Park; Sang-Sick

Patent Applications and Registrations

Patent applications and USPTO patent grants for Park; Sang-Sick.The latest application filed is for "semiconductor package with increased thermal radiation efficiency".

Company Profile

9.20.30

Park; Sang-Sick - Hwaseong-si KR
PARK; SANG-SICK - SEOUL KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package With Increased Thermal Radiation Efficiency App 20220293566 - Park; Sang-Sick ; et al.	2022-09-15
Semiconductor Package Including A Fillet Layer App 20220285321 - PARK; SANG-SICK ; et al.	2022-09-08
Semiconductor package including a fillet layer Grant 11,362,068 - Park , et al. June 14, 2	2022-06-14
Semiconductor Package App 20210407949 - PARK; Sang-Sick ; et al.	2021-12-30
Semiconductor Package Having A High Reliability App 20210280564 - HWANG; JI-HWAN ; et al.	2021-09-09
Semiconductor package having a high reliability Grant 11,018,115 - Hwang , et al. May 25, 2	2021-05-25
Semiconductor Package Including A Fillet Layer App 20210111159 - PARK; SANG-SICK ; et al.	2021-04-15
Semiconductor package having recessed adhesive layer between stacked chips Grant 10,930,613 - Park , et al. February 23, 2	2021-02-23
Semiconductor Package Having A High Reliability App 20200219853 - Hwang; Ji-Hwan ; et al.	2020-07-09
Semiconductor packages Grant 10,651,154 - Park , et al.	2020-05-12
Semiconductor package having a high reliability Grant 10,622,335 - Hwang , et al.	2020-04-14
Semiconductor Package And Method Of Manufacturing The Same App 20200098719 - PARK; Sang Sick ; et al.	2020-03-26
Semiconductor Package Having A High Reliability App 20190096856 - Hwang; Ji-Hwan ; et al.	2019-03-28
Semiconductor package having a high reliability Grant 10,153,255 - Hwang , et al. Dec	2018-12-11
Semiconductor Packages App 20180331076 - PARK; Sang-Sick ; et al.	2018-11-15
Semiconductor packages Grant 10,090,278 - Park , et al. October 2, 2	2018-10-02
Semiconductor Packages App 20170243856 - PARK; Sang-Sick ; et al.	2017-08-24
Semiconductor Package Having A High Reliability App 20170243857 - HWANG; JI-HWAN ; et al.	2017-08-24
Semiconductor device and method of fabricating the same Grant 9,171,825 - Park , et al. October 27, 2	2015-10-27
Method of manufacturing chip-stacked semiconductor package Grant 9,136,260 - Ahn , et al. September 15, 2	2015-09-15
Semiconductor Device And Method Of Fabricating The Same App 20150130083 - PARK; Sang-Sick ; et al.	2015-05-14
Bi-directional camera module and flip chip bonder including the same Grant 8,958,011 - Park , et al. February 17, 2	2015-02-17
Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages Grant 8,901,727 - Kang , et al. December 2, 2	2014-12-02
Method Of Manufacturing A Flip Chip Package And Apparatus To Attach A Semiconductor Chip Used In The Method App 20140196280 - JEON; Chang-Seong ; et al.	2014-07-17
Method Of Manufacturing Chip-stacked Semiconductor Package App 20140154839 - Ahn; Jung-seok ; et al.	2014-06-05
Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method Grant 8,697,494 - Jeon , et al. April 15, 2	2014-04-15
Semiconductor Packages, Methods Of Manufacturing Semiconductor Packages, And Systems Including Semiconductor Packages App 20140084456 - Kang; Myun-sung ; et al.	2014-03-27
Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes Grant 8,637,989 - Lee , et al. January 28, 2	2014-01-28
Method of manufacturing chip-stacked semiconductor package Grant 8,637,350 - Ahn , et al. January 28, 2	2014-01-28
Bi-directional Camera Module And Flip Chip Bonder Including The Same App 20130258188 - PARK; Sang-Sick ; et al.	2013-10-03
Multi-chip package having semiconductor chips of different thicknesses from each other and related device Grant 8,513,802 - Ma , et al. August 20, 2	2013-08-20
Fabricating Methods Of Semiconductor Devices And Pick-up Apparatuses Of Semiconductor Devices Therein App 20130149817 - JEON; Chang-Seong ; et al.	2013-06-13
Semiconductor Package And Method Of Manufacturing The Same App 20130032947 - Park; Sang-sick ; et al.	2013-02-07
Stacked Semiconductor Device App 20120326307 - JEONG; Se-young ; et al.	2012-12-27
Semiconductor Chip Having Via Electrodes And Stacked Semiconductor Chips Interconnected By The Via Electrodes App 20120299194 - Lee; Ho-jin ; et al.	2012-11-29
Method Of Manufacturing Chip-stacked Semiconductor Package App 20120282735 - Ahn; Jung-seok ; et al.	2012-11-08
Method Of Manufacturing A Flip Chip Package And Apparatus To Attach A Semiconductor Chip Used In The Method App 20120100668 - Jeon; Chang-Seong ; et al.	2012-04-26
Method Of Fabricating Semiconductor Stack Package App 20120077314 - PARK; Sang-sick ; et al.	2012-03-29
Multi-Chip Package Having Semiconductor Chips Of Different Thicknesses From Each Other And Related Device App 20110193229 - Ma; Keum-Hee ; et al.	2011-08-11
Semiconductor Chip Having Via Electrodes And Stacked Semiconductor Chips Interconnected By The Via Electrodes App 20100105169 - Lee; Ho-jin ; et al.	2010-04-29

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