U.S. patent application number 15/179683 was filed with the patent office on 2017-04-13 for semiconductor device and method for manufacturing the same.
This patent application is currently assigned to Advanced Semiconductor Engineering, Inc.. The applicant listed for this patent is Advanced Semiconductor Engineering, Inc.. Invention is credited to Yung-Shun Chang, Chien-Hua Chen, Teck-Chong Lee.
Application Number | 20170103946 15/179683 |
Document ID | / |
Family ID | 58500008 |
Filed Date | 2017-04-13 |
United States Patent
Application |
20170103946 |
Kind Code |
A1 |
Chang; Yung-Shun ; et
al. |
April 13, 2017 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Abstract
A semiconductor device includes a substrate, at least one
integrated passive device, a first redistribution layer, a second
redistribution layer, and conductive vias. The at least one
integrated passive device includes at least one capacitor disposed
adjacent to a first surface of the substrate. The first
redistribution layer is disposed adjacent to the first surface of
the substrate. The second redistribution layer is disposed adjacent
to a second surface of the substrate. The conductive vias extend
through the substrate, and electrically connect the first
redistribution layer and the second redistribution layer.
Inventors: |
Chang; Yung-Shun;
(Kaohsiung, TW) ; Chen; Chien-Hua; (Kaohsiung,
TW) ; Lee; Teck-Chong; (Kaohsiung, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Advanced Semiconductor Engineering, Inc. |
Kaohsiung |
|
TW |
|
|
Assignee: |
Advanced Semiconductor Engineering,
Inc.
|
Family ID: |
58500008 |
Appl. No.: |
15/179683 |
Filed: |
June 10, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62238341 |
Oct 7, 2015 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 24/13 20130101;
H01L 21/486 20130101; H01L 21/561 20130101; H01L 2224/131 20130101;
H01L 2224/97 20130101; H01L 24/81 20130101; H01L 23/3114 20130101;
H01L 21/565 20130101; H01L 24/97 20130101; H01L 2924/15788
20130101; H01L 23/49838 20130101; H01L 24/16 20130101; H01L
2224/131 20130101; H01L 2924/15311 20130101; H01L 2924/157
20130101; H01L 23/3128 20130101; H01L 23/49827 20130101; H01L
2224/97 20130101; H01L 21/4853 20130101; H01L 2224/0401 20130101;
H01L 2924/014 20130101; H01L 2021/60022 20130101; H01L 2224/16238
20130101; H01L 2224/81447 20130101; H01L 23/49822 20130101; H01L
21/568 20130101; H01L 23/5223 20130101; H01L 23/5227 20130101; H01L
2924/00014 20130101; H01L 2224/81 20130101 |
International
Class: |
H01L 23/522 20060101
H01L023/522; H01L 21/56 20060101 H01L021/56; H01L 21/48 20060101
H01L021/48; H01L 23/498 20060101 H01L023/498; H01L 23/31 20060101
H01L023/31 |
Claims
1. A semiconductor device, comprising: a substrate having a first
surface and a second surface; at least one integrated passive
device including at least one capacitor disposed adjacent to the
first surface of the substrate; a first redistribution layer
disposed adjacent to the first surface of the substrate; a second
redistribution layer disposed adjacent to the second surface of the
substrate; and a plurality of conductive vias extending through the
substrate, and electrically connecting the first redistribution
layer and the second redistribution layer.
2. The semiconductor device according to claim 1, wherein the
substrate comprises glass, silicon or silica.
3. The semiconductor device according to claim 1, wherein the
capacitor includes a lower electrode, a dielectric layer and an
upper electrode, the lower electrode is disposed on the first
surface of the substrate, the dielectric layer is disposed on the
lower electrode, and the upper electrode is disposed on the
dielectric layer.
4. The semiconductor device according to claim 1, further
comprising: an insulation layer covering the capacitor and the
first surface of the substrate, the insulation layer defining at
least one first opening to expose a portion of the capacitor, the
insulation layer further defining a plurality of second openings
corresponding to the conductive vias; a first conductive
interconnector disposed in the first opening of the insulation
layer and electrically connected to the capacitor; and a plurality
of second conductive interconnectors disposed in respective ones of
the second openings of the insulation layer and electrically
connected to the conductive vias.
5. The semiconductor device according to claim 4, wherein the first
redistribution layer is disposed on the insulation layer, and the
first conductive interconnector and the second conductive
interconnectors are portions of the first redistribution layer.
6. The semiconductor device according to claim 1, wherein the
integrated passive device further includes an inductor including at
least two conductive vias that are electrically connected in
series.
7. The semiconductor device according to claim 1, wherein the
substrate defines a plurality of through holes, each of the
conductive vias comprises a conductor material and an inner
insulation layer, the conductor material is disposed on a side wall
of a respective through hole to define a central groove, and the
central groove is filled with the inner insulation layer.
8. The semiconductor device according to claim 1, further
comprising a semiconductor chip and an encapsulant, wherein the
semiconductor chip is disposed adjacent to, and is electrically
connected to, the first redistribution layer, and the encapsulant
covers the semiconductor chip.
9. A semiconductor device, comprising: a substrate having a first
surface and a second surface; integrated passive devices comprising
an inductor, and further comprising at least one capacitor disposed
adjacent to the first surface of the substrate; a first segment
disposed adjacent to the first surface of the substrate; a second
segment disposed adjacent to the second surface of the substrate;
and a plurality of conductive vias extending through the substrate,
wherein each of the conductive vias has a first end adjacent to the
first surface of the substrate and a second end adjacent to the
second surface of the substrate, wherein the first segment
electrically connects first ends of a first one and a second one of
the conductive vias, and the second segment electrically connects
second ends of the second one and a third one of the conductive
vias, and wherein the inductor comprises a series electrical
connection of the first one, the second one and the third one of
the conductive vias.
10. The semiconductor device according to claim 9, wherein the
capacitor includes a lower electrode disposed on the first surface
of the substrate, a dielectric layer disposed on the lower
electrode, and an upper electrode disposed on the dielectric
layer.
11. The semiconductor device according to claim 9, further
comprising: an insulation layer covering the capacitor and the
first surface of the substrate, the insulation layer defining at
least one first opening to expose a portion of the capacitor, the
insulation layer further defining a plurality of second openings
corresponding to the conductive vias; a first conductive
interconnector disposed in the first opening of the insulation
layer to electrically connect to the capacitor; and a plurality of
second conductive interconnectors disposed in respective second
openings of the insulation layer to electrically connect to the
conductive vias.
12. The semiconductor device according to claim 9, wherein the
substrate defines a plurality of through holes, each of the
conductive vias comprises a conductor material and an inner
insulation layer, the conductor material is disposed on a side wall
of a respective through hole to define a central groove, and the
central groove is filled with the insulation layer.
13. The semiconductor device according to claim 9, further
comprising a semiconductor chip and an encapsulant, wherein the
semiconductor chip is disposed adjacent to the first surface of the
substrate, and the encapsulant covers the semiconductor chip.
14-20. (canceled)
21. A semiconductor device, comprising: a substrate having a first
surface and a second surface; integrated passive devices including
an inductor and a capacitor disposed adjacent to the first surface
of the substrate; a first redistribution layer disposed adjacent to
the first surface of the substrate, the first redistribution layer
including a first segment; a second redistribution layer disposed
adjacent to the second surface of the substrate, the second
redistribution layer including a second segment; and a plurality of
conductive vias extending through the substrate, and electrically
connecting the first segment and the second segment, wherein the
first segment, the second segment and the conductive vias are
configured as the inductor.
22. The semiconductor device according to claim 21, wherein each of
the conductive vias has a first end adjacent to the first surface
of the substrate and a second end adjacent to the second surface of
the substrate, the first segment electrically connects first ends
of a first one and a second one of the conductive vias, and the
second segment electrically connects second ends of the second one
and a third one of the conductive vias.
23. The semiconductor device according to claim 22, wherein the
first segment is misaligned with the second segment.
24. The semiconductor device according to claim 21, wherein the
capacitor includes a lower electrode, a dielectric layer and an
upper electrode, the lower electrode is disposed on the first
surface of the substrate, the dielectric layer is disposed on the
lower electrode, and the upper electrode is disposed on the
dielectric layer.
25. The semiconductor device according to claim 24, further
comprising: a patterned circuit layer disposed on the first surface
of the substrate, wherein a first portion of the patterned circuit
layer is configured as the lower electrode of the capacitor and a
second portion of the patterned circuit layer is electrically
connected with the first redistribution layer.
26. The semiconductor device according to claim 21, wherein the
substrate defines a plurality of through holes, each of the
conductive vias comprises a conductor material and an inner
insulation layer, the conductor material is disposed on a side wall
of a respective through hole to define a central groove, and the
central groove is filled with the inner insulation layer.
27. The semiconductor device according to claim 21, further
comprising a semiconductor chip and an encapsulant, wherein the
semiconductor chip is disposed adjacent to, and is electrically
connected to, the first redistribution layer, and the encapsulant
covers the semiconductor chip.
Description
CROSS-REFERENCE TO RELATED PATENT APPLICATIONS
[0001] This application claims the benefit of and priority to U.S.
Provisional Patent Application 62/238,341 filed Oct. 7, 2015, the
contents of which are incorporated herein by reference in their
entirety.
BACKGROUND
[0002] 1. Field of the Disclosure
[0003] The present disclosure relates to the field of semiconductor
devices and semiconductor processes, and more particularly, to
semiconductor devices having an integrated passive device and
semiconductor processes for manufacturing the same.
[0004] 2. Description of the Related Art
[0005] A conventional circuit may include one or more passive
devices, where a passive device is a component such as a capacitor,
a resistor or an inductor. To achieve microminiaturization, there
is a trend to integrate passive devices into a semiconductor
device. However, an inductor is a spiral structure, and when
integrated by disposing the inductor on a surface of an insulation
layer, the spiral structure can occupy a large space.
SUMMARY
[0006] In an embodiment, a semiconductor device includes a
substrate, at least one integrated passive device, a first
redistribution layer, a second redistribution layer, and conductive
vias. The at least one integrated passive device includes at least
one capacitor disposed adjacent to the first surface of the
substrate. The first redistribution layer is disposed adjacent to a
first surface of the substrate. The second redistribution layer is
disposed adjacent to a second surface of the substrate. The
conductive vias extend through the substrate, and electrically
connect the first redistribution layer and the second
redistribution layer.
[0007] In an embodiment, a semiconductor device includes a
substrate, integrated passive devices, a first segment disposed
adjacent to a first surface of the substrate, a second segment
disposed adjacent to a second surface of the substrate, and
conductive vias. The integrated passive devices include an
inductor, and at least one capacitor disposed adjacent to the first
surface of the substrate. The conductive vias extend through the
substrate. Each of the conductive vias has a first end adjacent to
the first surface of the substrate and a second end adjacent to the
second surface of the substrate. The first segment electrically
connects first ends of a first one and a second one of the
conductive vias, and the second segment electrically connects
second ends of the second one and a third one of the conductive
vias. The inductor includes a series electrical connection of the
first one, the second one and the third one of the conductive
vias.
[0008] In an embodiment, a method for manufacturing a semiconductor
device includes: (a) providing a substrate having a first surface
and a second surface; (b) forming a plurality of conductive vias in
the substrate; (c) forming at least one capacitor adjacent to the
first surface of the substrate; (d) forming a first redistribution
layer adjacent to the first surface of the substrate; (e) forming a
second redistribution layer adjacent to the second surface of the
substrate, the second redistribution layer electrically connected
to the first redistribution layer through the conductive vias; and
(f) attaching a semiconductor chip adjacent to the first surface of
the substrate, the semiconductor chip electrically connected to the
first redistribution layer.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1 illustrates a cross-sectional view of a semiconductor
device according to an embodiment of the present disclosure.
[0010] FIG. 2 illustrates a cross-sectional view of a semiconductor
device according to an embodiment of the present disclosure.
[0011] FIG. 3 illustrates a cross-sectional view of a semiconductor
device according to an embodiment of the present disclosure.
[0012] FIG. 4 illustrates a cross-sectional view of a semiconductor
device according to an embodiment of the present disclosure.
[0013] FIG. 5 illustrates a cross-sectional view of a semiconductor
device according to an embodiment of the present disclosure.
[0014] FIG. 6, FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, FIG. 12,
FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17 and FIG. 18 illustrate
a method for manufacturing a semiconductor device according to an
embodiment of the present disclosure.
[0015] FIG. 19, FIG. 20, FIG. 21, FIG. 22, FIG. 23, FIG. 24, FIG.
25, FIG. 26 and FIG. 27 illustrate a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure.
[0016] FIG. 28 illustrates a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure.
[0017] FIG. 29 and FIG. 30 illustrate a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure.
DETAILED DESCRIPTION
[0018] An inductor integrated into a semiconductor device is
typically a spiral structure (a coil) disposed on a surface of an
insulation layer. That is, the spiral structure is two-dimensional,
and can occupy a large space of the layout. Further, in a package
structure of the semiconductor device, a redistribution layer (RDL)
including the integrated spiral structure of the inductor is
disposed on one side of an interposer or a substrate, with
conductive through vias providing electrical connection from one
side of the interposer or the substrate to the opposite side of the
interposer or the substrate. In other words, one end of a
conductive through via connects to the RDL, and the other end of
the conductive through via connects to a pad (e.g., a bump pad or
ball pad) on which an external connective component (e.g., a
respective bump or solder ball) is disposed for external
connection.
[0019] To address the above concerns, the present disclosure
provides an improved semiconductor device having an integrated
three-dimensional inductor, and improved techniques for
manufacturing the semiconductor device. The three-dimensional
inductor includes conductive through vias that connect an RDL on
one side of the interposer or the substrate with another RDL on an
opposite side of the interposer or the substrate. Because most of
the path of the three-dimensional inductor is contributed by the
conductive through vias that are disposed in the interposer or the
substrate, the three-dimensional inductor will have smaller
dimensions in a plane along an upper surface of the semiconductor
device relative to a two-dimensional implementation on a surface of
an insulator of the semiconductor device. Thus, dimensions of the
semiconductor device may be reduced.
[0020] FIG. 1 illustrates a cross-sectional view of a semiconductor
device 1 according to an embodiment of the present disclosure. The
semiconductor device 1 includes a substrate 10, at least one
integrated passive device (e.g., a capacitor 2 and/or an inductor
3), a first insulation layer 12, a second insulation layer 13, a
first RDL 14, a second RDL 16 and conductive vias 18, 19.
[0021] The substrate 10 has a first surface 101 and a second
surface 102 opposite to the first surface 101, and defines through
holes 103. In one or more embodiments, the substrate 10 is an
interposer made of glass, silicon or silica. That is, the substrate
10 in such embodiments may be cut from a glass wafer, a silicon
wafer or a silica wafer.
[0022] Each of the conductive vias 18, 19 is disposed in respective
ones of the through holes 103, extends through the substrate 10,
and electrically connects the first RDL 14 and the second RDL 16.
In one or more embodiments, the conductive vias 18, 19 each include
a first seed layer 17 on the side wall of the through hole 103, and
a first metal layer 20 on the first seed layer 17. In some
embodiments, the first seed layer 17 is omitted. In one or more
embodiments, a material of the first seed layer 17 is an alloy of
titanium (Ti) and copper (Cu), such as TiCu, and a material of the
first metal layer 20 is Cu. Other suitable metals or metal alloys
can be used.
[0023] Each of the conductive vias 18 has a first end 181 adjacent
to the first surface 101 of the substrate 10 and a second end 182
adjacent to the second surface 102 of the substrate 10. Each of the
conductive vias 19 has a first end 191 adjacent to the first
surface 101 of the substrate 10 and a second end 192 adjacent to
the second surface 102 of the substrate 10.
[0024] The capacitor 2 is disposed adjacent to the first surface
101 of the substrate 10. In the embodiment illustrated in FIG. 1,
there are two capacitors 2 disposed on the first surface 101 of the
substrate 10. Each of the capacitors 2 includes a lower electrode
21, a dielectric layer 22 and an upper electrode 23. The lower
electrode 21 is disposed on the first surface 101 of the substrate
10. The dielectric layer 22 is disposed on the lower electrode 21.
The upper electrode 23 is disposed on the dielectric layer 22. That
is, the dielectric layer 22 is disposed between the lower electrode
21 and the upper electrode 23. In one or more embodiments, the
lower electrode 21 and the upper electrode 23 include an alloy of
aluminum (Al) and Cu, such as AlCu, and the dielectric layer 22
includes a tantalum (Ta) alloy or compound, such as tantalum
pentoxide (Ta.sub.2O.sub.5), or Ta with Ta.sub.2O.sub.5. A
dimension (e.g., width, length, or surface area) of the upper
electrode 23 is substantially the same as a corresponding dimension
(e.g., width, length, or surface area) of the dielectric layer 22.
In one or more embodiments, and as shown in FIG. 1, a dimension
(e.g., width, length, or surface area) of the lower electrode 21 is
greater than the corresponding dimensions of the upper electrode 23
and the dielectric layer 22. In other embodiments, a dimension of
the lower electrode 21 is substantially the same as corresponding
dimensions of the upper electrode 23 and the dielectric layer 22.
In the illustration of FIG. 1, a structure and corresponding
dimensions of the two capacitors 2 are substantially the same;
however, in other embodiments, the structure and corresponding
dimensions of the two capacitors 2 may be different.
[0025] The semiconductor device 1 further includes contact pads
151. The contact pads 151 are disposed on the first surface 101 of
the substrate 10 and on the first ends of each of the conductive
vias 18, 19. The contact pads 151 and the lower electrode 21 are
portions of a same patterned circuit layer 15, that is, they are
formed at the same time. In one or more embodiments, the contact
pads 151 are omitted. In one or more embodiments in which a
material of the substrate 10 is a semiconductor material, a barrier
layer (not shown) is disposed between the patterned circuit layer
15 and the substrate 10.
[0026] The first insulation layer 12 covers the capacitors 2 and
the first surface 101 of the substrate 10, and defines first
openings 121 and second openings 122. The first openings 121 expose
a portion of the upper electrode 23 of the capacitor 2. The second
openings 122 correspond to the conductive vias 18, 19 and expose
the contact pads 151. In one or more embodiments, the first
insulation layer 12 includes a polymer such as benzocyclobutene
(BCB), polyimide (PI), polypropylene (PP) or epoxy. However, in
other embodiments, a material of the first insulation layer 12 may
be, for example, silicon oxide or silicon nitride.
[0027] The first RDL 14 is disposed on the first insulation layer
12, and includes first conductive interconnectors 141, second
conductive interconnectors 142 and first segments 143. That is, the
first conductive interconnectors 141, the second conductive
interconnectors 142 and the first segments 143 are portions of the
first RDL 14. The first conductive interconnector 141 is disposed
in the first opening 121 of the first insulation layer 12 to
electrically connect to the upper electrode 23 of the capacitor 2.
The second conductive interconnector 142 is disposed in the second
opening 122 of the first insulation layer 12 to electrically
connect to the conductive vias 18, 19 through the contact pads
151.
[0028] The first segments 143 are disposed on the first conductive
interconnectors 141 and the second conductive interconnectors 142
to electrically connect ones of the first conductive
interconnectors 141 or ones of the second conductive
interconnectors 142. An optional second seed layer 24 is disposed
between the first RDL 14 and the first insulation layer 12. The
second seed layer 24 may be omitted. In the embodiment illustrated
in FIG. 1, the second seed layer 24 is disposed between the second
conductive interconnector 142 and the contact pads 151, and between
the first segments 143 and the first insulation layer 12. A
material of the second seed layer 24 may be TiCu. The conductive
interconnectors 141, 142 and the first segments 143 may be Cu or
other suitable metal or metal alloy, and conductive interconnectors
141, 142 and the first segments 143 may be formed concurrently.
[0029] As shown in FIG. 1, within the inductor 3, one first segment
143 electrically connects two first ends 181 of corresponding
conductive vias 18 through the second conductive interconnectors
142 and the contact pads 151. Therefore, the conductive vias 18 are
electrically connected in series.
[0030] The second RDL 16 is disposed adjacent to the second surface
102 of the substrate 10, and includes second segments 161 and
connection pads 162. In one or more embodiments in which a material
of the substrate 10 is semiconductor material, a barrier layer (not
shown) is disposed between the second RDL 16 and the substrate 10.
In the embodiment illustrated in FIG. 1, a third seed layer 25 is
disposed between the second RDL 16 (including the second segments
161 and the connection pads 162) and the substrate 10. The third
seed layer 25 may be omitted. In one or more embodiments, a
material of the third seed layer 25 is TiCu; and a material of the
second RDL 16 (including the second segments 161 and the connection
pads 162) is Cu or other metal or metal alloy.
[0031] The second segments 161 are disposed adjacent to the second
surface 102 of the substrate 10 to electrically connect two second
ends 182 of corresponding conductive vias 18. Therefore, by the
first segments 143, the second conductive interconnectors 142, and
the contact pads 151, the conductive vias 18 are electrically
connected in series to form the inductor 3. That is, the inductor 3
includes the second segments 161, the conductive vias 18, the first
segments 143, the second conductive interconnectors 142 and the
contact pads 151. The second segments 161 and the first segments
143 are misaligned (to electrically connect different pairs of
conductive vias 18), so that the inductor 3 is in a serpentine
pattern along a plane that is substantially perpendicular to the
first surface 101 and the second surface 102 of the substrate 10
(e.g., a plane parallel to the page on which FIG. 1 is
illustrated). That is, the inductor 3 is a three-dimensional
inductor.
[0032] The second insulation layer 13 covers the second RDL 16 and
the second surface 102 of the substrate 10, and defines openings
131 to expose the connection pads 162. In one or more embodiments,
the second insulation layer 13 includes a polymer such as BCB, PI,
PP or epoxy. In other embodiments, a material of the second
insulation layer 13 may be, for example, silicon oxide or silicon
nitride.
[0033] As shown in FIG. 1, the semiconductor device 1 further
includes a protection layer 26, first under-bump metallurgies
(UBMs) 28, a semiconductor chip 4, an encapsulant 5 and external
connection elements 32. The protection layer 26 covers the first
segments 143 and the first insulation layer 12, and defines
openings 261 to expose portions (e.g., connection pads) of the
first segments 143. In one or more embodiments, the protection
layer 26 includes a polymer such as BCB, PI, PP, epoxy or solder
mask. The first UBMs 28 are disposed in the openings 261 to
electrically connect to the exposed portions (e.g., connection
pads) of the first segments 143. In the embodiment illustrated in
FIG. 1, the first UBM 28 includes a third RDL 281, and a fourth
seed layer 282 disposed between the third RDL 281 and the
protection layer 26. The fourth seed layer 282 may be omitted. In
one or more embodiments, the fourth seed layer 282 is TiCu and a
material of the third RDL 281 is Cu.
[0034] The semiconductor chip 4 is disposed adjacent to and
electrically connected to the first RDL 14. In the embodiment
illustrated in FIG. 1, the semiconductor chip 4 includes connection
elements 42 (e.g., bumps or solder balls) adjacent to an active
surface 41 thereof. The connection elements 42 connect to the first
UBMs 28. That is, the semiconductor chip 4 is electrically
connected to the first RDL 14 by flip-chip bonding. The encapsulant
5 covers the semiconductor chip 4 and the protection layer 26.
[0035] The external connection elements 32 (e.g., bumps or solder
balls) are disposed in the openings 131 of the second insulation
layer 13 to contact the connection pads 162 for external
connection.
[0036] In the embodiment illustrated in FIG. 1, the first RDL 14
and the second RDL 16 are disposed on opposite sides of the
substrate 10. In addition, portions of the first RDL 14 and the
second RDL 16 are electrically connected by the conductive vias 18
extending vertically through the substrate 10 (in the orientation
illustrated) to form the three-dimensional inductor 3. Therefore,
the three-dimensional inductor 3 will not occupy a large space on a
surface parallel to the first surface 101 of the substrate 10
(e.g., an upper surface of the first insulation layer 12).
[0037] FIG. 2 illustrates a cross-sectional view of a semiconductor
device 1 a according to an embodiment of the present disclosure.
The semiconductor device 1 a is similar to the semiconductor device
1 as shown in FIG. 1, with differences including different
structures of conductive vias 18a, 19a as compared to the
conductive vias 18, 19 of FIG. 1. The conductive vias 18a, 19a of
FIG. 2 include a conductor material (e.g., the first seed layer 17
and the first metal layer 20) and an inner insulation layer 34. As
shown in FIG. 2, the first seed layer 17 of the conductor material
is disposed on the side wall of the through hole 103, the first
metal layer 20 is disposed on the first seed layer 17 to define a
central groove, and the central groove is filled with the inner
insulation layer 34.
[0038] FIG. 3 illustrates a cross-sectional view of a semiconductor
device 1b according to an embodiment of the present disclosure. The
semiconductor device 1b is similar to the semiconductor device 1 as
shown in FIG. 1, with differences including a different structure
for an inductor 3a as compared to the inductor 3 in FIG. 1. As
shown in FIG. 3, the patterned circuit layer 15 further includes
third segments 152. Two first ends 181 of the corresponding
conductive vias 18 are electrically connected in series by a
corresponding third segment 152 rather than a first segment 143 as
illustrated in FIG. 1. Therefore, the inductor 3a will not occupy
any space on the upper surface of the first insulation layer
12.
[0039] FIG. 4 illustrates a cross-sectional view of a semiconductor
device 1c according to an embodiment of the present disclosure. The
semiconductor device 1c is similar to the semiconductor device 1 as
shown in FIG. 1, with differences including a different structure
for an inductor 3b as compared to the inductor 3 in FIG. 1. As
shown in FIG. 4, the semiconductor device 1c further includes a
fourth RDL 36 disposed on the second insulation layer 13, and the
second insulation layer 13 further defines openings 132. Further,
the second segments 161 of the second RDL 16 in the inductor 3b do
not electrically connect two second ends 182 of corresponding
conductive vias 18.
[0040] The fourth RDL 36 includes third conductive interconnectors
361 and fourth segments 362. That is, the third conductive
interconnectors 361 and the fourth segments 362 are portions of the
fourth RDL 36. The third conductive interconnector 361 is disposed
in the second opening 132 of the second insulation layer 13 to
electrically connect two second ends 182 of corresponding
conductive vias 18 through the second segments 161 of the second
RDL 16. The fourth segments 362 are disposed adjacent to the second
insulation layer 13 and on the third conductive interconnectors 361
to electrically connect to the third conductive interconnectors
361. In one or more embodiments, a fifth seed layer 38 is disposed
between the third conductive interconnector 361 and the second
insulation layer 13. The fifth seed layer 38 may be omitted. In the
embodiment illustrated in FIG. 4, the fifth seed layer 38 is
disposed between the fourth segments 362 and the second insulation
layer 13. In one or more embodiments, a material of the fifth seed
layer 38 is TiCu. In one or more embodiments, a material of the
third conductive interconnectors 361 and the fourth segments 362 is
Cu, and the third conductive interconnectors 361 and the fourth
segments 362 are formed concurrently.
[0041] By the first segments 143, the second conductive
interconnectors 142, the contact pads 151, the second segments 161
of the second RDL 16, the third conductive interconnectors 361 and
the fourth segments 362, the conductive vias 18 are electrically
connected in series to form the inductor 3b. That is, the inductor
3b includes the third conductive interconnectors 361, the fourth
segments 362, the conductive vias 18, the first segments 143, the
second conductive interconnectors 142 and the contact pads 151. The
fourth segments 362 and the first segments 143 are misaligned (to
electrically connect different pairs of conductive vias 18), so
that the inductor 3b is in a serpentine pattern along a plane that
is substantially perpendicular to the first surface 101 and the
second surface 102 of the substrate 10 (e.g., a plane parallel to
the page on which FIG. 4 is illustrated). That is, the inductor 3b
is a three-dimensional inductor with increased path length as
compared to the inductor 3 of FIG. 1.
[0042] FIG. 5 illustrates a cross-sectional view of a semiconductor
device 1d according to an embodiment of the present disclosure. The
semiconductor device 1d is similar to the semiconductor device 1 as
shown in FIG. 1, with differences including that the semiconductor
device 1d further includes second UBMs 30. The second UBMs 30 are
disposed in the openings 131 of the second insulation layer 13 to
contact the connection pads 162. The external connection elements
32 (e.g., bumps or solder balls) are disposed on the second UBMs 30
for external connection.
[0043] FIGS. 6 to 18 illustrate a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure. Referring to FIG. 6, a substrate 10 is provided. The
substrate 10 has a first surface 101 and a second surface 102
opposite to the first surface 101. In one or more embodiments, the
substrate 10 may be an interposer made of glass, silicon or silica.
That is, for example, the substrate 10 may be a glass wafer, a
silicon wafer or a silica wafer. In the embodiment illustrated in
FIG. 6, the substrate 10 is made of glass, and a thickness of the
substrate 10 is about 700 micrometers (.mu.m). Blind holes 104 are
formed in the substrate 10 from the first surface 101. In one or
more embodiments, a diameter of a blind hole 104 is about 60 .mu.m,
and a depth of the blind hole 104 is about 280 .mu.m.
[0044] Referring to FIG. 7, a first seed layer 17 is formed on a
side wall of the blind hole 104 and on the first surface 101 of the
substrate 10, such as by sputtering (e.g., by physical vapor
deposition (PVD)). Then, a first metal layer 20 is formed on the
first seed layer 17, such as by plating, to fill the blind hole
104. In one or more embodiments, a material of the first seed layer
17 is TiCu (e.g., a layer of Ti with a thickness of about 0.75
.mu.m and a layer of Cu with a thickness of about 2.5 .mu.m), and a
material of the first metal layer 20 is Cu. A removal technique,
such as chemical mechanical polishing (CMP), is performed to remove
the Cu outside the blind hole 104, and a removal technique, such as
wet etching, is performed to remove the Ti outside the blind hole
104. In this manner, conductive vias 18, 19 are formed in
respective ones of the blind holes 104. Each of the conductive vias
18 has a first end 181 adjacent to the first surface 101 of the
substrate 10 and a second end 182 adjacent to the second surface
102 of the substrate 10. Each of the conductive vias 19 has a first
end 191 adjacent to the first surface 101 of the substrate 10 and a
second end 192 adjacent to the second surface 102 of the substrate
10.
[0045] Referring to FIG. 8, a first metal layer (which will become
a patterned conductive layer 15 including lower electrodes 21 and
contact pads 151) is formed on the first surface 101 of the
substrate 10 and on the conductive vias 18, 19, such as by
sputtering. In one or more embodiments, a material of the first
metal layer is AlCu, and a thickness of the first metal layer is
about 1 .mu.m. Next, a second metal layer (which will become
dielectric layers 22 after oxidation) is formed on the first metal
layer, such as by sputtering. In one or more embodiments, a
material of the second metal layer is Ta, and a thickness of the
second metal layer is about 0.3 .mu.m. Thereafter, the second metal
layer is treated (e.g., oxidized and/or thickened) so that the
second metal layer becomes an insulation or dielectric layer (e.g.,
Ta.sub.2O.sub.5) having a thickness of about 0.407 .mu.m.
Thereafter, a third metal layer (which will become upper electrodes
23) is formed on the second metal layer, such as by sputtering. In
one or more embodiments, a material of the third metal layer is
AlCu, and a thickness of the third metal layer is about 1
.mu.m.
[0046] A first photoresist layer (not shown, and subsequently
removed) is formed on the third metal layer in a pattern. Then, the
third metal layer and the second metal layer are selectively
removed according to the pattern of the first photoresist layer,
such as by dry etching. Then, the first photoresist layer is
removed to form the dielectric layers 22 (corresponding to the
second metal layer) and the upper electrodes 23 (corresponding to
the third metal layer).
[0047] Next, a second photoresist layer (not shown, and
subsequently removed) is formed on the first metal layer and the
upper electrode 23 in a pattern. Then, the first metal layer is
selectively removed according to the pattern of the second
photoresist layer, such as by dry etching. Then, the second
photoresist layer is removed so as to form the patterned circuit
layer 15 (corresponding to the first metal layer) including the
lower electrodes 21 and the contact pads 151.
[0048] Two capacitors 2 are formed adjacent to the first surface
101 of the substrate 10 by the techniques described with respect to
FIG. 8. Each of the capacitors 2 includes a respective lower
electrode 21, dielectric layer 22 and upper electrode 23. The lower
electrode 21 is disposed on the first surface 101 of the substrate
10. The dielectric layer 22 is disposed on the lower electrode 21.
The upper electrode 23 is disposed on the dielectric layer 22. That
is, the dielectric layer 22 is disposed between the lower electrode
21 and the upper electrode 23. A dimension (e.g., width, length or
area) of the upper electrode 23 is substantially the same as a
corresponding dimension (e.g., width, length or area) of the
dielectric layer 22. In one or more embodiments, a dimension (e.g.,
width, length or area) of the lower electrode 21 is greater than
the corresponding dimensions of the upper electrode 23 and the
dielectric layer 22. In other embodiments, the dimension of the
lower electrode 21 is substantially the same as the corresponding
dimensions of the upper electrode 23 and the dielectric layer 22.
As shown in FIG. 8, dimensions and structure of the two capacitors
2 are substantially the same; however, in other embodiments, the
dimensions or structure of the two capacitors 2 may be
different.
[0049] The contact pads 151 are disposed on the first surface 101
of the substrate 10 and on the first ends of each of the conductive
vias 18, 19. In one or more embodiments in which a material of the
substrate 10 is a semiconductor material, a barrier layer (not
shown) is disposed between the patterned circuit layer 15 and the
substrate 10.
[0050] Referring to FIG. 9, a first insulation layer 12 is disposed
to cover the capacitors 2 and the first surface 101 of the
substrate 10. The first insulation layer 12 defines first openings
121 and second openings 122. The first openings expose portions of
the upper electrodes 23 of the capacitors 2. The second openings
122 correspond to the conductive vias 18, 19 and expose portions of
the contact pads 151. In one or more embodiments, the first
insulation layer 12 includes a polymer such as BCB, PI, PP or
epoxy. In other embodiments, a material of the first insulation
layer 12 may be, for example, silicon oxide or silicon nitride. In
one or more embodiments, a thickness of the first insulation layer
12 is about 3.7 .mu.m.
[0051] Referring to FIG. 10, an optional second seed layer 24 is
disposed over the first insulation layer 12. In one or more
embodiments, a material of the second seed layer 24 is TiCu (e.g.,
a layer of Ti with a thickness of about 0.1 .mu.m and a layer of Cu
with a thickness of about 0.2 .mu.m). A first RDL 14 is formed on
the first insulation layer 12 or on the second seed layer 24. The
first RDL 14 includes first conductive interconnectors 141, second
conductive interconnectors 142 and first segments 143. The first
conductive interconnector 141 is disposed in the first opening 121
of the first insulation layer 12 to electrically connect to the
upper electrode 23 of the capacitor 2. The second conductive
interconnector 142 is disposed in the second opening 122 of the
first insulation layer 12 to electrically connect to a respective
one of the conductive vias 18, 19 through a respective contact pad
151. The first segments 143 are disposed adjacent to the first
insulation layer 12 and on the first conductive interconnectors 141
and the second conductive interconnectors 142 to electrically
connect ones of the first conductive interconnectors 141 or ones of
the second conductive interconnectors 142. In one or more
embodiments, a material of the first conductive interconnectors
141, the second conductive interconnectors 142 and the first
segments 143 is Cu, and a thickness of the first segment 143 is
about 10 .mu.m.
[0052] It is to be understood that a third photoresist layer may be
used in the formation of the first RDL 14.
[0053] Referring to FIG. 11, a protection layer 26 is formed to
cover the first segments 143 and the first insulation layer 12. In
one or more embodiments, the protection layer 26 includes a polymer
such as BCB, PI, PP, epoxy or a solder mask, and a thickness of the
protection layer 26 is about 9.5 .mu.m. The protection layer 26
defines openings 261 to expose portions (e.g., connection pads) of
the first segments 143.
[0054] Referring to FIG. 12, first UBMs 28 are formed in the
openings 261 of the protection layer 26 to electrically connect to
the exposed portions (e.g., connection pads) of the first segments
143. The first UBM 28 includes a third RDL 281 and an optional
fourth seed layer 282. The fourth seed layer 282 is formed between
the third RDL 281 and the protection layer 26. In one or more
embodiments, a material of the third RDL 281 is Cu, and a thickness
of the third RDL 281 is about 10.6 .mu.m. In one or more
embodiments, a material of the fourth seed layer 282 is TiCu (e.g.,
a layer of Ti with a thickness of about 0.1 .mu.m and a layer of Cu
with a thickness of about 0.2 .mu.m). It is to be understood that a
fourth photoresist layer may be used in the formation of the first
UBMs 28.
[0055] Referring to FIG. 13, a semiconductor chip 4 is disposed
adjacent to, and is electrically connected to, the first RDL 14. As
shown in FIG. 13, the semiconductor chip 4 includes connection
elements 42 (e.g., bumps or solder balls) adjacent to an active
surface 41 thereof. The connection elements 42 connect to the first
UBMs 28. That is, the semiconductor chip 4 is electrically
connected to the first RDL 14 by flip-chip bonding.
[0056] Referring to FIG. 14, an encapsulant 5 is applied to cover
the semiconductor chip 4 and the protection layer 26. In one or
more embodiments, a material of the encapsulant 5 is a molding
compound, and a thickness of the encapsulant 5 is about 450
.mu.m.
[0057] Referring to FIG. 15, the substrate 10 is thinned from the
second surface 102 thereof, such as by grinding, to expose the
conductive vias 18, 19. In one or more embodiments, a bottom
portion of the substrate 10 with a thickness of about 450 .mu.m is
removed. Meanwhile, the blind holes 104 become through holes
103.
[0058] Referring to FIG. 16, a third seed layer 25 is optionally
formed on the second surface 102 of the substrate 10. In one or
more embodiments, a material of the third seed layer 25 is TiCu
(e.g., a layer of Ti with a thickness of about 0.1 .mu.m and a
layer of Cu with a thickness of about 0.2 .mu.m). A fifth
photoresist layer (not shown in FIG. 16, and subsequently removed)
is formed on the third seed layer 25 (or on the second surface 102
of the substrate 10), where the fifth photoresist layer is formed
in a pattern. Then, a second RDL 16 (including second segments 161
and connection pads 162) is formed on the third seed layer 25 (or
on the second surface 102 of the substrate 10) according to the
pattern of the fifth photoresist layer. In one or more embodiments,
a material of the second RDL 16 (including the second segments 161
and the connection pads 162) is Cu, and a thickness of the second
RDL 16 is about 10 .mu.m. Then, the fifth photoresist layer is
removed, and portions of the third seed layer 25 not covered by the
second RDL 16 are removed, such as by wet etching. In one or more
embodiments in which a material of the substrate 10 is
semiconductor material, a barrier layer (not shown) is disposed
between the second RDL 16 and the substrate 10. By the techniques
illustrated and described, one second segment 161 electrically
connects two second ends 182 of corresponding conductive vias 18.
Therefore, by the first segments 143, the second conductive
interconnectors 142 and the contact pads 151, the conductive vias
18 are electrically connected in series so as to from an inductor
3.
[0059] Referring to FIG. 17, a second insulation layer 13 is formed
to cover the second RDL 16 and the second surface 102 of the
substrate 10. The second insulation layer 13 defines openings 131
to expose the connection pads 162. In one or more embodiments, the
second insulation layer 13 includes a polymer such as BCB, PI, PP
or epoxy. In other embodiments, a material of the second insulation
layer 13 may be, for example, silicon oxide or silicon nitride. In
one or more embodiments, a thickness of the second insulation layer
13 may be about 9.5 .mu.m.
[0060] Referring to FIG. 18, external connection elements 32 (e.g.,
bumps or solder balls) are formed in the openings 131 of the second
insulation layer 13 to contact the connection pads 162 for external
connection. Then, singulation is performed to obtain the
semiconductor device 1 as shown in FIG. 1.
[0061] FIGS. 19 to 27 illustrate a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure. The initial stages of this embodiment are the same as
shown in FIGS. 6 to 12, and the stage of FIG. 19 is subsequent to
the stage of FIG. 12. As shown in FIG. 19, a first carrier 44 is
attached adjacent to the first RDL 14. In one or more embodiments,
the first carrier 44 is attached to the protection layer 26 by an
adhesion layer 46. The first carrier 44 may be, for example, a
glass wafer, a silicon wafer or a silica wafer.
[0062] Referring to FIG. 20, the substrate 10 is thinned from the
second surface 102 thereof, such as by backside grinding, to expose
the conductive vias 18, 19. For example, a bottom portion of the
substrate 10 with a thickness of about 450 .mu.m is removed.
[0063] Referring to FIG. 21, a second RDL 16 is formed on the
second surface 102 of the substrate 10 to electrically connect to
the first RDL 14 through the conductive vias 18, 19. The formation
of the second RDL 16 is similar to the stage of FIG. 16 described
above.
[0064] Referring to FIG. 22, a second insulation layer 13 is formed
to cover the second RDL 16 and the second surface 102 of the
substrate 10. The second insulation layer 13 defines openings 131
to expose the connection pads 162.
[0065] Referring to FIG. 23, second UBMs 30 are formed in the
openings 131 of the second insulation layer 13 to contact the
connection pads 162. Then, external connection elements 32 (e.g.,
bumps or solder balls) are formed on the second UBMs 30 for
external connection.
[0066] Referring to FIG. 24, a second carrier 48 is attached
adjacent to the second insulation layer 13. In one or more
embodiments, the second carrier 48 is attached to the second
insulation layer 13 by an adhesion layer 50. The second carrier 48
may be, for example, a glass wafer, a silicon wafer or a silica
wafer.
[0067] Referring to FIG. 25, the first carrier 44 and the adhesion
layer 46 are detached from the protection layer 26.
[0068] Referring to FIG. 26, a semiconductor chip 4 is disposed
adjacent to, and is electrically connected to, the first RDL 14. As
shown in FIG. 26, the semiconductor chip 4 includes connection
elements 42 (e.g., bumps or solder balls) adjacent to the active
surface 41 thereof. The connection elements 42 connect to the first
UBMs 28. That is, the semiconductor chip 4 is electrically
connected to the first RDL 14 by flip-chip bonding. Then, an
encapsulant 5 is applied to cover the semiconductor chip 4 and the
protection layer 26.
[0069] Referring to FIG. 27, the second carrier 48 and the adhesion
layer 50 are detached from the second insulation layer 13. Then,
singulation is performed to obtain the semiconductor device 1d as
shown in FIG. 5.
[0070] FIG. 28 illustrates a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure. The initial stages of this embodiment are the same as
shown in FIGS. 6 to 7, and the stage of FIG. 28 is subsequent to
the stage of FIG. 7. As shown in FIG. 28, after the first metal
layer is patterned to become the patterned circuit layer 15, the
patterned circuit layer 15 includes the lower electrodes 21 and the
contact pads 151 and also the third segments 152. Two first ends
181 of corresponding conductive vias 18 are electrically connected
in series by the third segment 152. The following stages of this
embodiment are the same as shown in FIGS. 9 to 18, to obtain the
semiconductor device 1b as shown in FIG. 3.
[0071] FIGS. 29 to 30 illustrate a method for manufacturing a
semiconductor device according to an embodiment of the present
disclosure. The initial stages of this embodiment are the same as
shown in FIGS. 6 to 15, and the stage of FIG. 29 is subsequent to
the stage of FIG. 15. As shown in FIG. 29, an optional third seed
layer 25 is formed on the second surface 102 of the substrate 10,
and a second RDL 16 (including second segments 161 and connection
pads 162) is formed on the third seed layer 25 or on the second
surface 102 of the substrate 10. The second segments 161 are pads
that do not electrically connect to each other, and one second
segment 161 does not electrically connect two second ends 182 of
the corresponding conductive vias 18.
[0072] Referring to FIG. 30, a second insulation layer 13 is formed
to cover the second RDL 16 and the second surface 102 of the
substrate 10. The second insulation layer 13 defines openings 131
to expose the connection pads 162, and second openings 132 to
expose ones of the second segments 161. A fourth RDL 36 may be
formed on the second insulation layer 13 (not shown), and the
following stage of this embodiment is the same as shown in FIG. 18,
to obtain the semiconductor device 1c as shown in FIG. 4.
[0073] Spatial descriptions, such as "above," "below," "up,"
"left," "right," "down," "top," "bottom," "vertical," "horizontal,"
"side," "higher," "lower," "upper," "over," "under," and so forth,
are indicated with respect to the orientation shown in the figures
unless otherwise specified. It should be understood that the
spatial descriptions used herein are for purposes of illustration
only, and that practical implementations of the structures
described herein can be spatially arranged in any orientation or
manner, provided that the merits of embodiments of this disclosure
are not deviated by such arrangement.
[0074] As used herein, the terms "approximately," "substantially,"
"substantial" and "about" are used to describe and account for
small variations. When used in conjunction with an event or
circumstance, the terms can refer to instances in which the event
or circumstance occurs precisely as well as instances in which the
event or circumstance occurs to a close approximation. For example,
when used in conjunction with a numerical value, the terms can
refer to a range of variation less than or equal to .+-.10% of that
numerical value, such as less than or equal to .+-.5%, less than or
equal to .+-.4%, less than or equal to .+-.3%, less than or equal
to .+-.2%, less than or equal to .+-.1%, less than or equal to
.+-.0.5%, less than or equal to .+-.0.1%, or less than or equal to
.+-.0.05%. For example, two numerical values can be deemed to be
"substantially" the same if a difference between the values is less
than or equal to .+-.10% of an average of the values, such as less
than or equal to .+-.5%, less than or equal to .+-.4%, less than or
equal to .+-.3%, less than or equal to .+-.2%, less than or equal
to .+-.1%, less than or equal to .+-.0.5%, less than or equal to
.+-.0.1%, or less than or equal to .+-.0.05%.
[0075] Additionally, amounts, ratios, and other numerical values
are sometimes presented herein in a range format. It is to be
understood that such range format is used for convenience and
brevity and should be understood flexibly to include numerical
values explicitly specified as limits of a range, but also to
include all individual numerical values or sub-ranges encompassed
within that range as if each numerical value and sub-range is
explicitly specified.
[0076] While the present disclosure has been described and
illustrated with reference to specific embodiments thereof, these
descriptions and illustrations do not limit the present disclosure.
It should be understood by those skilled in the art that various
changes may be made and equivalents may be substituted without
departing from the true spirit and scope of the present disclosure
as defined by the appended claims. The illustrations may not be
necessarily drawn to scale. There may be distinctions between the
artistic renditions in the present disclosure and the actual
apparatus due to manufacturing processes and tolerances. There may
be other embodiments of the present disclosure which are not
specifically illustrated. The specification and drawings are to be
regarded as illustrative rather than restrictive. Modifications may
be made to adapt a particular situation, material, composition of
matter, method, or process to the objective, spirit and scope of
the present disclosure. All such modifications are intended to be
within the scope of the claims appended hereto. While the methods
disclosed herein have been described with reference to particular
operations performed in a particular order, it will be understood
that these operations may be combined, sub-divided, or re-ordered
to form an equivalent method without departing from the teachings
of the present disclosure. Accordingly, unless specifically
indicated herein, the order and grouping of the operations are not
limitations of the present disclosure.
* * * * *