Song; Ho Geon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Song; Ho Geon.The latest application filed is for "semiconductor package".

Company Profile

6.34.38

Song; Ho Geon - Suwon-si KR
Song; Ho-geon - Gyeonggi-do KR
Song; Ho-Geon - Seoul KR
Song; Ho-Geon - Cheonan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package having reflective layer with selective transmittance Grant 10,896,879 - Lee , et al. January 19, 2	2021-01-19
Semiconductor Package App 20210005576 - Kim; Kyoungsoo ; et al.	2021-01-07
Semiconductor chip and semiconductor package including the same Grant 10,756,062 - Kim , et al. A	2020-08-25
Semiconductor Chip And Semiconductor Package Including The Same App 20200013753 - Kim; Kyoung-Soo ; et al.	2020-01-09
Semiconductor Package Having Reflective Layer With Selective Transmittance App 20190287920 - LEE; KUN SIL ; et al.	2019-09-19
Semiconductor Device App 20190139921 - BAEK; Nam Gyu ; et al.	2019-05-09
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 9,941,196 - Lee , et al. April 10, 2	2018-04-10
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20160233155 - LEE; Ho-Jin ; et al.	2016-08-11
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 9,343,361 - Lee , et al. May 17, 2	2016-05-17
Method of molding semiconductor package Grant 9,184,065 - Ko , et al. November 10, 2	2015-11-10
Method of fabricating semiconductor device Grant 9,159,680 - Park , et al. October 13, 2	2015-10-13
Method of manufacturing chip-stacked semiconductor package Grant 9,136,260 - Ahn , et al. September 15, 2	2015-09-15
Stack semiconductor package and manufacturing the same Grant 9,099,460 - Cho , et al. August 4, 2	2015-08-04
Method Of Molding Semiconductor Package App 20150118798 - Ko; Jun-young ; et al.	2015-04-30
Method of molding semiconductor package Grant 8,956,921 - Ko , et al. February 17, 2	2015-02-17
Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same Grant 8,927,340 - Park , et al. January 6, 2	2015-01-06
Stack Semiconductor Package And Manufacturing The Same App 20140363923 - Cho; Yun-Rae ; et al.	2014-12-11
Stack semiconductor package and manufacturing the same Grant 8,890,294 - Cho , et al. November 18, 2	2014-11-18
Method Of Manufacturing A Flip Chip Package And Apparatus To Attach A Semiconductor Chip Used In The Method App 20140196280 - JEON; Chang-Seong ; et al.	2014-07-17
Method Of Manufacturing Chip-stacked Semiconductor Package App 20140154839 - Ahn; Jung-seok ; et al.	2014-06-05
Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method Grant 8,697,494 - Jeon , et al. April 15, 2	2014-04-15
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20140057430 - LEE; Ho-Jin ; et al.	2014-02-27
Stacked chips in a semiconductor package Grant 8,637,969 - Lee , et al. January 28, 2	2014-01-28
Method of manufacturing chip-stacked semiconductor package Grant 8,637,350 - Ahn , et al. January 28, 2	2014-01-28
Double-sided Adhesive Tape, Semiconductor Packages, And Methods Of Fabricating The Same App 20130330881 - PARK; Jin-Woo ; et al.	2013-12-12
Stack Semiconductor Package And Manufacturing The Same App 20130328177 - Cho; Yun-Rae ; et al.	2013-12-12
Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device Grant 8,592,991 - Lee , et al. November 26, 2	2013-11-26
Semiconductor apparatus, method of manufacturing the same, and method of manufacturing semiconductor package Grant 8,586,477 - Jeong , et al. November 19, 2	2013-11-19
Semiconductor Package App 20130292846 - Lee; Seok-hyun ; et al.	2013-11-07
Semiconductor Package and Method of Manufacturing the Same App 20130264706 - Lee; Teak-hoon ; et al.	2013-10-10
Semiconductor Package Having Heat Spreader And Method Of Forming The Same App 20130208426 - Kim; Jae-Choon ; et al.	2013-08-15
Method Of Molding Semiconductor Package App 20130203220 - Ko; Jun-young ; et al.	2013-08-08
Method of fabricating stacked chips in a semiconductor package Grant 8,455,301 - Lee , et al. June 4, 2	2013-06-04
Methods of manufacturing semiconductor chips Grant 8,431,442 - Park , et al. April 30, 2	2013-04-30
Method of molding semiconductor package Grant 8,420,450 - Ko , et al. April 16, 2	2013-04-16
Method Of Fabricating Semiconductor Device App 20120309167 - PARK; Sang-Wook ; et al.	2012-12-06
Method Of Manufacturing Chip-stacked Semiconductor Package App 20120282735 - Ahn; Jung-seok ; et al.	2012-11-08
Debonder To Manufacture Semiconductor And Debonding Method Thereof App 20120234497 - Han; Il Young ; et al.	2012-09-20
Semiconductor Device And Method Of Fabricating The Semiconductor Device App 20120199981 - Jeong; Se-young ; et al.	2012-08-09
Semiconductor Package App 20120199968 - PARK; Sang-wook ; et al.	2012-08-09
Lead frame and semiconductor package having the same Grant 8,193,619 - Kim , et al. June 5, 2	2012-06-05
Semiconductor Device, Fabricating Method Thereof And Semiconductor Package Including The Semiconductor Device App 20120133048 - LEE; Ho-Jin ; et al.	2012-05-31
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly Grant 8,189,342 - Bang , et al. May 29, 2	2012-05-29
Methods Of Manufacturing Semiconductor Chips App 20120115307 - Park; Sang Wook ; et al.	2012-05-10
Method Of Manufacturing A Flip Chip Package And Apparatus To Attach A Semiconductor Chip Used In The Method App 20120100668 - Jeon; Chang-Seong ; et al.	2012-04-26
Semiconductor Apparatus, Method Of Manufacturing The Same, And Method Of Manufacturing Semiconductor Package App 20120028412 - Jeong; Se-young ; et al.	2012-02-02
Method Of Molding Semiconductor Package App 20110318887 - Ko; Jun-young ; et al.	2011-12-29
Wave Soldering Apparatus To Apply Buoyancy, Soldering Method, And Method Of Forming Solder Bumps For Flip Chips On A Substrate App 20110293903 - JUNG; Ky-hyun ; et al.	2011-12-01
Method of forming at least one bonding structure Grant 8,053,351 - Ryu , et al. November 8, 2	2011-11-08
Printed circuit board and method thereof and a solder ball land and method thereof Grant 8,039,972 - Jung , et al. October 18, 2	2011-10-18
Method Of Forming At Least One Bonding Structure App 20110136334 - Ryu; Hwang-Bok ; et al.	2011-06-09
Lead frame and semiconductor package having the same App 20100237478 - Kim; Geun-Woo ; et al.	2010-09-23
Printed circuit board and method thereof and a solder ball land and method thereof App 20090278249 - Jung; Ky-hyun ; et al.	2009-11-12
Printed circuit board and method thereof and a solder ball land and method thereof Grant 7,576,438 - Jung , et al. August 18, 2	2009-08-18
Semiconductor Package And Method Of Fabricating The Same, And Electronic Device Using The Semiconductor Package App 20090134510 - KIM; Hak-Sung ; et al.	2009-05-28
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly App 20070047377 - Bang; Hyo-Jae ; et al.	2007-03-01
Printed circuit board and method thereof and a solder ball land and method thereof App 20070040282 - Jung; Ky-hyun ; et al.	2007-02-22
Wire bonding method and device of performing the same App 20070023487 - Ko; Jun-young ; et al.	2007-02-01

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