U.S. patent application number 14/512546 was filed with the patent office on 2015-04-16 for heat dissipation device and a method for manufacturing same.
The applicant listed for this patent is FuKui Precision Component (Shenzhen) Co., Ltd., Zhen Ding Technology Co., Ltd.. Invention is credited to MING-JAAN HO, XIAN-QIN HU, FU-YUN SHEN.
Application Number | 20150101785 14/512546 |
Document ID | / |
Family ID | 52808659 |
Filed Date | 2015-04-16 |
United States Patent
Application |
20150101785 |
Kind Code |
A1 |
HO; MING-JAAN ; et
al. |
April 16, 2015 |
HEAT DISSIPATION DEVICE AND A METHOD FOR MANUFACTURING SAME
Abstract
A heat dissipation device includes a first copper sheet and a
second copper sheet. The first copper sheet includes a number of
first recesses and the second copper sheet includes a number of
corresponding second recesses. The second copper sheet is fixed on
the first copper sheet and an airtight receiving cavity is formed
by each first recess and each the second recess, a working fluid in
the airtight receiving cavity carries unwanted heat away.
Inventors: |
HO; MING-JAAN; (New Taipei,
TW) ; HU; XIAN-QIN; (Shenzhen, CN) ; SHEN;
FU-YUN; (Shenzhen, CN) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
FuKui Precision Component (Shenzhen) Co., Ltd.
Zhen Ding Technology Co., Ltd. |
Shenzhen
Tayuan |
|
CN
TW |
|
|
Family ID: |
52808659 |
Appl. No.: |
14/512546 |
Filed: |
October 13, 2014 |
Current U.S.
Class: |
165/170 ;
29/890.03 |
Current CPC
Class: |
F28F 2275/025 20130101;
H01L 21/4882 20130101; H01L 2924/00 20130101; H01L 23/427 20130101;
F28F 21/085 20130101; H01L 2924/0002 20130101; H01L 2924/0002
20130101; B21D 53/04 20130101; Y10T 29/4935 20150115; F28D 15/02
20130101 |
Class at
Publication: |
165/170 ;
29/890.03 |
International
Class: |
F28F 3/12 20060101
F28F003/12; F28F 21/08 20060101 F28F021/08; B21D 53/04 20060101
B21D053/04 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 12, 2013 |
CN |
201310474244.9 |
Claims
1. A heat dissipation device comprising: a first copper sheet
comprising a plurality of first recesses; a second copper sheet
comprising a plurality of second recesses, the second recesses
corresponding with the first recesses, the second copper sheet
being fixed on the first copper sheet and each the second recesses
facing the corresponding first recesses, an airtight receiving
cavity being formed by each of the first recesses and the second
recesses, the second copper sheet being fixed on the first copper
sheet with adhesive, the adhesive forms a part of an inner wall of
the airtight receiving cavity; and a working fluid received in the
airtight receiving cavity.
2. The heat dissipation device of claim 1, wherein the first copper
sheet comprises a first surface, the second copper sheet comprises
a second surface facing the first surface, the first recesses are
randomly distributed on the first surface.
3. The heat dissipation device of claim 2, wherein the first copper
sheet comprises a plurality of first ribs, the first ribs are
formed between each two adjacent first recesses, the second copper
sheet comprises a plurality of second ribs, the second ribs are
formed between each two adjacent second recesses, the first ribs
are corresponding with the second ribs.
4. The heat dissipation device of claim 1, wherein the adhesive is
low temperature solder paste.
5. The heat dissipation device of claim 4, wherein the adhesive
comprises a molten resin material doped with metal particles, the
metal particle is selected from the group comprising tin, bismuth
and any combination thereof.
6. The heat dissipation device of claim 5, wherein a weight ratio
of tin in the adhesive is in the range from about 37% to about 38%,
a weight ratio of bismuth in the adhesive is in the range from
about 51% to about 52%, and a weight ratio of molten resin in the
adhesive is in the range from about 4% to about 6%.
7. The heat dissipation device of claim 3, wherein the adhesive is
sandwiched between the first ribs and the second ribs.
8. The heat dissipation device of claim 1, wherein a cross section
of the first and second recesses is an arc or a semi circle.
9. A heat dissipation device, comprising: a first copper sheet
comprising a plurality of first recesses; a second copper sheet
comprising a plurality of second recesses, the second recesses
being corresponding with the first recesses, the second copper
sheet being fixed on the first copper sheet such that each of the
second recesses mate with the corresponding first recesses to
define a plurality of an airtight receiving cavities being formed
by each the first recess and the second recess; and a working fluid
in each of the airtight receiving cavities; wherein the first and
second copper sheets are configured to transmit external heat from
an outer surface toward the working fluid, thereby providing a heat
sink.
10. A method for manufacturing the heat dissipation device, the
method comprising: providing a first copper base and a second
copper base, the first copper base comprises a first surface, the
second copper base comprises a second surface facing toward the
first surface; processing the first surface to form a number of
first recess and a number of ribs between each two adjacent first
recesses, processing the second surface to form a number of second
recesses, the second recesses and the first recesses have the same
shape and size; providing an adhesive on the ribs of the first
copper sheet; providing a working fluid in the first recesses of
the first copper sheet; pressing the second copper sheet on the
adhesive, and the second copper sheet is fixed with the first
copper sheet by the adhesive, each the first recesses are in
communication with the second recesses, each of the first recesses
and the second recesses together form an airtight receiving cavity;
solidifying the adhesive.
11. The method of claim 9, wherein the a depth of each first
recesses is smaller than a thickness of the first copper sheet, a
depth of each second recesses is smaller than a thickness of the
second copper sheet.
12. The method of claim 10, wherein the adhesive is low temperature
solder paste.
13. The method of claim 12, wherein the adhesive comprises of
molten resin material doped with metal particles, the metal
particle is selected from the group comprising tin, bismuth and any
combination thereof.
14. The method of claim 13, wherein a weight ratio of tin in the
adhesive is in the range from about 37% to about 38%, a weight
ratio of bismuth in the adhesive is in the range from about 51% to
about 52%, and a weight ratio of molten resin in the adhesive is in
the range from about 4% to about 6%.
15. The method of claim 13, wherein the working fluid at least is
able to select from the group comprising water, methanol, ethanol,
acetone, ammonia, paraffin, oil, and chlorofluorocarbons.
Description
FIELD
[0001] The subject matter herein generally relates to temperature
control.
BACKGROUND
[0002] Since a high-power electronic device generates a large
amount of heat during operation, the performance and lifetime of
the electronic device is lowered if the heat cannot be dissipated
in time.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Implementations of the present technology will now be
described, by way of example only, with reference to the attached
figures.
[0004] FIG. 1 is a diagrammatic view of a heat dissipation device
comprising a first copper sheet in accordance with a first
embodiment.
[0005] FIG. 2 is a diagrammatic view of the first copper sheet of
FIG. 1.
[0006] FIG. 3 is a cross sectional view taken along line III-III of
the first copper sheet of FIG. 2.
[0007] FIG. 4 is a diagrammatic view showing the heat dissipation
device used with an electronic device.
[0008] FIG. 5 illustrates a flowchart of a method for manufacturing
the heat dissipation device of FIG. 1.
[0009] FIG. 6 illustrates a diagrammatic view of a first copper
sheet and a second copper sheet provided for manufacturing the heat
dissipation device.
[0010] FIG. 7 is a diagrammatic view of an adhesive on the first
copper sheet in FIG. 6.
[0011] FIG. 8 is a diagrammatic view of a working fluid received in
the first copper sheet.
[0012] FIG. 9 is a diagrammatic view of the second copper sheet
fixed with the first copper sheet.
DETAILED DESCRIPTION
[0013] It will be appreciated that for simplicity and clarity of
illustration, where appropriate, reference numerals have been
repeated among the different figures to indicate corresponding or
analogous elements. In addition, numerous specific details are set
forth in order to provide a thorough understanding of the
embodiments described herein. However, it will be understood by
those of ordinary skill in the art that the embodiments described
herein can be practiced without these specific details. In other
instances, methods, procedures, and components have not been
described in detail so as not to obscure the related relevant
feature being described. Also, the description is not to be
considered as limiting the scope of the embodiments described
herein. The drawings are not necessarily to scale and the
proportions of certain parts have been exaggerated to better
illustrate details and features of the present disclosure.
[0014] Several definitions that apply throughout this disclosure
will now be presented.
[0015] The term "substantially" is defined to be essentially
conforming to the particular dimension, shape, or other feature
that the term modifies, such that the component need not be exact.
For example, "substantially cylindrical" means that the object
resembles a cylinder, but can have one or more deviations from a
true cylinder. The term "comprising," when utilized, means
"including, but not necessarily limited to"; it specifically
indicates open-ended inclusion or membership in the so-described
combination, group, series and the like. The references "a
plurality of" and "a number of" mean "at least two."
[0016] The present disclosure is described in relation to a heat
dissipation device. The heat dissipation device includes a first
copper sheet and a second copper sheet. The first copper sheet
includes a number of first recesses; the second copper sheet
includes a number of second recesses.
[0017] The second recesses correspond with the first recesses and
the second copper sheet is fixed on the first copper sheet. An
airtight receiving cavity is formed by each first recess and second
recess together and a working fluid is received in the airtight
receiving cavity.
[0018] FIG. 1 illustrates a heat dissipation device 100 according
to one embodiment. The heat dissipation device 100 includes a first
copper sheet 10, a second copper sheet 40, and an adhesive 20
configured for fixing the first copper sheet 10 and the second
copper sheet 40 together. A number of airtight receiving cavities
404 are formed by the first copper sheet 10 and the second copper
sheet 40 and a working fluid 30 is received in each of the airtight
receiving cavities 404.
[0019] The first copper sheet 10 includes a first surface 101. The
first surface 101 defines a number of first recesses 102 which are
randomly distributed on the first surface 101, and the first
recesses 102 are substantially strip-shaped, as shown in FIG. 2. A
cross section of the first and second recesses 102 and 402 is an
arc or a semicircle, as shown in FIG. 3. A depth of each first
recess 102 is smaller than a thickness of the first copper sheet
10. A thickness of each first copper sheet 10 and second copper 40
sheet is about 140 um.
[0020] The second copper sheet 40 has substantially the same
structure and shape as the first copper sheet 40. The second copper
sheet 40 includes a second surface 401. The second surface 401
defines a number of second recesses 402 corresponding with the
first recesses 102. A depth of each second recess 402 is smaller
than a thickness of the second copper sheet 40. The second recesses
402 and the first recesses 102 have the same shape and size. A
number of first ribs 104 are formed between each two adjacent first
recesses 102. A number of second ribs 404 are formed between each
two adjacent second recesses 402, the first ribs 104 correspond
locationally with the second ribs 404.
[0021] The adhesive 20 is arranged on the ribs 104 and the first
copper sheet 10 and the second copper sheet 40 are fixed by the
adhesive 20. In the illustrated embodiment, the adhesive 20 is low
temperature solder paste, a melting point of the low temperature
solder paste is about 139.degree. C. or less. The first recesses
102 are in communication with the second recesses 402, each first
recess 102 and each second recess 402 together form a receiving
cavity 404, and the adhesive 20 is on a part of an inner wall of
the receiving cavity 404, the adhesive 20 is configured for
accelerating cooling the working fluid 30.
[0022] The working fluid 30 is received in each receiving cavity
404. The working fluid 30 can be selected from the group comprising
water, methanol, ethanol, acetone, ammonia, paraffin, oil, and
chlorofluorocarbons at least. In the illustrated embodiment, the
working fluid 30 is water. A heat capacity of water is about
4.2.times.10.sup.3J/(kg.), which is larger than a heat capacity of
steel sheeting.
[0023] FIG. 4 shows the heat dissipation device 100 being used with
a heat generating member 60. The heat dissipation device 100 is
very thin and fixed with a heat generating member 60 of an
electronic device using adhesive (not shown). In this embodiment,
the heat generating member 60 is a CPU but is not limited to CPU
only. The generating member 60 is fixed on a printed circuit board
50 via solder ball 62. Heat generated by the heat generating member
60 is transferred and gathered at bottom of the first copper sheet
10, and the heat is absorbed by water 30 in the receiving cavity
404 and diffused through the first copper sheet 10 and the second
copper sheet 40 during the heat transfer. The water 30 is
vaporized, when water vapour is moved to an inner wall of the
second recess 402, it condenses into small water droplets which
attach to the inner wall of the receiving cavity 404. Finally the
small droplets will flow into the first recess 102 again in a
continuous process, so heat from the heat generating member 60 of
the electronic device is dissipated.
[0024] FIG. 5 illustrates a flowchart in accordance with an example
embodiment. The example method 200 for manufacturing the heat
dissipation device 100 (shown in FIG. 1) is provided by way of an
example, as there are a variety of ways to carry out the method.
Additionally, the illustrated order of blocks is by example only
and the order of the blocks can change. The method 200 can begin at
block 201.
[0025] At block 201, a first copper base 15, and a second copper
base 25 are provided, as shown in FIG. 6. The first copper base 15
includes a first surface 101, the second copper base 25 includes a
second surface 201 facing the first surface 101. A thickness of the
first copper base 15 is the same as that of the second copper base
25, being about 140 um.
[0026] At block 202, the first surface 101 is processed to form a
number of first recesses 102, and at the same time, a number of
ribs 104 are formed between each two adjacent first recesses 102.
The second surface 401 is processed to form a number of second
recesses 402, the second recesses 402 and the first recesses 102
have the same shape and size Thereby, the first copper sheet 10 and
the second copper sheet 20 are obtained. A depth of each first
recess 102 is smaller than a thickness of the first copper sheet
10. A depth of each second recess 402 is smaller than a thickness
of the second copper sheet 40. In this embodiment, the first and
second recesses 102 and 402 are formed using a laser beam and a
cross section of the first and second recesses 102 and 402 is an
arc or a semicircle, as shown in FIG. 3.
[0027] At block 203, an adhesive 20 is provided on the ribs 104 of
the first copper sheet 10, as shown in FIG. 7. A melting point of
the adhesive 20 is about 139 degrees or less, but higher than a
boiling point of water. That is to say, when water is used for
absorbing heat, the adhesive 20 is not influenced by boiling
water.
[0028] The adhesive 20 is mainly comprised of molten resin material
doped with metal particles. The metal particle is selected from a
group comprising tin, bismuth, and any combination thereof. A
diameter of the metal particle is in the range from about 25 um to
45 um. A weight ratio of tin in the adhesive 20 is in the range
from about 37% to 38%. A weight ratio of bismuth in the adhesive 20
is in the range from about 51% to 52%. A weight ratio of molten
resin in the adhesive 20 is in the range from about 4% to 6%. In
the illustrated embodiment, the resin is C.sub.19H.sub.29COOH and
the adhesive 20 also comprises solvent C.sub.10H.sub.20O.sub.3,
which is active agent C.sub.4H.sub.6O.sub.4, and an anti-oxidant:
C.sub.7H.sub.7N.sub.3 is configured for avoiding oxidation of the
metal particles. The weight ratio of the solvent, active agent, and
antioxidant are respectively 1.0% .about.3.0%, 0.1% .about.0.3%,
0.05% .about.0.06%. The proportion of the adhesive 20 as specified
above is able to obtain a better adhesion and have less
susceptibility to water.
[0029] At block 204, a working fluid 30 is provided in the first
recesses 102, as shown in FIG. 8.
[0030] At block 205, the second copper sheet 40 is pressed on the
adhesive 20 and the second copper sheet 40 is fixed with the first
copper sheet by the adhesive 20, as shown in FIG. 9, each of the
first recesses 102 are in communication with each of the second
recesses 402 and each of the first recess 102 and the second
recesses 402 together form an airtight receiving cavity 404. When
the adhesive 20 is solidified a heat dissipation device 100 is
obtained.
[0031] The embodiments shown and described above are only examples.
Therefore, many such details are neither shown nor described. Even
though numerous characteristics and advantages of the present
technology have been set forth in the foregoing description,
together with details of the structure and function of the present
disclosure, the disclosure is illustrative only, and changes may be
made in the detail, including in matters of shape, size, and
arrangement of the parts within the principles of the present
disclosure, up to and including the full extent established by the
broad general meaning of the terms used in the claims. It will
therefore be appreciated that the embodiments described above may
be modified within the scope of the claims.
* * * * *