Canaperi; Donald F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Canaperi; Donald F..The latest application filed is for "forming high carbon content flowable dielectric film with low processing damage".

Company Profile

17.46.37

Canaperi; Donald F. - Bridgewater CT
Canaperi; Donald F. - Averill Park NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor microcooler Grant 11,056,418 - Canaperi , et al. July 6, 2	2021-07-06
Semiconductor microcooler Grant 11,049,789 - Canaperi , et al. June 29, 2	2021-06-29
Semiconductor structures of more uniform thickness Grant 11,031,250 - Ebrish , et al. June 8, 2	2021-06-08
Dual function magnetic tunnel junction pillar encapsulation Grant 10,971,675 - Nguyen , et al. April 6, 2	2021-04-06
Nanosheet eDRAM Grant 10,937,789 - Reznicek , et al. March 2, 2	2021-03-02
Low oxygen cleaning for CMP equipment Grant 10,832,917 - Canaperi , et al. November 10, 2	2020-11-10
Forming High Carbon Content Flowable Dielectric Film With Low Processing Damage App 20200234949 - Briggs; Benjamin D. ; et al.	2020-07-23
Semiconductor Structures Of More Uniform Thickness App 20200176263 - Ebrish; Mona A. ; et al.	2020-06-04
Semiconductor Microcooler App 20200161216 - Canaperi; Donald F. ; et al.	2020-05-21
Semiconductor Microcooler App 20200118904 - Canaperi; Donald F. ; et al.	2020-04-16
Semiconductor Microcooler App 20200051886 - Canaperi; Donald F. ; et al.	2020-02-13
Semiconductor Microcooler App 20200051896 - Canaperi; Donald F. ; et al.	2020-02-13
Semiconductor microcooler Grant 10,553,516 - Canaperi , et al. Fe	2020-02-04
Semiconductor microcooler Grant 10,553,522 - Canaperi , et al. Fe	2020-02-04
Dual Function Magnetic Tunnel Junction Pillar Encapsulation App 20200028069 - Nguyen; Son V. ; et al.	2020-01-23
NANOSHEET eDRAM App 20190378842 - Reznicek; Alexander ; et al.	2019-12-12
Dual function magnetic tunnel junction pillar encapsulation Grant 10,468,585 - Nguyen , et al. No	2019-11-05
Fully aligned via employing selective metal deposition Grant 10,395,986 - Briggs , et al. A	2019-08-27
Hybridization fin reveal for uniform fin reveal depth across different fin pitches Grant 10,366,928 - Bi , et al. July 30, 2	2019-07-30
Cyclic etch process to remove dummy gate oxide layer for fin field effect transistor fabrication Grant 10,242,882 - Bi , et al.	2019-03-26
Rework of patterned dielectric and metal hardmask films Grant 10,242,872 - Arnold , et al.	2019-03-26
Composite manganese nitride / low-k dielectric cap Grant 10,224,283 - Canaperi , et al.	2019-03-05
Hybridization fin reveal for uniform fin reveal depth across different fin pitches Grant 10,163,721 - Bi , et al. Dec	2018-12-25
Cyclic Etch Process To Remove Dummy Gate Oxide Layer For Fin Field Effect Transistor Fabrication App 20180358232 - Bi; Zhenxing ; et al.	2018-12-13
Low Oxygen Cleaning For Cmp Equipment App 20180358231 - Canaperi; Donald F. ; et al.	2018-12-13
Low Oxygen Cleaning For Cmp Equipment App 20180358230 - Canaperi; Donald F. ; et al.	2018-12-13
Rework Of Patterned Dielectric And Metal Hardmask Films App 20180277369 - Arnold; John C. ; et al.	2018-09-27
Polysilicon residue removal in nanosheet MOSFETs Grant 9,997,352 - Bi , et al. June 12, 2	2018-06-12
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Grant 9,947,622 - Canaperi , et al. April 17, 2	2018-04-17
Hybridization fin reveal for uniform fin reveal depth across different fin pitches Grant 9,935,015 - Bi , et al. April 3, 2	2018-04-03
Hybridization Fin Reveal For Uniform Fin Reveal Depth Across Different Fin Pitches App 20180090384 - Bi; Zhenxing ; et al.	2018-03-29
Polysilicon Residue Removal In Nanosheet Mosfets App 20180090315 - Bi; Zhenxing ; et al.	2018-03-29
Hybridization Fin Reveal For Uniform Fin Reveal Depth Across Different Fin Pitches App 20180090367 - Bi; Zhenxing ; et al.	2018-03-29
Hybridization Fin Reveal For Uniform Fin Reveal Depth Across Different Fin Pitches App 20180090385 - Bi; Zhenxing ; et al.	2018-03-29
Composite Manganese Nitride / Low-k Dielectric Cap App 20170317032 - Canaperi; Donald F. ; et al.	2017-11-02
Hybridization fin reveal for uniform fin reveal depth across different fin pitches Grant 9,754,798 - Bi , et al. September 5, 2	2017-09-05
Composite manganese nitride/low-K dielectric cap Grant 9,711,456 - Canaperi , et al. July 18, 2	2017-07-18
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Grant 9,691,705 - Canaperi , et al. June 27, 2	2017-06-27
Composite Manganese Nitride / Low-k Dielectric Cap App 20170179034 - Canaperi; Donald F. ; et al.	2017-06-22
Polysilicon residue removal in nanosheet MOSFETs Grant 9,679,780 - Bi , et al. June 13, 2	2017-06-13
Wafer bonding using boron and nitrogen based bonding stack Grant 9,640,514 - Lin , et al. May 2, 2	2017-05-02
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS App 20170005040 - Canaperi; Donald F. ; et al.	2017-01-05
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Grant 9,472,503 - Canaperi , et al. October 18, 2	2016-10-18
Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors Grant 9,449,810 - Canaperi , et al. September 20, 2	2016-09-20
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS App 20160133576 - Canaperi; Donald F. ; et al.	2016-05-12
Interconnect structure containing a porous low k interconnect dielectric/dielectric cap Grant 9,312,224 - Canaperi , et al. April 12, 2	2016-04-12
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Grant 9,275,952 - Canaperi , et al. March 1, 2	2016-03-01
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS App 20160035618 - Canaperi; Donald F. ; et al.	2016-02-04
Advanced Ultra Low K Sicoh Dielectrics Prepared By Built-in Engineered Pore Size And Bonding Structured With Cyclic Organosilicon Precursors App 20160005597 - Canaperi; Donald F. ; et al.	2016-01-07
Composite dielectric materials with improved mechanical and electrical properties Grant 9,214,332 - Canaperi , et al. December 15, 2	2015-12-15
Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors Grant 9,209,017 - Canaperi , et al. December 8, 2	2015-12-08
Advanced Ultra Low K Sicoh Dielectrics Prepared By Built-in Engineered Pore Size And Bonding Structured With Cyclic Organosilicon Precursors App 20150279667 - Canaperi; Donald F. ; et al.	2015-10-01
Composite Dielectric Materials With Improved Mechanical And Electrical Properties App 20150270124 - Canaperi; Donald F. ; et al.	2015-09-24
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS App 20150214157 - Canaperi; Donald F. ; et al.	2015-07-30
Semiconductor fabrication method using stop layer Grant 9,087,796 - Adam , et al. July 21, 2	2015-07-21
Semiconductor Fabrication Method Using Stop Layer App 20140242797 - Adam; Thomas N. ; et al.	2014-08-28
Reticle carrier Grant 8,815,475 - Petrarca , et al. August 26, 2	2014-08-26
Reticle Carrier App 20130130162 - Petrarca; Kevin S. ; et al.	2013-05-23
Reticle carrier Grant 8,439,728 - Petrarca , et al. May 14, 2	2013-05-14
Damascene Reticle And Method Of Manufacture Thereof App 20120040277 - Petrarca; Kevin S. ; et al.	2012-02-16
Method of manufacture of damascene reticle Grant 8,110,321 - Petrarca , et al. February 7, 2	2012-02-07
Method And Composition For Electro-chemical-mechanical Polishing App 20100051474 - Andricacos; Panayotis C. ; et al.	2010-03-04
Damascene Reticle And Method Of Manufacture Thereof App 20080286660 - Petrarca; Kevin S. ; et al.	2008-11-20
Manufacturable CoWP metal cap process for copper interconnects Grant 7,407,605 - Restaino , et al. August 5, 2	2008-08-05
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20070215842 - Restaino; Darryl D. ; et al.	2007-09-20
Manufacturable CoWP metal cap process for copper interconnects Grant 7,253,106 - Restaino , et al. August 7, 2	2007-08-07
Materials and method to seal vias in silicon substrates Grant 7,199,450 - Casey , et al. April 3, 2	2007-04-03
Materials And Method To Seal Vias In Silicon Substrates App 20060255480 - Casey; Jon A. ; et al.	2006-11-16
Method and composition for electro-chemical-mechanical polishing App 20060163083 - Andricacos; Panayotis C. ; et al.	2006-07-27
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20060134911 - Restaino; Darryl D. ; et al.	2006-06-22
Very low effective dielectric constant interconnect structures and methods for fabricating the same Grant 7,045,453 - Canaperi , et al. May 16, 2	2006-05-16
Very low effective dielectric constant interconnect Structures and methods for fabricating the same Grant 7,023,093 - Canaperi , et al. April 4, 2	2006-04-04
Very low effective dielectric constant interconnect structures and methods for fabricating the same App 20050186778 - Canaperi, Donald F. ; et al.	2005-08-25
Micro electromechanical switch having self-aligned spacers Grant 6,762,667 - Volant , et al. July 13, 2	2004-07-13
Very low effective dielectric constant interconnect Structures and methods for fabricating the same App 20040087135 - Canaperi, Donald F. ; et al.	2004-05-06
Micro electromechanical switch having self-aligned spacers App 20030210124 - Volant, Richard P. ; et al.	2003-11-13
Micro electromechanical switch having self-aligned spacers Grant 6,621,392 - Volant , et al. September 16, 2	2003-09-16
Preparation of strained Si/SiGe on insulator by hydrogen induced layer transfer technique Grant 6,524,935 - Canaperi , et al. February 25, 2	2003-02-25
Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) Grant 6,475,072 - Canaperi , et al. November 5, 2	2002-11-05
Slurry for mechanical polishing (CMP) of metals and use thereof Grant 6,348,076 - Canaperi , et al. February 19, 2	2002-02-19
Inductive head lamination with layer of magnetic quenching material Grant 5,576,099 - Canaperi , et al. * November 19, 1	1996-11-19
Apparatus and method for electroplating pin grid array packaging modules Grant 5,516,416 - Canaperi , et al. May 14, 1	1996-05-14

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