U.S. patent application number 15/478822 was filed with the patent office on 2018-03-29 for hybridization fin reveal for uniform fin reveal depth across different fin pitches.
The applicant listed for this patent is INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Zhenxing Bi, Donald F. Canaperi, Thamarai S. Devarajan, Sivananda K. Kanakasabapathy, Fee Li Lie, Peng Xu.
Application Number | 20180090384 15/478822 |
Document ID | / |
Family ID | 59701283 |
Filed Date | 2018-03-29 |
United States Patent
Application |
20180090384 |
Kind Code |
A1 |
Bi; Zhenxing ; et
al. |
March 29, 2018 |
HYBRIDIZATION FIN REVEAL FOR UNIFORM FIN REVEAL DEPTH ACROSS
DIFFERENT FIN PITCHES
Abstract
A method for uniform fin reveal depth for semiconductor devices
includes dry etching a dielectric material to reveal semiconductor
fins by a quasi-atomic layer etching (quasi-ALE) process to achieve
depth uniformity across different fin pitches. A lateral bias
induced by the quasi-ALE process is compensated for by
isotropically etching the dielectric material.
Inventors: |
Bi; Zhenxing; (Niskayuna,
NY) ; Canaperi; Donald F.; (Bridgewater, CT) ;
Devarajan; Thamarai S.; (Albany, NY) ;
Kanakasabapathy; Sivananda K.; (Niskayuna, NY) ; Lie;
Fee Li; (Albany, NY) ; Xu; Peng; (Guilderland,
NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
Armonk |
NY |
US |
|
|
Family ID: |
59701283 |
Appl. No.: |
15/478822 |
Filed: |
April 4, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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15278747 |
Sep 28, 2016 |
9754798 |
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15478822 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/66795 20130101;
H01L 29/0649 20130101; H01L 21/76229 20130101; H01L 21/31111
20130101; H01L 29/0653 20130101; H01L 21/823431 20130101; H01L
21/76224 20130101; H01L 21/0206 20130101; H01L 21/31138 20130101;
H01L 21/823481 20130101; H01L 29/7851 20130101; H01L 21/31116
20130101 |
International
Class: |
H01L 21/8234 20060101
H01L021/8234; H01L 21/311 20060101 H01L021/311; H01L 21/762
20060101 H01L021/762 |
Claims
1. A method for uniform fin reveal depth for semiconductor devices,
comprising: dry etching a dielectric material to reveal
semiconductor fins by a quasi-atomic layer etching (quasi-ALE)
process to achieve depth uniformity across different fin pitches
wherein the quasi-ALE process includes a plurality of gas and bias
pulse cycles of depositing a polymer with embedded etchant and
removing the polymer to release the etchant to remove the
dielectric material; and compensating for a lateral bias induced by
the quasi-ALE process by isotropically etching the dielectric
material.
2. (canceled)
3. The method as recited in claim 1, wherein the quasi-ALE process
laterally etches isolation regions without fins slower than dense
fin regions, and the isotropically etching reversely laterally
etches the isolation regions faster than the dense fin regions.
4. The method as recited in claim 1, wherein isotropically etching
includes a plasma free reactive cleaning or remote plasma etch.
5. The method as recited in claim 1, further comprising a plasma
strip to remove a polymer collected from the quasi-ALE process.
6. The method as recited in claim 5, wherein the plasma strip
includes N.sub.2H.sub.2 or O.sub.2 plasma.
7. The method as recited in claim 1, further comprising deglazing
the dielectric material to remove footings formed by the dry
etching at the base of the fins to achieve the depth uniformity
across different fin pitches.
8. A method for uniform fin reveal depth for semiconductor devices,
comprising: forming a liner over semiconductor fins and a
substrate; forming one or more dielectric materials over the liner;
dry etching the one or more dielectric materials to reveal
semiconductor fins by a quasi-atomic layer etching (quasi-ALE)
process to achieve depth uniformity across different fin pitches
and different material types or qualities; isotropically etching
the one or more dielectric materials with a plasma free reactive
cleaning or remote plasma etch to compensate for lateral bias
induced by the quasi-ALE process; deglazing the one or more
dielectric materials to remove footings formed by the dry etching
at the base of the fins to achieve the depth uniformity across
different fin pitches and material types or qualities; and
recessing the liner to a surface of the one or more dielectric
materials.
9. The method as recited in claim 8, wherein the quasi-ALE process
includes a plurality of gas and bias pulse cycles of depositing a
polymer with embedded etchant and removing the polymer to release
the etchant to remove the one or more dielectric materials.
10. The method as recited in claim 8, wherein the quasi-ALE process
etches isolation regions without fins slower than dense fin
regions, and the plasma free reactive cleaning or remote plasma
etch reversely etches the isolation regions faster than the dense
fin regions.
11. The method as recited in claim 8, wherein the isotropically
etching includes a cyclic removal process.
12. The method as recited in claim 8, further comprising a plasma
strip to remove collected polymer from the quasi-ALE process.
13. The method as recited in claim 12, wherein the plasma strip
includes N.sub.2H.sub.2 or O.sub.2 plasma.
14. The method as recited in claim 8, wherein the liner includes
silicon nitride and recessing the liner includes etching the liner
with hot phosphoric acid.
15. A method for uniform fin reveal depth for semiconductor
devices, comprising: dry etching a dielectric material to reveal
semiconductor fins by a quasi-atomic layer etching (quasi-ALE)
process to achieve depth uniformity across different fin pitches
wherein the quasi-ALE process laterally etches isolation regions
without fins slower than dense fin regions; and compensating for a
lateral bias induced by the quasi-ALE process by isotropically
etching the dielectric material where the isotropically etching
reversely laterally etches the isolation regions faster than the
dense fin regions.
16. The method as recited in claim 15, wherein the quasi-ALE
process includes a plurality of gas and bias pulse cycles.
17. The method as recited in claim 15, wherein isotropically
etching includes a plasma free reactive cleaning or remote plasma
etch.
18. The method as recited in claim 15, further comprising a plasma
strip to remove a polymer collected from the quasi-ALE process.
19. The method as recited in claim 18, wherein the plasma strip
includes N.sub.2H.sub.2 or O.sub.2 plasma.
20. The method as recited in claim 15, further comprising deglazing
the dielectric material to remove footings formed by the dry
etching at the base of the fins to achieve the depth uniformity
across different fin pitches.
Description
BACKGROUND
Technical Field
[0001] The present invention generally relates to semiconductor
processing, and more particularly to methods and structures for fin
reveals that preserve shallow trench isolation height (e.g.,
uniform fin reveal depth) regardless of fin density.
Description of the Related Art
[0002] Fin reveal processes typically employ a buffered HF etch
process (wet etch) and an oxide removal etch (oxide etch) to reveal
fins through an oxide layer during fin field effect transistor
manufacturing. The wet etch process etches dense fin region regions
(dense regions) at a faster etch rate while the oxide removal etch
process etches isolation regions (iso regions) at a faster etch
rate. The wet etch process does most of the material removal during
the fin reveal, and the oxide removal process tunes the iso region
fin reveal depth to attempt to match the fin reveal depth in the
dense region. The etch rate of wet etch (e.g., HF) is very
sensitive to oxide material quality and volume. When the oxide
layer (e.g., shallow trench isolation (STI) material) changes or
includes fin pitch changes, the fin reveal process needs to be
re-tuned to provide a good balance between iso region and dense
region differences. This is very difficult to do especially given
the small process window for the two etch processes for the fin
reveal, which is not comparable with multi-fin pitch CMOS
(complementary metal oxide semiconductor) patterning.
SUMMARY
[0003] In accordance with an embodiment of the present invention, a
method for uniform fin reveal depth for semiconductor devices
includes dry etching a dielectric material to reveal semiconductor
fins by a quasi-atomic layer etching (quasi-ALE) process to achieve
depth uniformity across different fin pitches. A lateral bias
induced by the quasi-ALE process is compensated for by
isotropically etching the dielectric material.
[0004] Another method for uniform fin reveal depth for
semiconductor devices includes forming a liner over semiconductor
fins and a substrate; forming one or more dielectric materials over
the liner; dry etching the one or more dielectric materials to
reveal semiconductor fins by a quasi-atomic layer etching
(quasi-ALE) process to achieve depth uniformity across different
fin pitches and different material types or qualities;
isotropically etching the one or more dielectric materials with a
plasma free reactive cleaning or remote plasma etch to compensate
for lateral bias induced by the quasi-ALE process; deglazing the
one or more dielectric materials to remove footings at the base of
the fins to achieve the depth uniformity across different fin
pitches and material types or qualities; and recessing the liner to
a surface of the one or more dielectric materials.
[0005] A semiconductor device having a uniform height across
different fin densities includes a semiconductor substrate having
fins etched therein and including dense fin regions and isolation
regions without fins. One or more dielectric layers are formed at a
base of the fins and the isolation regions and have a uniform
height across the fins and the isolation regions. The uniform
height includes a less than 2 nanometer difference across the one
or more dielectric layers.
[0006] These and other features and advantages will become apparent
from the following detailed description of illustrative embodiments
thereof, which is to be read in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] The following description will provide details of preferred
embodiments with reference to the following figures wherein:
[0008] FIG. 1 is a cross-sectional view showing a dielectric layer
planarized over fins having different fin pitches or densities in
accordance with an embodiment of the present invention;
[0009] FIG. 2 is a cross-sectional view showing the dielectric
layer etched using a dry fin reveal etch which etches isolation
regions faster than the dense fin regions and leaves footings and
wall deposits on fins adjacent to the isolation regions in
accordance with an embodiment of the present invention;
[0010] FIG. 3 is a cross-sectional view showing the dielectric
layer etched to compensate for undue lateral etch bias from the dry
fin reveal using an isotropic etch that etches dense regions faster
than the isolation regions at a reverse rate in accordance with an
embodiment of the present invention;
[0011] FIG. 4 is a cross-sectional view showing the dielectric
layer deglazed to remove footings to provide a uniform dielectric
layer reveal depth across all fin densities in accordance with an
embodiment of the present invention;
[0012] FIG. 5 is a cross-sectional view showing one or more
dielectric layer materials being formed over a liner and planarized
over fins having different fin pitches or densities in accordance
with an embodiment of the present invention;
[0013] FIG. 6 is a cross-sectional view showing the one or more
dielectric layer materials etched using a dry fin reveal etch which
etches isolation regions faster than the dense fin regions and
leaves footings and wall deposits on fins adjacent to the isolation
regions in accordance with an embodiment of the present
invention;
[0014] FIG. 7 is a cross-sectional view showing the one or more
dielectric layer materials etched to compensate for undue lateral
etch bias from the dry fin reveal using an isotropic etch that
etches dense regions faster than the isolation regions at a reverse
rate in accordance with an embodiment of the present invention;
[0015] FIG. 8 is a cross-sectional view showing the one or more
dielectric layer materials deglazed to remove footings to provide a
uniform dielectric layer reveal depth across all fin densities and
dielectric layer materials in accordance with an embodiment of the
present invention;
[0016] FIG. 9 is a plot of normalized fin reveal depth versus space
between fins (nm) showing a linear relationship in accordance with
an embodiment of the present invention; and
[0017] FIG. 10 is a block/flow diagram showing a method for uniform
fin reveal depth for semiconductor devices in accordance with an
embodiment of the present invention.
DETAILED DESCRIPTION
[0018] Embodiments of the present invention provide a hybrid fin
reveal method to minimize differences in both vertical and lateral
directions for shallow trench isolation material formed about the
fins. The hybrid fin reveal provides uniformity across different
fin densities and different dielectric quality films. In useful
embodiments, a dry fin reveal process is employed such as, e.g.,
atomic layer etching (ALE), to achieve depth uniformity across
different fin pitches. A plasma free reactive clean or remote
plasma etch (downstream plasma etch) can then be employed to
compensate for a lateral bias induced by the ALE process. An
optional deglaze process can be employed to clean up remnants at a
footing of the fins.
[0019] In other embodiments, fins can be formed with different
pattern density regions (e.g., >2 regions), which include a hard
mask (e.g., SiN) patterned on top of the fins. A protective etch
selective liner can be deposited over the fins in some embodiments.
Each region can be filled using dielectric materials (e.g.,
oxides), and, in some embodiments, materials with different
properties may be employed in different regions. A planarization
process is employed to planarize the dielectrics to the hard
mask.
[0020] A dry fin reveal process (e.g., ALE or quasi-ALE) can be
employed to achieve depth uniformity across the different fin
density regions or different film quality regions. A N.sub.2H.sub.2
or O.sub.2 plasma strip can be employed to clean a polymer induced
by the dry fin reveal process. A reactive clean (e.g., plasma free
reactive clean or remote plasma etch/downstream plasma etch) can be
employed to compensate for the lateral bias induced by dry etch
process. A deglaze process can be employed to remove excess oxide
footings, and a hot phosphoric acid etch can be employed to remove
a nitride liner, if deposited. Uniformity of shallow trench
isolation (STI) dielectric is achieved between regions of different
fin densities or STI material quality in both vertical and lateral
directions to provide a uniform fin reveal.
[0021] It is to be understood that aspects of the present invention
will be described in terms of a given illustrative architecture;
however, other architectures, structures, substrate materials and
process features and steps can be varied within the scope of
aspects of the present invention.
[0022] It will also be understood that when an element such as a
layer, region or substrate is referred to as being "on" or "over"
another element, it can be directly on the other element or
intervening elements can also be present. In contrast, when an
element is referred to as being "directly on" or "directly over"
another element, there are no intervening elements present. It will
also be understood that when an element is referred to as being
"connected" or "coupled" to another element, it can be directly
connected or coupled to the other element or intervening elements
can be present. In contrast, when an element is referred to as
being "directly connected" or "directly coupled" to another
element, there are no intervening elements present.
[0023] The present embodiments can include a design for an
integrated circuit chip, which can be created in a graphical
computer programming language, and stored in a computer storage
medium (such as a disk, tape, physical hard drive, or virtual hard
drive such as in a storage access network). If the designer does
not fabricate chips or the photolithographic masks used to
fabricate chips, the designer can transmit the resulting design by
physical means (e.g., by providing a copy of the storage medium
storing the design) or electronically (e.g., through the Internet)
to such entities, directly or indirectly. The stored design is then
converted into the appropriate format (e.g., GDSII) for the
fabrication of photolithographic masks, which typically include
multiple copies of the chip design in question that are to be
formed on a wafer. The photolithographic masks are utilized to
define areas of the wafer (and/or the layers thereon) to be etched
or otherwise processed.
[0024] Methods as described herein can be used in the fabrication
of integrated circuit chips. The resulting integrated circuit chips
can be distributed by the fabricator in raw wafer form (that is, as
a single wafer that has multiple unpackaged chips), as a bare die,
or in a packaged form. In the latter case, the chip is mounted in a
single chip package (such as a plastic carrier, with leads that are
affixed to a motherboard or other higher level carrier) or in a
multichip package (such as a ceramic carrier that has either or
both surface interconnections or buried interconnections). In any
case, the chip is then integrated with other chips, discrete
circuit elements, and/or other signal processing devices as part of
either (a) an intermediate product, such as a motherboard, or (b)
an end product. The end product can be any product that includes
integrated circuit chips, ranging from toys and other low-end
applications to advanced computer products having a display, a
keyboard or other input device, and a central processor.
[0025] It should also be understood that material compounds will be
described in terms of listed elements, e.g., SiGe. These compounds
include different proportions of the elements within the compound,
e.g., SiGe includes Si.sub.xGe.sub.1-x where x is less than or
equal to 1, etc. In addition, other elements can be included in the
compound and still function in accordance with the present
principles. The compounds with additional elements will be referred
to herein as alloys.
[0026] Reference in the specification to "one embodiment" or "an
embodiment", as well as other variations thereof, means that a
particular feature, structure, characteristic, and so forth
described in connection with the embodiment is included in at least
one embodiment. Thus, the appearances of the phrase "in one
embodiment" or "in an embodiment", as well any other variations,
appearing in various places throughout the specification are not
necessarily all referring to the same embodiment.
[0027] It is to be appreciated that the use of any of the following
"/", "and/or", and "at least one of", for example, in the cases of
"A/B", "A and/or B" and "at least one of A and B", is intended to
encompass the selection of the first listed option (A) only, or the
selection of the second listed option (B) only, or the selection of
both options (A and B). As a further example, in the cases of "A,
B, and/or C" and "at least one of A, B, and C", such phrasing is
intended to encompass the selection of the first listed option (A)
only, or the selection of the second listed option (B) only, or the
selection of the third listed option (C) only, or the selection of
the first and the second listed options (A and B) only, or the
selection of the first and third listed options (A and C) only, or
the selection of the second and third listed options (B and C)
only, or the selection of all three options (A and B and C). This
can be extended, as readily apparent by one of ordinary skill in
this and related arts, for as many items listed.
[0028] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
example embodiments. As used herein, the singular forms "a," "an"
and "the" are intended to include the plural forms as well, unless
the context clearly indicates otherwise. It will be further
understood that the terms "comprises," "comprising," "includes"
and/or "including," when used herein, specify the presence of
stated features, integers, steps, operations, elements and/or
components, but do not preclude the presence or addition of one or
more other features, integers, steps, operations, elements,
components and/or groups thereof.
[0029] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper," and the like, can be used herein for
ease of description to describe one element's or feature's
relationship to another element(s) or feature(s) as illustrated in
the FIGS. It will be understood that the spatially relative terms e
intended to encompass different orientations of the device in use
or operation in addition to the orientation depicted in the FIGS.
For example, if the device in the FIGS. is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
term "below" can encompass both an orientation of above and below.
The device can be otherwise oriented (rotated 90 degrees or at
other orientations), and the spatially relative descriptors used
herein can be interpreted accordingly. In addition, it will also be
understood that when a layer is referred to as being "between" two
layers, it can be the only layer between the two layers, or one or
more intervening layers can also be present.
[0030] It will be understood that, although the terms first,
second, etc. can be used herein to describe various elements, these
elements should not be limited by these terms. These terms are only
used to distinguish one element from another element. Thus, a first
element discussed below could be termed a second element without
departing from the scope of the present concept.
[0031] Referring now to the drawings in which like numerals
represent the same or similar elements and initially to FIG. 1, a
partially fabricated semiconductor device 10 is illustratively
shown. The device 10 includes a substrate 12 that provides a
plurality of fin structures 14 etched therein. The substrate 12 in
the embodiments shown includes a bulk substrate having fins
patterned and etched using a lithographic patterning or other
patterning process (e.g., spacer image transfer (SIT), etc.). The
patterning process patterns a hard mask 22, which functions as an
etch mask for etching the fins 14. The hard mask 22 can include a
nitride, other hard mask materials or combinations thereof.
[0032] The plurality of fin structures 14 are formed from the
substrate 12, which includes a semiconductor material including,
but not limited to Si, strained Si, SiC, SiGe, SiGeC, Si alloys,
Ge, Ge alloys, GaAs, InAs, InP as well as other III/V and II/VI
compound semiconductors. The plurality of fin structures 14 are
etched using a reactive ion etch (RIE) or the like. Fin dense
regions 20 and fin isolation regions 18 are defined by the layout
and dummy fin cut processing.
[0033] A dielectric material 16 is deposited over and on the fins
14 and the substrate 12. The dielectric material 16 can be formed
by chemical vapor deposition (CVD), flowable CVD (FCVD),
ultraviolet curable FCVD, high aspect ratio process (HARP),
enhanced HARP (eHARP), etc. Combinations of these and other
processes can be employed that can affect the quality of the
dielectric material 16.
[0034] The removal of the dielectric material 16 to expose the hard
mask 22 and/or the fins 14 is referred to as a fin reveal. The fin
reveal can include a planarization process and/or one or more
etching processes. The dielectric material 16 can include an oxide,
forms or oxides, other dielectric materials or combinations of
types and qualities of dielectric materials. The dielectric
material 16 can be recessed to form a shallow trench isolation
(STI) region at the base of the fins 14.
[0035] In the embodiment depicted in FIG. 1, three illustrative
regions R1, R2 and R3 are shown. R1 represents a dense fin region.
R2 represents a region free of fins and having a first pitch
(between dense regions), and R3 represents a region free of fins
and having a second pitch (between dense regions), which is larger
than the first pitch. Each region R1, R2, R3, etc. can include a
same dielectric material or a different dielectric material. Many
different regions and configurations may be employed instead of or
in addition to those depicted. The device 10 is planarized by,
e.g., a chemical mechanical polish (CMP) or etch, which stops on
the hard mask 22 to planarize the dielectric material 16.
[0036] Referring to FIG. 2, the fin reveal process is performed
using a dry fin reveal and, in particular, an atomic layer etch
(ALE). In a particularly useful embodiment, the ALE process
includes a quasi-ALE process or a gas/bias pulsing process.
[0037] The quasi-ALE process cycles between a polymer deposition
and etch process. The quasi-ALE process is a gas cycling process.
One cycle deposits a polymer, the next cycle uses Ar to activate F
inside of the polymer to etch dielectric material (e.g., oxide).
The quasi-ALE process provides better etch uniformity on large
spaces and tight spaces (e.g., STI). The polymer deposits more on
silicon nitride as compared to oxide, so it has selectivity to
silicon nitride.
[0038] The quasi-ALE process employs a capacitive plasma tool with
both gas and bias pulsing. For example, quasi-ALE uses Ar atoms to
bomb the polymer deposited to activate fluorine inside of the
polymer to react with an oxide layer or material. The polymer will
deposit selectively on nitride compared to oxide to achieve higher
etch selectivity.
[0039] The quasi-ALE process has a low vertical etch rate
difference between dense regions 20 and iso regions 18. In
addition, the quasi-ALE process has a lower lateral etch rate in
iso regions 18 as compared with the dense regions 20 due to a
higher polymer collection in the lateral dimensions due to several
root causes, such as, e.g., sticking coefficient, increased solid
angle of acceptance of polymer from phase gas, etc. The quasi-ALE
lateral etch rate of dielectric layer 16 is slower in the iso
regions 18 than the dense regions 20. A large oxide footing 24 is
formed that is left after the quasi-ALE process. A higher polymer
collection 26 forms on the fins 14 adjacent to the iso regions
18.
[0040] Referring to FIG. 3, a strip process is employed to remove
the polymer by-product (polymer collection 26). The strip process
can include a N.sub.2H.sub.2 or O.sub.2 plasma strip. The strip
process is followed by a plasma free reactive clean or downstream
plasma process (remote plasma etch), which is preferably an
isotropic etch.
[0041] The plasma free reactive clean or downstream plasma process,
which can include a cyclic etch process. A cyclic etch process can
include NH.sub.3/HF delivered and absorbed on the surface to be
etched. The surface is then etched using chemicals to react with
the surface and form by-products in a self-ended process. Then, the
by-products are purged with a slightly high temperature thermal
treatment (e.g., about 100 degrees C. or higher). The cyclic etch
cycles between chemical reaction and purging. The plasma free
reactive clean has no bias, and therefore no plasma kinetic energy
to damage the substrate or surface. Mainly chemical reactions occur
between (non-accelerated) ions and the etch target to remove a
lateral difference in different density regions in an isotropic
etch process.
[0042] A downstream plasma etch or remote plasma assisted dry etch
process is largely conformal and selective towards silicon oxide
layers but does not readily etch silicon regardless of whether the
silicon is amorphous, crystalline or polycrystalline. The
selectivity provides advantages for applications such as STI and
inter-layer dielectric (ILD) recess formation. Remote plasma
excitation of the active etchant species permits plasma-damage-free
processing.
[0043] The dry etch process produces solid by-products which grow
on the surface of as material is removed. The solid by-products are
subsequently removed via sublimation when the temperature is
raised.
[0044] The plasma free reactive clean or remote plasma etch
provides an opposite lateral etch rate (e.g., iso regions 18 etch
faster than the dense regions 20 at a same rate as previously
etched), which can offset the bias by the quasi-ALE process. The
dielectric layer 16 is etched and recessed during the plasma free
reactive clean to remove the dielectric material to provide
symmetry and leave symmetric footings 28 about the fins 14 in the
dielectric layer 16. The footings 28 are now symmetrical for fins
14 adjacent to the iso regions 18 and for fins formed within the
dense regions 20.
[0045] Referring to FIG. 4, an optional deglaze process is
performed. The deglaze process can include an HF wet etch. (The
deglaze can be a short process which includes a downstream plasma
or can also be a wet etch process). The deglaze process removes the
footings 28 and cleans up the surface of the dielectric layer 16 to
form the STI.
[0046] In accordance with the present embodiments, the iso regions
18 and the dense regions 20 can include less than 1 nm difference
for both lateral and vertical direction differences. While up to
about 2 nm is acceptable, lower lateral and vertical direction
differences are desired. The STI (16) remains level throughout the
regions R1, R2 and R3, whether there are dense fins 20 or no fins
(iso regions 18).
[0047] Referring to FIG. 5, a partially fabricated semiconductor
device 40 is illustratively shown. The device 40 includes substrate
12 that provides the plurality of fin structures 14 etched therein.
The hard mask 22 can be included.
[0048] The plurality of fin structures 14 are formed from the
substrate 12. The plurality of fin structures 14 are etched using a
reactive ion etch (RIE) or the like. Fin dense regions 20 and fin
isolation regions 18 are defined by the layout and dummy fin cut
processing.
[0049] A liner 30 is formed over the fins 14 and hard mask 22. The
liner 30 includes a material that permits selective etching
relative to a dielectric material to be formed. The liner 30 can
include a nitride, such as silicon nitride, although other
dielectric materials may be employed.
[0050] Instead of a single dielectric material (16, FIG. 1) or two
or more dielectric materials 34, 36, 38, 44, 46 can be deposited
over the liner 30. The dielectric materials 34, 36, 38, 44, 46 can
include different materials, different forms of the same material,
materials formed by different processes, e.g., CVD, FCVD,
ultraviolet curable FCVD, HARP, eHARP, etc. In some embodiments,
some of the dielectric materials 34, 36, 38, 44, 46 can be the same
materials. The present embodiments, provide a uniform lateral and
vertical uniformity across different fin densities and the material
types or qualities.
[0051] In the embodiment depicted in FIG. 5, three illustrative
regions R1, R2 and R3 are shown. R1 represents a dense fin region.
R2 represents a region free of fins and having a first pitch, and
R3 represents a region free of fins and having a second pitch,
which is larger than the first pitch. Each region R1, R2, R3, etc.
can include a same dielectric material or a different dielectric
material. More or less regions may also be employed. The device 40
is planarized by e.g., CMP or etching, which stops on the hard mask
22 to planarize the dielectric materials 34, 36, 38, 44, 46.
[0052] Referring to FIG. 6, the fin reveal process is performed
using a dry etch process, such as, e.g., a quasi-ALE process. In
one embodiment, the quasi-ALE process cycles between a polymer
deposition and etch process. The quasi-ALE process has a low
vertical etch rate difference between dense regions 20 and iso
regions 18. The quasi-ALE lateral etch rate of dielectric material
34, 36, 38, 44, 46 is slower in the iso regions 18 than the dense
regions 20. The large oxide footing 24 is formed, which is left
after the quasi-ALE process. Higher polymer collection 26 forms on
the fins 14 adjacent to the iso regions 18.
[0053] Referring to FIG. 7, a strip process is employed to remove
the polymer by-product (polymer collection 26). The strip process
can include a N.sub.2H.sub.2 or O.sub.2 plasma strip. The strip
process can be followed by a plasma free reactive clean or
downstream plasma/remote plasma etch. The plasma free reactive
clean or remote plasma etch can include an isotropic etch, which
includes an opposite lateral etch rate (e.g., iso regions 18 etch
faster than the dense regions 20 at a same rate as previously
etched), which can offset the bias by the quasi-ALE process. The
dielectric material 34, 36, 38, 44, 46 is etched and recessed
during the plasma free reactive clean to remove the dielectric
material (e.g. oxide) to provide symmetry and leave symmetric
footings 28 about the fins 14 in the dielectric material 34, 36,
38, 44, 46. The footings 28 are become symmetrical for fins 14
adjacent to the iso regions 18 and for fins formed within the dense
regions 20.
[0054] Referring to FIG. 8, an optional deglaze process is
performed. The deglaze process can include an HF etch. The deglaze
process removes the footings 28 and cleans up the surface of the
dielectric 34, 36, 38, 44, 46 to form the STI.
[0055] In accordance with the present embodiments, the iso regions
18 and the dense regions 20 can include less than 1 nm difference
for both lateral and vertical direction differences. While up to
about 2 nm is acceptable, lower lateral and vertical direction
differences are desired. The STI (34, 36, 38, 44, 46) remains level
throughout the regions R1, R2 and R3, whether there are dense fins
20 or no fins (iso regions 18). The liner 30 is recessed to the
surface of the STI 34, 36, 38, 44, 46. The liner 30 can be etched
using a hot phosphoric acid etch.
[0056] In FIGS. 4 and 8 (or FIGS. 3 and 7), processing continues
with the formation of gate structures, source/drain regions,
contact formation, metal lines, etc. While the present embodiments
may be employed with any fin pitch, it should be understood that
the present embodiments are particularly useful for sub 40 nm fin
pitches.
[0057] Referring to FIG. 9, a plot of normalized fin reveal depth
versus space between fins (nm) is shown. A trace 50 shows a
logarithmic relation (y=0.102*ln(x)+1.3244) for a conventional
process. For high density fins, the logarithmic relationship
rapidly changes resulting in large variations of reveal depths for
small changes in fin density. In accordance with the present
embodiments, a trace 52 shows a linear relation (for example:
y=3.times.10.sup.-5*x+0.9879) for a process in accordance with
embodiments of the present invention. For high density fins, the
linear relationship changes very little resulting in negligible
variations of reveal depths for changes in fin density. While other
relationships are contemplated, these relationships illustrate
aspects of the present invention.
[0058] Referring to FIG. 10, methods for uniform fin reveal depth
for semiconductor devices are illustratively shown. In some
alternative implementations, the functions noted in the blocks may
occur out of the order noted in the figures. For example, two
blocks shown in succession may, in fact, be executed substantially
concurrently, or the blocks may sometimes be executed in the
reverse order, depending upon the functionality involved. It will
also be noted that each block of the block diagrams and/or
flowchart illustration, and combinations of blocks in the block
diagrams and/or flowchart illustration, can be implemented by
special purpose hardware-based systems that perform the specified
functions or acts or carry out combinations of special purpose
hardware and computer instructions.
[0059] In block 102, fins are etched into a semiconductor substrate
using a hard mask or other etch mask patterned on the fins. In
block 104, an optional liner is formed over the fins and the
substrate. In block 106, a dielectric material or dielectric
materials are deposited over different fin regions. If the liner is
employed, selective deposition or block masks may be employed to
form different dielectric materials or different dielectric
qualities in different fin regions (e.g., dense or iso regions of
different densities or qualities).
[0060] In block 106, a dry etch is performed to provide a fin
reveal that removes the dielectric material or materials to reveal
the fins. The dry etch can include a quasi-ALE process to achieve
depth uniformity across different fin pitches. The quasi-ALE
process includes a plurality of cycles of: depositing a polymer,
and etching the polymer and dielectric material (or materials) to
achieve the depth uniformity across different fin pitches.
[0061] The quasi-ALE process includes a plurality of gas and bias
pulse cycles of depositing a polymer with embedded etchant and
removing the polymer to release the etchant to remove the
dielectric material. The quasi-ALE process results in polymer
collection on fin side walls and footings (oxide) left on fins
adjacent to iso regions. The quasi-ALE process includes a lower
lateral etch rate in iso regions as compared with the dense
regions.
[0062] In block 108, a plasma strip can be employed to remove the
polymer collection on the fin side walls and footings left on fins
adjacent to iso regions. The plasma strip can include
N.sub.2H.sub.2 plasma or O.sub.2 plasma.
[0063] In block 110, compensation for lateral bias induced by the
quasi-ALE process is performed. For example, a lower lateral etch
rate in dense regions is provided as compared with the iso regions.
Compensation can be performed using an isotropic etch performed on
the dielectric material to compensate for the lateral bias. Since
the quasi-ALE process laterally etches isolation regions without
fins slower than dense fin regions, a compensation etch reversely
etches the isolation regions faster than the dense fin regions.
[0064] In block 112, the compensation etch can include a plasma
free reactive clean or downstream plasma/remote plasma etch
employed as an isotropic oxide removal process.
[0065] In block 114, a deglazing process may be performed on the
dielectric material or material to remove remaining footings at the
base of the fins to achieve the depth uniformity across different
fin pitches and material types or qualities. The deglazing can
include an HF etch or the like.
[0066] In block 116, the liner, if present, is recessed to a
surface of the one or more dielectric materials. The liner can be
recessed by a hot phosphoric etch. The liner is particularly useful
when multiple dielectric materials are employed for the STI
dielectric. The liner can include a nitride where the dielectric
material can include an oxide. In block 118, processing continues
to form finFETs and other components, such as contacts, metal
lines, dielectric layers, etc.
[0067] Having described preferred embodiments for hybridization fin
reveal for uniform fin reveal depth across different fin pitches
(which are intended to be illustrative and not limiting), it is
noted that modifications and variations can be made by persons
skilled in the art in light of the above teachings. It is therefore
to be understood that changes may be made in the particular
embodiments disclosed which are within the scope of the invention
as outlined by the appended claims. Having thus described aspects
of the invention, with the details and particularity required by
the patent laws, what is claimed and desired protected by Letters
Patent is set forth in the appended claims.
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