Patent | Date |
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Reversible Resistive Memory Logic Gate Device App 20220310908 - Chen; Hsueh-Chung ;   et al. | 2022-09-29 |
Sacrificial Fin For Contact Self-alignment App 20220262923 - Mignot; Yann ;   et al. | 2022-08-18 |
Wrapped-around Contact For Vertical Field Effect Transistor Top Source-drain App 20220199785 - Xie; Ruilong ;   et al. | 2022-06-23 |
Stacked Vertical Transport Field-effect Transistor Logic Gate Structures With Shared Epitaxial Layers App 20220181321 - Kang; Tsung-Sheng ;   et al. | 2022-06-09 |
Three-dimensional Field Effect Device App 20220130992 - Zhou; Huimei ;   et al. | 2022-04-28 |
Sacrificial fin for contact self-alignment Grant 11,316,029 - Mignot , et al. April 26, 2 | 2022-04-26 |
Formation of contacts for semiconductor devices Grant 11,227,801 - Xie , et al. January 18, 2 | 2022-01-18 |
Three-dimensional field effect device Grant 11,222,981 - Zhou , et al. January 11, 2 | 2022-01-11 |
Self-aligned contacts for MOL Grant 11,205,590 - Fan , et al. December 21, 2 | 2021-12-21 |
Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability Grant 11,205,587 - Fan , et al. December 21, 2 | 2021-12-21 |
Silicide Formation For Source/drain Contact In A Vertical Transport Field-effect Transistor App 20210391224 - Wu; Heng ;   et al. | 2021-12-16 |
Layout Design for Threshold Voltage Tuning App 20210384139 - ZHOU; Huimei ;   et al. | 2021-12-09 |
Three-dimensional field effect device Grant 11,183,593 - Zhou , et al. November 23, 2 | 2021-11-23 |
Contacts And Liners Having Multi-segmented Protective Caps App 20210351073 - Fullam; Jennifer ;   et al. | 2021-11-11 |
Contacts and liners having multi-segmented protective caps Grant 11,171,051 - Fullam , et al. November 9, 2 | 2021-11-09 |
Barrier-free vertical interconnect structure Grant 11,164,778 - Wang , et al. November 2, 2 | 2021-11-02 |
Silicide formation for source/drain contact in a vertical transport field-effect transistor Grant 11,158,543 - Wu , et al. October 26, 2 | 2021-10-26 |
Sacrificial Fin For Contact Self-alignment App 20210328041 - Mignot; Yann ;   et al. | 2021-10-21 |
Cmos Top Source/drain Region Doping And Epitaxial Growth For A Vertical Field Effect Transistor App 20210305104 - Wu; Heng ;   et al. | 2021-09-30 |
Formation Of Contacts For Semiconductor Devices App 20210296178 - Xie; Ruilong ;   et al. | 2021-09-23 |
Middle-of-line interconnect having low metal-to-metal interface resistance Grant 11,114,382 - Varghese , et al. September 7, 2 | 2021-09-07 |
Self-aligned contacts for vertical field effect transistors Grant 11,081,566 - Fan , et al. August 3, 2 | 2021-08-03 |
Metal contact isolation for semiconductor structures Grant 11,063,126 - Fan , et al. July 13, 2 | 2021-07-13 |
Barrier-free Vertical Interconnect Structure App 20210159117 - Wang; Junli ;   et al. | 2021-05-27 |
Method and structure of metal cut Grant 11,011,417 - Fan , et al. May 18, 2 | 2021-05-18 |
Three-dimensional Field Effect Device App 20210118873 - Zhou; Huimei ;   et al. | 2021-04-22 |
Three-dimensional field effect device Grant 10,971,490 - Zhou , et al. April 6, 2 | 2021-04-06 |
Stack viabar structures Grant 10,971,356 - Fan , et al. April 6, 2 | 2021-04-06 |
Self-Aligned Contacts for MOL App 20210090950 - Fan; Su Chen ;   et al. | 2021-03-25 |
Extreme ultraviolet lithography patterning with directional deposition Grant 10,957,552 - Xu , et al. March 23, 2 | 2021-03-23 |
Gate contact over active enabled by alternative spacer scheme and claw-shaped cap Grant 10,943,990 - Greene , et al. March 9, 2 | 2021-03-09 |
Self-aligned contact for vertical field effect transistor Grant 10,896,972 - Anderson , et al. January 19, 2 | 2021-01-19 |
Silicide Formation For Source/drain Contact In A Vertical Transport Field-effect Transistor App 20210013108 - Wu; Heng ;   et al. | 2021-01-14 |
Low-resistance Top Contact On Vtfet App 20210005735 - Waskiewicz; Christopher J. ;   et al. | 2021-01-07 |
Gate tie-down enablement with inner spacer Grant 10,879,375 - Fan , et al. December 29, 2 | 2020-12-29 |
Method And Structure Of Metal Cut App 20200381296 - Fan; Su Chen ;   et al. | 2020-12-03 |
Gate contact over active region with self-aligned source/drain contact Grant 10,832,943 - Fan , et al. November 10, 2 | 2020-11-10 |
Low-resistance top contact on VTFET Grant 10,833,173 - Waskiewicz , et al. November 10, 2 | 2020-11-10 |
Sacrificial gate spacer regions for gate contacts formed over the active region of a transistor Grant 10,832,961 - Fan , et al. November 10, 2 | 2020-11-10 |
Method and structure for cost effective enhanced self-aligned contacts Grant 10,818,548 - Lai , et al. October 27, 2 | 2020-10-27 |
Sacrificial Gate Spacer Regions For Gate Contacts Formed Over The Active Region Of A Transistor App 20200335401 - Fan; Su Chen ;   et al. | 2020-10-22 |
Buried contact to provide reduced VFET feature-to-feature tolerance requirements Grant 10,804,148 - Fan , et al. October 13, 2 | 2020-10-13 |
Gate Contact Over Active Region With Self-aligned Source/drain Contact App 20200321244 - Fan; Su Chen ;   et al. | 2020-10-08 |
Buried contact to provide reduced VFET feature-to-feature tolerance requirements Grant 10,796,957 - Fan , et al. October 6, 2 | 2020-10-06 |
Self-aligned Contacts For Vertical Field Effect Transistors App 20200295156 - Fan; Su Chen ;   et al. | 2020-09-17 |
Metal Contact Isolation For Semiconductor Structures App 20200279925 - Fan; Su Chen ;   et al. | 2020-09-03 |
Bottom contact formation for vertical transistor devices Grant 10,727,317 - Fan , et al. | 2020-07-28 |
Stack Viabar Structures App 20200203156 - FAN; Su Chen ;   et al. | 2020-06-25 |
Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability Grant 10,685,876 - Fan , et al. | 2020-06-16 |
Extreme ultraviolet lithography patterning with directional deposition Grant 10,658,190 - Xu , et al. | 2020-05-19 |
Stack Viabar Structures App 20200135457 - FAN; Su Chen ;   et al. | 2020-04-30 |
Gate Contact Over Active Enabled by Alternative Spacer Scheme and Claw-Shaped Cap App 20200135886 - Greene; Andrew ;   et al. | 2020-04-30 |
Middle-of-line Interconnect Having Low Metal-to-metal Interface Resistance App 20200126926 - Varghese; Alex Joseph ;   et al. | 2020-04-23 |
Self-aligned contact for vertical field effect transistor Grant 10,622,458 - Anderson , et al. | 2020-04-14 |
Bottom Contact Formation For Vertical Transistor Devices App 20200111895 - Fan; Su Chen ;   et al. | 2020-04-09 |
Stack viabar structures Grant 10,615,027 - Fan , et al. | 2020-04-07 |
Extreme Ultraviolet Lithography Patterning With Directional Deposition App 20200098578 - Xu; Yongan ;   et al. | 2020-03-26 |
Extreme Ultraviolet Lithography Patterning With Directional Deposition App 20200098581 - Xu; Yongan ;   et al. | 2020-03-26 |
Liner And Cap Structures For Reducing Local Interconnect Vertical Resistance Without Compromising Reliability App 20200090990 - Fan; Su Chen ;   et al. | 2020-03-19 |
Liner And Cap Structures For Reducing Local Interconnect Vertical Resistance Without Compromising Reliability App 20200090989 - Fan; Su Chen ;   et al. | 2020-03-19 |
Low-resistance Top Contact On Vtfet App 20200075746 - Waskiewicz; Christopher J. ;   et al. | 2020-03-05 |
Self-aligned Contact For Vertical Field Effect Transistor App 20200052096 - Anderson; Brent A. ;   et al. | 2020-02-13 |
Three-dimensional Field Effect Device App 20200035824 - Zhou; Huimei ;   et al. | 2020-01-30 |
Three-dimensional Field Effect Device App 20200035823 - Zhou; Huimei ;   et al. | 2020-01-30 |
Gate tie-down enablement with inner spacer Grant 10,522,654 - Fan , et al. Dec | 2019-12-31 |
Vertical field effect transistor with self-aligned contacts Grant 10,497,798 - Xie , et al. De | 2019-12-03 |
Gate Tie-down Enablement With Inner Spacer App 20190363178 - Fan; Su Chen ;   et al. | 2019-11-28 |
Embedded bottom metal contact formed by a self-aligned contact process for vertical transistors Grant 10,490,653 - Fan , et al. Nov | 2019-11-26 |
Three-dimensional field effect device Grant 10,490,667 - Zhou , et al. Nov | 2019-11-26 |
Three-dimensional Field Effect Device App 20190355717 - Zhou; Huimei ;   et al. | 2019-11-21 |
Three-dimensional Field Effect Device App 20190355845 - Zhou; Huimei ;   et al. | 2019-11-21 |
Local interconnect structure including non-eroded contact via trenches Grant 10,388,602 - Fan , et al. A | 2019-08-20 |
Vertical Field Effect Transistor With Self-aligned Contacts App 20190252267 - Xie; Ruilong ;   et al. | 2019-08-15 |
Gate tie-down enablement with inner spacer Grant 10,332,977 - Fan , et al. | 2019-06-25 |
Replacement metal gate stack for diffusion prevention Grant 10,332,971 - Ando , et al. | 2019-06-25 |
Embedded bottom metal contact formed by a self-aligned contact process for vertical transistors Grant 10,319,835 - Fan , et al. | 2019-06-11 |
Method of forming vertical FinFET device having self-aligned contacts Grant 10,312,154 - Xie , et al. | 2019-06-04 |
Self-aligned Contacts For Vertical Field Effect Transistor Cell Height Scaling App 20190088764 - XIE; Ruilong ;   et al. | 2019-03-21 |
Buried Contact To Provide Reduced Vfet Feature-to-feature Tolerance Requirements App 20190067100 - Fan; Su Chen ;   et al. | 2019-02-28 |
Buried Contact To Provide Reduced Vfet Feature-to-feature Tolerance Requirements App 20190067101 - Fan; Su Chen ;   et al. | 2019-02-28 |
Reflow interconnect using Ru Grant 10,217,664 - Clevenger , et al. Feb | 2019-02-26 |
Reflow interconnect using Ru Grant 10,211,101 - Clevenger , et al. Feb | 2019-02-19 |
Forming Self-Aligned Contact with Spacer First App 20190027580 - Fan; Su Chen ;   et al. | 2019-01-24 |
Forming self-aligned contact with spacer first Grant 10,186,599 - Fan , et al. Ja | 2019-01-22 |
Gate Tie-down Enablement With Inner Spacer App 20180374932 - Fan; Su Chen ;   et al. | 2018-12-27 |
Embedded Bottom Metal Contact Formed By A Self-aligned Contact Process For Vertical Transistors App 20180337257 - Fan; Su Chen ;   et al. | 2018-11-22 |
Embedded Bottom Metal Contact Formed By A Self-aligned Contact Process For Vertical Transistors App 20180337260 - Fan; Su Chen ;   et al. | 2018-11-22 |
Self-aligned Contact For Vertical Field Effect Transistor App 20180337256 - Anderson; Brent A. ;   et al. | 2018-11-22 |
Gate tie-down enablement with inner spacer Grant 10,128,352 - Fan , et al. November 13, 2 | 2018-11-13 |
REFLOW INTERCONNECT USING Ru App 20180277432 - Clevenger; Lawrence A. ;   et al. | 2018-09-27 |
REFLOW INTERCONNECT USING Ru App 20180277433 - Clevenger; Lawrence A. ;   et al. | 2018-09-27 |
Embedded bottom metal contact formed by a self-aligned contact process for vertical transistors Grant 10,020,381 - Fan , et al. July 10, 2 | 2018-07-10 |
Gate Tie-down Enablement With Inner Spacer App 20180151433 - Fan; Su Chen ;   et al. | 2018-05-31 |
Stable multiple threshold voltage devices on replacement metal gate CMOS devices Grant 9,985,027 - Fan , et al. May 29, 2 | 2018-05-29 |
Reflow interconnect using Ru Grant 9,960,078 - Clevenger , et al. May 1, 2 | 2018-05-01 |
Replacement gate structures for transistor devices Grant 9,953,978 - Xie , et al. April 24, 2 | 2018-04-24 |
Gate tie-down enablement with inner spacer Grant 9,941,163 - Fan , et al. April 10, 2 | 2018-04-10 |
Gate tie-down enablement with inner spacer Grant 9,929,049 - Fan , et al. March 27, 2 | 2018-03-27 |
Replacement Metal Gate Stack For Diffusion Prevention App 20180083117 - Ando; Takashi ;   et al. | 2018-03-22 |
Replacement metal gate stack for diffusion prevention Grant 9,905,665 - Ando , et al. February 27, 2 | 2018-02-27 |
Gate tie-down enablement with inner spacer Grant 9,899,259 - Fan , et al. February 20, 2 | 2018-02-20 |
Wimpy and nominal semiconductor device structures for vertical finFETs Grant 9,881,842 - Chung , et al. January 30, 2 | 2018-01-30 |
Gate Tie-down Enablement With Inner Spacer App 20170372959 - Fan; Su Chen ;   et al. | 2017-12-28 |
Interconnect structure including middle of line (MOL) metal layer local interconnect on ETCH stop layer Grant 9,786,607 - Fan , et al. October 10, 2 | 2017-10-10 |
Gate Tie-down Enablement With Inner Spacer App 20170278753 - Fan; Su Chen ;   et al. | 2017-09-28 |
Gate tie-down enablement with inner spacer Grant 9,735,054 - Fan , et al. August 15, 2 | 2017-08-15 |
Interconnect structure including middle of line (MOL) metal layer local interconnect on etch stop layer Grant 9,728,456 - Fan , et al. August 8, 2 | 2017-08-08 |
Stable multiple threshold voltage devices on replacement metal gate CMOS devices Grant 9,728,462 - Fan , et al. August 8, 2 | 2017-08-08 |
Local Interconnect Structure Including Non-eroded Contact Via Trenches App 20170170118 - Fan; Su Chen ;   et al. | 2017-06-15 |
Gate Tie-down Enablement With Inner Spacer App 20170170070 - Fan; Su Chen ;   et al. | 2017-06-15 |
Gate Tie-down Enablement With Inner Spacer App 20170162438 - Fan; Su Chen ;   et al. | 2017-06-08 |
Interconnect Structure Including Middle Of Line (mol) Metal Layer Local Interconnect On Etch Stop Layer App 20170140984 - Fan; Su Chen ;   et al. | 2017-05-18 |
Freestanding spacer having sub-lithographic lateral dimension and method of forming same Grant 9,653,571 - Chen , et al. May 16, 2 | 2017-05-16 |
Gate tie-down enablement with inner spacer Grant 9,627,257 - Fan , et al. April 18, 2 | 2017-04-18 |
Self-aligned Gate Tie-down Contacts With Selective Etch Stop Liner App 20170092585 - Fan; Su Chen ;   et al. | 2017-03-30 |
Stable Multiple Threshold Voltage Devices On Replacement Metal Gate Cmos Devices App 20170077098 - Fan; Su Chen ;   et al. | 2017-03-16 |
Interconnect structure including middle of line (MOL) metal layer local interconnect on etch stop layer Grant 9,583,442 - Fan , et al. February 28, 2 | 2017-02-28 |
Contact area structure and method for manufacturing the same Grant 9,576,901 - Chen , et al. February 21, 2 | 2017-02-21 |
Gate Tie-down Enablement With Inner Spacer App 20170047254 - Fan; Su Chen ;   et al. | 2017-02-16 |
Gate Tie-down Enablement With Inner Spacer App 20170047252 - Fan; Su Chen ;   et al. | 2017-02-16 |
Self-aligned Gate Tie-down Contacts With Selective Etch Stop Liner App 20170047418 - Fan; Su Chen ;   et al. | 2017-02-16 |
Self-aligned gate tie-down contacts with selective etch stop liner Grant 9,570,573 - Fan , et al. February 14, 2 | 2017-02-14 |
Local interconnect structure including non-eroded contact via trenches Grant 9,570,397 - Fan , et al. February 14, 2 | 2017-02-14 |
Interconnect Structure Including Middle Of Line (mol) Metal Layer Local Interconnect On Etch Stop Layer App 20170018459 - Fan; Su Chen ;   et al. | 2017-01-19 |
Stable multiple threshold voltage devices on replacement metal gate CMOS devices Grant 9,536,791 - Fan , et al. January 3, 2 | 2017-01-03 |
Interconnect Structure Including Middle Of Line (mol) Metal Layer Local Interconnect On Etch Stop Layer App 20160379932 - Fan; Su Chen ;   et al. | 2016-12-29 |
Freestanding Spacer Having Sub-lithographic Lateral Dimension And Method Of Forming Same App 20160365425 - Chen; Hsueh-Chung ;   et al. | 2016-12-15 |
Stable Multiple Threshold Voltage Devices On Replacement Metal Gate Cmos Devices App 20160293493 - Fan; Su Chen ;   et al. | 2016-10-06 |
Stable Multiple Threshold Voltage Devices On Replacement Metal Gate Cmos Devices App 20160293492 - Fan; Su Chen ;   et al. | 2016-10-06 |
Methods of forming a combined gate and source/drain contact structure and the resulting device Grant 9,455,254 - Xie , et al. September 27, 2 | 2016-09-27 |
Gate tie-down enablement with inner spacer Grant 9,397,049 - Fan , et al. July 19, 2 | 2016-07-19 |
Replacement Metal Gate Stack For Diffusion Prevention App 20160197157 - Ando; Takashi ;   et al. | 2016-07-07 |
STI region for small fin pitch in FinFET devices Grant 9,385,123 - Chen , et al. July 5, 2 | 2016-07-05 |
Methods Of Forming A Combined Gate And Source/drain Contact Structure And The Resulting Device App 20160133623 - Xie; Ruilong ;   et al. | 2016-05-12 |
Replacement Gate Structures For Transistor Devices App 20160118385 - Xie; Ruilong ;   et al. | 2016-04-28 |
Replacement metal gate stack for diffusion prevention Grant 9,312,136 - Ando , et al. April 12, 2 | 2016-04-12 |
Integrated multiple gate length semiconductor device including self-aligned contacts Grant 9,293,551 - Fan , et al. March 22, 2 | 2016-03-22 |
Method for single fin cuts using selective ion implants Grant 9,287,130 - Cai , et al. March 15, 2 | 2016-03-15 |
Methods of forming replacement gate structures for transistors and the resulting devices Grant 9,257,348 - Xie , et al. February 9, 2 | 2016-02-09 |
Sti Region For Small Fin Pitch In Finfet Devices App 20150357328 - Chen; Hsueh-Chung ;   et al. | 2015-12-10 |
Integrated Multiple Gate Length Semiconductor Device Including Self-aligned Contacts App 20150349075 - Fan; Su Chen ;   et al. | 2015-12-03 |
Sti Region For Small Fin Pitch In Finfet Devices App 20150340272 - Chen; Hsueh-Chung ;   et al. | 2015-11-26 |
Recessing And Capping Of Gate Structures With Varying Metal Compositions App 20150340462 - XIE; Ruilong ;   et al. | 2015-11-26 |
Replacement Metal Gate Stack For Diffusion Prevention App 20150255458 - Ando; Takashi ;   et al. | 2015-09-10 |
Recessing and capping of gate structures with varying metal compositions Grant 9,130,029 - Xie , et al. September 8, 2 | 2015-09-08 |
Borderless Contact For Ultra-thin Body Devices App 20150155353 - Fan; Su Chen ;   et al. | 2015-06-04 |
Integrated Multiple Gate Length Semiconductor Device Including Self-aligned Contacts App 20150145057 - Fan; Su Chen ;   et al. | 2015-05-28 |
Borderless contact for ultra-thin body devices Grant 9,024,389 - Fan , et al. May 5, 2 | 2015-05-05 |
Formation of the dielectric cap layer for a replacement gate structure Grant 8,957,465 - Xie , et al. February 17, 2 | 2015-02-17 |
Methods Of Forming Replacement Gate Structures For Transistors And The Resulting Devices App 20150041905 - Xie; Ruilong ;   et al. | 2015-02-12 |
Formation Of The Dielectric Cap Layer For A Replacement Gate Structure App 20140299924 - XIE; Ruilong ;   et al. | 2014-10-09 |
Self-aligned contacts Grant 8,853,076 - Fan , et al. October 7, 2 | 2014-10-07 |
Formation of the dielectric cap layer for a replacement gate structure Grant 8,772,168 - Xie , et al. July 8, 2 | 2014-07-08 |
Recessing And Capping Of Gate Structures With Varying Metal Compositions App 20140159169 - XIE; Ruilong ;   et al. | 2014-06-12 |
Borderless contacts in semiconductor devices Grant 8,741,752 - Fan , et al. June 3, 2 | 2014-06-03 |
Recessing and capping of gate structures with varying metal compositions Grant 8,679,909 - Xie , et al. March 25, 2 | 2014-03-25 |
Method for forming a self-aligned contact opening by a lateral etch Grant 8,679,968 - Xie , et al. March 25, 2 | 2014-03-25 |
Self-aligned Contacts App 20140070282 - Fan; Su Chen ;   et al. | 2014-03-13 |
Borderless contacts in semiconductor devices Grant 8,637,908 - Fan , et al. January 28, 2 | 2014-01-28 |
Recessing And Capping Of Gate Structures With Varying Metal Compositions App 20130328111 - Xie; Ruilong ;   et al. | 2013-12-12 |
Borderless Contacts For Metal Gates Through Selective Cap Deposition App 20130320414 - Fan; Su-Chen ;   et al. | 2013-12-05 |
Borderless Contacts For Metal Gates Through Selective Cap Deposition App 20130320411 - Fan; Su-Chen ;   et al. | 2013-12-05 |
Method For Forming A Self-aligned Contact Opening By A Lateral Etch App 20130307087 - Xie; Ruilong ;   et al. | 2013-11-21 |
Formation Of The Dielectric Cap Layer For A Replacement Gate Structure App 20130187203 - XIE; Ruilong ;   et al. | 2013-07-25 |
Borderless Contact For Ultra-thin Body Devices App 20130134517 - Fan; Su Chen ;   et al. | 2013-05-30 |
Multi-gate Field-effect Transistors With Variable Fin Heights App 20130082329 - Chen; Hsueh-Chung ;   et al. | 2013-04-04 |
Multi-gate Field-effect Transistors With Variable Fin Heights App 20130082333 - Chen; Hsueh-Chung ;   et al. | 2013-04-04 |
Borderless contact for ultra-thin body devices Grant 8,383,490 - Fan , et al. February 26, 2 | 2013-02-26 |
Borderless Contact For Ultra-thin Body Devices App 20130026570 - Fan; Su Chen ;   et al. | 2013-01-31 |
Borderless Contacts in Semiconductor Devices App 20130020615 - Fan; Su Chen ;   et al. | 2013-01-24 |
Borderless Contacts in Semiconductor Devices App 20130023115 - Fan; Su Chen ;   et al. | 2013-01-24 |
Three dimensional IC device and alignment methods of IC device substrates Grant 8,232,659 - Chen , et al. July 31, 2 | 2012-07-31 |
Method of forming self-aligned local interconnect and structure formed thereby Grant 8,124,525 - Koburger, III , et al. February 28, 2 | 2012-02-28 |
Method of forming replacement metal gate with borderless contact and structure thereof Grant 8,084,311 - Horak , et al. December 27, 2 | 2011-12-27 |
Interconnect structure and method of fabricating same Grant 7,781,892 - Chen , et al. August 24, 2 | 2010-08-24 |
Three Dimensional Ic Device And Alignment Methods Of Ic Device Substrates App 20080157407 - CHEN; Hsueh-Chung ;   et al. | 2008-07-03 |
Three dimensional IC device and alignment methods of IC device substrates Grant 7,371,663 - Chen , et al. May 13, 2 | 2008-05-13 |
Direct printing lithography system and method App 20070289467 - Chen; Hsueh-Chung ;   et al. | 2007-12-20 |
Wiring structure to minimize stress induced void formation Grant 7,301,239 - Wang , et al. November 27, 2 | 2007-11-27 |
Interconnect structure and method of fabricating same App 20070145596 - Chen; Hsueh-Chung ;   et al. | 2007-06-28 |
Three dimensional IC device and alignment methods of IC device substrates App 20070020871 - Chen; Hsueh-Chung ;   et al. | 2007-01-25 |
Copper interconnect structure with modulated topography and method for forming the same App 20060099786 - Fan; Su-Chen ;   et al. | 2006-05-11 |
Wiring structure to minimize stress induced void formation App 20060019414 - Wang; Chien-Jung ;   et al. | 2006-01-26 |
Interconnect structure for integrated circuits App 20050082677 - Fan, Su-Chen ;   et al. | 2005-04-21 |
Pre-treatment for salicide process App 20040222083 - Fan, Su-Chen | 2004-11-11 |
Pre-treatment for salicide process Grant 6,743,485 - Fan June 1, 2 | 2004-06-01 |
Pre-treatment for salicide process App 20020112951 - Fan, Su-Chen | 2002-08-22 |
Pre-treatment for salicide process App 20010006147 - Fan, Su-Chen | 2001-07-05 |