loadpatents
name:-0.031516075134277
name:-0.014553070068359
name:-0.045063018798828
CHANG; Yung-Shun Patent Filings

CHANG; Yung-Shun

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHANG; Yung-Shun.The latest application filed is for "assembly structure and method for manufacturing the same".

Company Profile
12.10.16
  • CHANG; Yung-Shun - Kaohsiung TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Assembly Structure And Method For Manufacturing The Same
App 20220310500 - CHANG; Yung-Shun ;   et al.
2022-09-29
Semiconductor device package and method for packaging the same
Grant 11,373,967 - Chang , et al. June 28, 2
2022-06-28
Package structure and method for manufacturing the same
Grant 11,276,620 - Chang , et al. March 15, 2
2022-03-15
Semiconductor Package Structure And Method For Manufacturing The Same
App 20210210423 - CHANG; Yung-Shun ;   et al.
2021-07-08
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210210420 - CHANG; Yung-Shun ;   et al.
2021-07-08
Package Structure And Method For Manufacturing The Same
App 20210202336 - CHANG; Yung-Shun ;   et al.
2021-07-01
Semiconductor Device Package And Method For Packaging The Same
App 20210151398 - CHANG; Yung-Shun ;   et al.
2021-05-20
Semiconductor device package and method of manufacturing the same
Grant 10,950,531 - Chang , et al. March 16, 2
2021-03-16
Integrated passive component and method for manufacturing the same
Grant 10,861,840 - Chang , et al. December 8, 2
2020-12-08
Semiconductor Device Package And Method For Manufacturing The Same
App 20200381345 - CHANG; Yung-Shun ;   et al.
2020-12-03
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200381348 - CHANG; Yung-Shun ;   et al.
2020-12-03
Semiconductor device packages
Grant 10,838,144 - Chin , et al. November 17, 2
2020-11-17
Semiconductor Package Device And Method Of Manufacturing The Same
App 20200350282 - CHANG; Yung-Shun ;   et al.
2020-11-05
Semiconductor package device and method of manufacturing the same
Grant 10,741,523 - Chang , et al. A
2020-08-11
Semiconductor Package Device And Method Of Manufacturing The Same
App 20200118970 - CHANG; Yung-Shun ;   et al.
2020-04-16
Semiconductor Device Packages
App 20190187371 - CHIN; Yi-Min ;   et al.
2019-06-20
Semiconductor device packages
Grant 10,241,264 - Chin , et al.
2019-03-26
Integrated Passive Component And Method For Manufacturing The Same
App 20190067261 - CHANG; Yung-Shun ;   et al.
2019-02-28
Semiconductor System And Device Package Including Interconnect Structure
App 20180138113 - CHEN; Chien-Hua ;   et al.
2018-05-17
Semiconductor device and process of making the same
Grant 9,929,132 - Lee , et al. March 27, 2
2018-03-27
Semiconductor Device Packages
App 20180003894 - CHIN; Yi-Min ;   et al.
2018-01-04
Semiconductor device and method for manufacturing the same
Grant 9,837,352 - Chang , et al. December 5, 2
2017-12-05
Semiconductor Device And Process Of Making The Same
App 20170133360 - LEE; Teck-Chong ;   et al.
2017-05-11
Semiconductor Device And Method For Manufacturing The Same
App 20170103946 - Chang; Yung-Shun ;   et al.
2017-04-13
Semiconductor device and process of making the same
Grant 9,577,027 - Lee , et al. February 21, 2
2017-02-21
Semiconductor Device And Process Of Making The Same
App 20150349048 - LEE; Teck-Chong ;   et al.
2015-12-03

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