| Patent | Date |
|---|
Polymer Dispersion, Method For Manufacturing The Polymer Dispersion, And Method For Manufacturing Polymer Composite Film
App 20220169789 - LEE; KUAN-WEI ; et al. | 2022-06-02 |
Transparent Polyimide Mixture, Method For Manufacturing The Transparent Polyimide Mixture, And Method For Manufacturing Transparent Polyimide Film
App 20220169851 - LEE; KUAN-WEI ; et al. | 2022-06-02 |
Thick Polyimide Film And Method For Manufacturing Same
App 20220152912 - HUANG; WEI-HSIN ; et al. | 2022-05-19 |
Method For Manufacturing Self-healing Composition, Self-healing Composition, And Self-healing Film
App 20220153770 - HUANG; CHI-FEI ; et al. | 2022-05-19 |
Polyimide Film And Method For Manufacturing Same
App 20220135797 - HUANG; WEI-HSIN ; et al. | 2022-05-05 |
Circuit board using low dielectric resin composition
Grant 11,261,328 - Su , et al. March 1, 2 | 2022-03-01 |
Fluorine-containing Dispersion And Method Of Manufacturing The Same, And Fluorine-containing Composite Film
App 20220033663 - LEE; KUAN-WEI ; et al. | 2022-02-03 |
Method For Manufacturing Electromagnetic Shielding Film
App 20220039303 - CHUNG; SHENG-FENG ; et al. | 2022-02-03 |
Polyimide Component, Polyimide Film, And Polyimide Copper Clad Laminate
App 20220002490 - LEE; KUAN-WEI ; et al. | 2022-01-06 |
Liquid Crystal Polymer Composition, Copper Substrate, And Method For Manufacturing The Copper Substrate
App 20210363384 - LEE; KUAN-WEI ; et al. | 2021-11-25 |
Conductive Ink And Conductive Element Able To Be Stretched
App 20210348012 - SU; LING-LUNG ; et al. | 2021-11-11 |
Circuit Board Using Low Dielectric Resin Composition
App 20210102067 - SU; SZU-HSIANG ; et al. | 2021-04-08 |
Polyimide Film, Block Copolymer Of Polyamide Acid, And Method For Manufacturing The Block Copolymer Of Polyamide Acid
App 20210087319 - LEE; KUAN-WEI ; et al. | 2021-03-25 |
Conductive Composition, Conductive Film, And Circuit Board Using The Same
App 20210092840 - CHUNG; SHENG-FENG ; et al. | 2021-03-25 |
Photosensitive resin composition, and polymer film made therefrom
Grant 10,928,730 - Yen , et al. February 23, 2 | 2021-02-23 |
Polyamic Acid Composition, Polyimide Film, And Copper Clad Laminate
App 20210017336 - SU; SZU-HSIANG ; et al. | 2021-01-21 |
Low dielectric resin composition, film and circuit board using the same
Grant 10,894,882 - Su , et al. January 19, 2 | 2021-01-19 |
Inorganic shell, resin composition, and method for making inorganic shell
Grant 10,875,984 - Liang , et al. December 29, 2 | 2020-12-29 |
Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same
Grant 10,844,174 - Huang , et al. November 24, 2 | 2020-11-24 |
Modified polyimide compound, resin composition and polyimide film
Grant 10,822,522 - Ho , et al. November 3, 2 | 2020-11-03 |
Elastic Conductive Composite Fabric Capable Of Detecting And Providing Electrical Signals According To Reflections Of Limbs And Body Movements
App 20200338868 - HUANG; CHI-FEI ; et al. | 2020-10-29 |
Modified Polyimide Compound, Resin Composition And Polyimide Film
App 20190359852 - HO; MING-JAAN ; et al. | 2019-11-28 |
Photosensitive Resin Composition, And Polymer Film Made Therefrom
App 20190361349 - YEN; CHEN-FENG ; et al. | 2019-11-28 |
Modified Liquid Crystal Polymer, Polymeric Film, And Method For Manufacturing The Modified Liquid Crystal Polymer
App 20190352456 - HSIANG; SHOU-JUI ; et al. | 2019-11-21 |
Resin composition, polyimide film and method for manufacturing polyimide film
Grant 10,428,238 - Ho , et al. October 1, 2 | 2019-10-01 |
Water soluble photosensitive resin composition and film using same
Grant 10,423,069 - Yen , et al. Sept | 2019-09-24 |
Package substrate
Grant 10,412,835 - Huang Sept | 2019-09-10 |
Photosensitive resin composition, and film and printed circuit board using same
Grant 10,329,368 - Hsu , et al. | 2019-06-25 |
Low Dielectric Polyimide Composition, Polyimide, Polyimide Film And Copper Clad Laminate Using The Same
App 20190085131 - HUANG; NAN-KUN ; et al. | 2019-03-21 |
Inorganic Shell, Resin Composition, And Method For Making Inorganic Shell
App 20190055378 - LIANG; KUO-SHENG ; et al. | 2019-02-21 |
Low Dielectric Resin Composition, Film And Circuit Board Using The Same
App 20180265699 - SU; SZU-HSIANG ; et al. | 2018-09-20 |
Package Substrate
App 20180235085 - HUANG; YU-CHENG | 2018-08-16 |
Resin Composition, Method For Making Resin Composition And Film For Circuit Board, And Circuit Board
App 20180223048 - HSU; MAO-FENG ; et al. | 2018-08-09 |
Photosensitive Resin Composition, Method For Making Photosensitive Resin Composition, And Method For Making Printed Circuit Board Therewith
App 20180203350 - HSU; MAO-FENG ; et al. | 2018-07-19 |
Resin Composition, Polyimide Film And Method For Manufacturing Polyimide Film
App 20180201805 - HO; MING-JAAN ; et al. | 2018-07-19 |
Water Soluble Photosensitive Resin Composition And Film Using Same
App 20180188649 - YEN; CHEN-FENG ; et al. | 2018-07-05 |
Heat dissipation device and method for manufacturing same
Grant 10,012,454 - Hu , et al. July 3, 2 | 2018-07-03 |
Method of manufacturing a package substrate
Grant 9,992,873 - Huang June 5, 2 | 2018-06-05 |
Package structure
Grant 9,905,508 - Su February 27, 2 | 2018-02-27 |
Heat sink, method for making the same, and electronic device having the same
Grant 9,855,629 - Huang January 2, 2 | 2018-01-02 |
Resin Composition, Adhesive Film, And Circuit Board Using The Same
App 20170369747 - SU; SZU-HSIANG ; et al. | 2017-12-28 |
Polyamic Acid, Polyimide, Polyimide Film And Copper Clad Laminate Using The Same
App 20170369653 - KAO; YU-WEN ; et al. | 2017-12-28 |
Photosensitive Resin Composition, And Film And Printed Circuit Board Using Same
App 20170362361 - HSU; MAO-FENG ; et al. | 2017-12-21 |
Package Structure
App 20170365540 - SU; WEI-SHUO | 2017-12-21 |
Circuit Board And Method For Making The Same
App 20170339795 - LI; YAN-LU ; et al. | 2017-11-23 |
Printed circuit board and method for manufacturing same
Grant 9,820,388 - Ho , et al. November 14, 2 | 2017-11-14 |
Ultrathin Heat Dissipation Structure And A Method For Manufacturing Same
App 20170325356 - HOU; NING ; et al. | 2017-11-09 |
Method for manufacturing package structure
Grant 9,786,589 - Su October 10, 2 | 2017-10-10 |
Method for manufacturing printed circuit board with etching process to partially remove conductive layer
Grant 9,788,437 - Su October 10, 2 | 2017-10-10 |
Resin Composition And Adhesive Film And Circuit Board Made Of The Same
App 20170275508 - HSU; MAO-FENG ; et al. | 2017-09-28 |
Printed circuit board with embedded component and method for manufacturing same
Grant 9,730,328 - Hsu August 8, 2 | 2017-08-08 |
Method for manufacturing printed circuit board
Grant 9,706,640 - Ho , et al. July 11, 2 | 2017-07-11 |
Flexible Circuit Board And Method For Manufacturing Same
App 20170188451 - HU; XIAN-QIN ; et al. | 2017-06-29 |
Flexible circuit board and method for making the same
Grant 9,693,448 - Hu , et al. June 27, 2 | 2017-06-27 |
Circuit Board And Method For Manufacturing Same
App 20170127519 - HUANG; YU-CHENG | 2017-05-04 |
Circuit Board For Radio Transceiving And Method For Manufacturing Same
App 20170110244 - HU; XIAN-QIN ; et al. | 2017-04-20 |
Chip Package And Method For Manufacturing Same
App 20170110427 - SU; WEI-SHUO | 2017-04-20 |
Flexible Circuit Board And Method For Making The Same
App 20170105280 - HU; XIAN-QIN ; et al. | 2017-04-13 |
Flexible circuit board and method for manufacturing same
Grant 9,622,340 - Hu , et al. April 11, 2 | 2017-04-11 |
Flexible circuit board and method for manufacturing same
Grant 9,615,445 - Hu , et al. April 4, 2 | 2017-04-04 |
Substrate, Chip Package With Same And Method For Manufacturing Same
App 20170084509 - HUANG; YU-CHENG | 2017-03-23 |
Circuit Board And Method For Making The Same
App 20170079136 - SU; SZU-HSIANG ; et al. | 2017-03-16 |
Flexible Circuit Board And Method For Manufacturing Same
App 20170027054 - HU; XIAN-QIN ; et al. | 2017-01-26 |
Package structure and method for manufacturing same
Grant 9,548,427 - Huang January 17, 2 | 2017-01-17 |
Flexible Circuit Board And Method For Manufacturing Same
App 20160381786 - HU; XIAN-QIN ; et al. | 2016-12-29 |
Heat Sink, Method For Making The Same, And Electronic Device Having The Same
App 20160381833 - HUANG; YU-CHENG | 2016-12-29 |
Circuit Board, Method For Making The Same, And Portable Electronic Device Employing The Same
App 20160366766 - YEH; TZU-CHIEN | 2016-12-15 |
Package Structure And Method For Manufacturing Same
App 20160351753 - HUANG; YU-CHENG | 2016-12-01 |
Printed Circuit Board And Method For Manufacturing Same
App 20160353582 - SU; WEI-SHUO | 2016-12-01 |
Thin Heat Dissipation Foil And Method For Manufacturing Same
App 20160320142 - HO; MING-JAAN ; et al. | 2016-11-03 |
Flexible circuit board and method for manufacturing same
Grant 9,485,859 - Hu , et al. November 1, 2 | 2016-11-01 |
Packaging substrate and method for manufacturing same
Grant 9,472,426 - Su October 18, 2 | 2016-10-18 |
Method for manufacturing printed circuit board
Grant 9,439,282 - Hu September 6, 2 | 2016-09-06 |
Method for manufacturing printed circuit board
Grant 9,439,281 - Hu September 6, 2 | 2016-09-06 |
Hybrid Circuit Board And Method For Making The Same, And Semiconductor Package Structure
App 20160240464 - HUANG; YU-CHENG | 2016-08-18 |
Package Structure And Method For Manufacturing Same
App 20160181181 - SU; WEI-SHUO | 2016-06-23 |
Printed Circuit Board And Method For Manufacturing Same
App 20160183357 - HO; Ming-Jaan ; et al. | 2016-06-23 |
Coreless package structure and method for manufacturing same
Grant 9,362,248 - Ha Woo , et al. June 7, 2 | 2016-06-07 |
Flexible printed circuit board and method for making same
Grant 9,357,631 - Ho , et al. May 31, 2 | 2016-05-31 |
Packaging substrate, method for manufacturing same, and chip packaging body having same
Grant 9,357,647 - Hu , et al. May 31, 2 | 2016-05-31 |
Flexible Printed Circuit Board And Method For Manufacturing Same
App 20160150635 - HU; XIAN-QIN ; et al. | 2016-05-26 |
Multi-layer Circuit Board
App 20160135295 - HSU; CHE-WEI ; et al. | 2016-05-12 |
Interposer and method for manufacturing same
Grant 9,332,656 - Lee May 3, 2 | 2016-05-03 |
Method for manufacturing a printed circuit board
Grant 9,295,150 - Hu March 22, 2 | 2016-03-22 |
Method of manufacturing a printed circuit board with circuit visible
Grant 9,288,914 - Ho , et al. March 15, 2 | 2016-03-15 |
Heat Dissipation Device And Method For Manufacturing Same
App 20160061540 - HU; XIAN-QIN ; et al. | 2016-03-03 |
Part-embedded Circuit Structure And Method For Manufacturing Same
App 20160066418 - CHENG; YU-HAO ; et al. | 2016-03-03 |
Flexible printed circuit board and method for manufacturing same
Grant 9,277,640 - Ho , et al. March 1, 2 | 2016-03-01 |
Interposer and package on package structure
Grant 9,271,388 - Hsu February 23, 2 | 2016-02-23 |
Method for manufacturing a multi-layer circuit board
Grant 9,265,146 - Hsu , et al. February 16, 2 | 2016-02-16 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Structure Having Same
App 20150380391 - HA WOO; Yong ; et al. | 2015-12-31 |
Packaging Substrate And Method For Manufacturing Same
App 20150371873 - SU; WEI-SHUO | 2015-12-24 |
Compact rigid-flexible printed circuit board and method for manufacturing same
Grant 9,210,811 - Li December 8, 2 | 2015-12-08 |
Method for manufacturing rigid-flexible printed circuit board
Grant 9,198,304 - Li November 24, 2 | 2015-11-24 |
Substrate, chip package and method for manufacturing substrate
Grant 9,190,386 - Su November 17, 2 | 2015-11-17 |
Packaging substrate, method for manufacturing same, and chip packaging structure having same
Grant 9,173,298 - Ha Woo , et al. October 27, 2 | 2015-10-27 |
Packaging substrate, method for manufacturing same, and chip packaging body having same
Grant 9,165,790 - Ha Woo , et al. October 20, 2 | 2015-10-20 |
Packaging substrate and method for manufacturing same
Grant 9,159,614 - Su October 13, 2 | 2015-10-13 |
Method for manufacturing multilayer printed circuit board
Grant 9,125,334 - Zeng September 1, 2 | 2015-09-01 |
Method for manufacturing printed circuit board
Grant 9,107,311 - Shen , et al. August 11, 2 | 2015-08-11 |
Method for manufacturing printed circuit board
Grant 9,107,332 - Hu August 11, 2 | 2015-08-11 |
Package structure and method for manufacturing same
Grant 9,099,450 - Hsu August 4, 2 | 2015-08-04 |
Method for manufacturing multilayer printed circuit board
Grant 9,095,082 - Zeng July 28, 2 | 2015-07-28 |
Printed circuit board with embedded component and method for manufacturing same
Grant 9,089,082 - Hsu July 21, 2 | 2015-07-21 |
Flexible Printed Circuit Board And Method For Manufacturing Same
App 20150189738 - HO; MING-JAAN ; et al. | 2015-07-02 |
Flexible Printed Circuit Board And Method For Manufacturing Same
App 20150189760 - HO; MING-JAAN ; et al. | 2015-07-02 |
Rigid-flex printed circuit board and method for making same
Grant 9,072,173 - Hou June 30, 2 | 2015-06-30 |
Method for manufacturing printed circuit board
Grant 9,066,417 - Liu , et al. June 23, 2 | 2015-06-23 |
Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible
Grant 9,066,431 - Liu , et al. June 23, 2 | 2015-06-23 |
Interposer And Method For Manufacturing Same
App 20150136457 - LEE; TAEKOO | 2015-05-21 |
Embedded printed circuit board and method for manufacturing same
Grant 9,024,203 - Lai May 5, 2 | 2015-05-05 |
Method for manufacturing IC substrate
Grant 9,015,936 - Hsu , et al. April 28, 2 | 2015-04-28 |
Rigid-flexible Printed Circuit Board,method For Manufacturing Same,and Printed Circuit Board Module
App 20150101847 - TSAI; HSIEN-MING | 2015-04-16 |
Heat Dissipation Device And A Method For Manufacturing Same
App 20150101785 - HO; MING-JAAN ; et al. | 2015-04-16 |
Method for manufacturing multilayer printed circuit board
Grant 8,997,343 - Cheng April 7, 2 | 2015-04-07 |
Package on package structure and method for manufacturing same
Grant 9,000,573 - Chen , et al. April 7, 2 | 2015-04-07 |
Method for manufacturing printed circuit board
Grant 8,978,244 - Cai , et al. March 17, 2 | 2015-03-17 |
Printed Circuit Board And Method For Manufacturing Same
App 20150053466 - HO; MING-JAAN ; et al. | 2015-02-26 |
Printed Circuit Board And Method For Manufacturing Same
App 20150040392 - HO; MING-JAAN ; et al. | 2015-02-12 |
Circuit substrate for mounting chip, method for manufacturing same and chip package having same
Grant 8,951,848 - Chou , et al. February 10, 2 | 2015-02-10 |
Flexible Printed Circuit Board And Method For Making Same
App 20150034364 - HO; MING-JAAN ; et al. | 2015-02-05 |
Package structure and method for manufacturing same
Grant 8,941,227 - Lee January 27, 2 | 2015-01-27 |
Substrate, Chip Package And Method For Manufacturing Substrate
App 20150024552 - SU; WEI-SHUO | 2015-01-22 |
Coreless Package Structure And Method For Manufacturing Same
App 20150014849 - HA WOO; YONG ; et al. | 2015-01-15 |
Multilayer Printed Circuit Board Having Anisotropy Condictive Film And Method For Manufacturing Same
App 20150000959 - SU; WEI-SHUO | 2015-01-01 |
Printed Circuit Board And Method For Manufacturing Same
App 20140374153 - LEE; YU-HSIEN ; et al. | 2014-12-25 |
Package On Package Structrue And Method For Manufacturing Same
App 20140374894 - CHEN; CHIEN-CHIH ; et al. | 2014-12-25 |
Packaging Substrate And Method For Manufacturing Same
App 20140361439 - SU; WEI-SHUO | 2014-12-11 |
Multilayer Circuit Board And Method For Manufacturing Same
App 20140353006 - LEE; TAEKOO | 2014-12-04 |
Compact Rigid-flexible Printed Circuit Board And Method For Manufacturing Same
App 20140305683 - LI; BIAO | 2014-10-16 |
Package Structure And Method For Manufacturing Same
App 20140300009 - HSU; SHIH-PING | 2014-10-09 |
Package on package structrue and method for manufacturing same
Grant 8,853,000 - Chen , et al. October 7, 2 | 2014-10-07 |
Method for manufacturing multilayer printed circuit board having mounting cavity
Grant 8,850,701 - Cai October 7, 2 | 2014-10-07 |
Rigid-flexible Printed Circuit Board And Method For Manufacturing Same
App 20140182899 - LI; BIAO | 2014-07-03 |
Printed Circuit Board With Embedded Component And Method For Manufacturing Same
App 20140185257 - HSU; Shih-Ping | 2014-07-03 |
Rigid-flex Printed Circuit Board And Method For Making Same
App 20140182900 - HOU; NING | 2014-07-03 |
Printed Circuit Board With Embedded Component And Method For Manufactruing Same
App 20140182892 - HSU; SHIH-PING | 2014-07-03 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Structure Having Same
App 20140185259 - HA WOO; YONG ; et al. | 2014-07-03 |
Package Structure And Method For Manufacturing Same
App 20140175646 - LEE; TAEKOO | 2014-06-26 |
Polyimide, Copper-clad Laminate, Flexible Printed Circuit Board, And Method For Manufacturing The Flexible Printed Circuit Board
App 20140158410 - HO; MING-JAAN | 2014-06-12 |
Printed Circuit Board With Visible Triangular Shaped Traces
App 20140158407 - HO; MING-JAAN | 2014-06-12 |
Pcb With Visible Circuit And Method For Making And Using Pcb With Visible Circuit
App 20140151092 - HO; MING-JAAN ; et al. | 2014-06-05 |
Circuit Board, Package Structure And Method For Manufacturing Same
App 20140146504 - HU; WEN-HUNG | 2014-05-29 |
Multi-layer Printed Circuit Board And Method For Manufacturing Same
App 20140144675 - HSU; SHIH-PING | 2014-05-29 |
Printed Circuit Board With Circuit Visible And Method For Manufacturing Same
App 20140144685 - HO; MING-JAAN ; et al. | 2014-05-29 |
Printed circuit board with fins
Grant 8,735,728 - Cheng May 27, 2 | 2014-05-27 |
Multilayer printed circuit board and method for making same
Grant 8,723,050 - Cheng May 13, 2 | 2014-05-13 |
Embedded Printed Circuit Board And Method For Manufacturing Same
App 20140124245 - LAI; CHIEN-KUANG | 2014-05-08 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140117553 - HA WOO; YONG ; et al. | 2014-05-01 |
Interposer And Package On Package Structure
App 20140118951 - HSU; SHIH-PING | 2014-05-01 |
Printed Circuit Board And Method For Manufacturing Same
App 20140110152 - ZUO; QING ; et al. | 2014-04-24 |
Etching device and method for manufacturing printed circuit board using same
Grant 8,685,202 - Bai April 1, 2 | 2014-04-01 |
Printed Circuit Board And Method For Manufacturing Same
App 20140083757 - HU; WEN-HUNG | 2014-03-27 |
Chip Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Structure Having Same
App 20140085833 - HSU; SHIH-PING ; et al. | 2014-03-27 |
Printed Circuit Board And Method For Manufacturing Same
App 20140083744 - HU; WEN-HUNG | 2014-03-27 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140078706 - HU; CHU-CHIN ; et al. | 2014-03-20 |
Package On Package Structrue And Method For Manufacturing Same
App 20140061903 - CHEN; CHIEN-CHIH ; et al. | 2014-03-06 |
Package On Package Structure And Method For Manufacturing Same
App 20140061951 - LEE; TAEKOO | 2014-03-06 |
Printed Circuit Baord And Method For Manufacturing Same
App 20140060902 - HU; WEN-HUNG | 2014-03-06 |
Printed Circuit Baord And Method For Manufacturing Same
App 20140054075 - HU; WEN-HUNG | 2014-02-27 |
Multilayer Flexible Printed Circuit Board And Method For Manufacturing Same
App 20140054079 - SHEN; FU-YUN ; et al. | 2014-02-27 |
Printed Circuit Board And Method For Manufacturing Same
App 20140054074 - SHEN; FU-YUN ; et al. | 2014-02-27 |
Chip Package Structure And Method For Manufacturing Same
App 20140054785 - WANG; FENG | 2014-02-27 |
Method For Manufacturing Printed Circuit Board
App 20140053397 - LIU; RUI-WU ; et al. | 2014-02-27 |
Resin coated copper foil, method for manufacturing same and multi-layer circuit board
Grant 8,647,518 - Ho February 11, 2 | 2014-02-11 |
Printed circuit board
Grant 8,648,261 - Huang February 11, 2 | 2014-02-11 |
Packaging Substrate, Method For Manufacturing Same, And Chip Packaging Body Having Same
App 20140036465 - HU; CHU-CHIN ; et al. | 2014-02-06 |
Printed Circuit Board With Patterned Electrically Conductive Layer Therein Visible And Method For Manufacturing Same
App 20140027164 - LIU; RUI-WU ; et al. | 2014-01-30 |
Circuit Substrate For Mounting Chip, Method For Manufacturing Same And Chip Package Having Same
App 20140027893 - CHOU; E-TUNG ; et al. | 2014-01-30 |
Multi-layer Circuit Board And Method For Manufacturing Same
App 20140000950 - HSU; CHE-WEI ; et al. | 2014-01-02 |
Packaging Substrate And Method For Manufacturing Same
App 20130341073 - HSU; CHE-WEI ; et al. | 2013-12-26 |
Method For Manufacturing Ic Substrate
App 20130318785 - HSU; CHE-WEI ; et al. | 2013-12-05 |
Multilayer Printed Circuit Board And Method For Manufacturing Same
App 20130313002 - HSU; SHIH-PING | 2013-11-28 |
Method for manufacturing rigid-flexible printed circuit board
Grant 8,591,692 - Wang , et al. November 26, 2 | 2013-11-26 |
Method for manufacturing rigid-flexible printed circuit board
Grant 8,580,068 - Cheng November 12, 2 | 2013-11-12 |
Resin Coated Copper Foil, Method For Manufacturing Same And Multi-layer Circuit Board
App 20130284692 - HO; MING-JAAN | 2013-10-31 |
Apparatus and method for pressing printed circuit board
Grant 8,567,468 - Cheng October 29, 2 | 2013-10-29 |
System and method for cutting substrate into workpieces
Grant 8,554,355 - Wu October 8, 2 | 2013-10-08 |
Printed Circuit Board And Method For Manufacturing Printed Circuit Board
App 20130220683 - CAI; ZONG-QING | 2013-08-29 |
Method for manufacturing printed circuit board with cavity
Grant 8,516,694 - Cai , et al. August 27, 2 | 2013-08-27 |
Apparatus and method for wet processing substrate
Grant 8,500,949 - Lin August 6, 2 | 2013-08-06 |
Electronic component device and connector assembly having same
Grant 8,481,854 - Zeng July 9, 2 | 2013-07-09 |
Method for forming electrical traces on substrate
Grant 8,475,867 - Bai , et al. July 2, 2 | 2013-07-02 |
Apparatus for wet processing substrate
Grant 8,464,734 - Chen , et al. June 18, 2 | 2013-06-18 |
Clamping apparatus
Grant 8,454,005 - Cheng June 4, 2 | 2013-06-04 |
Method of manufacturing FPCB substrate
Grant 8,453,324 - Liu , et al. June 4, 2 | 2013-06-04 |
Method for manufacturing multilayer flexible printed circuit board
Grant 8,453,321 - Zhang , et al. June 4, 2 | 2013-06-04 |
Method for screen printing printed circuit board substrate
Grant 8,448,571 - Zheng May 28, 2 | 2013-05-28 |
Apparatus for wet processing substrate
Grant 8,388,800 - Bai , et al. March 5, 2 | 2013-03-05 |
Method for manufacturing printed circuit board with thick traces
Grant 8,377,317 - Bai , et al. February 19, 2 | 2013-02-19 |
Apparatus for spraying etchant onto printed circuit board
Grant 8,377,252 - Lee , et al. February 19, 2 | 2013-02-19 |
Cleaning apparatus
Grant 8,332,984 - Yeh , et al. December 18, 2 | 2012-12-18 |
Coverlay processing system
Grant 8,322,017 - Liao , et al. December 4, 2 | 2012-12-04 |
Method for manufacturing multilayer printed circuit board with plated through holes
Grant 8,302,300 - Chen November 6, 2 | 2012-11-06 |
Circuit substrate for mounting electronic component and circuit substrate assembly having same
Grant 8,300,420 - Tsai , et al. October 30, 2 | 2012-10-30 |
Method For Manufacturing Rigid-flexible Printed Circuit Board
App 20120260501 - LI; BIAO | 2012-10-18 |
Method for manufacturing printed circuit board
Grant 8,268,537 - Huang , et al. September 18, 2 | 2012-09-18 |
Printed circuit board module
Grant 8,251,712 - Cheng August 28, 2 | 2012-08-28 |
Electroplating apparatus
Grant 8,252,154 - Cheng August 28, 2 | 2012-08-28 |
Printed Circuit Board Substrate
App 20120211267 - HUANG; PAI-HUNG ; et al. | 2012-08-23 |
Simulation system and method for manufacturing printed circuit board
Grant 8,249,847 - Zhu , et al. August 21, 2 | 2012-08-21 |
Method for smoothing printed circuit boards
Grant 8,227,175 - Tsai , et al. July 24, 2 | 2012-07-24 |
Flexible printed circuit board holder
Grant 8,223,505 - Wu , et al. July 17, 2 | 2012-07-17 |
Apparatus For Plating Flexible Printed Circuit Board
App 20120175249 - YEH; TSO-HUNG ; et al. | 2012-07-12 |
Method For Manufacturing Multilayer Printed Circuit Board
App 20120160803 - CAI; XUE-JUN | 2012-06-28 |
Multilayer Printed Circuit Board And Method For Making Same
App 20120160554 - CHENG; CHIEN-PANG | 2012-06-28 |
Apparatus And Method For Pressing Printed Circuit Board
App 20120160398 - CHENG; CHIEN-PANG | 2012-06-28 |
Method for manufacturing a printed circuit board
Grant 8,205,330 - Zhang , et al. June 26, 2 | 2012-06-26 |
Etching Apparatus With Suction Mechanism
App 20120103521 - CHENG; CHIEN-PANG | 2012-05-03 |
Apparatus For Transporting Flexible Printed Circuit Board Strip
App 20120097784 - Liao; Tao-Ming ; et al. | 2012-04-26 |
Method For Manufacturing Rigid-flexible Printed Circuit Board
App 20120097326 - WANG; MING-DE ; et al. | 2012-04-26 |
Flexible printed circuit boards including carbon nanotube bundles
Grant 8,164,000 - Yeh , et al. April 24, 2 | 2012-04-24 |
Plating apparatus
Grant 8,141,512 - Yeh , et al. March 27, 2 | 2012-03-27 |
Method Of Manufacturing Fpcb Substrate
App 20120066903 - LIU; RUI-WU ; et al. | 2012-03-22 |
Method for manufacturing multilayer printed circuit boards
Grant 8,112,880 - Zhang , et al. February 14, 2 | 2012-02-14 |
Method For Manufacturing Multilayer Printed Circuit Board
App 20120023744 - ZENG; HUI | 2012-02-02 |
Multilayer printed circuit board
Grant 8,101,266 - Lee , et al. January 24, 2 | 2012-01-24 |
Method for manufacturing printed circuit boards
Grant 8,088,294 - Yeh , et al. January 3, 2 | 2012-01-03 |
Printed circuit board assembly
Grant 8,089,003 - Lee , et al. January 3, 2 | 2012-01-03 |
Printed circuit board and method for manufacturing same
Grant 8,071,887 - Liou , et al. December 6, 2 | 2011-12-06 |
Flexible printed circuit board having curved edge
Grant 8,071,884 - Wang , et al. December 6, 2 | 2011-12-06 |
Printed circuit board and method for manufacturing same
Grant 8,067,696 - Tsai , et al. November 29, 2 | 2011-11-29 |
Apparatus for recycling metal from metal ions containing waste solution
Grant 8,062,580 - Chen , et al. November 22, 2 | 2011-11-22 |
Board inverter
Grant 8,061,959 - Fan , et al. November 22, 2 | 2011-11-22 |
Method of manufacturing multilayer printed circuit board having buried holes
Grant 8,052,881 - Zhu , et al. November 8, 2 | 2011-11-08 |
Method of detecting faulty via holes in printed circuit boards
Grant 8,049,511 - Xiao , et al. November 1, 2 | 2011-11-01 |
Printed circuit boards
Grant 8,049,113 - He , et al. November 1, 2 | 2011-11-01 |
| 