Chen; Chien-Hua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Chien-Hua.The latest application filed is for "digital microfluidics device with droplet processing components".
Company Profile
147.200.200
- Chen; Chien-Hua - New Taipei TW
- Chen; Chien-Hua - Corvallis OR
- Chen; Chien-Hua - Lititz PA
- Chen; Chien-Hua - Taipei City TW
- Chen; Chien Hua - NEW TAIPEI CITY TW
- Chen; Chien-Hua - Kaohsiung TW
- Chen; Chien-Hua - Taipei TW
- Chen; Chien-Hua - Escondido CA
- Chen; Chien-Hua - Taoyuan N/A TW
- Chen; Chien-Hua - Hsinchu County TW
- Chen; Chien-Hua - Taoyuan City TW
- Chen; Chien-Hua - Taichung TW
- Chen; Chien-Hua - Hsinchu TW
- Chen; Chien-Hua - Covallis OR
- Chen; Chien-Hua - Tao-Yuan County TW
- Chen; Chien-Hua - Tao-Yuan TW
- Chen; Chien-Hua - Changhua County TW
- Chen; Chien Hua - Pingtun N/A TW
- Chen; Chien-Hua - Taiwan CN
- Chen; Chien-Hua - Pingtung N/A TW
- Chen; Chien-Hua - Hsin-Chu N/A TW
Patent Activity
| Patent | Date |
|---|---|
| Device and method of test tube preparation Grant 11,440,694 - Chen , et al. September 13, 2 | 2022-09-13 |
| Plurality of filters Grant 11,440,009 - Chen , et al. September 13, 2 | 2022-09-13 |
| Conductive elements electrically coupled to fluidic dies Grant 11,433,670 - Cumbie , et al. September 6, 2 | 2022-09-06 |
| Movable mold insert adjuster Grant 11,433,571 - Chen , et al. September 6, 2 | 2022-09-06 |
| Molding a fluid flow structure Grant 11,426,900 - Chen , et al. August 30, 2 | 2022-08-30 |
| Vortex Particle Separation App 20220250070 - Shkolnikov; Viktor ; et al. | 2022-08-11 |
| Digital Microfluidics Device With Droplet Processing Components App 20220250077 - Cumbie; Michael W. ; et al. | 2022-08-11 |
| Loop heat pipe evaporator Grant 11,408,684 - Richard , et al. August 9, 2 | 2022-08-09 |
| Load Balancing And Secure Tunneling For Cloud-based Network Controllers App 20220239632 - Kung; Yu-Cheng ; et al. | 2022-07-28 |
| Fluid ejection device with a carrier having a slot Grant 11,390,081 - Chen , et al. July 19, 2 | 2022-07-19 |
| Fluidic dies Grant 11,390,075 - Choy , et al. July 19, 2 | 2022-07-19 |
| Fluid feed path wettability coating Grant 11,390,076 - Chen , et al. July 19, 2 | 2022-07-19 |
| Fluid Circulation And Ejection App 20220203696 - Choy; Si-Iam ; et al. | 2022-06-30 |
| Embedded microfluidic devices Grant 11,364,497 - Chen , et al. June 21, 2 | 2022-06-21 |
| Coplanar fluidic interconnect Grant 11,364,496 - Chen , et al. June 21, 2 | 2022-06-21 |
| Planarization layers over silicon dies Grant 11,364,493 - Cumbie , et al. June 21, 2 | 2022-06-21 |
| Orifice Shield App 20220184957 - Chen; Chien-Hua ; et al. | 2022-06-16 |
| Fluid Ejection Face Selective Coating App 20220184949 - Chen; Chien-Hua ; et al. | 2022-06-16 |
| Carriers including fluid ejection dies Grant 11,358,390 - Cumbie , et al. June 14, 2 | 2022-06-14 |
| Fluid Property Sensor App 20220176707 - STUDER; Anthony D. ; et al. | 2022-06-09 |
| Fluid ejection dies Grant 11,331,915 - Chen , et al. May 17, 2 | 2022-05-17 |
| Fluid Ejection Head Service With Non-wetting Layer App 20220143980 - Chen; Chien-Hua ; et al. | 2022-05-12 |
| Uniform Print Head Surface Coating App 20220143978 - Chen; Chien-Hua ; et al. | 2022-05-12 |
| Coplanar Modular Printbars App 20220143883 - Chen; Chien-Hua ; et al. | 2022-05-12 |
| Particle separation Grant 11,325,125 - Shkolnikov , et al. May 10, 2 | 2022-05-10 |
| Print head interposers Grant 11,325,378 - Cumbie , et al. May 10, 2 | 2022-05-10 |
| Fluid property sensor Grant 11,318,750 - Chen , et al. May 3, 2 | 2022-05-03 |
| Selective release of material in thermally degradable capsule Grant 11,318,469 - Shkolnikov , et al. May 3, 2 | 2022-05-03 |
| Molded Structures With Channels App 20220126577 - Chen; Chien-Hua ; et al. | 2022-04-28 |
| Fluid Propelling Apparatus Including A Heat Sink App 20220111645 - Clark; Garrett E. ; et al. | 2022-04-14 |
| Molded Structures With Channels App 20220111647 - Chen; Chien-Hua ; et al. | 2022-04-14 |
| Fluid Ejection Polymeric Recirculation Channel App 20220105725 - Chen; Chien-Hua ; et al. | 2022-04-07 |
| Fluid circulation and ejection Grant 11,292,265 - Choy , et al. April 5, 2 | 2022-04-05 |
| Molded die slivers with exposed front and back surfaces Grant 11,292,257 - Chen , et al. April 5, 2 | 2022-04-05 |
| Microfluidic chip Grant 11,278,887 - Shkolnikov , et al. March 22, 2 | 2022-03-22 |
| Chip to chip fluidic interconnect Grant 11,278,892 - Cumbie , et al. March 22, 2 | 2022-03-22 |
| Fluid Ejection Device With Break(s) In Cover Layer App 20220072858 - Cumbie; Michael W. ; et al. | 2022-03-10 |
| Curved Fluid Ejection Devices App 20220032626 - Chen; Chien-Hua ; et al. | 2022-02-03 |
| Fluid propelling apparatus including a heat sink Grant 11,235,574 - Clark , et al. February 1, 2 | 2022-02-01 |
| Coplanar microfluidic manipulation Grant 11,235,328 - Cumbie , et al. February 1, 2 | 2022-02-01 |
| Thermal contact dies Grant 11,225,086 - Cumbie , et al. January 18, 2 | 2022-01-18 |
| Two-step molding for a lead frame Grant 11,227,807 - Cumbie , et al. January 18, 2 | 2022-01-18 |
| Fluidic dies with inlet and outlet channels Grant 11,225,074 - Cumbie , et al. January 18, 2 | 2022-01-18 |
| Applying Mold Chase Structure To End Portion Of Fluid Ejection Die App 20220009231 - Chen; Chien-Hua ; et al. | 2022-01-13 |
| Three-dimensional Features Formed In Molded Panel App 20220002149 - Chen; Chien-Hua ; et al. | 2022-01-06 |
| Image Identification Method And System App 20220005173 - Hwang; Wen Jyi ; et al. | 2022-01-06 |
| Deformable covers on sensors and reservoirs Grant 11,215,562 - Chen , et al. January 4, 2 | 2022-01-04 |
| Fluid ejection die interlocked with molded body Grant 11,214,065 - Cumbie , et al. January 4, 2 | 2022-01-04 |
| Circuit Die Alignment Target App 20210402782 - Fuller; Anthony M. ; et al. | 2021-12-30 |
| Semiconductor package and semiconductor process Grant 11,201,125 - Hsieh , et al. December 14, 2 | 2021-12-14 |
| Fluidic Die With Surface Condition Monitoring App 20210370668 - Martin; Eric ; et al. | 2021-12-02 |
| Conductive elements electrically coupled to fluidic dies Grant 11,186,082 - Chen , et al. November 30, 2 | 2021-11-30 |
| Fluid ejection device Grant 11,186,090 - Chen , et al. November 30, 2 | 2021-11-30 |
| Sequential Encapsulation Of Reagents App 20210362116 - Shkolnikov; Viktor ; et al. | 2021-11-25 |
| Separations Of Focused Particle Flows App 20210362156 - Shkolnikov; Viktor ; et al. | 2021-11-25 |
| Circuit package Grant 11,183,437 - Chen , et al. November 23, 2 | 2021-11-23 |
| Fluidic Die With Nozzle Layer Electrode For Fluid Control App 20210347171 - Anderson; Daryl E. ; et al. | 2021-11-11 |
| Fluidic Device With Nozzle Layer Conductors App 20210347169 - Przybyla; James R. ; et al. | 2021-11-11 |
| Selective Release Of Material In Thermally Degradable Capsule App 20210331165 - Shkolnikov; Viktor ; et al. | 2021-10-28 |
| Fluidic ejection devices with enclosed cross-channels Grant 11,155,086 - Choy , et al. October 26, 2 | 2021-10-26 |
| Fluidic Die Assemblies With Rigid Bent Substrates App 20210323312 - Chen; Chien-Hua ; et al. | 2021-10-21 |
| Thermally Controlled Reagent Release App 20210322990 - Shkolnikov; Viktor ; et al. | 2021-10-21 |
| Three-dimensional features formed in molded panel Grant 11,148,942 - Chen , et al. October 19, 2 | 2021-10-19 |
| Curved Fluid Ejection Modules App 20210316553 - Chen; Chien-Hua ; et al. | 2021-10-14 |
| Die contact formations Grant 11,135,839 - Cumbie , et al. October 5, 2 | 2021-10-05 |
| Microfluidic Devices App 20210299662 - Shkolnikov; Viktor ; et al. | 2021-09-30 |
| Molded fluid flow structure Grant 11,130,339 - Chen , et al. September 28, 2 | 2021-09-28 |
| Fluidic Ejection Dies With Enclosed Cross-channels App 20210291547 - Choy; Si-Iam ; et al. | 2021-09-23 |
| Fluid Ejection Dies App 20210283910 - Chen; Chien-Hua ; et al. | 2021-09-16 |
| Thermal Contact Dies App 20210283926 - Cumbie; Michael W ; et al. | 2021-09-16 |
| Fluid Ejection Devices App 20210276332 - Chen; Chien-Hua ; et al. | 2021-09-09 |
| Preloaded storage container and print head to dispense fluid Grant 11,110,714 - Nielsen , et al. September 7, 2 | 2021-09-07 |
| Fluid ejection die molded into molded body Grant 11,097,537 - Chen , et al. August 24, 2 | 2021-08-24 |
| Carriers Including Fluid Ejection Dies App 20210252859 - Cumbie; Michael ; et al. | 2021-08-19 |
| Conductive Elements Electrically Coupled To Fluidic Dies App 20210252860 - Chen; Chien-Hua ; et al. | 2021-08-19 |
| Fluid Property Sensor App 20210252871 - STUDER; Anthony D. ; et al. | 2021-08-19 |
| Conductive Elements Electrically Coupled To Fluidic Dies App 20210252858 - Cumbie; Michael W ; et al. | 2021-08-19 |
| Complex impedance detection Grant 11,090,929 - Chen , et al. August 17, 2 | 2021-08-17 |
| Dual Direction Dispensers App 20210245151 - CUMBIE; Michael W. ; et al. | 2021-08-12 |
| Fluid Ejection Device With A Carrier Having A Slot App 20210229438 - CHEN; Chien-Hua ; et al. | 2021-07-29 |
| Fluid Feed Path Wettability Coating App 20210229439 - Chen; Chien-Hua ; et al. | 2021-07-29 |
| Movable Mold Insert Adjuster App 20210221029 - CHEN; Chien-Hua ; et al. | 2021-07-22 |
| Cross-die recirculation channels and chamber recirculation channels Grant 11,065,883 - Chen , et al. July 20, 2 | 2021-07-20 |
| Dielectrophoresis And Density Separators App 20210213449 - Shkolnikov; Viktor ; et al. | 2021-07-15 |
| Particle Separation App 20210213451 - SHKOLNIKOV; Viktor ; et al. | 2021-07-15 |
| Fluidic ejection dies with enclosed cross-channels Grant 11,059,291 - Choy , et al. July 13, 2 | 2021-07-13 |
| Microfluidic Device Channel Layer App 20210197199 - SHKOLNIKOV; Viktor ; et al. | 2021-07-01 |
| Fluid ejection die heat exchangers Grant 11,046,073 - Chen , et al. June 29, 2 | 2021-06-29 |
| Liquid level sensing Grant 11,046,084 - Cumbie , et al. June 29, 2 | 2021-06-29 |
| Semiconductor package structure and method of manufacturing the same Grant 11,037,846 - Chen , et al. June 15, 2 | 2021-06-15 |
| Embedded Microfluidic Devices App 20210170401 - CHEN; Chien-Hua ; et al. | 2021-06-10 |
| Fluid Testing App 20210170396 - CUMBIE; Michael W. ; et al. | 2021-06-10 |
| Printhead Grant 11,020,967 - Chen , et al. June 1, 2 | 2021-06-01 |
| Liquid level sensing Grant 11,009,382 - Chen , et al. May 18, 2 | 2021-05-18 |
| Three-dimensional (3D) printing with epoxy resin Grant 11,007,712 - Liu , et al. May 18, 2 | 2021-05-18 |
| Fluid property sensing with electrodes Grant 11,009,383 - Cumbie , et al. May 18, 2 | 2021-05-18 |
| Fluidic Ejection Dies With Enclosed Cross-channels App 20210129534 - Choy; Si-lam ; et al. | 2021-05-06 |
| Fluid Property Sensor App 20210129549 - Cumbie; Michael W ; et al. | 2021-05-06 |
| Fluid Property Sensor App 20210129550 - Chen; Chien-Hua ; et al. | 2021-05-06 |
| Fluid flow structure forming method Grant 10,994,539 - Chen , et al. May 4, 2 | 2021-05-04 |
| Molded fluid flow structure with saw cut channel Grant 10,994,541 - Chen , et al. May 4, 2 | 2021-05-04 |
| Semiconductor device package and method of manufacturing the same Grant 10,964,652 - Chen , et al. March 30, 2 | 2021-03-30 |
| Semiconductor Package Structure And Method Of Manufacturing The Same App 20210090965 - CHEN; Chien-Hua ; et al. | 2021-03-25 |
| Fluid ejection die fluid recirculation Grant 10,946,648 - Chen , et al. March 16, 2 | 2021-03-16 |
| Encapsulating a bonded wire with low profile encapsulation Grant 10,946,658 - Chen , et al. March 16, 2 | 2021-03-16 |
| Device and Method of Test Tube Preparation App 20210070490 - Chen; Chien-Hua ; et al. | 2021-03-11 |
| Omniphobic membranes and application thereof Grant 10,940,438 - Tung , et al. March 9, 2 | 2021-03-09 |
| Fluid dispenser Grant 10,933,640 - Chen , et al. March 2, 2 | 2021-03-02 |
| Print Head Interposers App 20210039390 - Cumbie; Michael W. ; et al. | 2021-02-11 |
| Semiconductor Device Packages Including An Inductor And A Capacitor App 20210043719 - CHEN; Chien-Hua ; et al. | 2021-02-11 |
| Semiconductor device package and method of manufacturing the same Grant 10,903,561 - Chen , et al. January 26, 2 | 2021-01-26 |
| Plasmonic nanostructure including sacrificial passivation coating Grant 10,890,486 - Chen , et al. January 12, 2 | 2021-01-12 |
| SERS sensor apparatus with passivation film Grant 10,871,449 - Chen , et al. December 22, 2 | 2020-12-22 |
| Fluid ejection device including integrated circuit Grant 10,864,719 - Cumbie , et al. December 15, 2 | 2020-12-15 |
| Integrated passive component and method for manufacturing the same Grant 10,861,840 - Chang , et al. December 8, 2 | 2020-12-08 |
| Three-dimensional (3D) printing with epoxy mold compound Grant 10,850,446 - Chen , et al. December 1, 2 | 2020-12-01 |
| Molded Printhead App 20200369031 - Choy; Silam J. ; et al. | 2020-11-26 |
| Printing fluid cartridge with electrodes and method to the level of fluid in a printing fluid cartridge Grant 10,836,178 - Ge , et al. November 17, 2 | 2020-11-17 |
| Molded printhead Grant 10,836,169 - Choy , et al. November 17, 2 | 2020-11-17 |
| Print head interposers Grant 10,836,162 - Cumbie , et al. November 17, 2 | 2020-11-17 |
| Semiconductor device packages including an inductor and a capacitor Grant 10,833,144 - Chen , et al. November 10, 2 | 2020-11-10 |
| Frame layer receiving a substrate supported SEL stage Grant 10,830,704 - Chen , et al. November 10, 2 | 2020-11-10 |
| Transfer molded fluid flow structure Grant 10,821,729 - Chen , et al. November 3, 2 | 2020-11-03 |
| Two-step Molding For A Lead Frame App 20200343153 - Cumbie; Michael W. ; et al. | 2020-10-29 |
| Composite wafers Grant 10,815,121 - Choy , et al. October 27, 2 | 2020-10-27 |
| Complex Impedance Detection App 20200331259 - CHEN; Chien-Hua ; et al. | 2020-10-22 |
| Fluid Flow Structure Forming Method App 20200331272 - CHEN; Chien-Hua ; et al. | 2020-10-22 |
| Fluid Ejection Device Including Fluid Output Channel App 20200331264 - Cumbie; Michael W ; et al. | 2020-10-22 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200335458 - CHEN; Chien-Hua ; et al. | 2020-10-22 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200335858 - CHEN; Chien-Hua ; et al. | 2020-10-22 |
| Inverted TIJ Grant 10,780,698 - Cumbie, Jr. , et al. Sept | 2020-09-22 |
| Fluid ejection dies Grant 10,780,697 - Chen , et al. Sept | 2020-09-22 |
| Printbars and methods of forming printbars Grant 10,780,696 - Chen , et al. Sept | 2020-09-22 |
| Fluid Circulation And Ejection App 20200290365 - Choy; Si-lam ; et al. | 2020-09-17 |
| Planarization Layers Over Silicon Dies App 20200282394 - Cumbie; Michael W. ; et al. | 2020-09-10 |
| Cross-die Recirculation Channels And Chamber Recirculation Channels App 20200282738 - Chen; Chien-Hua ; et al. | 2020-09-10 |
| Flexible carrier for fluid flow structure Grant 10,751,997 - Chen , et al. A | 2020-08-25 |
| Relative pressure sensor Grant 10,753,815 - Cumbie , et al. A | 2020-08-25 |
| Fluid Ejection Die Molded Into Molded Body App 20200247123 - Kind Code | 2020-08-06 |
| Microfluidic Devices App 20200246799 - Kind Code | 2020-08-06 |
| Fluid Ejection Die Heat Exchangers App 20200238695 - Chen; Chien-Hua ; et al. | 2020-07-30 |
| Fluidic Dies App 20200238699 - Choy; Si-lam ; et al. | 2020-07-30 |
| Fluid ejection device including fluid output channel Grant 10,723,128 - Cumbie , et al. | 2020-07-28 |
| Fluid Ejection Die Interlocked With Molded Body App 20200223226 - Cumbie; Michael W ; et al. | 2020-07-16 |
| Deformable Covers On Sensors And Reservoirs App 20200225162 - Chen; Chien-Hua ; et al. | 2020-07-16 |
| Flip-top washing device for vegetables and fruits Grant 10,702,103 - Chen | 2020-07-07 |
| Microfluidic Devices With Lid For Loading Fluid App 20200206734 - ELY; Hilary ; et al. | 2020-07-02 |
| Microfluidic Package App 20200197935 - CHEN; Chien-Hua ; et al. | 2020-06-25 |
| Fluidic Dies With Inlet And Outlet Channels App 20200198340 - Cumbie; Michael W. ; et al. | 2020-06-25 |
| Circuit package Grant 10,685,898 - Chen , et al. | 2020-06-16 |
| Molded Die Slivers With Exposed Front And Back Surfaces App 20200180314 - Chen; Chien-Hua ; et al. | 2020-06-11 |
| Die Contact Formations App 20200164645 - Cumbie; Michael W ; et al. | 2020-05-28 |
| Fluidic Ejection Dies With Enclosed Cross-channels App 20200164647 - Choy; Si-lam ; et al. | 2020-05-28 |
| Printheads and methods of fabricating a printhead Grant 10,661,567 - Cumbie , et al. | 2020-05-26 |
| Sers Sensor Apparatus With Passivation Film App 20200158645 - Chen; Zhizhang ; et al. | 2020-05-21 |
| Omniphobic Membranes and Application Thereof App 20200156006 - Tung; Kuo-Lun ; et al. | 2020-05-21 |
| Preloaded Storage Container And Print Head To Dispense Fluid App 20200147972 - Nielsen; Jeffrey A. ; et al. | 2020-05-14 |
| Fluid level sensor Grant 10,647,128 - Chen , et al. | 2020-05-12 |
| Circuit Package App 20200144148 - Chen; Chien-Hua ; et al. | 2020-05-07 |
| Encapsulating a Bonded Wire with Low Profile Encapsulation App 20200139705 - Chen; Chien-Hua ; et al. | 2020-05-07 |
| Microelectromechanical system (MEMS) devices Grant 10,640,369 - Chen , et al. | 2020-05-05 |
| Microfluidic Chip App 20200129979 - SHKOLNIKOV; Viktor ; et al. | 2020-04-30 |
| Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure Grant 10,632,752 - Chen , et al. | 2020-04-28 |
| Method of making a fluid structure having compression molded fluid channel Grant 10,603,916 - Chen , et al. | 2020-03-31 |
| Heat pipe--thermal storage medium based cool storage system Grant 10,605,541 - Zheng , et al. | 2020-03-31 |
| Printhead Grant 10,603,911 - Chen , et al. | 2020-03-31 |
| Molded Panels App 20200094475 - Chen; Chien-Hua ; et al. | 2020-03-26 |
| Chip To Chip Fluidic Interconnect App 20200094247 - CUMBIE; Michael W. ; et al. | 2020-03-26 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200083591 - HSIEH; Sheng-Chi ; et al. | 2020-03-12 |
| Coplanar Fluidic Interconnect App 20200070160 - Chen; Chien-Hua ; et al. | 2020-03-05 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20200075571 - CHEN; Chien-Hua ; et al. | 2020-03-05 |
| Fluid reservoir with fluid property and level detection Grant 10,576,748 - Ge , et al. | 2020-03-03 |
| Fluid Ejection Die Fluid Recirculation App 20200061992 - Chen; Chien-Hua ; et al. | 2020-02-27 |
| Substrate supported SEL stage and housing Grant 10,557,798 - Chen , et al. Feb | 2020-02-11 |
| Incineration system and process Grant 10,557,391 - Chen , et al. Feb | 2020-02-11 |
| Circuit package Grant 10,559,512 - Chen , et al. Feb | 2020-02-11 |
| Coplanar Microfluidic Manipulation App 20200038872 - Cumbie; Michael W. ; et al. | 2020-02-06 |
| Package Structure And Method For Manufacturing The Same App 20200035654 - CHEN; Chien-Hua ; et al. | 2020-01-30 |
| Printhead App 20200031126 - Chen; Chien-Hua ; et al. | 2020-01-30 |
| Printbars And Methods Of Forming Printbars App 20200023641 - Chen; Chien-Hua ; et al. | 2020-01-23 |
| Fluid Level Sensor App 20200003601 - GE; Ning ; et al. | 2020-01-02 |
| Capacitor Bank Structure, Semiconductor Package Structure And Method For Manufacturing The Same App 20190393297 - KUNG; Cheng-Yuan ; et al. | 2019-12-26 |
| Fluid Ejection Dies App 20190389220 - Chen; Chien-Hua ; et al. | 2019-12-26 |
| Molded die slivers with exposed front and back surfaces Grant 10,500,859 - Chen , et al. Dec | 2019-12-10 |
| Liquid Level Sensor Circuit App 20190368911 - Chen; Chien-Hua ; et al. | 2019-12-05 |
| Printed Circuit Board Fluid Ejection Apparatus App 20190366719 - Chen; Chien-Hua ; et al. | 2019-12-05 |
| Fluid level sensing with protective member Grant 10,493,766 - Chen , et al. De | 2019-12-03 |
| Thermal energy storage system with tunable phase change composition Grant 10,495,388 - Zheng , et al. De | 2019-12-03 |
| Electrical device Grant 10,490,341 - Kung , et al. Nov | 2019-11-26 |
| Printhead electrical interconnects Grant 10,479,085 - Mourey , et al. Nov | 2019-11-19 |
| Process for making a molded device assembly and printhead assembly Grant 10,479,086 - Chen , et al. Nov | 2019-11-19 |
| Printhead Grant 10,471,714 - Chen , et al. Nov | 2019-11-12 |
| MEMS device package and method for manufacturing the same Grant 10,472,228 - Chen , et al. Nov | 2019-11-12 |
| Semiconductor device package comprising a dielectric layer with built-in inductor Grant 10,475,718 - Chen , et al. Nov | 2019-11-12 |
| Semiconductor device package Grant 10,475,734 - Chen , et al. Nov | 2019-11-12 |
| Molded fluid flow structure Grant 10,464,324 - Chen , et al. No | 2019-11-05 |
| Fluid Ejection Device Including Fluid Output Channel App 20190315125 - Cumbie; Michael W ; et al. | 2019-10-17 |
| Fluid ejection die and glass-based support substrate Grant 10,434,774 - Chen , et al. O | 2019-10-08 |
| Circuit packages comprising epoxy mold compounds and methods of compression molding Grant 10,438,864 - Chen , et al. O | 2019-10-08 |
| Printer circuit board fluid ejection apparatus Grant 10,427,407 - Chen , et al. October 1, 2 | 2019-10-01 |
| Printbars and methods of forming printbars Grant 10,421,274 - Chen , et al. Sept | 2019-09-24 |
| Fluid ejection die and plastic-based substrate Grant 10,421,278 - Chen , et al. Sept | 2019-09-24 |
| Molded printhead Grant 10,421,279 - Chen , et al. Sept | 2019-09-24 |
| Inkjet printhead Grant 10,384,450 - Chen , et al. A | 2019-08-20 |
| Fluid Ejection Device App 20190248141 - Chen; Chien-Hua ; et al. | 2019-08-15 |
| Overmolded ink delivery device Grant 10,377,142 - Chen , et al. A | 2019-08-13 |
| Fluid Reservoir With Fluid Property And Level Detection App 20190240985 - Ge; Ning ; et al. | 2019-08-08 |
| Service structures in print heads Grant 10,369,793 - Mourey , et al. | 2019-08-06 |
| Printing Fluid Cartridge With Electrodes And Method To The Level Of Fluid In A Printing Fluid Cartridge App 20190232673 - Ge; Ning ; et al. | 2019-08-01 |
| Relative Pressure Sensor App 20190226930 - Cumbie; Michael W. ; et al. | 2019-07-25 |
| Circuit Package App 20190214325 - Chen; Chien-Hua ; et al. | 2019-07-11 |
| Printed circuit board to molded compound interface Grant 10,342,140 - Chen , et al. | 2019-07-02 |
| Printed circuit board with recessed pocket for fluid droplet ejection die Grant 10,328,694 - Chen , et al. | 2019-06-25 |
| Flexible Liquid Crystal Display App 20190179190 - Chen; Chien-Hua ; et al. | 2019-06-13 |
| Semiconductor Device Package App 20190181082 - CHEN; Chien-Hua ; et al. | 2019-06-13 |
| Circuit package having a plurality of epoxy mold compounds with different compositions Grant 10,319,657 - Chen , et al. | 2019-06-11 |
| Fluid Level Sensor App 20190168511 - Chen; Chien-Hua ; et al. | 2019-06-06 |
| Liquid Level Sensing App 20190162576 - Chen; Chien-Hua ; et al. | 2019-05-30 |
| Printed circuit board fluid ejection apparatus Grant 10,300,701 - Chen , et al. | 2019-05-28 |
| Semiconductor device package Grant 10,304,765 - Chen , et al. | 2019-05-28 |
| Inkjet Printhead App 20190152225 - Chen; Chien-Hua ; et al. | 2019-05-23 |
| Substrate Supported Sel Stage And Housing App 20190145898 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Print Head Interposers App 20190143688 - Cumbie; Michael W. ; et al. | 2019-05-16 |
| Plurality Of Filters App 20190143325 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Frame Layer Receiving A Substrate Supported Sel Stage App 20190145896 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Microfluidic Device With Manifold App 20190144268 - Chen; Chien-Hua ; et al. | 2019-05-16 |
| Fluid Ejection Device With A Portioning Wall App 20190134977 - CHEN; Chien-Hua ; et al. | 2019-05-09 |
| Composite Wafers App 20190135615 - Choy; Si-lam J. ; et al. | 2019-05-09 |
| Circuit package Grant 10,276,468 - Chen , et al. | 2019-04-30 |
| Fluid ejection device Grant 10,272,680 - Chen , et al. | 2019-04-30 |
| Fluid Property Sensing With Electrodes App 20190120678 - Cumbie; Michael W. ; et al. | 2019-04-25 |
| Fluid Level Sensing With Protective Member App 20190118540 - Chen; Chien-Hua ; et al. | 2019-04-25 |
| Microelectromechanical System (mems) Devices App 20190119104 - Chen; Chien-Hua ; et al. | 2019-04-25 |
| Fluid Dispenser App 20190111683 - Chen; Chien-Hua ; et al. | 2019-04-18 |
| Liquid Level Sensing App 20190111694 - Cumbie; Michael W. ; et al. | 2019-04-18 |
| Inverted Tij App 20190111680 - Cumbie; Michael W ; et al. | 2019-04-18 |
| Fluid flow structure Grant 10,232,618 - Chen , et al. | 2019-03-19 |
| Printhead with bond pad surrounded by dam Grant 10,232,619 - Chen , et al. | 2019-03-19 |
| Printhead with s-shaped die Grant 10,232,620 - Cumbie , et al. | 2019-03-19 |
| Process for making a molded device assembly and printhead assembly Grant 10,232,621 - Chen , et al. | 2019-03-19 |
| Reflective Liquid Crystal Display App 20190079340 - CHENG; Shin-Yi ; et al. | 2019-03-14 |
| Printbars and methods of forming printbars Grant 10,226,926 - Chen , et al. | 2019-03-12 |
| Molded printhead structure Grant 10,220,620 - Chen , et al. | 2019-03-05 |
| Integrated Passive Component And Method For Manufacturing The Same App 20190067261 - CHANG; Yung-Shun ; et al. | 2019-02-28 |
| Mems Device Package And Method For Manufacturing The Same App 20190055118 - CHEN; Chien-Hua ; et al. | 2019-02-21 |
| Electrical Device App 20190057809 - KUNG; Cheng-Yuan ; et al. | 2019-02-21 |
| Printhead cartridge molded with nozzle health sensor Grant 10,207,508 - Chen , et al. Feb | 2019-02-19 |
| Print head interposers Grant 10,207,500 - Cumbie , et al. Feb | 2019-02-19 |
| Semiconductor device package Grant 10,211,137 - Chen , et al. Feb | 2019-02-19 |
| Three-dimensional (3d) Printing With Epoxy Resin App 20190039293 - Liu; Qin ; et al. | 2019-02-07 |
| Printhead die Grant 10,195,851 - Chen , et al. Fe | 2019-02-05 |
| Three-dimensional (3d) Printing With Epoxy Mold Compound App 20190030799 - Chen; CHien-Hua ; et al. | 2019-01-31 |
| Flip-top Washing Device For Vegetables And Fruits App 20190029471 - Chen; Chien-Hua | 2019-01-31 |
| Printing fluid cartridge Grant 10,189,265 - Chen , et al. Ja | 2019-01-29 |
| Printhead With Non-epoxy Mold Compound App 20190009537 - Chen; Chien-Hua ; et al. | 2019-01-10 |
| Printhead App 20190001676 - Chen; Chien-Hua ; et al. | 2019-01-03 |
| Molded fluid flow structure Grant 10,166,776 - Chen , et al. J | 2019-01-01 |
| Plasmonic Nanostructure Including Sacrificial Passivation Coating App 20180372543 - Chen; Zhizhang ; et al. | 2018-12-27 |
| Flexible carrier for fluid flow structure Grant 10,160,209 - Chen , et al. Dec | 2018-12-25 |
| Molded fluid flow structure Grant 10,160,213 - Chen , et al. Dec | 2018-12-25 |
| Molded Die Slivers With Exposed Front And Back Surfaces App 20180361744 - Chen; Chien-Hua ; et al. | 2018-12-20 |
| Process For Making A Molded Device Assembly And Printhead Assembly App 20180361746 - Chen; Chien-Hua ; et al. | 2018-12-20 |
| Fluid Ejection Die And Plastic-based Substrate App 20180354268 - Chen; Chien-Hua ; et al. | 2018-12-13 |
| Semiconductor Device Package App 20180358291 - CHEN; Chien-Hua ; et al. | 2018-12-13 |
| Semiconductor Device Package App 20180358290 - CHEN; Chien-Hua ; et al. | 2018-12-13 |
| Semiconductor Device Package App 20180337164 - CHEN; Chien-Hua ; et al. | 2018-11-22 |
| Molded Fluid Flow Structure With Saw Cut Channel App 20180333956 - Chen; Chien-Hua ; et al. | 2018-11-22 |
| Flexible Carrier For Fluid Flow Structure App 20180326724 - Chen; Chien-Hua ; et al. | 2018-11-15 |
| Relative Pressure Sensor App 20180321100 - Cumbie; Michael W. ; et al. | 2018-11-08 |
| Fluid Propelling Apparatus Including A Heat Sink App 20180319655 - Clark; Garrett E. ; et al. | 2018-11-08 |
| Fluid Ejection Device Including Integrated Circuit App 20180319160 - Cumbie; Michael W. ; et al. | 2018-11-08 |
| Fluid ejection device with fluid feed holes Grant 10,112,408 - Chen , et al. October 30, 2 | 2018-10-30 |
| Molded Printhead App 20180304633 - Choy; Silam J. ; et al. | 2018-10-25 |
| Molded fluid flow structure with saw cut channel Grant 10,081,188 - Chen , et al. September 25, 2 | 2018-09-25 |
| Molded die slivers with exposed front and back surfaces Grant 10,081,186 - Chen , et al. September 25, 2 | 2018-09-25 |
| Fluid Ejection Die And Glass-based Support Substrate App 20180264813 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Overmolded Ink Delivery Device App 20180264834 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Circuit Package App 20180269125 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Three-dimensional Features Formed In Molded Panel App 20180265353 - Chen; Chien-Hua ; et al. | 2018-09-20 |
| Service Structures In Print Heads App 20180244044 - MOUREY; Devin Alexander ; et al. | 2018-08-30 |
| Semiconductor Package And Semiconductor Process App 20180247904 - HSIEH; Sheng-Chi ; et al. | 2018-08-30 |
| Fruit and vegetable washer Grant 10,058,119 - Chen August 28, 2 | 2018-08-28 |
| Fruit And Vegetable Washer App 20180220692 - CHEN; CHIEN-HUA | 2018-08-09 |
| Printhead Electrical Interconnects App 20180222202 - Mourey; Devin Alexander ; et al. | 2018-08-09 |
| Circuit Package App 20180226316 - Chen; Chien-Hua ; et al. | 2018-08-09 |
| Printheads And Methods Of Fabricating A Printhead App 20180222201 - Cumbie; Michael W. ; et al. | 2018-08-09 |
| Printhead App 20180222194 - CHEN; Chien-Hua ; et al. | 2018-08-09 |
| Printhead With S-shaped Die App 20180215147 - Cumbie; Michael W. ; et al. | 2018-08-02 |
| Print Head Interposers App 20180215151 - Cumbie; Michael W. ; et al. | 2018-08-02 |
| Molded printhead Grant 10,029,467 - Choy , et al. July 24, 2 | 2018-07-24 |
| Optical Modules App 20180203194 - Chen; Chien-Hua ; et al. | 2018-07-19 |
| Overmolded ink delivery device Grant 10,016,983 - Chen , et al. July 10, 2 | 2018-07-10 |
| Liquid Crystal Composition And Liquid Crystal Display Device App 20180187078 - Cheng; Shin-Yi ; et al. | 2018-07-05 |
| Printed Circuit Board With Recessed Pocket For Fluid Droplet Ejection Die App 20180170050 - Chen; Chien Hua ; et al. | 2018-06-21 |
| Printed Circuit Board To Molded Compound Interface App 20180168049 - Chen; Chien-Hua ; et al. | 2018-06-14 |
| Semiconductor devices Grant 9,997,447 - Chen , et al. June 12, 2 | 2018-06-12 |
| Printed Circuit Board Fluid Ejection Apparatus App 20180154636 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Printbars And Methods Of Forming Printbars App 20180154633 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Emission Device To Expose Printing Material App 20180154576 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Printhead With Bond Pad Surrounded By Dam App 20180154632 - Chen; Chien-Hua ; et al. | 2018-06-07 |
| Molded Fluid Flow Structure App 20180141338 - Chen; Chien-Hua ; et al. | 2018-05-24 |
| Molded Fluid Flow Structure App 20180141337 - Chen; Chien-Hua ; et al. | 2018-05-24 |
| Semiconductor System And Device Package Including Interconnect Structure App 20180138113 - CHEN; Chien-Hua ; et al. | 2018-05-17 |
| Semiconductor Device Packages App 20180138262 - CHEN; Chien-Hua ; et al. | 2018-05-17 |
| Fluid Ejection Device App 20180134038 - Chen; Chien-Hua ; et al. | 2018-05-17 |
| Molded Fluid Flow Structure App 20180134039 - Chen; Chien-Hua ; et al. | 2018-05-17 |
| Fluid Flow Structure App 20180126732 - Chen; Chien-Hua ; et al. | 2018-05-10 |
| Molded Printhead Structure App 20180111374 - Chen; Chien-Hua ; et al. | 2018-04-26 |
| Molded fluid flow structure Grant 9,944,080 - Chen , et al. April 17, 2 | 2018-04-17 |
| Semiconductor device and process of making the same Grant 9,929,132 - Lee , et al. March 27, 2 | 2018-03-27 |
| Printhead with bond pad surrounded by dam Grant 9,919,524 - Chen , et al. March 20, 2 | 2018-03-20 |
| Printed circuit board fluid ejection apparatus Grant 9,919,525 - Chen , et al. March 20, 2 | 2018-03-20 |
| Molded Printhead App 20180065374 - Chen; Chien-Hua ; et al. | 2018-03-08 |
| Molded print bar Grant 9,902,162 - Chen , et al. February 27, 2 | 2018-02-27 |
| Printhead assembly Grant 9,895,889 - Chen , et al. February 20, 2 | 2018-02-20 |
| Fluid flow structure Grant 9,895,888 - Chen , et al. February 20, 2 | 2018-02-20 |
| Molded printhead structure Grant 9,889,664 - Chen , et al. February 13, 2 | 2018-02-13 |
| Method for controlling exhaust flow in wafer processing module Grant 9,892,982 - Tseng , et al. February 13, 2 | 2018-02-13 |
| Semiconductor device and method of manufacturing the same Grant 9,881,917 - Shih , et al. January 30, 2 | 2018-01-30 |
| Circuit Package App 20180025960 - Chen; Chien-Hua ; et al. | 2018-01-25 |
| Fluid Ejection Device With Fluid Feed Holes App 20180015732 - Chen; Chien Hua ; et al. | 2018-01-18 |
| Circuit Package App 20180012816 - Chen; Chien-Hua ; et al. | 2018-01-11 |
| Printhead Cartridge Molded With Nozzle Health Sensor App 20180001642 - Chen; Chien-Hua ; et al. | 2018-01-04 |
| Molded printhead Grant 9,844,946 - Chen , et al. December 19, 2 | 2017-12-19 |
| Semiconductor device and method for manufacturing the same Grant 9,837,352 - Chang , et al. December 5, 2 | 2017-12-05 |
| Printing Fluid Cartridge App 20170334211 - Chen; Chien-Hua ; et al. | 2017-11-23 |
| Fluid Structure With Compression Molded Fluid Channel App 20170313079 - Chen; Chien-Hua ; et al. | 2017-11-02 |
| Molded Fluid Flow Structure App 20170305167 - Chen; Chien-Hua ; et al. | 2017-10-26 |
| Molded Die Slivers With Exposed Front And Back Surfaces App 20170305158 - Chen; Chien-Hua ; et al. | 2017-10-26 |
| Power saving mechanism for in-pocket detection Grant 9,788,277 - Ting , et al. October 10, 2 | 2017-10-10 |
| Printhead Die App 20170282551 - Chen; Chien-Hua ; et al. | 2017-10-05 |
| Printhead dies molded with nozzle health sensor Grant 9,770,909 - Chen , et al. September 26, 2 | 2017-09-26 |
| Printing fluid cartridge Grant 9,751,319 - Chen , et al. September 5, 2 | 2017-09-05 |
| Fluid structure with compression molded fluid channel Grant 9,731,509 - Chen , et al. August 15, 2 | 2017-08-15 |
| Molded die slivers with exposed front and back surfaces Grant 9,724,920 - Chen , et al. August 8, 2 | 2017-08-08 |
| Molded Fluid Flow Structure With Saw Cut Channel App 20170217184 - Chen; Chien-Hua ; et al. | 2017-08-03 |
| Fluid directing assembly Grant 9,707,766 - Chaffins , et al. July 18, 2 | 2017-07-18 |
| Printhead die Grant 9,707,753 - Chen , et al. July 18, 2 | 2017-07-18 |
| Printbar and method of forming same Grant 9,676,192 - Chen , et al. June 13, 2 | 2017-06-13 |
| Molded fluid flow structure with saw cut channel Grant 9,656,469 - Chen , et al. May 23, 2 | 2017-05-23 |
| Semiconductor Device And Process Of Making The Same App 20170133360 - LEE; Teck-Chong ; et al. | 2017-05-11 |
| Molded Printhead Structure App 20170120590 - Chen; Chien-Hua ; et al. | 2017-05-04 |
| Printed Circuit Board Fluid Ejection Apparatus App 20170120596 - CHEN; Chien-Hua ; et al. | 2017-05-04 |
| Method for making a porous silica aerogel composite membrane Grant 9,636,633 - Lin , et al. May 2, 2 | 2017-05-02 |
| Semiconductor Device And Method For Manufacturing The Same App 20170103946 - Chang; Yung-Shun ; et al. | 2017-04-13 |
| Method for Making A Porous Silica Aerogel Composite Membrane App 20170095769 - Lin; Yi-Feng ; et al. | 2017-04-06 |
| Printing Fluid Cartridge App 20170080715 - Chen; Chien-Hua ; et al. | 2017-03-23 |
| Printed Circuit Board Fluid Ejection Apparatus App 20170072693 - Chen; Chien-Hua ; et al. | 2017-03-16 |
| Flexible Carrier App 20170072690 - CHEN; Chien-Hua ; et al. | 2017-03-16 |
| Fuel reforming system and process Grant 9,595,726 - Chen , et al. March 14, 2 | 2017-03-14 |
| Process For Making A Molded Device Assembly And Printhead Assembly App 20170066242 - CHEN; Chien-Hua ; et al. | 2017-03-09 |
| Semiconductor device and process of making the same Grant 9,577,027 - Lee , et al. February 21, 2 | 2017-02-21 |
| Printhead Assembly App 20170043582 - CHEN; Chien-Hua ; et al. | 2017-02-16 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20170047276 - CHEN; Chien-Hua ; et al. | 2017-02-16 |
| Overmolded Ink Delivery Device App 20170036451 - CHEN; Chien-Hua ; et al. | 2017-02-09 |
| Porous silica aerogel composite membrane and method for making the same and carbon dioxide sorption device Grant 9,561,463 - Lin , et al. February 7, 2 | 2017-02-07 |
| Printhead With Bond Pad Surrounded By Dam App 20170028722 - Chen; Chien-Hua ; et al. | 2017-02-02 |
| Fluid Flow Structure App 20170028725 - CHEN; Chien-Hua ; et al. | 2017-02-02 |
| Semiconductor Device And Method Of Manufacturing The Same App 20170018550 - SHIH; Hsu-Chiang ; et al. | 2017-01-19 |
| Molded printhead Grant 9,539,814 - Chen , et al. January 10, 2 | 2017-01-10 |
| Printed circuit board fluid ejection apparatus Grant 9,517,626 - Chen , et al. December 13, 2 | 2016-12-13 |
| Apparatus for locating a vehicle and methods utilizing the same Grant 9,489,844 - Lin , et al. November 8, 2 | 2016-11-08 |
| Diagonal openings in photodefinable glass Grant 9,446,590 - Chen , et al. September 20, 2 | 2016-09-20 |
| Adhesive transfer Grant 9,355,834 - Chen , et al. May 31, 2 | 2016-05-31 |
| Transparent display apparatus Grant 9,329,425 - Chen , et al. May 3, 2 | 2016-05-03 |
| Multi-wafer pair anodic bonding apparatus and method Grant 9,287,126 - Chen , et al. March 15, 2 | 2016-03-15 |
| Piezoelectric actuator and method of making a piezoelectric actuator Grant 9,266,326 - Abbott, Jr. , et al. February 23, 2 | 2016-02-23 |
| Rocker switch device Grant 9,129,758 - Chen September 8, 2 | 2015-09-08 |
| Semiconductor transformer device and method for manufacturing the same Grant 8,963,671 - Chen , et al. February 24, 2 | 2015-02-24 |
| Femto-assisted location estimation in macro-femto heterogeneous networks Grant 8,958,819 - Lee , et al. February 17, 2 | 2015-02-17 |
| Pixel circuit Grant 8,896,591 - Chien , et al. November 25, 2 | 2014-11-25 |
| Drop detection Grant 8,864,289 - Govyadinov , et al. October 21, 2 | 2014-10-21 |
| Semiconductor structure with passive element network and manufacturing method thereof Grant 8,853,819 - Chen , et al. October 7, 2 | 2014-10-07 |
| Semiconductor package having passive device and method for making the same Grant 8,778,769 - Chen , et al. July 15, 2 | 2014-07-15 |
| Pixel circuit, display panel, and driving method thereof Grant 8,766,970 - Chien , et al. July 1, 2 | 2014-07-01 |
| Backlight module structure preventing light leakage from protrusion in optical sheets Grant 8,721,157 - Hsiao , et al. May 13, 2 | 2014-05-13 |
| Fluid nozzle array Grant 8,690,295 - Bengali , et al. April 8, 2 | 2014-04-08 |
| Signal swing trimming apparatus and method thereof Grant 8,502,589 - Li , et al. August 6, 2 | 2013-08-06 |
| Micro electrical mechanical system Grant 8,497,577 - Chen , et al. July 30, 2 | 2013-07-30 |
| Liquid crystal display device Grant 8,477,255 - Huang , et al. July 2, 2 | 2013-07-02 |
| Semiconductor package having passive device and method for making the same Grant 8,415,790 - Chen , et al. April 9, 2 | 2013-04-09 |
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