Jeon; Chang-Seong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jeon; Chang-Seong.The latest application filed is for "method of cutting substrate and method of singulating semiconductor chips".

Company Profile

2.15.20

Jeon; Chang-Seong - Yongin-si KR
Jeon; Chang-Seong - Hwaseong-si KR
Jeon; Chang-seong - Gyeonggi-do KR
Jeon; Chang-Seong - Seongnam-si KR
Jeon; Chang-seong - Suwon-si KR
Jeon, Chang Seong - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of cutting substrate and method of singulating semiconductor chips Grant 10,867,857 - Jeon , et al. December 15, 2	2020-12-15
Method Of Cutting Substrate And Method Of Singulating Semiconductor Chips App 20200098635 - JEON; CHANG-SEONG ; et al.	2020-03-26
Semiconductor Packages And Methods For Fabricating The Same App 20160372447 - JANG; Hye-young ; et al.	2016-12-22
Semiconductor packages and methods for fabricating the same Grant 9,461,029 - Jang , et al. October 4, 2	2016-10-04
Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same Grant 9,245,787 - Jeon , et al. January 26, 2	2016-01-26
Semiconductor Packages And Methods For Fabricating The Same App 20150380394 - JANG; Hye-young ; et al.	2015-12-31
Semiconductor package and method of fabricating the same Grant 9,177,942 - Kim , et al. November 3, 2	2015-11-03
Method of manufacturing chip-stacked semiconductor package Grant 9,136,260 - Ahn , et al. September 15, 2	2015-09-15
Substrate of semiconductor package and method of fabricating semiconductor package using the same Grant 9,082,871 - Park , et al. July 14, 2	2015-07-14
Substrate Of Semiconductor Package And Method Of Fabricating Semiconductor Package Using The Same App 20150155259 - PARK; Gi-Jun ; et al.	2015-06-04
Substrate of semiconductor package and method of fabricating semiconductor package using the same Grant 8,987,904 - Park , et al. March 24, 2	2015-03-24
Semiconductor Package And Method Of Fabricating The Same App 20150069635 - KIM; Wonkeun ; et al.	2015-03-12
Method Of Manufacturing A Flip Chip Package And Apparatus To Attach A Semiconductor Chip Used In The Method App 20140196280 - JEON; Chang-Seong ; et al.	2014-07-17
Method Of Manufacturing Chip-stacked Semiconductor Package App 20140154839 - Ahn; Jung-seok ; et al.	2014-06-05
Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method Grant 8,697,494 - Jeon , et al. April 15, 2	2014-04-15
Method of manufacturing chip-stacked semiconductor package Grant 8,637,350 - Ahn , et al. January 28, 2	2014-01-28
Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes Grant 8,637,989 - Lee , et al. January 28, 2	2014-01-28
Substrate Of Semiconductor Package And Method Of Fabricating Semiconductor Package Using The Same App 20140008794 - PARK; Gi-Jun ; et al.	2014-01-09
Fabricating Methods Of Semiconductor Devices And Pick-up Apparatuses Of Semiconductor Devices Therein App 20130149817 - JEON; Chang-Seong ; et al.	2013-06-13
Apparatus Of Manufacturing Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages Using The Same App 20120313332 - Jeon; Chang-Seong ; et al.	2012-12-13
Semiconductor Chip Having Via Electrodes And Stacked Semiconductor Chips Interconnected By The Via Electrodes App 20120299194 - Lee; Ho-jin ; et al.	2012-11-29
Method Of Manufacturing Chip-stacked Semiconductor Package App 20120282735 - Ahn; Jung-seok ; et al.	2012-11-08
Method Of Manufacturing A Flip Chip Package And Apparatus To Attach A Semiconductor Chip Used In The Method App 20120100668 - Jeon; Chang-Seong ; et al.	2012-04-26
Method Of Fabricating Semiconductor Stack Package App 20120077314 - PARK; Sang-sick ; et al.	2012-03-29
Semiconductor Chip Having Via Electrodes And Stacked Semiconductor Chips Interconnected By The Via Electrodes App 20100105169 - Lee; Ho-jin ; et al.	2010-04-29
Probe Card Having Redistributed Wiring Probe Needle Structure And Probe Card Module Using The Same App 20090278561 - Jo; Cha-jea ; et al.	2009-11-12
Dry type heating pipeline structure and construction method thereof App 20040074631 - Jeon, Chang Seong	2004-04-22

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