U.S. patent application number 14/217744 was filed with the patent office on 2014-07-17 for method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method.
This patent application is currently assigned to Samsung Electronics Co., Ltd. The applicant listed for this patent is Samsung Electronics Co., Ltd. Invention is credited to Chang-Seong JEON, Sang-Sick PARK, Ho-Geon SONG, Mitsuo UMEMOTO.
Application Number | 20140196280 14/217744 |
Document ID | / |
Family ID | 45973367 |
Filed Date | 2014-07-17 |
United States Patent
Application |
20140196280 |
Kind Code |
A1 |
JEON; Chang-Seong ; et
al. |
July 17, 2014 |
METHOD OF MANUFACTURING A FLIP CHIP PACKAGE AND APPARATUS TO ATTACH
A SEMICONDUCTOR CHIP USED IN THE METHOD
Abstract
A method and apparatus to manufacture a flip chip package
includes dotting a flux on a first preliminary bump of a package
substrate, attaching a preliminary bump of a first semiconductor
chip to the first preliminary bump of the package substrate via the
flux, dotting a flux on a second preliminary bump of the package
substrate, and attaching a preliminary bump of a second
semiconductor chip to the second preliminary bump of the package
substrate via the flux. Accordingly, an evaporation of the flux on
the preliminary bump of the package substrate may be
suppressed.
Inventors: |
JEON; Chang-Seong;
(Hwaseong-si, KR) ; SONG; Ho-Geon; (Suwon-si,
KR) ; UMEMOTO; Mitsuo; (Seongnam-si, KR) ;
PARK; Sang-Sick; (Hwaseong-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Samsung Electronics Co., Ltd |
Suwon-si |
|
KR |
|
|
Assignee: |
Samsung Electronics Co.,
Ltd
Suwon-si
KR
|
Family ID: |
45973367 |
Appl. No.: |
14/217744 |
Filed: |
March 18, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
13241517 |
Sep 23, 2011 |
8697494 |
|
|
14217744 |
|
|
|
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Current U.S.
Class: |
29/740 |
Current CPC
Class: |
H01L 2224/73204
20130101; H01L 2224/75804 20130101; H01L 2924/01047 20130101; H01L
24/97 20130101; H01L 2224/13025 20130101; H01L 2224/7525 20130101;
H01L 2224/97 20130101; H01L 2924/01033 20130101; H01L 2225/06517
20130101; H01L 2924/014 20130101; H01L 2924/181 20130101; H01L
2224/16225 20130101; H01L 24/13 20130101; H01L 2924/181 20130101;
H01L 2224/7501 20130101; H01L 2224/97 20130101; H01L 2924/15311
20130101; H01L 24/83 20130101; H01L 25/50 20130101; H01L 2224/16146
20130101; H01L 24/75 20130101; H01L 2924/15311 20130101; H01L
2224/73204 20130101; H01L 2224/17181 20130101; H01L 24/32 20130101;
H01L 2224/73204 20130101; H01L 2225/06541 20130101; H01L 21/67
20130101; H01L 24/16 20130101; H01L 2224/81193 20130101; H01L
2224/81011 20130101; H01L 2224/81815 20130101; H01L 2224/16225
20130101; H01L 2924/15311 20130101; H01L 2224/16225 20130101; H01L
2224/81 20130101; H01L 2224/73204 20130101; H01L 2224/32225
20130101; H01L 2924/00012 20130101; H01L 2224/32225 20130101; H01L
2924/00 20130101; H01L 2224/7598 20130101; H01L 2924/00 20130101;
H01L 2224/7901 20130101; H01L 24/81 20130101; H01L 2224/97
20130101; H01L 23/16 20130101; H01L 2224/32225 20130101; H01L
2224/7515 20130101; H01L 2224/759 20130101; H01L 2224/8385
20130101; H01L 2224/97 20130101; H01L 2225/06513 20130101; H01L
24/74 20130101; Y10T 29/53178 20150115; H01L 2224/75824 20130101;
H01L 25/0657 20130101; H01L 23/3128 20130101; H01L 2224/32151
20130101; H01L 24/17 20130101; H01L 2224/75252 20130101; H01L
2224/831 20130101 |
Class at
Publication: |
29/740 |
International
Class: |
H01L 23/00 20060101
H01L023/00; H01L 21/67 20060101 H01L021/67 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 21, 2010 |
KR |
10-2010-0102984 |
Claims
1. An apparatus to attach a semiconductor chip, the apparatus
comprising: a flux-dotting unit to sequentially dotting a flux on a
first preliminary bump and a second preliminary bump of a package
substrate; and a chip-attaching unit arranged adjacent to the
flux-dotting unit to sequentially attach preliminary bumps of first
and second semiconductor chips to the first and second preliminary
bumps of the package substrate.
2. The apparatus of claim 1, wherein the flux-dotting unit
comprises: a dotting head configured to store the flux; and a
nozzle installed at the head, the nozzle having nozzle holes to dot
the flux on the first and second preliminary bumps of the package
substrate.
3. The apparatus of claim 2, wherein the flux-dotting unit further
comprises a gap-adjusting member to adjust a gap between the nozzle
and the first and second preliminary bumps of the package
substrate.
4. The apparatus of claim 3, wherein the gap-adjusting member
comprises: a rod extending from the nozzle and making contact with
the package substrate; and a spring connected between the rod and
the nozzle.
5. An apparatus that attaches a semiconductor chip, the apparatus
comprising: a flux-dotting unit to deposit a first flux on at least
one first substrate bump of a package substrate, and to deposit a
second flux on at least one second substrate bump in response to an
attachment signal; and a chip-attaching unit that attaches at least
one first chip bump of a first semiconductor chip to the at least
one first substrate bump in response to a flux output signal.
6. The apparatus of claim 5, further comprising at least one
control module in electrical communication with the flux-dotting
unit and the chip-attaching unit that generates the flux output
signal in response to flux-dotting unit depositing the first flux,
and that generates and that generates the attachment signal in
response to the chip-attaching unit attaching the at least one
first chip bump to the at least one first substrate bump.
7. The apparatus of claim 6, wherein the flux-dotting unit includes
a flux-dotting module that generates the flux output signal in
response to depositing the first flux, and the chip-attaching
module includes a chip-attaching module in electrical communication
with the flux-dotting module that generates the chip attachment
signal in response to attaching the at least one first chip bump to
the at least one first substrate bump.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Divisional Application of prior U.S.
application Ser. No. 13/241,517, filed on Sep. 23, 2011 in the
United States Patent and Trademark Office, which claims priority
under 35 USC .sctn.119 to Korean Patent Application No.
10-2010-0102984, filed on Oct. 21, 2010 in the Korean Intellectual
Property Office (KIPO), the contents of which are herein
incorporated by reference in their entirety.
BACKGROUND
[0002] 1. Field of the General Inventive Concept
[0003] Example embodiments relate to a method of manufacturing a
flip chip package, and an apparatus to attach a semiconductor chip
used in the method. More particularly, example embodiments relate
to a method of manufacturing a flip chip package including
conductive bumps, and an apparatus to attach a semiconductor chip
used in the method.
[0004] 2. Description of the Related Art
[0005] Generally, a plurality of semiconductor fabrication
processes may be performed on a semiconductor substrate to form a
plurality of semiconductor chips. In order to mount the
semiconductor chips on a printed circuit board (PCB), a packaging
process may be performed on the semiconductor chips to form
semiconductor packages.
[0006] The semiconductor package may include a package substrate, a
semiconductor chip mounted on the package substrate, conductive
connecting members to electrically connecting the semiconductor
chip with the package substrate, a molding member formed on the
package substrate to cover the semiconductor chip, and external
terminals mounted on the package substrate.
[0007] The conductive connecting members may include conductive
wires, conductive bumps, etc. A semiconductor package having a
structure where a semiconductor chip and a package substrate may be
connected with each other via the conductive bumps may be referred
to as a flip chip package.
[0008] The conductive bump may be formed by a reflow process on
preliminary bumps of the semiconductor chip and the package
substrate. Before performing the reflow process, it may be required
to preliminarily attach the preliminary bump of the semiconductor
chip to the preliminary bump of the package substrate.
[0009] The preliminary attaching process may include coating a flux
on the preliminary bump. The flux may include an adhesive, an oxide
remover, etc. The adhesive may attach the preliminary bumps to each
other. The oxide remover may remove a native oxide layer on the
preliminary bumps. Coating the flux may include coating the flux on
the preliminary bump of the semiconductor chip into coating the
flux on an entire surface of the package substrate.
[0010] Conventional processes for coating the flux on the
preliminary bump of the semiconductor chip may require running a
chip-attaching unit for holding the semiconductor chip between a
position of the semiconductor chip and a reservoir to store the
flux, so that a coating time may be too long.
[0011] Further, conventional processes for coating the flux include
disposing flux on the entire surface of the package substrate
before a process of attaching the package substrate to the
semiconductor chip is performed. Consequently, the flux on a
following preliminary bump may be evaporated during attaching
proceeding preliminary bumps of the semiconductor chip and the
package substrate to each other, thereby causing an insufficient
amount of flux to exist on conductive bumps of the package
substrate. When an insufficient amount of the flux exists, adhesion
strength between the preliminary bumps may be weakened, so that the
conductive bump may not have sufficient strength. This weak
conductive bump may cause an improper electrical connection between
the semiconductor chip and the package substrate.
SUMMARY OF THE PRESENT INVENTIVE CONCEPT
[0012] At least one exemplary embodiment provides a method of
manufacturing a flip chip package.
[0013] Additional features and utilities of the present general
inventive concept will be set forth in part in the description
which follows and, in part, will be obvious from the description,
or may be learned by practice of the general inventive concept.
[0014] Example embodiments also provide an apparatus to attach a
semiconductor chip used in the above-mentioned method.
[0015] According to some example embodiments, there is provided a
method of manufacturing a flip chip package. In the method of
manufacturing the flip chip package, a flux may be dotted on a
first preliminary bump of a package substrate. A preliminary bump
of a first semiconductor chip may be attached to the first
preliminary bump of the package substrate using the flux. The flux
may be dotted on a second preliminary bump of the package
substrate. A preliminary bump of a second semiconductor chip may be
attached to the second preliminary bump of the package substrate
using the flux.
[0016] In some example embodiments, attaching the preliminary bumps
of the first semiconductor chip and the second semiconductor chip
may be performed immediately after dotting the flux to prevent the
flux on the first preliminary bump and the second preliminary bump
of the package substrate from being evaporated.
[0017] In some example embodiments, the method may further include
converting the first preliminary bump of the package substrate and
the preliminary bump of the first semiconductor chip into a first
conductive bump, and converting the second preliminary bump of the
package substrate and the preliminary bump of the second
semiconductor chip into a second conductive bump. Converting the
first preliminary bump of the package substrate and the preliminary
bump of the first semiconductor chip into the first conductive bump
may be performed simultaneously with converting the second
preliminary bump of the package substrate and the preliminary bump
of the second semiconductor chip into the second conductive bump.
Converting the first preliminary bump of the package substrate and
the preliminary bump of the first semiconductor chip into the first
conductive bump, and converting the second preliminary bump of the
package substrate and the preliminary bump of the second
semiconductor chip into the second conductive bump may be performed
by reflow processes.
[0018] In some example embodiments, the method may further include
cutting the package substrate to separate the first semiconductor
chip and the second semiconductor chip from each other.
[0019] In some example embodiments, the method may further include
filling spaces between the first semiconductor chip and the package
substrate, and between the second semiconductor chip and the
package substrate with an insulating material.
[0020] In some example embodiments, the method may further include
molding the first semiconductor chip and the second semiconductor
chip.
[0021] In some example embodiments, the method may further include
mounting external terminals on the package substrate.
[0022] In some example embodiments, each of the first semiconductor
chip and the second semiconductor chip may include a plug connected
to the preliminary bump, and a preliminary upper bump formed on the
plug. The method may further include attaching a third
semiconductor chip to the preliminary upper bump.
[0023] In some example embodiments, attaching the third
semiconductor chip may include dotting the flux on the preliminary
upper bump, and attaching a preliminary bump of the third
semiconductor chip to the preliminary upper bump using the flux.
Attaching the preliminary bump of the third semiconductor chip to
the preliminary upper bump may include converting the preliminary
upper bump and the preliminary bump of the third semiconductor chip
into a third conductive bump.
[0024] In some example embodiments, the method may further include
cutting the package substrate to separate the first semiconductor
chip and the third semiconductor chip from the second semiconductor
chip and the third semiconductor chip.
[0025] In some example embodiments, the method may further include
filling spaces between the first semiconductor chip and the package
substrate, between the second semiconductor chip and the package
substrate, between the first semiconductor chip and the third
semiconductor chip, and between the second semiconductor chip and
the third semiconductor chip with an insulating material.
[0026] In some example embodiments, the method may further include
molding the first semiconductor chip and the third semiconductor
chip, and the second semiconductor chip and the third semiconductor
chip
[0027] According to some example embodiments, there is provided an
apparatus to attach a semiconductor chip. The apparatus may include
a flux-dotting unit and a chip-attaching unit. The flux-dotting
unit may sequentially dot a flux on a first preliminary bump and a
second preliminary bump of a package substrate. The chip-attaching
unit may be arranged adjacent to the flux-dotting unit to
sequentially attach preliminary bumps of a first semiconductor chip
and a second semiconductor chip to the first preliminary bump and
the second preliminary bump of the package substrate,
respectively.
[0028] In some example embodiments, the flux-dotting unit may
include a dotting head configured to store the flux, and a nozzle
installed at the dotting head. The nozzle may have a plurality of
nozzle holes to dot the flux on the first preliminary bump and the
second preliminary bump.
[0029] In some example embodiments, the flux-dotting unit may
further include a gap-adjusting member to adjust a gap between the
nozzle and the first and second preliminary bumps. The
gap-adjusting member may include a rod extending from the nozzle
and selectively making contact with the package substrate, and a
spring connected between the nozzle and the rod.
[0030] According to some example embodiments, the preliminary bump
of the semiconductor chip may be attached to the preliminary bump
of the package substrate immediately after dotting the flux on the
preliminary bump of the package substrate. Thus, an evaporation of
the flux on the preliminary bump of the package substrate may be
suppressed. Further, a time to attach the semiconductor chip to the
package substrate may be decreased. As a result, the semiconductor
chip and the package substrate may be firmly attached to each other
through the conductive bump.
[0031] According to another exemplary embodiment of the present
general inventive concept, an apparatus that attaches a
semiconductor chip includes a flux-dotting unit to deposit a first
flux on at least one first substrate bump of a package substrate,
and to deposit a second flux on at least one second substrate bump
in response to an attachment signal, and a chip-attaching unit that
attaches at least one first chip bump of a first semiconductor chip
to the at least one first substrate bump in response to a flux
output signal.
[0032] In yet another exemplary embodiment of the present general
inventive concept, A method of manufacturing attaching a
semiconductor chip to a package substrate including depositing a
first flux on at least one a first substrate bump of the package
substrate, generating a flux output signal in response to
depositing the first flux, attaching at least one first chip bump
of the first semiconductor chip to the at least one first substrate
bump in response to a flux output signal, generating an attachment
signal after attaching the at least one first chip bump to the at
least one first substrate bump, and depositing a second flux on at
least one second substrate bump in response to the attachment
signal.
BRIEF DESCRIPTION OF THE DRAWINGS
[0033] These and/or other features and utilities of the present
general inventive concept will become apparent and more readily
appreciated from the following description of exemplary
embodiments, taken in conjunction with the accompanying drawings of
which:
[0034] FIGS. 1A-1C is a cross-sectional view illustrating an
apparatus to attach a semiconductor chip in accordance with some
example embodiments of the present general inventive concept;
[0035] FIGS. 2 to 12 are cross-sectional views illustrating a
method of manufacturing a flip chip package in accordance with some
example embodiments; and
[0036] FIGS. 13 to 20 are cross-sectional views illustrating a
method of manufacturing a flip chip package in accordance with some
example embodiments.
DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS
[0037] Reference will now be made in detail to the embodiments of
the present general inventive concept, examples of which are
illustrated in the accompanying drawings, wherein like reference
numerals refer to the like elements throughout. The embodiments are
described below in order to explain the present general inventive
concept while referring to the figures.
[0038] It will be understood that when an element or layer is
referred to as being "on," "connected to" or "coupled to" another
element or layer, it can be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like numerals refer to like elements throughout. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items.
[0039] It will be understood that, although the terms first,
second, third etc. may be used herein to describe various elements,
components, regions, layers and/or sections, these elements,
components, regions, layers and/or sections should not be limited
by these terms. These terms are only used to distinguish one
element, component, region, layer or section from another region,
layer or section. Thus, a first element, component, region, layer
or section discussed below could be termed a second element,
component, region, layer or section without departing from the
teachings of the present general inventive concept.
[0040] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper" and the like, may be used herein for ease
of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. It
will be understood that the spatially relative terms are intended
to encompass different orientations of the device in use or
operation in addition to the orientation depicted in the figures.
For example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
exemplary term "below" can encompass both an orientation of above
and below. The device may be otherwise oriented (rotated 90 degrees
or at other orientations) and the spatially relative descriptors
used herein interpreted accordingly.
[0041] The terminology used herein describes exemplary embodiments
only and is not intended to limit the present general inventive
concept. As used herein, the singular forms "a," "an" and "the" are
intended to include the plural forms as well, unless the context
clearly indicates otherwise. It will be further understood that the
terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
[0042] Example embodiments are described herein with reference to
cross-sectional illustrations that are schematic illustrations of
idealized example embodiments (and intermediate structures). As
such, variations from the shapes of the illustrations as a result,
for example, of manufacturing techniques and/or tolerances, are to
be expected. Thus, example embodiments should not be construed as
limited to the particular shapes of regions illustrated herein but
are to include deviations in shapes that result, for example, from
manufacturing. For example, an implanted region illustrated as a
rectangle will, typically, have rounded or curved features and/or a
gradient of implant concentration at its edges rather than a binary
change from implanted to non-implanted region. Likewise, a buried
region formed by implantation may result in some implantation in
the region between the buried region and the surface through which
the implantation takes place. Thus, the regions illustrated in the
figures are schematic in nature and their shapes are not intended
to illustrate the actual shape of a region of a device and are not
intended to limit the scope of the present general inventive
concept.
[0043] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which the present
general inventive concept belongs. It will be further understood
that terms, such as those defined in commonly used dictionaries,
should be interpreted as having a meaning that is consistent with
their meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0044] Hereinafter, example embodiments will be explained in detail
with reference to the accompanying drawings.
[0045] Apparatus to Align a Wafer Stage
[0046] FIG. 1A is a cross-sectional view illustrating an apparatus
to attach a semiconductor chip in accordance with an exemplary
embodiment of the present general inventive concept.
[0047] Referring to FIG. 1A, an apparatus 100 to attach a
semiconductor chip in accordance with this example embodiment may
include a flux-dotting unit 110 and a chip-attaching unit 120. The
flux-dotting unit 110 and the chip-attaching unit 120 may
communicate with one another during a flux depositing process and
attachment process, as discussed in greater detail below.
[0048] The flux-dotting unit 110 may perform a flux depositing
process to deposit flux that may couple preliminary bumps of a
semiconductor chip 220 together with preliminary bumps of a package
substrate 210. More specifically, the flux-dotting unit 110 may
sequentially dot a flux F on a plurality of preliminary substrate
bumps. The plurality of preliminary substrate bumps may include
individual preliminary substrate bumps and/or a plurality of pairs
of preliminary substrate bumps. For example, the plurality of
preliminary substrate bumps may include a pair of first and second
preliminary substrate bumps 212 and 214 on an upper surface of a
package substrate 210. In some example embodiments, the flux F may
include, but is not limited to, an adhesive, solder, an
oxide-remover, etc. The flux F may include a liquid material or a
gaseous material. Alternatively, the flux F may include an
insulating paste.
[0049] The chip-attaching unit 120 may be arranged adjacent to the
flux-dotting unit 110. The chip-attaching unit 120 may sequentially
attach first and second semiconductor chips 220 and 230 to the
first and second preliminary substrate bumps 212 and 214 on which
the flux F may be dotted.
[0050] In some example embodiments, the chip-attaching unit 120 may
attach a preliminary chip bump 222 of the first semiconductor chip
220 to a first preliminary substrate bump 212 just after the
flux-dotting unit 110 may dot the flux F on the first preliminary
substrate bump 212. In at least one exemplary embodiment, the
chip-attaching unit 120 attaches the preliminary chip bump 222 of
the first semiconductor chip 220 to the first preliminary substrate
bump 212 immediately after the flux-dotting unit 110 may dot the
flux F on the first preliminary substrate bump 212. It may be
appreciated, however, that the time at which a preliminary chip
bump is attached to a preliminary substrate bump may be selectively
varied. The chip-attaching unit 120 may then hold the second
semiconductor chip 230. The chip-attaching unit 120 holding the
second semiconductor chip 230 may be located adjacent to the
flux-dotting unit 110. The flux-dotting unit 110 may dot the flux F
on the second preliminary substrate bump 214. The chip-attaching
unit 120 may attach a second preliminary chip bump 232 of the
second semiconductor chip 230 to the second preliminary substrate
bump 214. That is, the flux-dotting unit 110 may not dot the flux F
on all of the substrate preliminary bumps of the package substrate
210 in advance. The chip-attaching unit 120 may attach the
semiconductor chip to the preliminary substrate bump of the package
substrate 210 on which the flux F may be dotted immediately after
dotting the flux F on any of the preliminary substrate bumps of the
package substrate 210.
[0051] Therefore, because the semiconductor chip may be attached to
a preliminary substrate bump of the package substrate immediately
after dotting the flux F on the preliminary substrate bump of the
package substrate, there may not exist a sufficient time that the
flux F may be evaporated. As a result, a first preliminary chip
bump 222 of the first semiconductor chip 220 and a second
preliminary chip bump 232 of the second semiconductor chip 230 may
be firmly attached to respective preliminary substrate bumps 212
and 214 of the package substrate 210 via a sufficient amount of the
flux F. Accordingly, an electrical connection between preliminary
substrate bumps of the package substrate 210 and preliminary bumps
of the semiconductor chip 220 may be improved.
[0052] In at least one exemplary embodiment of the apparatus 100
described above, a control system may control the based on the
respective dotting process and attaching process. Referring to FIG.
1B, an apparatus 100 includes an apparatus control module 130 in
electrical communication with the flux-dotting unit 110 and the
chip-attaching unit 120, and may determine the respective
operations of the flux-dotting unit 110 and the chip-attaching unit
120. Accordingly, the apparatus control module 130 may generate
and/or receive control signals based on respective operations of
the flux-dotting unit 110 and/or the chip-attaching unit 120 to
control the flux-dotting and chip attachment processes.
[0053] For example, the flux-dotting unit 110 may deposit a first
flux on at least a first preliminary substrate bump, as discussed
in detail above. The control module 130 may determine that the
flux-dotting unit 110 deposited the flux, and in response generates
a flux output signal. Meanwhile, the control module 130 controls
the flux-dotting unit 110 to stop depositing flux until an
attachment signal is generated, as discussed further below. The
chip-attaching unit 120 receives the flux output signal and
attaches a preliminary chip bump of the semiconductor chip 220 to
the preliminary substrate bump 212 having the flux deposited
thereon. In response to determining the preliminary chip bump of
the semiconductor chip 220 is attached to the preliminary substrate
bump 212, the apparatus control 130 generates an attachment signal.
Based on the attachment signal, the flux-dotting unit 110 may
deposit a second flux on a second preliminary substrate bump, as
discussed above. Accordingly, since flux is not delivered from the
flux-dotting unit 110 until after receiving the attachment signal,
evaporation of flux deposited on a preliminary substrate bump
waiting for attachment is prevented.
[0054] In an alternative exemplary embodiment illustrated in FIG.
10, the flux-dotting unit 110 and the chip-attaching unit 120 may
include respective control modules. For example, the flux-dotting
unit 110 may include a flux-dotting module 140 that generates the
flux output signal in response to depositing the flux. Similarly,
the chip-attaching unit 120 may include a chip-attaching module 145
that generates the attachment signal in response to attaching one
or more preliminary chip bumps to a respective preliminary
substrate bump. Accordingly, the flux-dotting module 140 and the
chip-attaching module 145 may communicate with one another such
that the flux-dotting unit 110 does not deposit flux F until after
receiving the attachment signal from the chip-attaching unit 120,
as described above. Thus, flux F may be prevented from evaporating
from one or more preliminary substrate bumps of the package
substrate due to prolonged exposure to outside air during the chip
attachment process.
[0055] Further, the flux-dotting unit 110 may dot the flux F on the
preliminary substrate bumps 212 and 214 of the package substrate
210, as opposed to the preliminary chip bumps 222 and 232 of the
semiconductor chips 220 and 230. Thus, it may not be required to
move the chip-attaching unit 120 between a reservoir to store the
flux F and the package substrate 210. As a result, a time to attach
the semiconductor chips 220 and 230 to the package substrate 210
may be greatly reduced.
[0056] Additionally, the apparatus 100 may further include
actuators (not shown) to move vertically and horizontally both the
flux-dotting unit 110 and the chip-attaching unit 120 vertically
and/or horizontally. Alternatively, the apparatus 100 may further
include an actuator (not shown) to move the package substrate
210.
[0057] In at least one exemplary embodiment, the flux-dotting unit
110 may include a dotting head 112 and a nozzle 114. The dotting
head 112 may have an inner space (Is) configured to receive and/or
store the flux F. The nozzle 114 may be connected to a lower
surface of the dotting head 112. The nozzle 114 may have nozzle
holes 115 in fluidic communication with an inner space (Is) of the
dotting head 112. Thus, the flux F in the dotting head 112 may be
supplied to the preliminary substrate bumps 212 and 214 of the
package substrate 210 through one or more of the nozzle holes 115.
That is, any combination of nozzle holes 115 may be utilized to
deliver flux F to one or more preliminary substrate bumps of the
package substrate 210.
[0058] The apparatus 100 may also include a heater (not shown) to
supply heat to the flux to generate the liquid and/or gaseous flux
material. The heater may be coupled to various locations of the
flux-dotting unit 110 including, but not limited to, an outer
surface of the flux-dotting unit 110 and an inner surface of the
flux-dotting unit to heat the inner space (Is) storing the flux
F.
[0059] Additionally, the flux-dotting unit 110 may further include
a gap-adjusting member 116 to adjust a gap between the nozzle 114
and the package substrate 210. That is, the gap-adjusting member
116 may adjust a gap between the nozzle 114 and the preliminary
substrate bumps 212 and 214 of the package substrate 210. The
gap-adjusting member 116 may adjust positions of the nozzle 114 in
accordance with distances between an upper surface and the
preliminary substrate bumps 212 and 214 of the package substrate
210. That is, the gap-adjusting member 116 may adjust the positions
of the nozzle 114 in accordance with sizes and heights of the
preliminary substrate bumps 212 and 214 of the package substrate
210.
[0060] In at least one exemplary embodiment, the gap-adjusting
member 116 may include a rod 117 and a spring 118 to adjust the
length of the rod 117. The rod 117 extends from a lower surface of
the nozzle 114 and selectively making contact with the upper
surface of the package substrate 210. The spring 118 is connected
between the rod 117 and the nozzle 114 to resiliently support the
rod 117, and to adjust a length of the rod 117 with respect to the
nozzle 114 and/or dotting head 112. For example, the spring 118 may
be compressed in response to contacting the rod 117 against a
surface of the package substrate. Accordingly, the distance between
the rod and the nozzle 114 and/or dotting head 112 may be
decreased, thereby decreasing the distance of the gap between the
nozzle holes 114 and the preliminary substrate bumps 212 and 214 of
the package substrate 210.
[0061] Method of Manufacturing a Flip Chip Package
[0062] FIGS. 2 to 12 are cross-sectional views illustrating a
method of manufacturing a flip chip package using the apparatus in
FIG. 1 in accordance with some example embodiments.
[0063] Referring to FIG. 2, the flux-dotting unit 110 may be
arranged over at least one first preliminary substrate bump 212 of
the package substrate 210. The chip-attaching unit 120 may be
arranged adjacent to the flux-dotting unit 110 with holding the
first semiconductor chip 220.
[0064] Referring to FIG. 3, the flux-dotting unit 110 may be
descended toward the package substrate 210. The rods 117 may make
contact with the upper surface of the package substrate 210.
[0065] Referring to FIG. 4, the flux-dotting unit 110 may be
continuously descended with the spring 118 being compressed, so
that the nozzle 114 may be positioned adjacent to the first
preliminary substrate bump 212 of the package substrate 210. When
the nozzle 114 may approach a proper position, the flux F in the
dotting head 112 may be dotted on the first preliminary substrate
bump 212 of the package substrate 210 through the nozzle holes 115.
In at least one exemplary embodiment, the flux F may include an
adhesive, an oxide remover, etc. The flux F may include, but is not
limited to, a liquid material and a gaseous material.
Alternatively, the flux F may include an insulating paste.
[0066] Referring to FIG. 5, after dotting the flux F on the first
preliminary substrate bump 212 of the package substrate 210, the
flux-dotting unit 110 may be ascended.
[0067] Referring to FIG. 6, the flux-dotting unit 110 may be moved
to a position over the second preliminary substrate bump 214 of the
package substrate 210. The chip-attaching unit 120 may be arranged
over the first preliminary substrate bump 212 of the package
substrate 210 on which the flux F may be dotted. The chip-attaching
unit 120 may be descended to contact the preliminary chip bump 222
of the first semiconductor chip 220 with the first preliminary
substrate bump 212 of the package substrate 210. Heat may be
applied to the preliminary chip bump 222 of the first semiconductor
chip 220 and the first preliminary substrate bump 212 of the
package substrate 210 to attach the preliminary chip bump 222 of
the first semiconductor chip 220 to the first substrate preliminary
bump 212 of the package substrate 210. The heat may be applied by a
flux heater (not shown) coupled to an external portion of the
chip-attaching unit 120, or an external heater (not shown) that
applies the heat after the first semiconductor chip 220 and the
first preliminary substrate bump 212 of the package substrate 210
to attach the preliminary chip bump 222 of the first semiconductor
chip 220 to the first substrate preliminary bump 212 of the package
substrate 210. In some example embodiments, the preliminary chip
bump 222 of the first semiconductor chip 220 may be attached to the
first substrate preliminary bump 212 of the package substrate 210
immediately after dotting the flux F on the first preliminary
substrate bump 212 of the package substrate 210. Thus, a time when
the flux exists on a preliminary substrate bump without being
attached to a preliminary chip bump is decreased, thereby reducing
evaporation of the flux during the semiconductor chip attachment
process.
[0068] Referring to FIG. 7, the chip-attaching unit 120 may be
positioned adjacent to the flux-dotting unit 110 with holding the
second semiconductor chip 230.
[0069] Processes substantially the same as those illustrated with
reference to FIGS. 3 to 6 may be performed to attach at least one
second preliminary chip bump 232 of the second semiconductor chip
230 to at least one second preliminary substrate bump 214 of the
package substrate 210 in FIG. 8.
[0070] Referring to FIG. 9, the package substrate 210 may be cut to
separate the first semiconductor chip 220 and the second
semiconductor chip 230 from each other. A reflow process may be
performed on the first semiconductor chip 220 to convert the
preliminary bumps 212 and 222 into the conductive bump 240. That
is, the reflow process may combine a preliminary substrate bump 212
that is attached to a preliminary chip 222 into a single conductive
bump 240. Because the flux F may be evaporated during the reflow
process, the flux F may be almost removed. A reflow process with
respect to the second semiconductor chip 230 may be substantially
the same as the reflow process with respect to the first
semiconductor chip 220. Thus, any further illustrations with
respect to the reflow process on the second semiconductor chip 230
may be omitted herein for brevity. Alternatively, before cutting
the package substrate 210, the reflow process may be performed on
the first semiconductor chip 220 and the second semiconductor chip
230.
[0071] Referring to FIG. 10, an underfilling layer 250 may be
formed between the first semiconductor chip 220 and the package
substrate 210 to surround the conductive bump 240 with the
underfilling layer 250.
[0072] Alternatively, when the flux F includes the insulating
paste, the insulating paste may not be removed by the reflow
process. That is, the insulating paste may be converted into the
underfilling layer 250 after the reflow process. Thus, when the
flux F may include the insulating paste, the process to form the
underfilling layer 250 may be omitted.
[0073] Referring to FIG. 11, a molding member 260 may be formed on
the package substrate 210 to cover the first semiconductor chip
220. In some example embodiments, the molding member 260 may
include an epoxy molding compound (EMC).
[0074] Referring to FIG. 12, external terminals 270 may be mounted
on a lower surface of the package substrate 210 to complete a flip
chip package. In some example embodiments, the external terminals
270 may include solder balls.
[0075] FIGS. 13 to 20 are cross-sectional views illustrating an
exemplary method of manufacturing a flip chip package using the
apparatus in FIG. 1 in accordance with some example
embodiments.
[0076] The flip chip package of at least one example embodiment
illustrated in FIGS. 13-20 may correspond to a multi-chip package
223 including sequentially stacked semiconductor chips and plugs
224 included in the semiconductor chips.
[0077] Processes substantially the same as those illustrated with
reference to FIGS. 2 to 5 may be performed to attach a first
preliminary chip bump 222 of the first semiconductor chip 220 to a
first preliminary substrate bump 212 of the package substrate
210.
[0078] In some example embodiments, the first semiconductor chip
220 may include a plug 224. The plug 224 may be vertically disposed
in the first semiconductor chip 220. Thus, the plug 224 may have a
lower end exposed through a lower surface of the first
semiconductor chip 220, an upper end exposed through an upper
surface of the first semiconductor chip 220. The preliminary chip
bump 222 of the first semiconductor chip 220 may be formed on the
lower end of the plug 224. An upper preliminary bump 226 may be
formed on the upper end of the plug 224.
[0079] Referring to FIG. 13, after attaching the first
semiconductor chip 220 to the package substrate 210, the
flux-dotting unit 110 may be still positioned over the first
preliminary substrate bump 212 of the package substrate 210. The
chip-attaching unit 120 may be arranged adjacent to the
flux-dotting unit 110 with holding a third semiconductor chip
280.
[0080] Referring to FIG. 14, the flux-dotting unit 110 may be
descended toward the package substrate 210. The rods 117 may make
contact with the upper surface of the package substrate 210.
[0081] Referring to FIG. 15, the flux-dotting unit 110 may be
continuously descended with the spring 118 being compressed, so
that the nozzle 114 may be positioned adjacent to the upper
preliminary bump 226. When the nozzle 114 may approach a proper
position, the flux F in the dotting head 112 may be dotted on the
upper preliminary bump 226 through the nozzle holes 115.
[0082] Referring to FIG. 16, the flux-dotting unit 110 may be moved
to a position over the second preliminary substrate bump 214 of the
package substrate 210. The chip-attaching unit 120 may be arranged
over the upper preliminary bump 226 on which the flux F may be
dotted. The chip-attaching unit 120 may be descended to attach the
upper preliminary bump 226 of the first semiconductor chip 220 to a
preliminary chip bump 282 of the third semiconductor chip 280 to
construct the multi-chip package 223.
[0083] Processes substantially the same as those illustrated with
reference to FIGS. 13 to 16 may be performed to the third
semiconductor chip 280 to the second semiconductor chip 230 to
construct a multi-chip package having additional layers to those of
the exemplary embodiment illustrated in FIGS. 13-16.
[0084] Referring to FIG. 17, the package substrate 210 may be cut
to separate the first semiconductor chip 220 and the third
semiconductor chip 280 from the second semiconductor chip 230 and
the third semiconductor chip 280. A reflow process may be performed
on the first semiconductor chip 220 and the third semiconductor
chip 280 to convert the first preliminary substrate bump 212 of the
package substrate 210 and the preliminary chip bump 222 of the
first semiconductor chip 220 into the conductive bump 240, and the
upper preliminary bump 226 of the first semiconductor chip 220 and
the preliminary chip bump 282 of the third semiconductor chip 280
into a conductive bump 290.
[0085] Referring to FIG. 18, an underfilling layer 255 may be
formed between the first semiconductor chip 220 and the package
substrate 210, and between the first semiconductor chip 220 and the
third semiconductor chip 280 to surround the conductive bumps 240
and 290 with the underfilling layer 255. When the flux F may
include the insulating paste, the process to form the underfilling
layer 255 may be omitted.
[0086] Referring to FIG. 19, a molding member 265 may be formed on
the package substrate 210 to cover the first semiconductor chip 220
and the third semiconductor chip 280. In some example embodiments,
the molding member 265 may include an epoxy molding compound
(EMC).
[0087] Referring to FIG. 20, external terminals 275 may be mounted
on a lower surface of the package substrate 210 to complete a flip
chip package. In some example embodiments, the external terminals
275 may include solder balls.
[0088] According to some example embodiments, a preliminary chip
bump of the semiconductor chip may be attached to a preliminary
substrate bump of the package substrate just after dotting the flux
on the preliminary substrate bump of the package substrate. Thus,
an evaporation of the flux on the preliminary substrate bump of the
package substrate may be suppressed. Further, a time to attach the
semiconductor chip to the package substrate may be decreased. As a
result, the semiconductor chip and the package substrate may be
firmly attached to each other through the conductive bump.
[0089] Although a few embodiments of the present general inventive
concept have been shown and described, it will be appreciated by
those skilled in the art that changes may be made in these
embodiments without departing from the principles and spirit of the
general inventive concept, the scope of which is defined in the
appended claims and their equivalents.
* * * * *