| Patent | Date |
|---|
Circuit Board With Embedded Electronic Component And Method For Manufacturing The Same
App 20220312598 - HSU; HSIAO-TING ; et al. | 2022-09-29 |
Method For Manufacturing Electromagnetic Shielding Film
App 20220312655 - SHEN; FU-YUN ; et al. | 2022-09-29 |
Method of manufacturing circuit board
Grant 11,457,532 - Shen , et al. September 27, 2 | 2022-09-27 |
Circuit Board For Transmitting High-frequency Signal And Method For Manufacturing The Same
App 20220232696 - SHEN; FU-YUN ; et al. | 2022-07-21 |
Circuit Board And Method For Manufacturing The Same
App 20220225510 - HSU; HSIAO-TING ; et al. | 2022-07-14 |
Embedded Circuit Board And Manufacturing Method Thereof
App 20220225512 - YANG; CHENG-YI ; et al. | 2022-07-14 |
Method for making a heat dissipation structure
Grant 11,380,603 - Shen , et al. July 5, 2 | 2022-07-05 |
Camera Module And Method For Manufacturing The Same
App 20220191361 - Dai; Jun ; et al. | 2022-06-16 |
Method For Manufacturing Transmission Circuit Board
App 20220141948 - SHEN; FU-YUN ; et al. | 2022-05-05 |
Electromagnetic shielding film
Grant 11,297,748 - Shen , et al. April 5, 2 | 2022-04-05 |
Edge-to-edge board connection structure
Grant 11,296,444 - Ho , et al. April 5, 2 | 2022-04-05 |
Adapter Board And Method For Making Adapter Board
App 20220087020 - PENG; MAN-ZHI ; et al. | 2022-03-17 |
Circuit Board And Manufacturing Method Thereof
App 20220078922 - HO; MING-JAAN ; et al. | 2022-03-10 |
Circuit board using low dielectric resin composition
Grant 11,261,328 - Su , et al. March 1, 2 | 2022-03-01 |
Transmission circuit board and method for manufacturing the same
Grant 11,259,405 - Shen , et al. February 22, 2 | 2022-02-22 |
Board-to-board Connection Structure And Method For Manufacturing Same
App 20220052471 - HO; MING-JAAN ; et al. | 2022-02-17 |
Printed circuit board and method for manufacturing the same
Grant 11,252,818 - Liu , et al. February 15, 2 | 2022-02-15 |
Circuit Board And Method Of Manufacturing Circuit Board, And Method Of Manufacturing Circuit Board Assembly
App 20210410295 - WEI; WEN-ZHU ; et al. | 2021-12-30 |
Circuit board and manufacturing method thereof
Grant 11,212,922 - Ho , et al. December 28, 2 | 2021-12-28 |
High-frequency Signal Transmission Structureand Method For Manufacturing The Same
App 20210399397 - HSU; HSIAO-TING ; et al. | 2021-12-23 |
Thin Circuit Board And Method Of Manufacturing The Same
App 20210392758 - HSU; HSIAO-TING ; et al. | 2021-12-16 |
Transparent Pcb And Method For Manufacturing The Same
App 20210385944 - HSU; HSIAO-TING ; et al. | 2021-12-09 |
Transmission Circuit Board And Method For Manufacturing The Same
App 20210345479 - SHEN; FU-YUN ; et al. | 2021-11-04 |
Transparent PCB and method for manufacturing the same
Grant 11,134,564 - Hsu , et al. September 28, 2 | 2021-09-28 |
Connecting Structure
App 20210289628 - LIU; Rui-Wu ; et al. | 2021-09-16 |
Adapter Board And Method For Making Adaptor Board
App 20210235581 - PENG; MAN-ZHI ; et al. | 2021-07-29 |
Circuit Board And Manufacturing Method Thereof
App 20210235590 - HO; MING-JAAN ; et al. | 2021-07-29 |
Method for connecting stacked circuits boards
Grant 11,051,404 - Liu , et al. June 29, 2 | 2021-06-29 |
Heat Equalization Plate And Method For Manufacturing The Same
App 20210161028 - SHEN; FU-YUN ; et al. | 2021-05-27 |
Circuit Board Using Low Dielectric Resin Composition
App 20210102067 - SU; SZU-HSIANG ; et al. | 2021-04-08 |
Multilayer Circuit Board And Method For Manufacturing The Same
App 20210059058 - HSU; HSIAO-TING ; et al. | 2021-02-25 |
Method for manufacturing an ultrathin heat dissipation structure
Grant 10,923,411 - Hou , et al. February 16, 2 | 2021-02-16 |
Method for manufacturing interposer
Grant 10,910,300 - Peng , et al. February 2, 2 | 2021-02-02 |
Method For Manufacturing Interposer
App 20210028099 - PENG; MAN-ZHI ; et al. | 2021-01-28 |
Low dielectric resin composition, film and circuit board using the same
Grant 10,894,882 - Su , et al. January 19, 2 | 2021-01-19 |
Method of manufacturing physical structure for high frequency signal transmission
Grant 10,874,016 - Ho , et al. December 22, 2 | 2020-12-22 |
Bendable circuit board and method for manufacturing the same
Grant 10,863,620 - Ho , et al. December 8, 2 | 2020-12-08 |
Printed circuit board and method for manufacturing the same
Grant 10,849,229 - Liu , et al. November 24, 2 | 2020-11-24 |
Modified polyimide compound, resin composition and polyimide film
Grant 10,822,522 - Ho , et al. November 3, 2 | 2020-11-03 |
Method for manufacturing flexible printed circuit board
Grant 10,791,625 - Hu , et al. September 29, 2 | 2020-09-29 |
Resin composition, adhesive layer, and circuit board utilizing same
Grant 10,745,595 - Shen , et al. A | 2020-08-18 |
Printed Circuit Board And Method For Manufacturing The Same
App 20200253056 - Kind Code | 2020-08-06 |
Heat dissipation structure, method for making the same, and electronic device having the same
Grant 10,658,265 - Shen , et al. | 2020-05-19 |
Flexible circuit board
Grant 10,660,210 - Shen , et al. | 2020-05-19 |
Method of manufacturing multilayer circuit board
Grant 10,660,218 - Hu , et al. | 2020-05-19 |
Multilayer circuit board and method of manufacturing the same
Grant 10,653,015 - Hu , et al. | 2020-05-12 |
Connecting Structure And Method For Connecting Stacked Circuits Boards Using Same
App 20200146149 - LIU; RUI-WU ; et al. | 2020-05-07 |
Method Of Manufacturing Circuit Board
App 20200137894 - SHEN; FU-YUN ; et al. | 2020-04-30 |
Printed Circuit Board And Method For Manufacturing The Same
App 20200137888 - LIU; RUI-WU ; et al. | 2020-04-30 |
Method For Connecting Stacked Circuit Boards
App 20200107455 - LIU; RUI-WU ; et al. | 2020-04-02 |
Method Of Making Flexible Circuit Board
App 20200068715 - SHEN; FU-YUN ; et al. | 2020-02-27 |
Flexible Circuit Board
App 20200068716 - SHEN; FU-YUN ; et al. | 2020-02-27 |
Method of making flexible circuit board
Grant 10,575,406 - Shen , et al. Feb | 2020-02-25 |
Method For Making A Heat Dissipation Structure
App 20200043827 - SHEN; FU-YUN ; et al. | 2020-02-06 |
Heat dissipation device
Grant 10,533,811 - Hu , et al. Ja | 2020-01-14 |
Method Of Manufacturing Physical Structure For High Frequency Signal Transmission
App 20200015352 - HO; MING-JAAN ; et al. | 2020-01-09 |
Modified Polyimide Compound, Resin Composition And Polyimide Film
App 20190359852 - HO; MING-JAAN ; et al. | 2019-11-28 |
Resin Composition, Adhesive Layer, And Circuit Board Utilizing Same
App 20190330500 - SHEN; FU-YUN ; et al. | 2019-10-31 |
Method For Manufacturing An Ultrathin Heat Dissipation Structure
App 20190320550 - HOU; NING ; et al. | 2019-10-17 |
Electromagnetic Shielding Film And Method For Manufacturing Same
App 20190320563 - SHEN; FU-YUN ; et al. | 2019-10-17 |
Ultrathin heat dissipation structure
Grant 10,448,540 - Hou , et al. Oc | 2019-10-15 |
Resin composition, polyimide film and method for manufacturing polyimide film
Grant 10,428,238 - Ho , et al. October 1, 2 | 2019-10-01 |
Multilayer Circuit Board And Method Of Manufacturing The Same
App 20190289725 - HU; XIAN-QIN ; et al. | 2019-09-19 |
Multilayer Circuit Board And Method Of Manufacturing The Same
App 20190289724 - HU; XIAN-QIN ; et al. | 2019-09-19 |
Flexible Printed Circuit Board, Printed Circuit Board Structure And Method For Manufacturing Flexible Printed Circuit Board
App 20190254161 - HU; XIAN-QIN ; et al. | 2019-08-15 |
Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained thereby
Grant 10,365,430 - Hu , et al. July 30, 2 | 2019-07-30 |
Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board
Grant 10,321,561 - Hu , et al. | 2019-06-11 |
Circuit board having conductive polymer
Grant 10,299,367 - Ho , et al. | 2019-05-21 |
Cooling plate and method for manufacturing thereof
Grant 10,278,307 - Hu , et al. | 2019-04-30 |
Cooling Plate And Method For Manufacturing Thereof
App 20190059174 - HU; XIAN-QIN ; et al. | 2019-02-21 |
Wireless power consortium device and method for manufacturing the same
Grant 10,205,487 - Ho , et al. Feb | 2019-02-12 |
Flexible circuit board and method for manufacturing same
Grant 10,117,328 - Zhong , et al. October 30, 2 | 2018-10-30 |
Method For Making A Circuit Board
App 20180310406 - HO; MING-JAAN ; et al. | 2018-10-25 |
Method for making a circuit board
Grant 10,104,771 - Ho , et al. October 16, 2 | 2018-10-16 |
Heat Dissipation Device
App 20180274869 - HU; XIAN-QIN ; et al. | 2018-09-27 |
Low Dielectric Resin Composition, Film And Circuit Board Using The Same
App 20180265699 - SU; SZU-HSIANG ; et al. | 2018-09-20 |
Resin Composition, Method For Making Resin Composition And Film For Circuit Board, And Circuit Board
App 20180223048 - HSU; MAO-FENG ; et al. | 2018-08-09 |
Resin Composition, Polyimide Film And Method For Manufacturing Polyimide Film
App 20180201805 - HO; MING-JAAN ; et al. | 2018-07-19 |
Method For Manufacturing High Frequency Signal Transmission Structure And High Frequency Signal Transmission Structure Obtained Thereby
App 20180196192 - HU; XIAN-QIN ; et al. | 2018-07-12 |
Heat dissipation device and method for manufacturing same
Grant 10,012,454 - Hu , et al. July 3, 2 | 2018-07-03 |
Printed circuit board
Grant 9,992,858 - Ho , et al. June 5, 2 | 2018-06-05 |
Flexible Printed Circuit Board, Printed Circuit Board Structure And Method For Manufacturing Flexible Printed Circuit Board
App 20180139841 - HU; XIAN-QIN ; et al. | 2018-05-17 |
Heat Dissipation Structure, Method For Making The Same, And Electronic Device Having The Same
App 20180082924 - SHEN; FU-YUN ; et al. | 2018-03-22 |
Circuit Board Having Conductive Polymer
App 20180070437 - HO; MING-JAAN ; et al. | 2018-03-08 |
High Frequency Signal Transmission Structure And Method For Same
App 20170354030 - HO; MING-JAAN ; et al. | 2017-12-07 |
Method For Making Conductive Polymer, And Composite Film And Circuit Board Having The Conductive Polymer
App 20170339782 - HO; MING-JAAN ; et al. | 2017-11-23 |
Printed circuit board and method for manufacturing same
Grant 9,820,388 - Ho , et al. November 14, 2 | 2017-11-14 |
Ultrathin Heat Dissipation Structure And A Method For Manufacturing Same
App 20170325356 - HOU; NING ; et al. | 2017-11-09 |
Method for making conductive polymer, and composite film and circuit board having the conductive polymer
Grant 9,807,868 - Ho , et al. October 31, 2 | 2017-10-31 |
Printed Circuit Board
App 20170265295 - HO; MING-JAAN ; et al. | 2017-09-14 |
Method for manufacturing printed circuit board
Grant 9,706,640 - Ho , et al. July 11, 2 | 2017-07-11 |
Flexible Circuit Board And Method For Manufacturing Same
App 20170188451 - HU; XIAN-QIN ; et al. | 2017-06-29 |
Flexible circuit board and method for making the same
Grant 9,693,448 - Hu , et al. June 27, 2 | 2017-06-27 |
Circuit Board For Radio Transceiving And Method For Manufacturing Same
App 20170110244 - HU; XIAN-QIN ; et al. | 2017-04-20 |
Flexible Circuit Board And Method For Making The Same
App 20170105280 - HU; XIAN-QIN ; et al. | 2017-04-13 |
Flexible circuit board and method for manufacturing same
Grant 9,622,340 - Hu , et al. April 11, 2 | 2017-04-11 |
Flexible circuit board and method for manufacturing same
Grant 9,615,445 - Hu , et al. April 4, 2 | 2017-04-04 |
Flexible Circuit Board And Method For Manufacturing Same
App 20170027054 - HU; XIAN-QIN ; et al. | 2017-01-26 |
Flexible Circuit Board And Method For Manufacturing Same
App 20160381786 - HU; XIAN-QIN ; et al. | 2016-12-29 |
Thin Heat Dissipation Foil And Method For Manufacturing Same
App 20160320142 - HO; MING-JAAN ; et al. | 2016-11-03 |
Flexible circuit board and method for manufacturing same
Grant 9,485,859 - Hu , et al. November 1, 2 | 2016-11-01 |
Printed Circuit Board And Method For Manufacturing Same
App 20160183357 - HO; Ming-Jaan ; et al. | 2016-06-23 |
Flexible printed circuit board and method for making same
Grant 9,357,631 - Ho , et al. May 31, 2 | 2016-05-31 |
Method of manufacturing a printed circuit board with circuit visible
Grant 9,288,914 - Ho , et al. March 15, 2 | 2016-03-15 |
Heat Dissipation Device And Method For Manufacturing Same
App 20160061540 - HU; XIAN-QIN ; et al. | 2016-03-03 |
Flexible printed circuit board and method for manufacturing same
Grant 9,277,640 - Ho , et al. March 1, 2 | 2016-03-01 |
Flexible Printed Circuit Board And Method For Manufacturing Same
App 20150189760 - HO; MING-JAAN ; et al. | 2015-07-02 |
Flexible Printed Circuit Board And Method For Manufacturing Same
App 20150189738 - HO; MING-JAAN ; et al. | 2015-07-02 |
Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible
Grant 9,066,431 - Liu , et al. June 23, 2 | 2015-06-23 |
Heat Dissipation Device And A Method For Manufacturing Same
App 20150101785 - HO; MING-JAAN ; et al. | 2015-04-16 |
Printed Circuit Board And Method For Manufacturing Same
App 20150053466 - HO; MING-JAAN ; et al. | 2015-02-26 |
Printed Circuit Board And Method For Manufacturing Same
App 20150040392 - HO; MING-JAAN ; et al. | 2015-02-12 |
Flexible Printed Circuit Board And Method For Making Same
App 20150034364 - HO; MING-JAAN ; et al. | 2015-02-05 |
Printed Circuit Board With Visible Triangular Shaped Traces
App 20140158407 - HO; MING-JAAN | 2014-06-12 |
Polyimide, Copper-clad Laminate, Flexible Printed Circuit Board, And Method For Manufacturing The Flexible Printed Circuit Board
App 20140158410 - HO; MING-JAAN | 2014-06-12 |
Pcb With Visible Circuit And Method For Making And Using Pcb With Visible Circuit
App 20140151092 - HO; MING-JAAN ; et al. | 2014-06-05 |
Printed Circuit Board With Circuit Visible And Method For Manufacturing Same
App 20140144685 - HO; MING-JAAN ; et al. | 2014-05-29 |
Resin coated copper foil, method for manufacturing same and multi-layer circuit board
Grant 8,647,518 - Ho February 11, 2 | 2014-02-11 |
Printed Circuit Board With Patterned Electrically Conductive Layer Therein Visible And Method For Manufacturing Same
App 20140027164 - LIU; RUI-WU ; et al. | 2014-01-30 |
Resin Coated Copper Foil, Method For Manufacturing Same And Multi-layer Circuit Board
App 20130284692 - HO; MING-JAAN | 2013-10-31 |
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