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Memory Device Including Control Gates Having Tungsten Structure
App 20220310524 - Greenlee; Jordan D. ; et al. | 2022-09-29 |
Methods of forming apparatuses including air gaps between conductive lines and related apparatuses, memory devices, and electronic systems
Grant 11,456,208 - Gupta , et al. September 27, 2 | 2022-09-27 |
Via Formation For A Memory Device
App 20220165793 - Economy; David Ross ; et al. | 2022-05-26 |
Methods Of Forming Apparatuses Including Air Gaps Between Conductive Lines And Related Apparatuses, Memory Devices, And Electronic Systems
App 20220051930 - Gupta; Sidhartha ; et al. | 2022-02-17 |
Memory Device With Low Density Thermal Barrier
App 20220020662 - Zheng; Pengyuan ; et al. | 2022-01-20 |
Memory cell stack and via formation for a memory device
Grant 11,189,662 - Economy , et al. November 30, 2 | 2021-11-30 |
Memory device with low density thermal barrier
Grant 11,158,561 - Zheng , et al. October 26, 2 | 2021-10-26 |
Access Line Grain Modulation In A Memory Device
App 20210312978 - Economy; David Ross ; et al. | 2021-10-07 |
Memory Device With High Resistivity Thermal Barrier
App 20210287960 - Economy; David Ross ; et al. | 2021-09-16 |
Via Formation For A Memory Device
App 20210225937 - Economy; David Ross ; et al. | 2021-07-22 |
Assemblies Having Conductive Structures with Three or More Different Materials
App 20210202710 - Economy; David Ross ; et al. | 2021-07-01 |
Methods Of Forming Tungsten Structures
App 20210183651 - Economy; David Ross ; et al. | 2021-06-17 |
Access line grain modulation in a memory device
Grant 10,991,425 - Economy , et al. April 27, 2 | 2021-04-27 |
Memory device with high resistivity thermal barrier
Grant 10,964,621 - Economy , et al. March 30, 2 | 2021-03-30 |
Assemblies having conductive structures with three or more different materials
Grant 10,957,775 - Economy , et al. March 23, 2 | 2021-03-23 |
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars
Grant 10,916,564 - Economy , et al. February 9, 2 | 2021-02-09 |
Assemblies Having Conductive Structures with Three or More Different Materials
App 20210005732 - Economy; David Ross ; et al. | 2021-01-07 |
Memory Device With High Resistivity Thermal Barrier
App 20200350225 - Economy; David Ross ; et al. | 2020-11-05 |
Memory Device With Low Density Thermal Barrier
App 20200350226 - Zheng; Pengyuan ; et al. | 2020-11-05 |
Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Materia
App 20200266210 - Economy; David Ross ; et al. | 2020-08-20 |
Methods Of Forming Tungsten Structures
App 20200211843 - Economy; David Ross ; et al. | 2020-07-02 |
Assemblies having vertically-extending structures, and methods of forming assemblies having vertically-extending channel material pillars
Grant 10,700,091 - Economy , et al. | 2020-06-30 |
Access Line Grain Modulation In A Memory Device
App 20200051624 - Economy; David Ross ; et al. | 2020-02-13 |
Conductive components and memory assemblies
Grant 10,475,810 - Bandyopadhyay , et al. Nov | 2019-11-12 |
Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Materia
App 20190304996 - Economy; David Ross ; et al. | 2019-10-03 |
Assemblies having vertically-extending structures
Grant 10,355,014 - Economy , et al. July 16, 2 | 2019-07-16 |
Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Materia
App 20190198519 - Economy; David Ross ; et al. | 2019-06-27 |
Conductive Components and Memory Assemblies
App 20180308861 - Bandyopadhyay; Sudip ; et al. | 2018-10-25 |
Conductive components and memory assemblies
Grant 10,014,319 - Bandyopadhyay , et al. July 3, 2 | 2018-07-03 |
Conductive components and memory assemblies
Grant 9,773,807 - Bandyopadhyay , et al. September 26, 2 | 2017-09-26 |
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