| Patent | Date |
|---|
Assembly Structure And Method For Manufacturing The Same
App 20220310500 - CHANG; Yung-Shun ; et al. | 2022-09-29 |
Semiconductor device package and method for packaging the same
Grant 11,373,967 - Chang , et al. June 28, 2 | 2022-06-28 |
Package structure and method for manufacturing the same
Grant 11,276,620 - Chang , et al. March 15, 2 | 2022-03-15 |
Package Structure And Method For Manufacturing The Same
App 20220068839 - KE; Po-Hsien ; et al. | 2022-03-03 |
Optical Device And Method Of Manufacturing The Same
App 20220020885 - TSAI; Yu-Pin ; et al. | 2022-01-20 |
Optical device and method of manufacturing the same
Grant 11,133,423 - Tsai , et al. September 28, 2 | 2021-09-28 |
Semiconductor Device Packages And Methods Of Manufacturing The Same
App 20210288024 - CHEN; Tang-Yuan ; et al. | 2021-09-16 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210210420 - CHANG; Yung-Shun ; et al. | 2021-07-08 |
Semiconductor Package Structure And Method For Manufacturing The Same
App 20210210423 - CHANG; Yung-Shun ; et al. | 2021-07-08 |
Package Structure And Method For Manufacturing The Same
App 20210202336 - CHANG; Yung-Shun ; et al. | 2021-07-01 |
Semiconductor Device Package And Method For Packaging The Same
App 20210151398 - CHANG; Yung-Shun ; et al. | 2021-05-20 |
Semiconductor device packages and methods of manufacturing the same
Grant 11,011,496 - Chen , et al. May 18, 2 | 2021-05-18 |
Semiconductor device package and method of manufacturing the same
Grant 10,950,531 - Chang , et al. March 16, 2 | 2021-03-16 |
Semiconductor Device Packages And Methods Of Manufacturing The Same
App 20210074676 - CHEN; Tang-Yuan ; et al. | 2021-03-11 |
Semiconductor Device Packages Including An Inductor And A Capacitor
App 20210043719 - CHEN; Chien-Hua ; et al. | 2021-02-11 |
Semiconductor device package and method of manufacturing the same
Grant 10,903,561 - Chen , et al. January 26, 2 | 2021-01-26 |
Optical Device And Method Of Manufacturing The Same
App 20210005761 - TSAI; Yu-Pin ; et al. | 2021-01-07 |
Integrated passive component and method for manufacturing the same
Grant 10,861,840 - Chang , et al. December 8, 2 | 2020-12-08 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20200381345 - CHANG; Yung-Shun ; et al. | 2020-12-03 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200381348 - CHANG; Yung-Shun ; et al. | 2020-12-03 |
Semiconductor device packages including an inductor and a capacitor
Grant 10,833,144 - Chen , et al. November 10, 2 | 2020-11-10 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20200350282 - CHANG; Yung-Shun ; et al. | 2020-11-05 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200335858 - CHEN; Chien-Hua ; et al. | 2020-10-22 |
Semiconductor package device and method of manufacturing the same
Grant 10,741,523 - Chang , et al. A | 2020-08-11 |
Semiconductor Package Device And Method Of Manufacturing The Same
App 20200118970 - CHANG; Yung-Shun ; et al. | 2020-04-16 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200083591 - HSIEH; Sheng-Chi ; et al. | 2020-03-12 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200075571 - CHEN; Chien-Hua ; et al. | 2020-03-05 |
Capacitor Bank Structure, Semiconductor Package Structure And Method For Manufacturing The Same
App 20190393297 - KUNG; Cheng-Yuan ; et al. | 2019-12-26 |
Electrical device
Grant 10,490,341 - Kung , et al. Nov | 2019-11-26 |
Semiconductor device package comprising a dielectric layer with built-in inductor
Grant 10,475,718 - Chen , et al. Nov | 2019-11-12 |
Integrated Passive Component And Method For Manufacturing The Same
App 20190067261 - CHANG; Yung-Shun ; et al. | 2019-02-28 |
Electrical Device
App 20190057809 - KUNG; Cheng-Yuan ; et al. | 2019-02-21 |
Semiconductor Device Package
App 20180337164 - CHEN; Chien-Hua ; et al. | 2018-11-22 |
Semiconductor Device Packages
App 20180138262 - CHEN; Chien-Hua ; et al. | 2018-05-17 |
Semiconductor System And Device Package Including Interconnect Structure
App 20180138113 - CHEN; Chien-Hua ; et al. | 2018-05-17 |
Semiconductor device and process of making the same
Grant 9,929,132 - Lee , et al. March 27, 2 | 2018-03-27 |
Semiconductor device and method of manufacturing the same
Grant 9,881,917 - Shih , et al. January 30, 2 | 2018-01-30 |
Semiconductor device and method for manufacturing the same
Grant 9,837,352 - Chang , et al. December 5, 2 | 2017-12-05 |
Semiconductor Device And Process Of Making The Same
App 20170133360 - LEE; Teck-Chong ; et al. | 2017-05-11 |
Semiconductor Device And Method For Manufacturing The Same
App 20170103946 - Chang; Yung-Shun ; et al. | 2017-04-13 |
Semiconductor device and process of making the same
Grant 9,577,027 - Lee , et al. February 21, 2 | 2017-02-21 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20170047276 - CHEN; Chien-Hua ; et al. | 2017-02-16 |
Semiconductor Device And Method Of Manufacturing The Same
App 20170018550 - SHIH; Hsu-Chiang ; et al. | 2017-01-19 |
Semiconductor Device And Process Of Making The Same
App 20150349048 - LEE; Teck-Chong ; et al. | 2015-12-03 |
Semiconductor structure with passive element network and manufacturing method thereof
Grant 8,853,819 - Chen , et al. October 7, 2 | 2014-10-07 |
Semiconductor Device Having Integrated Passive Device And Process For Manufacturing The Same
App 20140252547 - Chen; Chien-Hua ; et al. | 2014-09-11 |
Semiconductor package having passive device and method for making the same
Grant 8,778,769 - Chen , et al. July 15, 2 | 2014-07-15 |
Structure Of Embedded-trace Substrate And Method Of Manufacturing The Same
App 20130122216 - TARNG; Shin-Luh ; et al. | 2013-05-16 |
Semiconductor Package Having Passive Device and Method for Making the Same
App 20130115749 - Chen; Chien-Hua ; et al. | 2013-05-09 |
Semiconductor Package And Method For Making The Same
App 20130102122 - Chen; Chien-Hua ; et al. | 2013-04-25 |
Semiconductor package having passive device and method for making the same
Grant 8,415,790 - Chen , et al. April 9, 2 | 2013-04-09 |
Semiconductor package and method for making the same
Grant 8,368,173 - Chen , et al. February 5, 2 | 2013-02-05 |
Semiconductor package and method for making the same
Grant 8,274,133 - Chen , et al. September 25, 2 | 2012-09-25 |
Semiconductor Structure With Passive Element Network And Manufacturing Method Thereof
App 20120175731 - Chen; Chien-Hua ; et al. | 2012-07-12 |
Thermally enhanced package structure
Grant 8,059,422 - Tong , et al. November 15, 2 | 2011-11-15 |
Semiconductor Package and Method for Making the Same
App 20110156246 - Chen; Chien-Hua ; et al. | 2011-06-30 |
Semiconductor Package and Method for Making the Same
App 20110156247 - Chen; Chien-Hua ; et al. | 2011-06-30 |
Semiconductor Package and Method for Making the Same
App 20110156204 - Chen; Chien-Hua ; et al. | 2011-06-30 |
Stackable Package Having Embedded Interposer and Method for Making the Same
App 20100289133 - Chao; Shin-Hua ; et al. | 2010-11-18 |
Structure Of Embedded-trace Substrate And Method Of Manufacturing The Same
App 20100239857 - Tarng; Shin-Luh ; et al. | 2010-09-23 |
Flip chip package process
Grant 7,614,888 - Tong , et al. November 10, 2 | 2009-11-10 |
Wire-bonding method for wire-bonding apparatus
Grant 7,581,666 - Tong , et al. September 1, 2 | 2009-09-01 |
Two-stage die-bonding method for simultaneous die-bonding of multiple dies
Grant 7,547,575 - Tong , et al. June 16, 2 | 2009-06-16 |
Flip Chip Package Process
App 20090087947 - Tong; Ho-Ming ; et al. | 2009-04-02 |
Manufacturing Process And Structure Of A Thermally Enhanced Package
App 20090075027 - Tong; Ho-Ming ; et al. | 2009-03-19 |
Packaging substrate and manufacturing method thereof
Grant 7,445,944 - Tong , et al. November 4, 2 | 2008-11-04 |
Packaging substrate and manufacturing method thereof
App 20080124836 - Tong; Ho-Ming ; et al. | 2008-05-29 |
Wire-bonding method for wire-bonding apparatus
App 20080102539 - Tong; Ho-Ming ; et al. | 2008-05-01 |
Die Bonder And Die Bonding Method Thereof
App 20080085571 - Tong; Ho-Ming ; et al. | 2008-04-10 |
Packaging substrate and method of manufacturing the same
App 20080044931 - Tong; Ho-Ming ; et al. | 2008-02-21 |
Wire-bonding apparatus and wire-bonding method thereof
App 20080035706 - Tong; Ho-Ming ; et al. | 2008-02-14 |
| 