U.S. patent application number 15/377473 was filed with the patent office on 2017-03-30 for self-aligned gate tie-down contacts with selective etch stop liner.
The applicant listed for this patent is GLOBALFOUNDRIES INC.. Invention is credited to Su Chen Fan, Lars W. Liebmann, Ruilong Xie.
Application Number | 20170092585 15/377473 |
Document ID | / |
Family ID | 57964988 |
Filed Date | 2017-03-30 |
United States Patent
Application |
20170092585 |
Kind Code |
A1 |
Fan; Su Chen ; et
al. |
March 30, 2017 |
SELF-ALIGNED GATE TIE-DOWN CONTACTS WITH SELECTIVE ETCH STOP
LINER
Abstract
A method for forming a gate tie-down includes exposing an active
area to form trench contact openings and forming trench contacts
therein. An etch stop layer is formed on the trench contacts and on
spacers of adjacent gate structures. An interlevel dielectric (ILD)
is deposited to fill over the etch stop layer. The ILD and the etch
stop layer on one side of the gate structure are opened up to
provide an exposed etch stop layer portion. The gate structure is
recessed to expose a gate conductor. The exposed etch stop layer
portion is removed. A conductive material is deposited to provide a
self-aligned contact down to the trench contact on the one side of
the gate structure, to form a gate contact down to the gate
conductor and to form a horizontal connection within the ILD over
the active area between the gate conductor and the self-aligned
contact.
Inventors: |
Fan; Su Chen; (Cohoes,
NY) ; Liebmann; Lars W.; (Poughquag, NY) ;
Xie; Ruilong; (Niskayuna, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
GLOBALFOUNDRIES INC. |
Grand Cayman |
|
KY |
|
|
Family ID: |
57964988 |
Appl. No.: |
15/377473 |
Filed: |
December 13, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
14822490 |
Aug 10, 2015 |
9570573 |
|
|
15377473 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/31053 20130101;
H01L 29/45 20130101; H01L 29/7827 20130101; H01L 2221/1063
20130101; H01L 23/535 20130101; H01L 21/76895 20130101; H01L
21/76897 20130101; H01L 21/31058 20130101; H01L 29/0649 20130101;
H01L 29/4236 20130101 |
International
Class: |
H01L 23/535 20060101
H01L023/535; H01L 29/423 20060101 H01L029/423; H01L 29/78 20060101
H01L029/78; H01L 29/06 20060101 H01L029/06 |
Claims
1. A gate tie-down structure, comprising: a gate structure
including a gate conductor and gate spacers; trench contacts formed
on sides of the gate structure; an etch stop layer portion formed
on a gate spacer on one side of the gate structure and over the
trench contact on the one side of the gate structure; a first
interlevel dielectric (ILD) configured to bury the gate structure;
a second interlevel dielectric (ILD) having a thickness and being
formed on the first ILD and over the etch stop layer portion; a
self-aligned contact connecting to the trench contact on the other
side of the gate structure; a gate contact connected to the gate
conductor; and a horizontal connection within the thickness of the
second ILD formed over an active area and connecting the gate
conductor and the self-aligned contact over a gate spacer formed on
the other side of the gate structure.
2. The structure as recited in claim 1, wherein the etch stop layer
portion prevents shorts between one of the trench contacts and the
gate conductor.
3. The structure as recited in claim 1, wherein a spacer of an
adjacent gate structure remains intact throughout processing due to
a removed etch stop layer portion to prevent shorts between one of
the trench contacts and a gate conductor of an adjacent gate
structure.
4. The structure as recited in claim 1, wherein the second ILD
includes a thickness above a cap layer of adjacent gate structures,
and the horizontal connection between the gate conductor and the
self-aligned contact is formed within the second ILD thickness.
5. The structure as recited in claim 1, wherein the gate spacer
formed on the other side remains to permit contact between the
self-aligned contact and the gate contact and to prevent contact
between the trench contact and the gate conductor.
6. The structure as recited in claim 1, wherein the etch stop layer
portion includes a high-k dielectric material.
7. The structure as recited in claim 1, wherein the structure is
formed in the active area to reduce device area.
Description
BACKGROUND
[0001] Technical Field
[0002] The present invention relates to semiconductor processing,
and more particularly to a gate tie-down structure that permits
gate contacts in active areas and reduces shorts between adjacent
contacts and gate conductors.
[0003] Description of the Related Art
[0004] In conventional complementary metal oxide semiconductor
(CMOS) processing, gate contacts are formed over shallow trench
isolation (STI) regions. Gate contacts connect a gate line to upper
metal layers in device designs. In many instances, providing the
gate contacts in STI regions can result in a large amount of chip
area being lost.
[0005] Gate tie-down structures or regions provide a connection
between the gate contact and a source/drain (S/D) region contact.
The formation of a gate tie-down structure may result in shorts
between a silicide region of the S/D region or with conductive
material of an adjacent gate. This is due, in part, to the small
margins of dielectric materials between these structures and the
close proximity of the conductive bodies.
SUMMARY
[0006] A method for forming a gate tie-down includes exposing an
active area by etching dielectric material on adjacent sides of a
gate structure to open up trench contact openings; forming trench
contacts in the trench contact openings and forming an etch stop
layer on the trench contacts and on spacers of gate structures
adjacent to the trench contacts. An interlevel dielectric (ILD) is
deposited to fill over the etch stop layer in the trench contact
openings and over the gate structures adjacent to the trench
contacts. The ILD and the etch stop layer on one side of the gate
structure are opened up to provide an exposed etch stop layer
portion. The gate structure is recessed to remove a cap layer,
recess one spacer and expose a gate conductor. The exposed etch
stop layer portion is removed. A conductive material is deposited
to provide a self-aligned contact down to the trench contact on the
one side of the gate structure, to form a gate contact down to the
gate conductor and to form a horizontal connection within the ILD
over the active area between the gate conductor and the
self-aligned contact.
[0007] Another method for forming a gate tie-down includes exposing
an active area by etching dielectric material on adjacent sides of
a gate structure to open up trench contact openings; depositing a
first conductive material in the trench contact openings; recessing
the first conductive material to form trench contacts in the trench
contact openings; conformally depositing an etch stop layer on the
dielectric material, on the trench contacts and on spacers of gate
structures adjacent to the trench contacts; forming a planarizing
material over the etch stop layer; planarizing to remove the
planarizing material and the etch stop layer from a top surface;
removing the planarizing material from etch stop portions formed on
the trench contacts; depositing an interlevel dielectric (ILD) to
fill over the etch stop portions and over the gate structures
adjacent to the trench contacts; opening up the ILD and the etch
stop portion on one side of the gate structure to provide an
exposed etch stop layer portion; recessing the gate structure to
remove a cap layer, recess one spacer and expose a gate conductor;
removing the exposed etch stop layer portion; and depositing a
second conductive material to provide a self-aligned contact down
to the trench contact on the one side of the gate structure, to
form a gate contact down to the gate conductor and to form a
horizontal connection within the ILD over the active area between
the gate conductor and the self-aligned contact.
[0008] A gate tie-down structure includes a gate structure
including a gate conductor and gate spacers, trench contacts formed
on sides of the gate structure and an etch stop layer portion
formed on a gate spacer on one side of the gate structure and over
the trench contact on the one side of the gate structure. A first
interlevel dielectric (ILD) is configured to bury the gate
structure, and a second interlevel dielectric (ILD) has a thickness
and is formed on the first ILD and over the etch stop layer
portion. A self-aligned contact connects to the trench contact on
the other side of the gate structure. A gate contact is connected
to the gate conductor. A horizontal connection within the thickness
of the second ILD is formed over an active area and connects the
gate conductor and the self-aligned contact over a gate spacer
formed on the other side of the gate structure.
[0009] These and other features and advantages will become apparent
from the following detailed description of illustrative embodiments
thereof, which is to be read in connection with the accompanying
drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0010] The disclosure will provide details in the following
description of preferred embodiments with reference to the
following figures wherein:
[0011] FIG. 1 is a cross-sectional view of a semiconductor device
having gate structures formed in an interlevel dielectric (ILD) in
accordance with the present principles;
[0012] FIG. 2 is a cross-sectional view of the semiconductor device
of FIG. 1 having trench contact openings formed adjacent to a gate
structure to expose an active area in accordance with the present
principles;
[0013] FIG. 3 is a cross-sectional view of the semiconductor device
of FIG. 2 showing a conductive material formed in the trench
openings in accordance with the present principles;
[0014] FIG. 4 is a cross-sectional view of the semiconductor device
of FIG. 3 showing the conductive material planarized in accordance
with the present principles;
[0015] FIG. 5 is a cross-sectional view of the semiconductor device
of FIG. 4 showing the conductive material recessed to form trench
contacts in accordance with the present principles;
[0016] FIG. 6 is a cross-sectional view of the semiconductor device
of FIG. 5 showing an etch stop layer conformally deposited in
accordance with the present principles;
[0017] FIG. 7 is a cross-sectional view of the semiconductor device
of FIG. 6 showing a planarizing material formed over the etch stop
layer in accordance with the present principles;
[0018] FIG. 8 is a cross-sectional view of the semiconductor device
of FIG. 7 showing the planarizing material and the etch stop layer
planarized in accordance with the present principles;
[0019] FIG. 9 is a cross-sectional view of the semiconductor device
of FIG. 8 showing the planarizing material removed from etch stop
layer portions in accordance with the present principles;
[0020] FIG. 10 is a cross-sectional view of the semiconductor
device of FIG. 9 showing a top ILD formed on the etch stop layer
portions and over the gate structures in accordance with the
present principles;
[0021] FIG. 11 is a cross-sectional view of the semiconductor
device of FIG. 10 showing an open etch of the top ILD and the
formation of a self-aligned contact opening in accordance with the
present principles;
[0022] FIG. 12 is a cross-sectional view of the semiconductor
device of FIG. 11 showing an etch of a gate contact opening in
accordance with the present principles;
[0023] FIG. 13 is a cross-sectional view of the semiconductor
device of FIG. 12 showing an etch stop portion removed in
accordance with the present principles;
[0024] FIG. 14 is a cross-sectional view of the semiconductor
device of FIG. 13 showing a conductive material deposition, and the
conductive material and the top ILD planarized to form a gate
tie-down structure with a gate contact, a connection (in the top
ILD) and self-aligned contact in accordance with the present
principles; and
[0025] FIG. 15 is a block/flow diagram showing methods for forming
a gate tie-down in accordance with the present principles.
DETAILED DESCRIPTION
[0026] In accordance with the present principles, a gate tie-down
structure and methods for fabrication are provided. The gate
tie-down provides a gate contact (CB) that is able to short against
a self-aligned contact (CA) without shorting against a trench
silicide (TS) contact. The gate contact provides a connection to a
gate conductor (PC) of a gate structure employed in a transistor
device. The gate conductor in some instances may be connected to a
source or drain region. This is referred to as a gate tie-down.
Gate tie-downs in accordance with the present principles may be
provided over active regions without suffering from the shorting
issues of conventional structures.
[0027] The present principles provide methods and structures for
forming gate-tie-downs with an etch stop layer, e.g., high-k
dielectric, to encapsulate source/drain contacts. This etch stop
layer prevents breakthrough into adjacent gate conductors. In
addition, the gate tie-downs include a gate contact that is
self-aligned to a source/drain contact. The tie-down structure
provides a gate contact that can "fly" over the source/drain
contact making the design more compact saving precious chip area.
For example, the gate tie-down structure can be allowed on or over
active areas (AA). The gate contact structure enables the gate
contact to fly over a source/drain contact to reduce a layout
footprint. The gate tie-down structure may be employed in memory
devices, e.g., static random access memory (SRAM), processors, or
other chip devices.
[0028] It is to be understood that the present invention will be
described in terms of a given illustrative architecture; however,
other architectures, structures, substrate materials and process
features and steps may be varied within the scope of the present
invention.
[0029] It will also be understood that when an element such as a
layer, region or substrate is referred to as being "on" or "over"
another element, it can be directly on the other element or
intervening elements may also be present. In contrast, when an
element is referred to as being "directly on" or "directly over"
another element, there are no intervening elements present. It will
also be understood that when an element is referred to as being
"connected" or "coupled" to another element, it can be directly
connected or coupled to the other element or intervening elements
may be present. In contrast, when an element is referred to as
being "directly connected" or "directly coupled" to another
element, there are no intervening elements present.
[0030] The present embodiments may be included in an integrated
circuit or integrated circuit design. A design for an integrated
circuit chip may be created in a graphical computer programming
language, and stored in a computer storage medium (such as a disk,
tape, physical hard drive, or virtual hard drive such as in a
storage access network). If the designer does not fabricate chips
or the photolithographic masks used to fabricate chips, the
designer may transmit the resulting design by physical means (e.g.,
by providing a copy of the storage medium storing the design) or
electronically (e.g., through the Internet) to such entities,
directly or indirectly. The stored design is then converted into
the appropriate format (e.g., GDSII) for the fabrication of
photolithographic masks, which typically include multiple copies of
the chip design in question that are to be formed on a wafer. The
photolithographic masks are utilized to define areas of the wafer
(and/or the layers thereon) to be etched or otherwise
processed.
[0031] Methods as described herein may be used in the fabrication
of integrated circuit chips. The resulting integrated circuit chips
can be distributed by the fabricator in raw wafer form (that is, as
a single wafer that has multiple unpackaged chips), as a bare die,
or in a packaged form. In the latter case the chip is mounted in a
single chip package (such as a plastic carrier, with leads that are
affixed to a motherboard or other higher level carrier) or in a
multichip package (such as a ceramic carrier that has either or
both surface interconnections or buried interconnections). In any
case the chip is then integrated with other chips, discrete circuit
elements, and/or other signal processing devices as part of either
(a) an intermediate product, such as a motherboard, or (b) an end
product. The end product can be any product that includes
integrated circuit chips, ranging from toys and other low-end
applications to advanced computer products having a display, a
keyboard or other input device, and a central processor.
[0032] Reference in the specification to "one embodiment" or "an
embodiment" of the present principles, as well as other variations
thereof, means that a particular feature, structure,
characteristic, and so forth described in connection with the
embodiment is included in at least one embodiment of the present
principles. Thus, the appearances of the phrase "in one embodiment"
or "in an embodiment", as well any other variations, appearing in
various places throughout the specification are not necessarily all
referring to the same embodiment.
[0033] It is to be appreciated that the use of any of the following
"/", "and/or", and "at least one of", for example, in the cases of
"A/B", "A and/or B" and "at least one of A and B", is intended to
encompass the selection of the first listed option (A) only, or the
selection of the second listed option (B) only, or the selection of
both options (A and B). As a further example, in the cases of "A,
B, and/or C" and "at least one of A, B, and C", such phrasing is
intended to encompass the selection of the first listed option (A)
only, or the selection of the second listed option (B) only, or the
selection of the third listed option (C) only, or the selection of
the first and the second listed options (A and B) only, or the
selection of the first and third listed options (A and C) only, or
the selection of the second and third listed options (B and C)
only, or the selection of all three options (A and B and C). This
may be extended, as readily apparent by one of ordinary skill in
this and related arts, for as many items listed.
[0034] Referring now to the drawings in which like numerals
represent the same or similar elements and initially to FIG. 1, a
cross-sectional view of a partially fabricated semiconductor device
10 is shown in accordance with the present principles. The device
10 is formed on a substrate 12, which may include any suitable
substrate materials, such as Si, SiGe, SiC, III-V etc. Gate
structures 18 are formed on the substrate 12 and may include
source/drain (S/D) regions 26 adjacent to the gate structures 18.
The gate structures 18 may include a gate dielectric 28 (e.g., an
oxide) and a gate conductor 22, which may include a metal, doped
polysilicon or other suitable gate conductor material. Spacers 20
are formed on sidewalls of the gate conductor 22, and a cap layer
24 is formed over the gate conductor 22. The spacers 20 and the cap
24 may include a silicon nitride material, although other
dielectric materials may be employed. Gate structures 18 are buried
in an interlevel dielectric (ILD) material 14, such as an oxide.
Another ILD 16 is formed over the gate structures 18 and on the
first ILD 14. The ILD 16 may also include an oxide.
[0035] Referring to FIG. 2, recesses or trenches 30 are etched
through the ILD 14 and ILD 16 for selected gate structures 18. The
recesses 30 are formed to gain access to the S/D regions 26
adjacent to the spacers 20 of the gate structures 18. The recesses
30 are formed by performing a lithographic patterning process
followed by an etch process to open the recesses 30 and expose the
S/D regions 26. The etch process may include a reactive ion etch
(RIE) selective to the cap layer 24 and spacers 20 (e.g., nitride
material) of the gate structures 18. The recesses 30 allow for a
self-aligned contact to be provided as will be described.
[0036] Referring to FIG. 3, a deposition process is performed to
fill trenches 30 between spacers 20 of adjacent gate structures 18
and over the ILD 16 with a conductive material 32. The deposition
process may include a chemical vapor deposition (CVD) process
although other deposition processes may be employed. The conductive
material 32 may include W, although other metals may be employed,
e.g., Al, Cu, Ag, etc. The conductive material 32 connects to the
S/D regions 26. The conductive material 32 preferably includes the
same materials as the gate conductors 22.
[0037] Referring to FIG. 4, a planarization process is performed to
planarize a top surface of the device 10 to remove excess
conductive material 32. The planarization process may include a
chemical mechanical polish (CMP) process. The planarization process
removes the ILD 16 down to the cap layer 24.
[0038] Referring to FIG. 5, a recess process is performed to recess
the conductive material 32 to a position along the spacers 20. The
recess process may include a RIE process that selectively removes
the conductive material 32 relative to the ILD 14, the spacers 20
and the cap layer 24. In one embodiment, the ILD 14 includes oxide,
and the spacers 20 and cap layer 24 include nitride. Recessing the
conductive material 32 forms trench silicide (TS) contacts 36,
which contact the S/D regions 26 (also called S/D contacts). The
recess process forms recesses 34.
[0039] Referring to FIG. 6, an etch stop layer 38 is conformally
formed on the ILD 14 and in the recesses 34 on the cap layer 24 and
over the spacers 20 of the gate structure 18. The etch stop layer
38 may include a high selective etch stop layer (HS-ESL) and may
include a high-k dielectric material, such as e.g., HfO.sub.2,
AlO.sub.2, Ta.sub.2O.sub.5, etc., although other materials may be
employed. The etch stop layer 38 preferably includes a selectivity
greater than that of the cap layer 24 and the spacers 20 (e.g.,
greater than silicon nitride in one embodiment).
[0040] Referring to FIG. 7, a spin-on or deposition process is
performed to fill recesses 34 on the etch stop layer 38 on the gate
structures 18 with a planarizing material 40. In one embodiment,
the material 40 includes a spin-on organic dielectric material,
such as, e.g., polyimide, polynorbornenes, benzocyclobutene or
similar spin-on organic dielectric material.
[0041] Referring to FIG. 8, a planarization process is performed to
planarize a top surface of the device 10 to remove excess material
40 and etch stop layer 38 down to the cap layer 24. The
planarization process may include a CMP process.
[0042] Referring to FIG. 9, a selective etch process may be
performed to remove the material 40 from the etch stop layer 38 in
the recesses 34. The etch process may include RIE, which is
selective to the material of the cap layer 24, the ILD 14 and the
etch stop layer 38.
[0043] Referring to FIG. 10, another ILD 42 is deposited on the
device 10. The ILD 42 may include an oxide although other
dielectric materials may be employed. The ILD 42 fills the recesses
34 and covers the cap layer 24 and the ILD 14.
[0044] Referring to FIG. 11, a lithographic patterning process is
employed to form an opening 44 through the ILD 42. Once patterned
the ILD 42 is etched to remove material from opening 44 and within
region 52. The etch process selectively removes the ILD material
(e.g., oxide) with respect to the etch stop layer 38 and the cap
layer 24. The etch process may include a RIE.
[0045] Referring to FIG. 12, another lithographic patterning
process is employed to open the cap layer 24 to expose the gate
conductor 22 and recess one spacer 20. The etch process removes the
cap layer 24 and exposes a portion 48 of the other spacer 20 to
form region 50. A portion 46 of the etch stop layer 38 may be
thinned by the etching process. The etch process selectively
removes the cap layer 24, spacer 20 relative to the ILD material 42
(e.g., oxide) and the etch stop layer 38. The etch process may
include a directional RIE.
[0046] Referring to FIG. 13, another lithographic patterning
process is employed to remove the exposed portion of the etch stop
layer 38 selectively to the ILD 42, gate conductor 22 and spacers
20 (e.g., selective to oxide and nitride). With the etch stop layer
38 removed, a contact opening 54 is made for a self-aligned contact
(CA) down to the TS contact 36. In addition, a contact opening 56
is made for a gate contact (CB).
[0047] Referring to FIG. 14, a deposition process is performed to
deposit a conductive material 60 to form gate contacts 64 (CB),
self-aligned contacts 62 (CA), and a gate tie-down structure 66.
The conductive material 60 preferably includes a same material as
employed for TS contacts 36 and gate conductor 22. In one
embodiment, the conductive material 60 includes W, although other
metals may be employed. The conductive material 60 and the ILD 42
are planarized to recess the material 60 such that a portion of the
conductive material 60 forms a connection 74 between the gate
contact 64 and the contact 62 (that connects to the TS contact 36).
The connection 74 is buried within a thickness of the ILD 42.
[0048] In accordance with the present principles, the gate tie-down
structure 66 provides a self-aligned gate contact (CB) 64 that
shorts directly to contact 62 (CA) and not directly to the TS
contact 36. A spacer 68 along with the etch stop layer 38 prevents
shorts between the adjacent contact 36 and the gate conductor 22. A
spacer 70 prevents shorts between the adjacent contact 36 and the
gate conductor 22 (shorts in this region occurred in conventional
structures). A spacer 72 provides a dielectric barrier that
prevents direct shorting between the gate contact 64 and the TS
contact 36. In addition, the gate contact 64 is self-aligned with
the self-aligned contact 36. The gate contact 64 is made within the
active region (over S/D regions 26). This reduces the layout
footprint of the device 10. In other words, a horizontal connection
74 is made directly between the gate contact 64 and the
self-aligned contact 62 using vertical space provided by the ILD
42. This connection 74 is made without having to use layout area,
which would normally be consumed by placing the connections over an
STI region outside of the S/D regions (active area). The present
principles may be implemented in 7 nm technology, although other
technology sizes (larger or smaller may benefit from the present
principles).
[0049] Referring to FIG. 15, methods for forming a gate tie-down
are shown in accordance with the present principles. In some
alternative implementations, the functions noted in the blocks may
occur out of the order noted in the figures. For example, two
blocks shown in succession may, in fact, be executed substantially
concurrently, or the blocks may sometimes be executed in the
reverse order, depending upon the functionality involved. It will
also be noted that each block of the block diagrams and/or
flowchart illustration, and combinations of blocks in the block
diagrams and/or flowchart illustration, can be implemented by
special purpose hardware-based systems that perform the specified
functions or acts or carry out combinations of special purpose
hardware and computer instructions.
[0050] In block 102, after gate structures and source and drain
(S/D) regions are formed, an active area is exposed by etching
dielectric material on adjacent sides of a gate structure to open
up trench contact openings. In block 104, a conductive material is
deposited in the trench contact openings. In block 106, the
conductive material is recessed to form trench contacts in the
trench contact openings. In block 108, an etch stop layer is
conformally deposited on the dielectric material, on the trench
contacts and on spacers of gate structures adjacent to the trench
contacts. The etch stop layer may include a high-k dielectric
material.
[0051] In block 110, a planarizing material is optionally formed
over the etch stop layer. The planarizing material may include a
spun on organic material. In block 112, planarizing material and
the etch stop layer are planarized to remove them from a top
surface. In block 114, the planarizing material is removed from
etch stop portions formed on the trench contacts.
[0052] In block 116, an interlevel dielectric (ILD) is deposited to
fill over the etch stop portions and over the gate structures
adjacent to the trench contacts. In block 118, the ILD and the etch
stop portion are opened up on one side of the gate structure to
provide an exposed etch stop layer portion. In block 120, the gate
structure is recessed to remove a cap layer, recess one spacer and
expose a gate conductor. The recessed spacer remains to permit
contact between a self-aligned contact and a gate contact (which
will be formed) and to prevent contact between the trench contact
and the gate conductor.
[0053] In block 122, the exposed etch stop layer portion is
removed. In block 124, another conductive material is deposited to
provide a self-aligned contact down to the trench contact on the
one side of the gate structure, to form a gate contact down to the
gate conductor and to form a horizontal connection within the ILD
over the active area between the gate conductor and the
self-aligned contact. The etch stop portion opposite the one side
of the gate structure remains with a corresponding spacer of the
gate structure to prevent shorts between one of the trench contacts
and the gate conductor. The exposed etch stop layer portion
prevents erosion of a spacer of an adjacent gate structure to
prevent shorts between one of the trench contacts and a gate
conductor of an adjacent gate structure. The ILD includes a
thickness above the cap layer of the gate structures, and the
horizontal connection between the gate conductor and the
self-aligned contact is formed within the ILD thickness. In block
126, processing continues to complete the device.
[0054] Having described preferred embodiments for gate tie-down
with a highly selective etch stop liner (which are intended to be
illustrative and not limiting), it is noted that modifications and
variations can be made by persons skilled in the art in light of
the above teachings. It is therefore to be understood that changes
may be made in the particular embodiments disclosed which are
within the scope of the invention as outlined by the appended
claims. Having thus described aspects of the invention, with the
details and particularity required by the patent laws, what is
claimed and desired protected by Letters Patent is set forth in the
appended claims.
* * * * *