U.S. patent application number 15/003466 was filed with the patent office on 2016-06-02 for system and method for mitigating oxide growth in a gate dielectric.
The applicant listed for this patent is Texas Instruments Incorporated. Invention is credited to Husam N. Alshareef, Malcolm J. Bevan, Haowen Bu, Hiroaki Niimi.
Application Number | 20160155641 15/003466 |
Document ID | / |
Family ID | 46329735 |
Filed Date | 2016-06-02 |
United States Patent
Application |
20160155641 |
Kind Code |
A1 |
Bevan; Malcolm J. ; et
al. |
June 2, 2016 |
System and Method for Mitigating Oxide Growth in a Gate
Dielectric
Abstract
Oxide growth of a gate dielectric layer that occurs between
processes used in the fabrication of a gate dielectric structure
can be reduced. The reduction in oxide growth can be achieved by
maintaining the gate dielectric layer in an ambient effective to
mitigate oxide growth of the gate dielectric layer between at least
two sequential process steps used in the fabrication the gate
dielectric structure. Maintaining the gate dielectric layer in an
ambient effective to mitigate oxide growth also improves the
uniformity of nitrogen implanted in the gate dielectric.
Inventors: |
Bevan; Malcolm J.; (Dallas,
TX) ; Bu; Haowen; (Plano, TX) ; Niimi;
Hiroaki; (Tokyo, JP) ; Alshareef; Husam N.;
(Murphy, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Texas Instruments Incorporated |
Dallas |
TX |
US |
|
|
Family ID: |
46329735 |
Appl. No.: |
15/003466 |
Filed: |
January 21, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14858422 |
Sep 18, 2015 |
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15003466 |
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13017828 |
Jan 31, 2011 |
9177806 |
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14858422 |
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11931529 |
Oct 31, 2007 |
7906441 |
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13017828 |
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11145674 |
Jun 6, 2005 |
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11931529 |
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10436848 |
May 13, 2003 |
6921703 |
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11145674 |
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Current U.S.
Class: |
257/410 ;
438/760 |
Current CPC
Class: |
H01L 21/28035 20130101;
H01L 21/3205 20130101; C23C 16/45557 20130101; H01J 37/32825
20130101; H01L 21/28158 20130101; H01L 21/28202 20130101; H01L
29/513 20130101; H01L 29/66477 20130101; H01L 21/02323 20130101;
H01J 37/32899 20130101; H01L 21/324 20130101; H01L 21/6776
20130101; C23C 16/4582 20130101; H01L 29/42364 20130101; H01L
21/67196 20130101; H01L 21/02255 20130101; H01J 37/32752 20130101;
H01L 21/02329 20130101; H01L 21/318 20130101; H01L 21/02318
20130101; H01L 21/67167 20130101; H01L 29/518 20130101; H01L
21/31604 20130101; H01L 21/67201 20130101; H01L 21/28229 20130101;
H01L 21/02332 20130101; H01L 21/02181 20130101; H01L 29/517
20130101; H01L 21/0234 20130101; H01L 21/28185 20130101; H01J
2237/3321 20130101; H01L 21/67161 20130101; H01L 21/28194 20130101;
H01L 29/4916 20130101; H01L 29/78 20130101; H01L 21/28167 20130101;
H01L 21/0223 20130101; H01L 29/4908 20130101; H01L 21/3105
20130101; H01L 21/02326 20130101 |
International
Class: |
H01L 21/28 20060101
H01L021/28; H01L 29/51 20060101 H01L029/51 |
Claims
1. A method for forming a device structure on a substrate,
comprising: forming a dielectric layer on the substrate;
introducing nitrogen atoms in the dielectric layer confined mostly
to a top region of the dielectric layer using a plasma process in a
first process chamber of the processing system, the first process
chamber having a first pumping element configured to evacuate gas
from the first process chamber; transferring the substrate between
the first process chamber and a second process chamber through a
transfer chamber of the processing system, wherein the transfer
chamber is connected to the first process chamber via a first
vacuum lock door and connected to the second process chamber via a
second vacuum lock door, the transfer chamber having a gas
distribution system and a second, distinct pumping element that
provide an ambient of uniform, laminar inert gas flow within the
transfer chamber during transfer of the substrate between the first
process chamber and the second process chamber, wherein during the
transferring, the gas distribution system and the second pumping
element maintain a pressure of about 3 Torr to about 20 Torr in the
transfer chamber; performing a thermal process in the second
process chamber; and introducing and removing the substrate to the
processing system through a load lock distinct from said transfer
chamber.
2. The method of claim 1, wherein the nitrogen atoms are introduced
into the dielectric layer by flowing N.sub.2 in the plasma process
having a power of about 2 W to about 3000 W and a pressure of about
5 mTorr to about 50 T.
3. The method of claim 2, wherein during the transferring, the gas
distribution system and the second pumping element actively purge
the transfer chamber using an inert gas.
4. The method of claim 3, wherein the inert gas used for actively
purging includes at least one of N.sub.2, He, Ne, Ar, Kr, and
Xe.
5. The method of claim 2, wherein the transferring enclosure is
being actively purged at a flow rate of about 2 liters per minute
to about 7 liters per minute.
6. The method of claim 1, wherein the step of performing the
thermal process comprises an oxygen species and a temperature of
about 400.degree. C. to about 1200.degree. C.
7. The method of claim 1, wherein the step of performing the
thermal process comprises a NO species and a temperature of about
400.degree. C. to about 1200.degree. C.
8. The method of claim 1, further comprising forming a polysilicon
layer over the dielectric layer in a third process chamber
connected to the transfer chamber.
9. A method for forming device structure on a substrate,
comprising: introducing the substrate to a processing system by
transferring the substrate through a load lock to a distinct
transfer chamber, the transfer chamber having a gas distribution
system in fluid communication with the transfer chamber and a first
pumping element connected to the transfer chamber; maintaining the
transfer chamber at a pressure of about 3 Torr to about 20 Torr
while actively purging the transfer chamber with N.sub.2 at a
predetermined flow rate using the gas distribution system and the
first pumping element; and while maintaining the transfer chamber
at the pressure of about 3 Torr to about 20 Torr and actively
purging the transfer chamber: transferring the substrate from the
transfer chamber to a first process chamber having a distinct,
second pumping element; introducing nitrogen atoms confined mostly
to a top region of a dielectric layer on the substrate in the first
process chamber using a plasma process having a power of about 2W
to about 3000 W while the second pumping element provides a
pressure of about 5 mTorr to about 50 Torr in the first process
chamber; transferring the substrate from the first process chamber
to a second process chamber through the transfer chamber, the
second process chamber having a distinct third pumping element; and
performing a thermal process in the second process chamber at a
temperature of about 400.degree. C. to about 1200.degree. C.
10. The method of claim 9, further comprising the steps of:
transferring the substrate from the second process chamber to a
third process chamber through the transfer chamber while
maintaining the transfer chamber at the pressure of about 3 Torr to
about 200 Torr and actively purging the transfer chamber; and
forming a polysilicon layer over the dielectric layer in the third
process chamber.
11. The method of claims 9, wherein the thermal process uses
O.sub.2, N.sub.2O, or NO.
12. The method of claim 9, wherein the step of introducing nitrogen
atoms uses N.sub.2 and He.
13. A transistor device comprising: source and drain regions formed
in a semiconductor substrate and separated by a first region; a
gate dielectric layer formed adjacent the first region; the gate
dielectric layer comprising nitrogen confined mostly to a top
region of the gate dielectric layer, wherein the gate dielectric
layer is formed in a process comprising the steps of: forming the
gate dielectric layer over the semiconductor substrate; moving the
gate dielectric layer into a transferring enclosure following the
forming step, in the transferring enclosure the atmosphere pressure
is about 3 Torr to and is substantially free of oxidizing agents,
wherein the atmosphere pressure of the transferring enclosure is
being maintained while being actively purged with an inert gas;
introducing nitrogen atoms into mostly the top region of the gate
dielectric layer in a first chamber attached to the transferring
enclosure using a plasma process having a power of about 2W to
about 3000 W to mitigate leakage associated with operation of the
transistor device, the introduction of nitrogen atoms causing
damage to the gate dielectric; and repairing the damage by
subjecting the gate dielectric layer to a thermal process in a
second chamber attached to the transferring enclosure; and a
conductive layer adjacent the top region of the gate dielectric
layer.
14. (canceled)
15. The transistor device of claim 14, in which the transferring
enclosure is being actively purged at a flow rate of about 2 liters
per minute to about 7 liters per minute.
16. The transistor device of claim 14, in which the inert gas used
for actively purging includes at least one of N.sub.2, He, Ne, Ar,
Kr, and Xe.
17. The transistor device of claim 13, further comprising
maintaining the substrate in a load lock enclosure attached to the
transferring enclosure prior to the moving step.
18. The transistor device of claim 13, further comprising moving
the substrate into the transferring enclosure following the
repairing step, in which an atmosphere pressure in the transferring
enclosure is about 3 Torr to about 200 Ton and is substantially
free of oxidizing agents.
19. The transistor device of claim 13, wherein the nitrogen atoms
are introduced into the top region of the gate dielectric layer by
flowing N.sub.2 in the plasma process having a pressure of about 5
mTorr to about 50 T.
20. A transistor device comprising: source and drain regions formed
in a semiconductor substrate and separated by a first region; a
gate dielectric formed adjacent the first region; the gate
dielectric comprising a near surface region comprising nitrogen at
a concentration of greater that 5 atomic percent, wherein the near
surface region is formed in a process comprising the steps of:
forming the gate dielectric layer on the semiconductor substrate;
forming the near surface region in the gate dielectric layer by
introducing nitrogen atoms in the near surface region of the gate
dielectric layer using a plasma process in a first process chamber
of a processing system, the first process chamber having a first
pumping element configured to evacuate gas from the first process
chamber; performing a thermal process in a second process chamber;
transferring the semiconductor substrate between the first process
chamber and the second process chamber through a transfer chamber
of the processing system, wherein the transfer chamber is connected
to the first process chamber via a first vacuum lock door and
connected the second process chamber via a second vacuum lock door,
the transfer chamber having a gas distribution system and a second,
distinct pumping element that maintain a pressure of about 3 Torr
in the transfer chamber and actively purge the transfer chamber by
flowing an inert gas during the transferring of the semiconductor
substrate between the first process chamber and the second process
chamber; introducing the substrate to the processing system through
a load lock distinct from said transfer chamber to allow
introduction and removal of the substrate from the processing
system; and a conductive region formed adjacent the near surface
region of the gate dielectric.
21. The transistor device of claim 20, wherein the nitrogen atoms
are introduced by flowing N.sub.2 in the plasma process having a
power of about 2 W to about 3000 W and a pressure of about 5 mTorr
to about 50 T.
22. The transistor device of claim 20, wherein the step of
performing the thermal process comprises an oxygen species and a
temperature of about 400.degree. C. to about 1200.degree. C.
23. The transistor device of claim 20, wherein the step of
performing the thermal process comprises NO and a temperature of
about 400.degree. C. to about 1200.degree. C.
24. The transistor device of claim 20, in which the inert gas used
for actively purging includes at least one of N.sub.2, He, Ne, Ar,
Kr, and Xe.
Description
[0001] This application is a continuation of Ser. No. 14/858,422,
filed Sep. 18, 2015, which is a continuation of Ser. No.
13/017,828, filed Jan. 31, 2011 (now U.S. Pat. No. 9,177,806),
which is a continuation of Ser. No. 11/931,529, filed Oct. 31, 2007
(now U.S. Pat. No. 7,906,441), which is a continuation in part of
Ser. No. 11/145,674, filed Jun. 6, 2005 (abandoned), which is a
divisional of Ser. No. 10/436,848, filed May 13, 2003, (now U.S.
Pat. No. 6,921,703), the entireties of all of which are hereby
incorporated by reference. Additionally, this application is
related to the following co-pending U.S. patent applications: Ser.
No. 14/858,227, filed Sep. 18, 2015 and Ser. No. 14/858,279, filed
Sep. 18, 2015, all of which are incorporated herein by
reference.
TECHNICAL FIELD
[0002] The present invention relates to processes for the
manufacture of semiconductor devices and, more particularly, to the
formation of a gate dielectric with a gate electrode.
BACKGROUND OF THE INVENTION
[0003] In complementary metal oxide silicon (CMOS) technology, a
need to enhance the speed and increase the density of CMOS
integrated circuits (IC's) has resulted in the evolution of
transistor scaling, accompanied by progressively thinner gate
dielectric oxide. Reduction in the thickness of a gate dielectric
provides increased drive current, with resultant increased speed.
In addition, a thinner gate dielectric offers enhanced control of
channel charge, thereby reducing short channel effects. The
fabrication of thinner gate oxides, however, presents gate leakage
current and reliability issues. In particular, physically thinner
gate oxides exhibit gate leakage current increasing exponentially
with reduction in thickness.
[0004] The leakage current can be mitigated by introducing nitrogen
atoms into the gate dielectric. One method of nitrogen atom
introduction is to perform non-thermal nitridation (e.g., plasma
nitridation) on the gate dielectric. Nitridation, however,
introduces damage (e.g., plasma damage) to the top surface of the
gate dielectric that can extend into the bulk of the film and
result in nitrogen pile up at lower interface for thinner films.
The damage can cause high gate leakage, threshold voltage shifts,
or premature oxide breakdown when the devices are operating, as
well as mobility and performance reduction. A post-nitridation high
temperature (e.g., at or above 900.degree. C.) re-oxidation (HT
ReOx) can be performed on the gate dielectric to mitigate the
plasma damage and improve GOI.
[0005] Exposure to air and airborne molecular contaminants, such as
moisture and organics, following nitridation and/or re-oxidation of
the gate dielectric can result in inadvertent oxide growth of the
gate dielectric, which can increase the equivalent oxide thickness
(EOT) of the gate dielectric. By way of example, a nitrided gate
dielectric with an equivalent oxide thickness (EOT) of about 12-13
.ANG. and containing about 6-8% nitrogen can be formed from a
starting oxide film with a thickness of about 7-8 .ANG.. Reducing
the thickness of the starting oxide film below 7-8 .ANG. to reduce
the EOT of a nitrided gate dielectric is not practical. An oxide
film with a thickness of about 7-8 .ANG. includes about two
monolayers of gate oxide atoms. A further reduction in the
thickness of an oxide film would result in a monolayer (i.e., about
4 .ANG.) oxide film. Single monolayer oxide films have increased
roughness compared to dual monolayer oxide films. Roughness in the
starting oxide film can degrade the performance of the nitrided
gate dielectric. Another detrimental effect of inadvertent exposure
to air and airborne molecular contaminants is increased and
variable oxide growth across wafers and from wafer to wafer. This
results in higher EOT (e.g., from AMC) for the first few wafers
processed, especially as EOT is reduced below about 20 .ANG..
SUMMARY OF THE INVENTION
[0006] The following presents a simplified summary of the invention
in order to provide a basic understanding of some aspects of the
invention. This summary is not an extensive overview of the
invention. It is intended to neither identify key or critical
elements of the invention nor delineate the scope of the invention.
Its sole purpose is to present some concepts of the invention in a
simplified form as a prelude to the more detailed description that
is presented later.
[0007] The present invention relates generally to a method of
reducing oxide growth of a gate dielectric layer during formation
of a gate dielectric structure. An added advantage of the method is
improved N-incorporation uniformity. The gate dielectric structure
can be fabricated by forming a gate dielectric on a substrate,
nitridating the gate dielectric, re-oxidizing or densifying the
nitrided gate dielectric, and forming a conductive layer overlying
the re-oxidized or densified nitrided gate dielectric. The
reduction in oxide growth can be achieved by maintaining the gate
dielectric in an ambient effective to mitigate oxide growth of the
gate dielectric between at least two sequential process steps used
in fabricating the gate dielectric structure.
[0008] An ambient effective to mitigate oxide growth can include an
inert atmosphere, such as an inert gas, that can be maintained at a
pressure substantially below about 760 Torr but above vacuum (e.g.,
about 3 Torr to about 200 Torr). The ambient can be actively purged
with an inert gas (e.g., N.sub.2). Maintaining the pressure of the
inert atmosphere substantially below about 760 Torr but above
vacuum, while actively purging the inert atmosphere with an inert
gas, minimizes moisture and airborne molecular contaminants (AMCs)
in the ambient, which can be absorbed by the gate dielectric. A
main source of these contaminants can be incoming wafers and wafer
carriers and their desorption. Moisture and AMCs in the ambient can
be effectively reduced by maintaining the transfer pressure as high
as possible with active purging. This high transfer pressure,
however, is offset by the need to raise and lower the pressure
between each process performed in the fabrication of the gate
dielectric structure. Reducing the oxide growth in the gate
dielectric between processes results in the formation of a gate
dielectric with a substantially lower EOT and substantially higher
nitrogen content, compared to the EOT and nitrogen content of a
gate dielectric, which is formed without being maintained in an
environment effective to mitigate oxide growth between process
steps. Additionally, N uniformity is improved through the thickness
of the gate dielectric layer as well as across the wafer and from
wafer to wafer on which the gate dielectric structure can be
formed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The foregoing and other aspects of the present invention
will become apparent to those skilled in the art to which the
present invention relates upon reading the following description
with reference to the accompanying drawings.
[0010] FIG. 1 is an example of a system that can be utilized to
form at least part of gate dielectric structure in accordance with
an aspect of the present invention.
[0011] FIG. 2 is a methodology for forming at least part of the
gate dielectric structure using the system of FIG. 1 in accordance
with an aspect of the present invention.
[0012] FIG. 3 is a schematic cross-sectional illustration of a gate
dielectric structure in accordance with an aspect of the present
invention.
[0013] FIG. 4 illustrates a schematic cross-sectional view of a
substrate in accordance with an aspect of the present
invention.
[0014] FIG. 5 illustrates a schematic cross-sectional illustration
of the structure of FIG. 4 after a gate dielectric layer is formed
over the substrate in accordance with an aspect of the present
invention.
[0015] FIG. 6 illustrates a schematic cross-sectional illustration
of the structure of FIG. 5 undergoing a nitridation process in
accordance with an aspect of the present invention.
[0016] FIG. 7 illustrates a schematic cross-sectional illustration
of the structure of FIG. 5 undergoing a re-oxidation process in
accordance with an aspect of the present invention.
[0017] FIG. 8 illustrates a schematic cross-sectional illustration
of the structure of FIG. 7 after the re-oxidation process in
accordance with an aspect of the present invention.
[0018] FIG. 9 illustrates a schematic cross-sectional illustration
of the structure of FIG. 8 after undergoing a conductive layer
deposition process in accordance with an aspect of the present
invention.
[0019] FIG. 10 illustrates a graph of the equivalent oxide
thickness and flat band voltage of the dielectric layer for
different methods associated with the fabrication of the gate
dielectric layer.
[0020] FIG. 11 illustrates a graph of nitrogen concentration versus
gate dielectric depth of the thick gate dielectric layer for
different processes associated with fabricating the gate dielectric
layer.
DETAILED DESCRIPTION
[0021] The present invention relates generally to a method of
reducing oxide growth of a gate dielectric during formation of a
gate dielectric structure. The reduction in oxide growth can be
achieved by maintaining the gate dielectric in an ambient effective
to mitigate oxide growth of the gate dielectric between at least
two sequential process steps used to form the gate dielectric
structure. An ambient effective to mitigate oxide growth can
include an inert atmosphere that can be maintained at a pressure
substantially below about 760 Torr but above vacuum (e.g., about 3
Torr to about 200 Torr). The ambient can also be actively purged
with an inert gas (e.g., N.sub.2). In one aspect, a pressure of
about 10 Torr to about 100 Torr (e.g., 30 Torr) can be optimum to
minimize moisture and AMCs without excessively increasing the time
to raise/lower the pressure to transfer the gate dielectric
structure. Maintaining the pressure substantially below about 760
Torr but above vacuum, while actively purging the ambient with an
inert gas mitigates oxide growth of the gate dielectric between
gate formation processes. This results in the formation of a gate
dielectric with a substantially lower EOT and a substantially
higher and more uniform nitrogen content compared to the EOT and
nitrogen content of a gate dielectric, which is formed without
being maintained in an environment effective to mitigate oxide
growth between process steps.
[0022] FIG. 1 illustrates an example of a system 10 operative to
form at least a portion of a gate dielectric structure in
accordance with an aspect of the invention. The system 10 in this
example includes four process chambers 12, 14, 16, and 18 for
performing separate processes that are used in the formation of at
least part of a gate dielectric structure on a substrate, such as
silicon. The four process chambers 12, 14, 16, and 18 are coupled
to a transfer chamber 22 that facilitates transfer of the substrate
between the separate process chambers during fabrication of the
gate dielectric structure. The four process chambers 12, 14, 16,
and 18 and transfer chamber 22 can be maintained leak-tight during
fabrication, such that, for example, less than about 1 mTorr/min of
gas can leak back into each process chamber 12, 14, 16, and 18 and
the transfer chamber 22 during fabrication. Transfer chamber 22 can
be maintained at a fixed pressure of about 3 to about 200 Torr
(e.g., about 30 Torr) and process chambers 12, 14, 16, 18 can be
pumped down or back filled to this pressure to transfer the wafer,
on which the gate dielectric structure is formed, in or out of the
process chambers 12, 14, 16, 18.
[0023] The first process chamber 12 can be used in the formation of
a gate dielectric layer (e.g., silicon dioxide (SiO.sub.2) layer)
over the substrate. The gate dielectric layer can have a thickness
of about 7 .ANG. to about 20 .ANG., and be formed by a wet and/or
dry thermal oxidation processing, such as in-situ steam generation
(ISSG) and low-pressure (reduced pressure) rapid thermal process
(LP-RTP). It is to be appreciated that alternate methodologies can
be employed to form the gate dielectric layer. For example, any
suitable technique (e.g., plasma enhanced chemical vapor deposition
(CVD), thermal enhanced CVD and spin on techniques) may be employed
in forming the gate dielectric layer. Examples of CVD processes
that may be utilized in accordance with an aspect of the present
invention, include low pressure CVD (LPCVD), plasma enhanced CVD
(PECVD), and rapid thermal CVD (RTCVD). It is to be appreciated,
that other types of thin film formation can be employed, such as
other deposition techniques (e.g., physical vapor deposition (PVD))
and film growth techniques.
[0024] Alternate materials can be employed to provide the gate
dielectric material. The gate dielectric material can be SiO.sub.2
or another suitable oxide material that can perform the operation
associated with the gate dielectric material. Examples of some
other materials that can be utilized as the gate dielectric layer
include AlO.sub.3, ZrO.sub.2, HfO.sub.2 (AlHf) O.sub.x, HfO.sub.2,
La.sub.2O.sub.3 and Y.sub.2O.sub.3 to name a few. Those skilled in
the art will understand and appreciate appropriate types of
deposition techniques that can be employed to grow suitable
crystalline structures to form gate dielectric layers, such as
those identified above. It is to be further understood and
appreciated that other materials also could be employed to form the
gate dielectric layer.
[0025] The first process chamber can include a vacuum-lock door 24,
which interconnects the process chamber 12 and the transfer chamber
22. Temperature within first process chamber 12 can be maintained
by one or more heating elements 26 operative to heat the contents
of the chamber 12 to within a desired temperature range. For
example, prior to formation of the gate dielectric layer, the
temperature can be maintained at about 500.degree. C. to about
700.degree. C. and during formation of the gate dielectric layer,
for example by ISSG process, the temperature can be maintained at
about 850.degree. C. to about 1050.degree. C. Pressure within the
first process chamber 12 can be maintained by one or more pumping
elements 28 operative to evacuate gas from the chamber to within a
desired pressure range. For example, during formation of the gate
dielectric layer (e.g., by ISSG), the pressure can be maintained at
about 1 to about 20 Torr.
[0026] The second process chamber 14 can be used for the
introduction of nitrogen into the gate dielectric layer by a plasma
nitridation or plasma nitrided oxide process. The plasma
nitridation process can include applying nitrogen-source gas, such
as N.sub.2, N.sub.2O, NO, and NH.sub.3 or a mixture of a
nitrogen-source gas and inert gases, such as He, Ne, Ar, Kr, Xe,
and mixtures thereof, to the exposed surface of the gate dielectric
layer. The plasma nitridation process or nitrided oxide process
introduces nitrogen atoms into the gate dielectric layer, which
mitigates leakage associated with the gate device and blocks boron
into the active channel.
[0027] The second process chamber 14 can include a vacuum-lock door
30 through which the substrate can be transferred between the
second process chamber 30 and the transfer chamber 22. Temperature
within second process chamber 14 can be maintained by one or more
heating elements 32 operative to heat the contents of the chamber
14 to within a desired temperature range. Pressure within the
second process chamber 14 can be maintained by one or more pumping
elements 34 operative to introduce or evacuate gas from the chamber
to within a desired pressure range. In one aspect of the invention,
the plasma nitridation process or plasma nitrided oxide process can
be performed in the second process chamber 14 for about 3 seconds
to about 60 seconds at a power of about 2 watts to about 3000 watts
and a pressure of about 5 mTorr to about 50 Torr.
[0028] The third process chamber 16 can be used for the
re-oxidation of the nitrided gate dielectric, for example by rapid
thermal oxidation (RTO), or post anneal or densification in an
inert atmosphere, for example by RTP, or a combination of both.
Re-oxidation or post annealing of the nitrided gate dielectric
layer provides a thin dielectric layer without surface damage and
with nitrogen atoms embedded therein to facilitate the mitigation
of leakage through the gate dielectric and improved transistor
performance, for example improved drive current, mobility etc. The
third process chamber 16 can include a vacuum-lock door 36 through
which the substrate can be transferred between the third process
chamber 16 and the transfer chamber 22. Temperature within the
third process chamber 16 can be maintained by one or more heating
elements 38 operative to heat the contents of the chamber to within
a desired temperature range. For example, prior to re-oxidation,
the temperature can be maintained at about 500.degree. C. to about
700.degree. C. and during re-oxidation of the nitrided dielectric
layer, for example by RTO, the temperature can be maintained at
about 900.degree. C. to about 1050.degree. C. A post anneal in
N.sub.2 from about 900.degree. C. to about 1050.degree. C. could be
applied. Pressure within the third process chamber 16 can be
maintained by one or more pumping elements 40 operative to
introduce or evacuate gas from the chamber 36 to within a desired
pressure range. For example, during re-oxidation (e.g., RTO) of the
dielectric layer the pressure can be maintained at about 0.5 Torr
to about 50 Torr.
[0029] The fourth process chamber 18 can be used in the formation
of a conductive layer, such as polysilicon, over the re-oxidized,
nitrided gate dielectric. If the conductive layer is comprised of
polysilicon, the conductive layer may be formed using any suitable
technique including chemical vapor deposition (CVD) techniques,
such as low pressure chemical vapor deposition (LPCVD) or plasma
enhanced chemical vapor deposition (PECVD). If the conductive layer
is comprised of amorphous silicon, germanium, or their combination,
standard deposition techniques may be employed. If the conductive
layer is comprised of a metal, standard sputtering techniques may
be employed.
[0030] The fourth process chamber 18 can include a vacuum-lock door
42 which interconnects the process chamber 18 and the transfer
chamber 22. Temperature within the fourth process chamber 18 can be
maintained by one or more heating elements 44 operative to heat the
contents of the fourth chamber 18 to within a desired temperature
range. For example, during formation of the conductive layer (e.g.,
by CVD) the temperature can be maintained at about 500.degree. C.
to about 800.degree. C. Pressure within the fourth process chamber
18 can be maintained by one or more pumping elements 46 operative
to introduce or evacuate gas from the chamber 18 to within a
desired pressure range. For example, during formation of the
conductive layer (e.g., by CVD) the pressure can be maintained at
about 250 Torr to about 350 Torr.
[0031] The transfer chamber 22 interconnects the process chambers
12, 14, 16, and 18 and provides an interface between the process
chambers 12, 14, 16, and 18 during fabrication of at least part of
the gate dielectric structure. The transfer chamber 22 can include
one or more cool-down chamber (not shown) to allow cooling of the
gate dielectric between fabrication processes. Load locks 48 can be
provided to allow introduction and removal of a substrate from the
transfer chamber 22.
[0032] The transfer chamber 22 contains an ambient, such as an
inert atmosphere, which comprises an inert gas (e.g., N.sub.2, He,
Ar, Kr, Xe and mixtures thereof). Pressure within the transfer
chamber 22 can be maintained by one or more pumping elements 50
operative to evacuate gas from the chamber to within a desired
pressure range. For example, the inert atmosphere can be maintained
at a pressure substantially below about 760 Torr. The inert
atmosphere can also be maintained at a pressure above vacuum levels
(i.e., mTorr levels). Additionally, a gas distribution system 52
can be in fluid communication with the transfer chamber 22 for
actively purging the ambient of the transfer chamber 22. By
"actively purging" it is meant that the inert gas can be introduced
into the transfer chamber 22 at a rate effective to continuously
evacuate the atmosphere of the transfer chamber 22. By way of
example, a flow rate effective to continuously evacuate the
atmosphere of the transfer chamber 22 can be about 2 liters per
minute to about 7 liters per minute. The inert gas used for purging
can include any inert gas, such as N.sub.2, He, Ar, Kr and Xe, and
mixtures thereof, as well as other inert gases and mixture thereof
which do not detrimentally affect (e.g., oxidize) the gate
dielectric during transfer.
[0033] Maintaining the pressure of the inert atmosphere of the
ambient substantially below 760 Torr but above vacuum, while
actively purging the ambient, can establish a uniform, laminar gas
flow within the ambient. This uniform, laminar gas flow can provide
sufficient drag to evacuate airborne molecular contaminants (AMCs)
(e.g., moisture and organics) from the ambient. Airborne molecular
contaminants can potentially be absorbed by the gate dielectric and
cause oxide growth of the gate dielectric.
[0034] In one aspect, the inert atmosphere can be maintained at a
pressure of about 3 Torr to about 200 Torr (e.g., 30 Torr) while
being actively purged by a gas having a flow rate of about 2 liters
per minute to about 7 liters per minute (e.g., 5 liters per
minute). At a pressure of about 3 Torr to about 200 Torr, residual
moisture and organics from the processes used to form the gate
electrode structure can be readily evaporated and be evacuated from
ambient by the inert gas. Residual moisture and organics can be
diluted by operating at higher pressures, for example, about 10
fold as pressure is increased from about 3 to about 30 Torr.
Atmosphere pressures below about 3 Torr are difficult to maintain
during active purging gas and do not readily facilitate the
establishment of a uniform, laminar gas flow, which has sufficient
drag force to evacuate airborne molecular contaminants. Atmosphere
pressures above about 200 Torr decrease the rate at which moisture
and organics can be evaporated and are substantially higher than at
least some of the pressures used for the processes. An optimum
operating pressure can be about 10 to about 100 Torr (e.g., about
30 Torr) and can reduce levels of moisture and organics without
excessively prolonging time to bring process chambers up or down to
transfer chamber pressure to allow wafer transfer.
[0035] FIG. 2 illustrates a methodology of fabricating a gate
dielectric structure using the system described above. The
methodology begins at 100 such as in connection with providing and
preparing a substrate material, such as silicon. At 110, the
substrate can be introduced into the system by transferring the
substrate through the load lock into the transfer chamber. The
transfer chamber contains an inert atmosphere, which throughout the
fabrication process, can be maintained, for example, at a pressure
of about 3 Torr to about 200 Torr, a temperature of about
20.degree. C. to about 30.degree. C., and can be actively purged
with an inert gas, such as N.sub.2, at a flow rate of about 2
liters per minute to about 7 liters per minute.
[0036] The substrate can be transferred from the transfer chamber
into the first process chamber, which can be evacuated, for
example, to a pressure of about 1 Torr to about 20 Torr. At 120, a
gate dielectric can be formed overlying the substrate. By way of
example, the gate dielectric can be formed using an ISSG process at
a temperature of about 850.degree. C. to about 1050.degree. C.
[0037] Following formation of the gate dielectric at 120 and once
pressure is equalized to that of the transfer chamber, the gate
dielectric can be transferred from first process chamber into the
transfer chamber. At 130, the substrate can be cooled within the
transfer chamber, for example, to a temperature below about
150.degree. C.
[0038] Following cooling at 130, the substrate with the overlying
gate dielectric can be transferred into the second process chamber,
which is then evacuated, for example, to a pressure of about 15
Torr to about 50 mTorr. At 140, nitrogen can be introduced into an
exposed surface of the gate dielectric. By way of example, the
nitrogen can be introduced into the gate dielectric by plasma
nitridation (PN). The nitrided gate dielectric can then be
transferred from second processing chamber, through the transfer
chamber, into the third process chamber.
[0039] At 150, the nitrided gate dielectric can be re-oxidized or
densified to remove any plasma damage to the layer. By way of
example, the re-oxidation can be performed by RTO at a temperature
of about 900.degree. C. to about 1050.degree. C. and a pressure of
about 0.5 Torr to about 50 Torr.
[0040] After re-oxidation at 150, the gate dielectric can be
transferred from the third process chamber, through the transfer
chamber, and into fourth process chamber. At 160, a conductive
layer, such as polysilicon, can be formed over the gate dielectric
and substrate. The conductive layer can be formed for example by
chemical vapor deposition (CVD) at a temperature of about
600.degree. to about 800.degree. C. and a pressure of about 200
Torr to about 300 Torr.
[0041] FIG. 3 illustrates a transistor device 210 (e.g., MOSFET
device) having a gate dielectric structure 214 in accordance with
an aspect of the present invention. The transistor device 210 can
be fabricated on a substrate 212, such as silicon. The transistor
device 14 includes a thin gate dielectric layer 216 (e.g., about 8
.ANG. to about 20 .ANG. oxide layer). It is to be appreciated that
the transistor device 210 is provided for illustrative purposes and
that the substrate can include a plurality of transistor
devices.
[0042] The gate dielectric layer 216 can be an oxide (e.g., silicon
dioxide (SiO.sub.2)) or any other dielectric material suitable for
operating as a gate oxide of a transistor device. Since the gate
dielectric layer 216 is relatively thin (i.e., less than 20 .ANG.)
nitrogen atoms 218 are introduced into the dielectric layer 216 to
suppress leakage currents associated with the operation of the
transistor device 210. The nitrogen atoms 218 can be introduced
into the dielectric layer 216 by a plasma nitridation or plasma
nitrided oxide process. The plasma nitridation, however, causes a
damaged (e.g., plasma damaged) surface layer of the gate dielectric
layer 216 or through the bulk of the oxide layer.
[0043] A re-oxidation or densifying process can be performed on the
damaged layer to provide a gate dielectric layer 216 substantially
without damage and with nitrogen atoms 218 embedded therein to
facilitate the mitigation of leakage of the transistor device 210.
The re-oxidation on plasma nitrided oxide removes plasma damage
from plasma nitrided oxide, and minimizes nitrogen loss during a
subsequent fabrication processes as well as improves MOSFET
performance, for example drive current and mobility.
[0044] The transistor device 210 can also include a gate electrode
20 that can be disposed over the gate dielectric layer 216. The
gate electrode 220 can be comprised of polysilicon, amorphous
silicon, germanium, or metal. Sidewall spacers 222 of a suitable
insulating material can be disposed adjacent to the sidewalls of
the gate electrode 220. A source region 224 and a drain region 226
can also be formed in the substrate 212.
[0045] The source and drain regions 224 and 226 can also include
source/drain extensions (not shown) that extend to regions
generally aligned with and partially beneath the edges of the gate
electrodes. Those skilled in the art will understand and appreciate
that the transistor can be either a P type or N type transistor.
The source and drain regions 224 and 226 can be formed as N or P
type regions by doping with boron, arsenic or other appropriate
doping materials, as known in the art.
[0046] FIGS. 4-9 illustrate a methodology of fabricating a part of
a transistor device in accordance with an aspect of the present
invention. Referring to FIG. 4, a substrate layer 250 that can be
formed from a semiconductor material, such as silicon or
polysilicon. The substrate layer 250, however, could be formed from
any materials such as gallium arsenide, germanium,
silicon-germanium, epitaxial formations, silicon carbide, indium
phosphide, silicon-on-insulator substrates (SOI), strained Si
substrates, and/or other semiconductor substrate materials.
[0047] FIG. 5 illustrates the substrate 250 after an oxidation
process is initiated to form a gate dielectric layer 254 (e.g.,
silicon dioxide (SiO.sub.2) layer) over the substrate 250. The gate
dielectric layer 254 can have a thickness of about 7 .ANG. to about
15 .ANG., and be formed by a wet and/or dry thermal oxidation
processing. In one aspect of the invention, the gate dielectric
layer can be formed using an ISSG process in which the substrate
250 is heated to a temperature of about 850.degree. C. to about
1050.degree. C. in an atmosphere maintained at a pressure of about
1 Torr to about 20 Torr for about 5 to about 60 second.
[0048] After formation of the gate dielectric layer 254 over the
substrate 250, nitrogen can be introduced into the gate dielectric
layer 254. FIG. 6 illustrates the introduction of nitrogen into the
gate dielectric layer 254 by a plasma nitridation or plasma
nitrided oxide process 300. The plasma nitridation process or
nitrided oxide process 300 introduces nitrogen atoms 255 (FIG. 7)
into the gate dielectric layer 254, which mitigates leakage
associated with the gate device. In one aspect of the invention,
the plasma nitridation process or plasma nitrided oxide process can
be performed for about 3 seconds to about 60 seconds at a power of
about 2 watts to about 3000 watts and a pressure of about 5 mTorr
to about 50 Torr. The plasma nitridation may also cause plasma
damage to the layer 256 (FIG. 7). The plasma damage to the layer
256 can cause high gate leakage, threshold voltage shifts, or
premature oxide breakdown when the devices are operating.
[0049] Following introduction of nitrogen into the gate dielectric
layer 254, the gate dielectric layer can be re-oxidized or
densified, for example by rapid thermal oxidation (RTO). FIG. 7
illustrates a re-oxidation process 310 being performed on the
damaged surface layer 256 to provide a thin dielectric layer 258
without plasma damage (FIG. 8) and with nitrogen atoms 255 embedded
therein to facilitate the mitigation of leakage of the transistor
device. By way of example, the re-oxidation 310 on plasma nitrided
dielectric layer 256 can be performed at a temperature of about 400
.degree. C. to about 1200 .degree. C. for about 1 to about 60
seconds, at a pressure of about 1 to about 50 Torr with a gas
having about 1% to about 100% of an oxygen-source, such as O.sub.2,
N.sub.2O, and NO in an inert gas, such as He, Ne, Ar, Kr, Xe and
N.sub.2. The re-oxidation process 310 can be performed in a rapid
thermal processing (RTP) chamber or an oxidation furnace.
[0050] After re-oxidation of the nitrided gate dielectric, a
conductive layer 260 can deposited (e.g., by chemical vapor
deposition (CVD) techniques) over the resultant structure to
provide the conductive gate electrode of the gate structure. FIG. 9
illustrates the gate structure after the conductive layer is
deposited over the resultant structure.
[0051] During transfer of the gate dielectric between processes
used in the formation of the gate electrode structure (e.g.,
between the initial oxidation process and the nitridation process,
between the nitridation process and the re-oxidation process,
and/or between the re-oxidation process and the deposition
process), the gate dielectric can be maintained in an ambient, such
as an inert atmosphere that includes an inert gas (e.g., N.sub.2,
He, Ar, Kr, Xe, and mixtures thereof). The inert atmosphere can be
maintained at a pressure substantially below about 760 Torr. The
inert atmosphere can also be maintained at a pressure above vacuum
levels (i.e., mTorr levels). The ambient can be actively purged
with an inert gas. In one aspect, the inert atmosphere can be
maintained at a pressure of about 3 Torr to about 200 Torr (e.g.,
30 Torr) while being actively purged by a gas with a flow rate of
about 2 liters per minute to about 7 liters per minute (e.g., 5
liters per minute).
[0052] Maintaining the pressure of the inert atmosphere of the
ambient substantially below about 760 Torr but above vacuum, while
actively purging the ambient, mitigates oxide growth of the gate
dielectric during transfer of the gate dielectric between
processes. Reducing the oxide growth of gate dielectric between
processes results in the formation of a gate dielectric with a
substantially lower EOT, improved uniformity, and substantially
higher nitrogen content compared to the EOT and nitrogen content of
a gate dielectric, which is formed without being maintained in an
environment effective to minimize oxide growth between
processes.
[0053] FIG. 10 illustrates a graph 400 comparing the equivalent
oxide thickness (.ANG.) (represented by triangles) and flat band
voltage (Vfb) (represented by squares) of gate dielectric layers
fabricated by different methods. For each fabrication method, the
equivalent oxide thickness and flat band voltage were measured
after an in-situ steam generation process (ISSG), a plasma
nitridation process (PN), a re-oxidation process (RTO), and a
polysilicon deposition process (POLY) have been performed on a
silicon substrate. The fabrication methods differed in that between
processes of some methods the gate dielectric electric was
maintained in ambient effective to mitigate oxide growth (e.g., an
inert atmosphere maintained at 30 Torr and actively purged with an
inert gas at a flow rate of about 5 liters per minute), as opposed
to being exposed to an air atmosphere. Processes, which are
referred to in the graph as being "clustered", are processes
between which the gate dielectric layer was maintained in ambient
effect to mitigate oxide growth. Processes, which are referred to
in the graph as being "un-clustered", are processes between which
the gate dielectric layer was exposed to an air atmosphere.
[0054] As illustrated in the graph 400, fabrication methods that
include at least two processes that were clustered formed
dielectric layers with substantially lower equivalent oxide
thicknesses than the fabrication method that did not include any
clustering. For example, fabrication methods in which the ISSG,
DPN, RTO, and POLY were all clustered showed an about 12% to about
13% equivalent oxide improvement (i.e., about 1.1 to about 1.5
reduction in equivalent oxide thickness) compared to the
fabrication method which was un-clustered. Even in fabrication
methods where only two process were clustered (e.g., ISSG and DPN,
DPN and RTO, and RTO and POLY), an improvement in equivalent oxide
thickness was observed compared to fabrication methods in which the
processes were un-clustered. This improvement in EOT was achieved
without a decrease in flat band voltage.
[0055] FIG. 11 illustrates a graph 450 of nitrogen concentration
versus gate dielectric depth of a thick gate dielectric layer
(e.g., plasma nitrided 10 .ANG. oxide layer) for different
processes associated with fabrication of a gate dielectric. The
nitrogen concentration was measured using a commercially available
Time of Flight-Secondary Ion Mass Spectrometer (TOF-SIMS). A first
indicator 452 references data points (represented by squares)
associated with nitrogen concentration in a dielectric layer versus
depth after an in-situ steam generation process, a plasma nitrided
process, and a re-oxidation process has been performed on a silicon
substrate. Between each of these processes, the gate dielectric
layer is exposed to air. A second indicator 454 references data
points (represented by triangles) associated with nitrogen
concentration in a dielectric layer versus depth after an in-situ
steam generation process, a plasma nitrided process, and a
re-oxidation process has been form on a silicon substrate. Between
each process, the gate dielectric layer was maintained in ambient
effective to mitigate oxide growth (e.g., an inert atmosphere
maintained at 30 Torr and actively purged in an inert gas at a flow
rate of about 5 liters per minute).
[0056] As illustrated in the graph 450, substantially more nitrogen
(i.e., about 30% more N) was incorporated in the gate dielectric
layer when the gate dielectric layer was maintained in an ambient
effective to mitigate growth between processes compared to air.
This increase in nitrogen enhances the dielectric quality (e.g.,
mitigates leakage) of the dielectric layer. In comparison to a gate
dielectric with same level of nitrogen that is formed using an
un-clustered process, a gate dielectric layer formed using a
clustered process showed improved performance at a reduced EOT. In
addition, for oxide films about 10 .ANG. to about 20.ANG., graphs
similar to 450 show flatter N profiles (with improved dielectric
reliability) and improved N uniformity across the wafer and from
wafer to wafer.
[0057] Those skilled in the art will appreciate and understand that
although the gate dielectric in the system and methodology
described above is maintained in an ambient effective to mitigate
oxide growth during transfer of the gate dielectric between the
four fabrication processes, the gate dielectric could be maintained
in the ambient between just two sequential processes. Additionally,
although the dielectric in the system and methodology described
above is transferred through the same transfer chamber between
fabrication processes, the gate dielectric could potentially be
transferred through separate transfer chambers between sequential
processes. At least one of the separate transfer chambers could
include an ambient effective to mitigate oxide growth of the gate
dielectric.
[0058] Those skilled in the art will also understand and appreciate
that various processing operations that can be utilized in
formation of transistors in accordance with an aspect of the
present invention. By way of example, the gate electrodes can be
patterned via photolithography and etched (e.g., via an etch
chemistry or plasma etching) to form the gate electrode structures.
Ion implantation or other doping techniques can be utilized to form
source/drain regions 224 and 226 (FIG. 3). It further is to be
appreciated that the gate electrode structures can be used in the
formation of CMOS, BiCMOS or HBT devices.
[0059] What has been described above includes examples and
implementations of the present invention. Because it is not
possible to describe every conceivable combination of components,
circuitry or methodologies for purposes of describing the present
invention, one of ordinary skill in the art will recognize that
many further combinations and permutations of the present invention
are possible. Accordingly, the present invention is intended to
embrace all such alterations, modifications and variations that
fall within the spirit and scope of the appended claims.
* * * * *