horizontally-extending openings of integrated assemblies
Grant 10,283,524 - Greenlee , et al. | 2019-05-07 |
Gate Stacks
App 20190097017 - Hu; Yushi ; et al. | 2019-03-28 |
Methods Used In Forming An Array Of Elevationally-Extending Transistors
App 20190088671 - Greenlee; Jordan D. ; et al. | 2019-03-21 |
Assemblies having vertically-stacked conductive structures
Grant 10,170,493 - Greenlee , et al. J | 2019-01-01 |
Gate stacks
Grant 10,164,044 - Hu , et al. Dec | 2018-12-25 |
Method And Apparatus For Improved Etch Stop Layer Or Hard Mask Layer Of A Memory Device
App 20180366386 - Petz; Christopher W. ; et al. | 2018-12-20 |
Conductive Components and Memory Assemblies
App 20180308861 - Bandyopadhyay; Sudip ; et al. | 2018-10-25 |
Conductive components and memory assemblies
Grant 10,014,319 - Bandyopadhyay , et al. July 3, 2 | 2018-07-03 |
Conductive components and memory assemblies
Grant 9,773,807 - Bandyopadhyay , et al. September 26, 2 | 2017-09-26 |
Ohmic Contacts For Semiconductor Structures
App 20170117449 - Hu; Yongjun Jeff ; et al. | 2017-04-27 |
Ohmic contacts for semiconductor structures
Grant 9,608,185 - Hu , et al. March 28, 2 | 2017-03-28 |
Gate Stacks
App 20160308018 - Hu; Yushi ; et al. | 2016-10-20 |
Source Material For Electronic Device Applications
App 20160204205 - Meldrim; John Mark ; et al. | 2016-07-14 |
Source-channel Interaction In 3d Circuit
App 20160093688 - Meldrim; John Mark ; et al. | 2016-03-31 |
Source-channel interaction in 3D circuit
Grant 9,299,767 - Meldrim , et al. March 29, 2 | 2016-03-29 |
Silicided recessed silicon
Grant 9,076,888 - Nejad , et al. July 7, 2 | 2015-07-07 |
Methods of forming metal silicide-comprising material and methods of forming metal silicide-comprising contacts
Grant 8,962,431 - Wells , et al. February 24, 2 | 2015-02-24 |
Ohmic Contacts For Semiconductor Structures
App 20140234996 - Hu; Yongjun Jeff ; et al. | 2014-08-21 |
Methods of forming metal silicide-comprising material and methods of forming metal silicide-comprising contacts
Grant 8,728,930 - Wells , et al. May 20, 2 | 2014-05-20 |
Methods of Forming Metal Silicide-Comprising Material and Methods of Forming Metal Silicide-Comprising Contacts
App 20140134816 - Wells; David H. ; et al. | 2014-05-15 |
Methods Of Forming Metal Silicide-Comprising Material And Methods Of Forming Metal Silicide-Comprising Contacts
App 20130005136 - Wells; David H. ; et al. | 2013-01-03 |
Methods of forming memory cells
Grant 8,093,129 - Meldrim January 10, 2 | 2012-01-10 |
Ohmic Contacts For Semiconductor Structures
App 20110291147 - Hu; Yongjun Jeff ; et al. | 2011-12-01 |
Method of forming a transistor gate of a recessed access device, method of forming a recessed transistor gate and a non-recessed transistor gate, and method of fabricating an integrated circuit
Grant 7,977,236 - Nejad , et al. July 12, 2 | 2011-07-12 |
Methods Of Forming Memory Cells
App 20100197095 - Meldrim; John Mark | 2010-08-05 |
Method Of Forming A Transistor Gate Of A Recessed Access Device, Method Of Forming A Recessed Transistor Gate And A Non-Recessed Transistor Gate, And Method Of Fabricating An Integrated Circuit
App 20090239366 - Nejad; Hasan ; et al. | 2009-09-24 |
Silicided recessed silicon
Grant 7,557,032 - Nejad , et al. July 7, 2 | 2009-07-07 |
Silicided Recessed Silicon
App 20070105357 - Nejad; Hasan ; et al. | 2007-05-10 |
Silicided recessed silicon
App 20070049015 - Nejad; Hasan ; et al. | 2007-03-01 |
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