Patent | Date |
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Heat dissipation structure, method for making the same, and electronic device having the same Grant 10,658,265 - Shen , et al. | 2020-05-19 |
Composite circuit board and method of manufacturing the same Grant 10,159,149 - Hu , et al. Dec | 2018-12-18 |
Method Of Making A Flexible Printed Circuit Board App 20180310412 - ZHOU; LEI ;   et al. | 2018-10-25 |
Method of making a flexible printed circuit board Grant 10,111,336 - Zhou , et al. October 23, 2 | 2018-10-23 |
Composite Circuit Board And Method Of Manufacturing The Same App 20180192516 - HU; XIAN-QIN ;   et al. | 2018-07-05 |
Heat dissipation device and method for manufacturing same Grant 10,012,454 - Hu , et al. July 3, 2 | 2018-07-03 |
Method of manufacturing a package substrate Grant 9,992,873 - Huang June 5, 2 | 2018-06-05 |
Printed circuit board Grant 9,992,858 - Ho , et al. June 5, 2 | 2018-06-05 |
Heat Dissipation Structure, Method For Making The Same, And Electronic Device Having The Same App 20180082924 - SHEN; FU-YUN ;   et al. | 2018-03-22 |
Heat sink, method for making the same, and electronic device having the same Grant 9,855,629 - Huang January 2, 2 | 2018-01-02 |
High Frequency Signal Transmission Structure And Method For Same App 20170354030 - HO; MING-JAAN ;   et al. | 2017-12-07 |
Circuit Board And Method For Making The Same App 20170339795 - LI; YAN-LU ;   et al. | 2017-11-23 |
Method For Making Conductive Polymer, And Composite Film And Circuit Board Having The Conductive Polymer App 20170339782 - HO; MING-JAAN ;   et al. | 2017-11-23 |
Printed circuit board and method for manufacturing same Grant 9,820,388 - Ho , et al. November 14, 2 | 2017-11-14 |
Ultrathin Heat Dissipation Structure And A Method For Manufacturing Same App 20170325356 - HOU; NING ;   et al. | 2017-11-09 |
Method for making conductive polymer, and composite film and circuit board having the conductive polymer Grant 9,807,868 - Ho , et al. October 31, 2 | 2017-10-31 |
Method for making a multilayer flexible printed circuit board Grant 9,807,877 - Liu , et al. October 31, 2 | 2017-10-31 |
Method for manufacturing package structure Grant 9,786,589 - Su October 10, 2 | 2017-10-10 |
Method for manufacturing printed circuit board with etching process to partially remove conductive layer Grant 9,788,437 - Su October 10, 2 | 2017-10-10 |
Resin Composition And Adhesive Film And Circuit Board Made Of The Same App 20170275508 - HSU; MAO-FENG ;   et al. | 2017-09-28 |
Printed Circuit Board App 20170265295 - HO; MING-JAAN ;   et al. | 2017-09-14 |
Method for manufacturing printed circuit board Grant 9,706,640 - Ho , et al. July 11, 2 | 2017-07-11 |
Flexible Circuit Board And Method For Manufacturing Same App 20170188451 - HU; XIAN-QIN ;   et al. | 2017-06-29 |
Flexible circuit board and method for making the same Grant 9,693,448 - Hu , et al. June 27, 2 | 2017-06-27 |
Circuit Board And Method For Manufacturing Same App 20170127519 - HUANG; YU-CHENG | 2017-05-04 |
Circuit Board For Radio Transceiving And Method For Manufacturing Same App 20170110244 - HU; XIAN-QIN ;   et al. | 2017-04-20 |
Chip Package And Method For Manufacturing Same App 20170110427 - SU; WEI-SHUO | 2017-04-20 |
Flexible Circuit Board And Method For Making The Same App 20170105280 - HU; XIAN-QIN ;   et al. | 2017-04-13 |
Flexible circuit board and method for manufacturing same Grant 9,622,340 - Hu , et al. April 11, 2 | 2017-04-11 |
Flexible circuit board and method for manufacturing same Grant 9,615,445 - Hu , et al. April 4, 2 | 2017-04-04 |
Substrate, Chip Package With Same And Method For Manufacturing Same App 20170084509 - HUANG; YU-CHENG | 2017-03-23 |
Circuit Board And Method For Making The Same App 20170079136 - SU; SZU-HSIANG ;   et al. | 2017-03-16 |
Flexible Circuit Board And Method For Manufacturing Same App 20170027054 - HU; XIAN-QIN ;   et al. | 2017-01-26 |
Package structure and method for manufacturing same Grant 9,548,427 - Huang January 17, 2 | 2017-01-17 |
Flexible Circuit Board And Method For Manufacturing Same App 20160381786 - HU; XIAN-QIN ;   et al. | 2016-12-29 |
Heat Sink, Method For Making The Same, And Electronic Device Having The Same App 20160381833 - HUANG; YU-CHENG | 2016-12-29 |
Circuit Board, Method For Making The Same, And Portable Electronic Device Employing The Same App 20160366766 - YEH; TZU-CHIEN | 2016-12-15 |
Printed Circuit Board And Method For Manufacturing Same App 20160353582 - SU; WEI-SHUO | 2016-12-01 |
Package Structure And Method For Manufacturing Same App 20160351753 - HUANG; YU-CHENG | 2016-12-01 |
Thin Heat Dissipation Foil And Method For Manufacturing Same App 20160320142 - HO; MING-JAAN ;   et al. | 2016-11-03 |
Flexible circuit board and method for manufacturing same Grant 9,485,859 - Hu , et al. November 1, 2 | 2016-11-01 |
Hybrid Circuit Board And Method For Making The Same, And Semiconductor Package Structure App 20160240464 - HUANG; YU-CHENG | 2016-08-18 |
Package Structure And Method For Manufacturing Same App 20160181181 - SU; WEI-SHUO | 2016-06-23 |
Printed Circuit Board And Method For Manufacturing Same App 20160183357 - HO; Ming-Jaan ;   et al. | 2016-06-23 |
Flexible printed circuit board and method for making same Grant 9,357,631 - Ho , et al. May 31, 2 | 2016-05-31 |
Flexible Printed Circuit Board And Method For Manufacturing Same App 20160150635 - HU; XIAN-QIN ;   et al. | 2016-05-26 |
Method of manufacturing a printed circuit board with circuit visible Grant 9,288,914 - Ho , et al. March 15, 2 | 2016-03-15 |
Heat Dissipation Device And Method For Manufacturing Same App 20160061540 - HU; XIAN-QIN ;   et al. | 2016-03-03 |
Part-embedded Circuit Structure And Method For Manufacturing Same App 20160066418 - CHENG; YU-HAO ;   et al. | 2016-03-03 |
Flexible printed circuit board and method for manufacturing same Grant 9,277,640 - Ho , et al. March 1, 2 | 2016-03-01 |
Compact rigid-flexible printed circuit board and method for manufacturing same Grant 9,210,811 - Li December 8, 2 | 2015-12-08 |
Method for manufacturing rigid-flexible printed circuit board Grant 9,198,304 - Li November 24, 2 | 2015-11-24 |
Method for manufacturing multilayer printed circuit board Grant 9,125,334 - Zeng September 1, 2 | 2015-09-01 |
Method for manufacturing printed circuit board Grant 9,107,311 - Shen , et al. August 11, 2 | 2015-08-11 |
Method for manufacturing multilayer printed circuit board Grant 9,095,082 - Zeng July 28, 2 | 2015-07-28 |
Flexible Printed Circuit Board And Method For Manufacturing Same App 20150189760 - HO; MING-JAAN ;   et al. | 2015-07-02 |
Flexible Printed Circuit Board And Method For Manufacturing Same App 20150189738 - HO; MING-JAAN ;   et al. | 2015-07-02 |
Rigid-flex printed circuit board and method for making same Grant 9,072,173 - Hou June 30, 2 | 2015-06-30 |
Method for manufacturing printed circuit board Grant 9,066,417 - Liu , et al. June 23, 2 | 2015-06-23 |
Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible Grant 9,066,431 - Liu , et al. June 23, 2 | 2015-06-23 |
Heat Dissipation Device And A Method For Manufacturing Same App 20150101785 - HO; MING-JAAN ;   et al. | 2015-04-16 |
Method for manufacturing printed circuit board Grant 8,978,244 - Cai , et al. March 17, 2 | 2015-03-17 |
Printed Circuit Board And Method For Manufacturing Same App 20150053466 - HO; MING-JAAN ;   et al. | 2015-02-26 |
Printed Circuit Board And Method For Manufacturing Same App 20150040392 - HO; MING-JAAN ;   et al. | 2015-02-12 |
Flexible Printed Circuit Board And Method For Making Same App 20150034364 - HO; MING-JAAN ;   et al. | 2015-02-05 |
Printed Circuit Board And Method For Manufacturing Same App 20140374153 - LEE; YU-HSIEN ;   et al. | 2014-12-25 |
Compact Rigid-flexible Printed Circuit Board And Method For Manufacturing Same App 20140305683 - LI; BIAO | 2014-10-16 |
Method for manufacturing multilayer printed circuit board having mounting cavity Grant 8,850,701 - Cai October 7, 2 | 2014-10-07 |
Rigid-flex Printed Circuit Board And Method For Making Same App 20140182900 - HOU; NING | 2014-07-03 |
Rigid-flexible Printed Circuit Board And Method For Manufacturing Same App 20140182899 - LI; BIAO | 2014-07-03 |
Pcb With Visible Circuit And Method For Making And Using Pcb With Visible Circuit App 20140151092 - HO; MING-JAAN ;   et al. | 2014-06-05 |
Printed Circuit Board With Circuit Visible And Method For Manufacturing Same App 20140144685 - HO; MING-JAAN ;   et al. | 2014-05-29 |
Printed Circuit Board And Method For Manufacturing Same App 20140110152 - ZUO; QING ;   et al. | 2014-04-24 |
Method For Manufacturing Printed Circuit Board App 20140053397 - LIU; RUI-WU ;   et al. | 2014-02-27 |
Printed Circuit Board And Method For Manufacturing Same App 20140054074 - SHEN; FU-YUN ;   et al. | 2014-02-27 |
Multilayer Flexible Printed Circuit Board And Method For Manufacturing Same App 20140054079 - SHEN; FU-YUN ;   et al. | 2014-02-27 |
Printed circuit board Grant 8,648,261 - Huang February 11, 2 | 2014-02-11 |
Method for manufacturing rigid-flexible printed circuit board Grant 8,591,692 - Wang , et al. November 26, 2 | 2013-11-26 |
Method for manufacturing printed circuit board with cavity Grant 8,516,694 - Cai , et al. August 27, 2 | 2013-08-27 |
Electronic component device and connector assembly having same Grant 8,481,854 - Zeng July 9, 2 | 2013-07-09 |
Method for forming electrical traces on substrate Grant 8,475,867 - Bai , et al. July 2, 2 | 2013-07-02 |
Method for manufacturing multilayer flexible printed circuit board Grant 8,453,321 - Zhang , et al. June 4, 2 | 2013-06-04 |
Method of manufacturing FPCB substrate Grant 8,453,324 - Liu , et al. June 4, 2 | 2013-06-04 |
Method for screen printing printed circuit board substrate Grant 8,448,571 - Zheng May 28, 2 | 2013-05-28 |
Apparatus for wet processing substrate Grant 8,388,800 - Bai , et al. March 5, 2 | 2013-03-05 |
Coverlay processing system Grant 8,322,017 - Liao , et al. December 4, 2 | 2012-12-04 |
Method for manufacturing multilayer printed circuit board with plated through holes Grant 8,302,300 - Chen November 6, 2 | 2012-11-06 |
Flexible printed circuit board holder Grant 8,223,505 - Wu , et al. July 17, 2 | 2012-07-17 |
Method for manufacturing a printed circuit board Grant 8,205,330 - Zhang , et al. June 26, 2 | 2012-06-26 |
Method for manufacturing multilayer printed circuit boards Grant 8,112,880 - Zhang , et al. February 14, 2 | 2012-02-14 |
Flexible printed circuit board having curved edge Grant 8,071,884 - Wang , et al. December 6, 2 | 2011-12-06 |
Printed circuit board and method for manufacturing same Grant 8,071,887 - Liou , et al. December 6, 2 | 2011-12-06 |
Board inverter Grant 8,061,959 - Fan , et al. November 22, 2 | 2011-11-22 |
Method of manufacturing multilayer printed circuit board having buried holes Grant 8,052,881 - Zhu , et al. November 8, 2 | 2011-11-08 |
Printed circuit boards Grant 8,049,113 - He , et al. November 1, 2 | 2011-11-01 |
Method of detecting faulty via holes in printed circuit boards Grant 8,049,511 - Xiao , et al. November 1, 2 | 2011-11-01 |
Method for manufacturing multilayer flexible printed circuit board Grant 8,042,265 - Zhang , et al. October 25, 2 | 2011-10-25 |
Retaining apparatus for a flexible printed circuit board Grant 8,009,432 - Su , et al. August 30, 2 | 2011-08-30 |
Electroplating method Grant 7,998,332 - Liou , et al. August 16, 2 | 2011-08-16 |
Method for manufacturing printed circuit board having different thicknesses in different areas Grant 7,987,586 - He , et al. August 2, 2 | 2011-08-02 |
Flexible Printed Circuit Board Holder App 20110095464 - WU; CHENG-BIN ;   et al. | 2011-04-28 |
Apparatus for holding printed circuit boards Grant 7,916,499 - Feng , et al. March 29, 2 | 2011-03-29 |
Flexible printed circuit board holder Grant 7,903,424 - Wu , et al. March 8, 2 | 2011-03-08 |
Apparatus For Wet Processing Substrate App 20110024042 - Bai; Yao-Wen ;   et al. | 2011-02-03 |
Visual inspection apparatus for flexible printed circuit boards Grant 7,872,744 - Tong , et al. January 18, 2 | 2011-01-18 |
Method for manufacturing rigid-flexible printed circuit board Grant 7,789,989 - Ren , et al. September 7, 2 | 2010-09-07 |
Printed circuit board assembly having adhesive layer Grant 7,728,232 - Huang , et al. June 1, 2 | 2010-06-01 |
Method For Forming Electrical Traces On Substrate App 20100129532 - BAI; YAO-WEN ;   et al. | 2010-05-27 |
Method Of Forming Electrical Traces App 20100021652 - LIN; CHENG-HSIEN ;   et al. | 2010-01-28 |
Method For Manufacturing Flexible Printed Circuit Board App 20100018638 - ZHANG; QI | 2010-01-28 |
Method Of Forming Electrical Traces On Substrate App 20100021653 - LIN; CHENG-HSIEN ;   et al. | 2010-01-28 |
Method Of Forming Circuits On Circuit Board App 20090304911 - LIN; CHENG-HSIEN ;   et al. | 2009-12-10 |
Ink, Method Of Forming Electrical Traces Using The Same And Circuit Board App 20090301763 - LIN; CHENG-HSIEN ;   et al. | 2009-12-10 |
Ink And Method Of Forming Electrical Traces Using The Same App 20090291230 - LIN; CHENG-HSIEN ;   et al. | 2009-11-26 |
Ink And Method Of Forming Electrical Traces Using The Same App 20090286006 - LIN; CHENG-HSIEN ;   et al. | 2009-11-19 |
Method Of Forming Circuits On Circuit Board App 20090246357 - Liou; Shing-Tza ;   et al. | 2009-10-01 |
Method For Manufacturing Printed Circuit Board Having Different Thicknesses In Different Areas App 20090241333 - HE; DONG-QING ;   et al. | 2009-10-01 |
Printed Circuit Board And Method For Manufacturing Same App 20090242246 - LIOU; SHING-TZA ;   et al. | 2009-10-01 |
Method For Manufacturing Multilayer Printed Circuit Boards App 20090229121 - Zhang; Hu-Hai ;   et al. | 2009-09-17 |
Method For Forming Solder Lumps On Printed Circuit Board Substrate App 20090217520 - HUANG; FENG-YAN ;   et al. | 2009-09-03 |
Method for manufacturing multilayer flexible printed circuit board Grant 7,581,312 - Tu , et al. September 1, 2 | 2009-09-01 |
Method For Manufacturing Rigid-flexible Printed Circuit Board App 20090183823 - REN; LIN ;   et al. | 2009-07-23 |
Method For Forming Circuit In Making Printed Circuit Board App 20090178276 - LAI; YUNG-WEI ;   et al. | 2009-07-16 |
Board Inverter App 20090175713 - FAN; YA-LING ;   et al. | 2009-07-09 |
Method Of Manufacturing Multilayer Printed Circuit Board Having Buried Holes App 20090159559 - ZHU; YUN-LI ;   et al. | 2009-06-25 |
Printed Circuit Board And Method For Manufacturing The Same App 20090159317 - ZHANG; QI ;   et al. | 2009-06-25 |
Fpcb Substrate And Method Of Manufacturing The Same App 20090120671 - Liu; Rui-Wu ;   et al. | 2009-05-14 |
Simulation System And Method For Manufacturing Printed Circuit Board App 20090088881 - Zhu; Jin ;   et al. | 2009-04-02 |
Flexible printed circuit board Grant 7,511,962 - Hou , et al. March 31, 2 | 2009-03-31 |
Method Of Welding Electronic Components On Pcbs App 20090050677 - HAO; JIAN-YI ;   et al. | 2009-02-26 |
Apparatus For Holding Printed Circuit Boards App 20090045151 - Feng; Yong-Hui ;   et al. | 2009-02-19 |
Flexible Printed Circuit Board Substrate And Flexible Printed Circuit Board Fabricated Using The Same App 20090038828 - HOU; NING ;   et al. | 2009-02-12 |
Method Of Detecting Faulty Via Holes In Printed Circuit Boards App 20090039895 - Xiao; Li ;   et al. | 2009-02-12 |
Method Of Cutting Pcbs App 20090042370 - SU; YING ;   et al. | 2009-02-12 |
Visual Inspection Apparatus For Flexible Printed Circuit Boards App 20090033925 - TONG; LIAN-DA ;   et al. | 2009-02-05 |
Adhesive Layer And Printed Circuit Board Assembly Having The Same App 20090035566 - HUANG; FENG-YAN ;   et al. | 2009-02-05 |
Apparatus For Testing Chips With Ball Grid Array App 20090027072 - FENG; YONG-HUI ;   et al. | 2009-01-29 |
Flexible Printed Circuit Board App 20090014204 - WANG; MING ;   et al. | 2009-01-15 |
Surface Mounting Apparatus And Method App 20090000115 - ZHU; YIN-KUI ;   et al. | 2009-01-01 |
Flexible Printed Circuit Board Holder App 20090001641 - WU; Cheng-Bin ;   et al. | 2009-01-01 |
Coverlay Processing System App 20080314719 - Liao; Kai ;   et al. | 2008-12-25 |
Apparatus For Plasma-processing Flexible Printed Circuit Boards App 20080308042 - LONG; ZE ;   et al. | 2008-12-18 |
Screen Printing Stencil And Method For Manufacturing The Same App 20080302258 - Zhang; Yong-Hong ;   et al. | 2008-12-11 |
Flexible Printed Circuit Board App 20080285241 - HOU; NING ;   et al. | 2008-11-20 |
Printed Circuit Boards App 20080283289 - He; Dong-Qing ;   et al. | 2008-11-20 |
Gas-driven Liquid Pump App 20080286122 - TONG; LIAN-DA ;   et al. | 2008-11-20 |
Mounting Support For A Flexible Printed Circuit Board And Retaining Apparatus Having The Same App 20080266819 - SU; YING ;   et al. | 2008-10-30 |
Method For Manufacturing Multilayer Flexible Printed Circuit Board App 20080250637 - ZHANG; JUN-QING ;   et al. | 2008-10-16 |
Mounting Support For Retaining A Flexible Printed Circuit Board App 20080248258 - HAO; JIAN-YI | 2008-10-09 |
Laminator And Laminating Method App 20080230168 - WEN; YING-SONG ;   et al. | 2008-09-25 |
Method For Manufacturing Multilayer Flexible Printed Circuit Board App 20080148562 - TU; CHIH-YI ;   et al. | 2008-06-26 |